CN105251877A - Lower template mechanism of bending device - Google Patents
Lower template mechanism of bending device Download PDFInfo
- Publication number
- CN105251877A CN105251877A CN201510717575.XA CN201510717575A CN105251877A CN 105251877 A CN105251877 A CN 105251877A CN 201510717575 A CN201510717575 A CN 201510717575A CN 105251877 A CN105251877 A CN 105251877A
- Authority
- CN
- China
- Prior art keywords
- plate
- substrate
- spacing
- screw mandrel
- positioning plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention discloses a lower template mechanism of a bending device. The lower template mechanism comprises a positioning bottom plate and a lower template positioned on the positioning bottom plate. A lifting plate is arranged below the positioning bottom plate and provided with a base plate, the lifting plate is connected with a lead screw in a screwing manner, and the lead screw is connected with a motor. The lower template is provided with a plurality of template holes, the positioning bottom plate is provided with positioning holes, and electron components are positioned on the base plate and located in the template holes and the positioning holes. A transverse movement air cylinder is installed on the lifting plate, a piston rod of the transverse movement air cylinder is connected with the base plate, and the base plate is in sliding fit with the lifting plate. By means of the lower template mechanism, the processing manner that an upper template mechanism and a lower template mechanism in the prior art simply, vertically and oppositely run to bend terminals of the electron components is changed, the manner that the to-be-bent terminals of the electron components are laterally pushed to a forming module in an upper template mechanism to bend the terminals of the electron components is adopted, operators do not need to press the upper template mechanism on the terminals of the electron components with great efforts to bend the terminals of the electron components, the labor intensity is reduced, and the bending efficiency is improved.
Description
Technical field:
The present invention relates to electronic devices and components process equipment, in particular to a kind of lower die mechanism of bending equipment.
Background technology:
The terminal of portions of electronics components and parts can need use after bending process, adopts semi-automatic bending equipment to be unfavorable for the raising of electronic devices and components terminal bending efficiency in prior art.Particularly, the bending equipment mode of operation of described semi-automation is: loaded by manual type on the lower module of bending equipment and locate electronic devices and components to be processed, afterwards, drive the descending compressing of upper module on lower module by manual type, by larger manpower, the terminal of electronic devices and components is carried out bending.
Summary of the invention:
Technical problem solved by the invention: operator adopts the terminal of semi-automatic bending equipment bending electronic devices and components, labour intensity is large, and bending efficiency is low, and terminal bending is of low quality.
The invention provides following technical scheme:
A lower die mechanism for bending equipment, comprises positioning plate, the lower bolster be positioned on positioning plate; The bottom of described positioning plate is fixedly connected with left plate and right plate, and left plate is fixedly connected with a level board with the bottom of right plate; Be provided with the second lead between described level board and positioning plate, the second lead be sliding combined with the second lifter plate, the second lifter plate is provided with substrate, and substrate is positioned at the below of positioning plate; The bottom of described level board is provided with the second servomotor, and the second servomotor connects the second screw mandrel, and the second screw mandrel is upward through level board and the second lifter plate is spirally connected; The bottom of described substrate has the cutting structure holding and project upwards the second screw mandrel of the second lifter plate;
Described lower bolster offers multiple pattern hole, described positioning plate is offered the first locating hole that is multiple and pattern hole consistency from top to bottom, described electronic devices and components to be positioned on substrate and to be positioned at pattern hole and the first locating hole;
Described second lifter plate is provided with transverse cylinder, and the piston rod of transverse cylinder is connected with substrate, and the bottom of described substrate is provided with horizontal slide slot, and described second lifter plate is provided with the cross slide way coordinated with horizontal slide slot.
By technique scheme, the operation principle of the lower die mechanism of bending equipment of the present invention is as follows: electronic devices and components to be processed are placed on substrate by staff, and makes electronic devices and components be positioned at pattern hole and the first locating hole; Afterwards, the upper die mechanism of bending equipment runs downwards, and the forming module in upper die mechanism is pressed on described lower bolster; Afterwards, the second driven by servomotor second screw mandrel rotates, and the second screw mandrel drives the second lifter plate to rise along the second lead, the second lifter plate drive substrate and on electronic devices and components to rise certain height; Afterwards; transverse cylinder drives substrate relative to the second lifter plate transverse shifting; be positioned at the electronic devices and components transverse shifting in pattern hole on substrate; the terminal of the electronic devices and components of transverse shifting moves to the forming module in upper die mechanism; namely; terminal pushes away to forming module is horizontal by transverse cylinder, and so, namely the terminal of vertical shape is bent into preset shape.
