CN105247968A - Web page output selection - Google Patents
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- Publication number
- CN105247968A CN105247968A CN201380077071.5A CN201380077071A CN105247968A CN 105247968 A CN105247968 A CN 105247968A CN 201380077071 A CN201380077071 A CN 201380077071A CN 105247968 A CN105247968 A CN 105247968A
- Authority
- CN
- China
- Prior art keywords
- heat carrier
- wiring board
- printed wiring
- hole
- graphite flake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Abstract
A component-embedded substrate (10) has an insulating substrate (1), a metal layer (3) formed upon the surface of the insulating substrate (1), a through-hole (2) passing through the insulating substrate (1), and a thermally conductive body (20) which fills the through-hole (2). The thermally conductive body (20) is provided with a shape in which a graphite sheet (4) that has been coated with an adhesive (5) on the surface is wound into a roll shape.
Description
Technical field
The present invention relates to a kind of there is heat dissipation path printed wiring board and manufacture method and the heat carrier for this printed wiring board.
Background technology
There will be a known the heat that the semiconductor element owing to being mounted on printed wiring board produces in the past, and made the temperature of this semiconductor element and printed wiring board increase, the situation of this semiconductor element generation misoperation and damage.For this reason, need the heat produced by the semiconductor element carried to dispel the heat from printed wiring board, the heat radiation countermeasure declining such to make the temperature of this semiconductor element.As such heat radiation countermeasure, have from the element mounting of printed wiring board towards the backside conduction heat with this opposition side, element mounting face, and carry the such thermal component of radiator at this back side with the method for the heat spreader that will come from the conduction of element mounting face.In addition, high heat conduction layer is set in printed wiring board in addition, makes the heat produced from semiconductor element via this high heat conduction layer diffusion, make the method that the temperature of this semiconductor element and printed wiring board declines.
As the element mounting from printed wiring board towards the method for the back side efficient transmission heat conduction amount of its opposition side, there will be a known the method for filling the higher resin of heat conductivity in through hole and the method being pressed into the higher metal of the heat conductivity such as copper or aluminium.Such as, patent documentation 1 to 3 discloses the printed wiring board using such method to manufacture.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2010-263003 publication
Patent documentation 2: Japanese Patent Laid-Open 2010-205992 publication
Patent documentation 3: Japan Patent No. 3758175 publication
Summary of the invention
Invent technical problem to be solved
Here, when being pressed into by the heat carrier that metal is formed, the thermal resistance of this heat carrier depends on and intrinsic heat conductivity, the sectional area of heat carrier, the thickness of printed wiring board that metal has according to the caloric value on semiconductor element, decides the size of heat carrier.And, due in recent years along with the complicated of semiconductor element and high performance, caloric value has the trend of increase, by increasing the through hole for