Pass through technique scheme, bending equipment of the present invention changes upper and lower mould mechanism in prior art and runs and the processing mode of bending electronic devices and components terminal in opposite directions up and down simply, adopt thruster treat the electronic devices and components terminal of bending to forming module in upper die mechanism the mode of bending electronic devices and components terminal, make operator only need load electronic devices and components to be processed and descending upper die mechanism, upper die mechanism is oppressed its bending at electronic devices and components terminal without the need to effort by operator, so, not only alleviate the labour intensity of operator, improve terminal bending efficiency, and, improve the bending quality of electronic devices and components terminal.
Illustrate the one of positioning plate as the present invention, described positioning plate is offered a pair installing hole, a pair installing hole diagonal angle on positioning plate is arranged, and each installing hole internal fixtion is provided with axle sleeve.In actual production, the bottom of upper die mechanism be installed with a pair axle sleeve with the use of lead.When upper die mechanism comes downwards to certain altitude, lead inserts in axle sleeve and leads.
Illustrate the one that positioning plate and lower bolster install relation as the present invention, described positioning plate is installed with two groups of alignment pins, two groups of alignment pin diagonal angles on positioning plate are arranged, and often organize alignment pin and comprise two alignment pins be set up in parallel; Described lower bolster is offered the locating hole with two groups of detent fit.The object of above-mentioned design is more stablize and be positioned on positioning plate by lower bolster exactly.
As the one explanation of the present invention to the second lifter plate heave amplitude photo-electric control, described left plate and right plate install the second spacing photoelectric induction device, described second lifter plate is provided with second spacing photoelectric induction device with the use of the second sensor block.Described second spacing photoelectric induction device is electrically connected with the second servomotor, and the second spacing photoelectric induction device responds to the lifting displacement of the second sensor block, to control the action of the second servomotor.
Illustrate the one of substrate and transverse cylinder annexation as the present invention, described second lifter plate is offered a spacing slide slot, spacing slide slot is positioned at by the side of substrate; One sidewall of described substrate is installed with L shape contiguous block, the basal sliding of L shape contiguous block is engaged in spacing slide slot; The piston rod of described transverse cylinder is connected with substrate by L shape connector.
As a modification of the present invention, described level board is arranged in movable mechanism; Slide guide rail, slide the 3rd screw mandrel that guide rail is set up in parallel with front and back before and after described movable mechanism comprises, the 3rd servomotor connected with the 3rd screw mandrel; The bottom of described level board is installed with the front and back slide block sliding guide rail with front and back and coordinate, and the bottom of level board is installed with the internal thread block be spirally connected with the 3rd screw mandrel; Described 3rd screw mandrel is positioned at a protection case, and the lateral wall of protection case installs the 3rd spacing photoelectric induction device, the bottom of described level board be provided with the 3rd spacing photoelectric induction device with the use of the 3rd sensor block; Described protection case is also provided with the spacing plate vertically arranged, spacing plate is provided with proximity switch, the sidewall of described positioning plate is provided with proximity switch with the use of sensing element; Described 3rd spacing photoelectric induction device is positioned at the front end place of the 3rd screw mandrel, and described spacing plate is positioned at the rear end of the 3rd screw mandrel.
By above-mentioned improvement, whole lower die mechanism can move laterally by movable mechanism, so that the electronic devices and components completed unload from lower die mechanism by operating personnel, and is loaded in lower die mechanism by electronic devices and components to be processed.The front and back of whole lower die mechanism under the effect of movable mechanism are run amplitude and are controlled by proximity switch and the 3rd spacing photoelectric induction device, and described proximity switch and the 3rd spacing photoelectric induction device are electrically connected with the 3rd servomotor.
Accompanying drawing illustrates:
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is the structural representation of the lower die mechanism of a kind of bending equipment of the present invention;
Fig. 2 is the right view of Fig. 1;
Fig. 3 is the structural representation of the lower die mechanism gained observing bending equipment in Fig. 1 from upper right side.
Symbol description in figure:
10, positioning plate; 11, left plate; 12, right plate; 13, level board; 14, axle sleeve; 15, alignment pin;
20, lower bolster;
31, the second lead; 32, the second lifter plate; 321, spacing slide slot; 322, cross slide way; 33, substrate; 34, the second servomotor; 35, the second screw mandrel; 36, the second spacing photoelectric induction device; 37, the second sensor block;
41, transverse cylinder; 42, L shape contiguous block;
50, movable mechanism; 51, guide rail is slided in front and back; 52, the 3rd servomotor; 53, case is protected; 54, the 3rd spacing photoelectric induction device; 55, spacing plate;
A, electronic devices and components.
Detailed description of the invention:
Composition graphs 1 to Fig. 3, a kind of lower die mechanism of bending equipment, comprises positioning plate 10, the lower bolster 20 be positioned on positioning plate.The bottom of described positioning plate is fixedly connected with left plate 11 and right plate 12, and left plate is fixedly connected with a level board 13 with the bottom of right plate; Be provided with between described level board and positioning plate and the second lead 31, second lead is sliding combined with the second lifter plate 32, second lifter plate is provided with substrate 33, substrate is positioned at the below of positioning plate; The bottom of described level board is provided with the second servomotor 34, second servomotor and connects the second screw mandrel 35, second screw mandrel and be upward through level board and the second lifter plate is spirally connected; The bottom of described substrate has the cutting structure holding and project upwards the second screw mandrel of the second lifter plate.Described lower bolster offers multiple pattern hole, described positioning plate is offered the first locating hole that is multiple and pattern hole consistency from top to bottom, described electronic devices and components a to be positioned on substrate and to be positioned at pattern hole and the first locating hole.Described second lifter plate is provided with transverse cylinder 41, and the piston rod of transverse cylinder is connected with substrate, and the bottom of described substrate is provided with horizontal slide slot, and described second lifter plate is provided with the cross slide way 322 coordinated with horizontal slide slot.Wherein, described second lifter plate 32 is offered a spacing slide slot 321, spacing slide slot is positioned at by the side of substrate 33; The basal sliding one sidewall of described substrate being installed with L shape contiguous block 42, L shape contiguous block is engaged in spacing slide slot; The piston rod of described transverse cylinder 41 is connected with substrate by L shape connector.
Composition graphs 1 to Fig. 3, described positioning plate 10 offers a pair installing hole, and a pair installing hole diagonal angle on positioning plate is arranged, and each installing hole internal fixtion is provided with axle sleeve 14.Described positioning plate 10 is installed with two groups of alignment pins, 15, two groups of alignment pins diagonal angle on positioning plate to arrange, often organizes alignment pin and comprise two alignment pins be set up in parallel; Described lower bolster 20 is offered the locating hole with two groups of detent fit.
Composition graphs 1 to Fig. 3, described left plate 11 and right plate 12 install the second spacing photoelectric induction device 36, described second lifter plate 32 is provided with second spacing photoelectric induction device with the use of the second sensor block 37.
Composition graphs 1 to Fig. 3, described level board 13 is arranged in movable mechanism 50; Slide guide rail 51, slide the 3rd screw mandrel that guide rail is set up in parallel with front and back before and after described movable mechanism comprises, the 3rd servomotor 52 connected with the 3rd screw mandrel; The bottom of described level board is installed with the front and back slide block sliding guide rail with front and back and coordinate, and the bottom of level board is installed with the internal thread block be spirally connected with the 3rd screw mandrel.Described 3rd screw mandrel is positioned at a protection case 53, and the lateral wall of protection case installs the 3rd spacing photoelectric induction device 54, the bottom of described level board be provided with the 3rd spacing photoelectric induction device with the use of the 3rd sensor block; Described protection case is also provided with the spacing plate 55 vertically arranged, spacing plate is provided with proximity switch, the sidewall of described positioning plate 10 is provided with proximity switch with the use of sensing element; Described 3rd spacing photoelectric induction device is positioned at the front end place of the 3rd screw mandrel, and described spacing plate is positioned at the rear end of the 3rd screw mandrel.
In actual production, electronic devices and components a to be processed is placed on substrate 33 by staff, and makes electronic devices and components be positioned at pattern hole and the first locating hole; Afterwards, the upper die mechanism of bending equipment runs downwards, and the forming module in upper die mechanism is pressed on described lower bolster 20; Afterwards, the second servomotor 34 drives the second screw mandrel to rotate, and the second screw mandrel drives the second lifter plate 32 to rise along the second lead 31, the second lifter plate 32 drive substrate 33 and on electronic devices and components a to rise certain height; Afterwards; transverse cylinder 41 drives substrate 33 relative to the second lifter plate 32 transverse shifting; be positioned at the electronic devices and components a transverse shifting in pattern hole on substrate 33; the terminal of the electronic devices and components a of transverse shifting moves to the forming module in upper die mechanism; namely; terminal pushes away to forming module is horizontal by transverse cylinder 41, and so, namely the terminal of vertical shape is bent into preset shape.
Above content is only better embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (6)
1. a lower die mechanism for bending equipment, comprises positioning plate (10), the lower bolster (20) be positioned on positioning plate; It is characterized in that:
The bottom of described positioning plate is fixedly connected with left plate (11) and right plate (12), and left plate is fixedly connected with a level board (13) with the bottom of right plate; Be provided with the second lead (31) between described level board and positioning plate, the second lead be sliding combined with the second lifter plate (32), the second lifter plate is provided with substrate (33), and substrate is positioned at the below of positioning plate; The bottom of described level board is provided with the second servomotor (34), and the second servomotor connects the second screw mandrel (35), and the second screw mandrel is upward through level board and the second lifter plate is spirally connected; The bottom of described substrate has the cutting structure holding and project upwards the second screw mandrel of the second lifter plate;
Described lower bolster offers multiple pattern hole, described positioning plate is offered the first locating hole that is multiple and pattern hole consistency from top to bottom, electronic devices and components (a) to be positioned on substrate and to be positioned at pattern hole and the first locating hole;
Described second lifter plate is provided with transverse cylinder (41), the piston rod of transverse cylinder is connected with substrate, the bottom of described substrate is provided with horizontal slide slot, and described second lifter plate is provided with the cross slide way (322) coordinated with horizontal slide slot.
2. the lower die mechanism of a kind of bending equipment as claimed in claim 1; it is characterized in that: (10) offer a pair installing hole to described positioning plate; a pair installing hole diagonal angle on positioning plate is arranged, and each installing hole internal fixtion is provided with axle sleeve (14).
3. the lower die mechanism of a kind of bending equipment as claimed in claim 1, it is characterized in that: described positioning plate (10) is installed with two groups of alignment pins (15), two groups of alignment pin diagonal angles on positioning plate are arranged, and often organize alignment pin and comprise two alignment pins be set up in parallel; Described lower bolster (20) is offered the locating hole with two groups of detent fit.
4. the lower die mechanism of a kind of bending equipment as claimed in claim 1; it is characterized in that: the upper spacing photoelectric induction device of installation second (36) of described left plate (11) and right plate (12), described second lifter plate (32) is provided with second spacing photoelectric induction device with the use of the second sensor block (37).
5. the lower die mechanism of a kind of bending equipment as claimed in claim 1, is characterized in that: described second lifter plate (32) is offered a spacing slide slot (321), spacing slide slot is positioned at by the side of substrate (33); One sidewall of described substrate is installed with L shape contiguous block (42), the basal sliding of L shape contiguous block is engaged in spacing slide slot; The piston rod of described transverse cylinder (41) is connected with substrate by L shape connector.
6. the lower die mechanism of a kind of bending equipment as claimed in claim 1, is characterized in that: described level board (13) is arranged in movable mechanism (50); Slide guide rail (51), slide the 3rd screw mandrel that guide rail is set up in parallel with front and back before and after described movable mechanism comprises, the 3rd servomotor (52) connected with the 3rd screw mandrel; The bottom of described level board is installed with the front and back slide block sliding guide rail with front and back and coordinate, and the bottom of level board is installed with the internal thread block be spirally connected with the 3rd screw mandrel;
Described 3rd screw mandrel is positioned at a protection case (53), the lateral wall of protection case installs the 3rd spacing photoelectric induction device (54), the bottom of described level board be provided with the 3rd spacing photoelectric induction device with the use of the 3rd sensor block; Described protection case is also provided with the spacing plate (55) vertically arranged, spacing plate is provided with proximity switch, the sidewall of described positioning plate (10) is provided with proximity switch with the use of sensing element; Described 3rd spacing photoelectric induction device is positioned at the front end place of the 3rd screw mandrel, and described spacing plate is positioned at the rear end of the 3rd screw mandrel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510717575.XA CN105251877A (en) | 2015-10-29 | 2015-10-29 | Lower template mechanism of bending device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510717575.XA CN105251877A (en) | 2015-10-29 | 2015-10-29 | Lower template mechanism of bending device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105251877A true CN105251877A (en) | 2016-01-20 |
Family
ID=55091973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510717575.XA Pending CN105251877A (en) | 2015-10-29 | 2015-10-29 | Lower template mechanism of bending device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105251877A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1242019A (en) * | 1996-10-31 | 2000-01-19 | 国家淀粉及化学投资控股公司 | Adhesives with low level of residual monomers and process for manufacturing same |
| KR20040056413A (en) * | 2002-12-23 | 2004-07-01 | 주식회사 에스엠시 | Battery Cell a Terminal Automatic Bending Machine |
| CN202180465U (en) * | 2011-06-09 | 2012-04-04 | 许晓华 | Multi-degree-of-freedom workbench |
| CN104858637A (en) * | 2015-05-21 | 2015-08-26 | 苏州博众精工科技有限公司 | Automatic alignment press-fit mechanism |
| CN102975186B (en) * | 2012-08-20 | 2015-09-02 | 昆山洺九机电有限公司 | Lifting platform system |
| CN205183502U (en) * | 2015-10-29 | 2016-04-27 | 苏州凡特斯测控科技有限公司 | Lower die mechanism of equipment of bending |
-
2015
- 2015-10-29 CN CN201510717575.XA patent/CN105251877A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1242019A (en) * | 1996-10-31 | 2000-01-19 | 国家淀粉及化学投资控股公司 | Adhesives with low level of residual monomers and process for manufacturing same |
| KR20040056413A (en) * | 2002-12-23 | 2004-07-01 | 주식회사 에스엠시 | Battery Cell a Terminal Automatic Bending Machine |
| CN202180465U (en) * | 2011-06-09 | 2012-04-04 | 许晓华 | Multi-degree-of-freedom workbench |
| CN102975186B (en) * | 2012-08-20 | 2015-09-02 | 昆山洺九机电有限公司 | Lifting platform system |
| CN104858637A (en) * | 2015-05-21 | 2015-08-26 | 苏州博众精工科技有限公司 | Automatic alignment press-fit mechanism |
| CN205183502U (en) * | 2015-10-29 | 2016-04-27 | 苏州凡特斯测控科技有限公司 | Lower die mechanism of equipment of bending |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104889231A (en) | Punching device for electric wire threading slot punching | |
| CN105234222A (en) | Bending equipment for terminals of electronic components | |
| CN204770013U (en) | Novel panel beating mechanism of bending | |
| CN205183502U (en) | Lower die mechanism of equipment of bending | |
| CN105251837A (en) | Multi-station bending device | |
| CN205183425U (en) | A equipment for electronic components terminal is bent | |
| CN105251826A (en) | Device for bending terminals of electron components in up-and-down linkage manner | |
| CN205085201U (en) | Equipment of bending of electronic components terminal | |
| CN208825310U (en) | A kind of multistation punching slide block device | |
| CN203526372U (en) | Production line middle platform automatic feeding device | |
| CN105251877A (en) | Lower template mechanism of bending device | |
| CN205183480U (en) | Sheet metal component punching device | |
| CN205183423U (en) | Equipment of bending of upper die mechanism and lower die mechanism linkage | |
| CN205183426U (en) | Equipment of bending | |
| CN105234228A (en) | Bending and side pushing mechanism for electronic elements | |
| CN104001837B (en) | Wire pair moves bend forming die | |
| CN205183427U (en) | Multistation equipment of bending | |
| CN106346505B (en) | It is a kind of to take fixture cover device for the automatic of circuit board automated production | |
| CN207668378U (en) | A kind of electronic component pin apparatus for bending | |
| CN105251838A (en) | Bending device with upper die mechanism and lower die mechanism in linkage | |
| CN205085274U (en) | Adopt side to push away lower die mechanism of equipment of bending of mode | |
| CN205183424U (en) | Electronic components of sub - adjustable length of bending end mechanism of bending | |
| CN105251876A (en) | Lower die mechanism of bending equipment adopting lateral pushing manner | |
| CN205085202U (en) | Carry out equipment that up -down linkage bent to electronic components terminal | |
| CN205183594U (en) | Link board equipment of bending |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160120 |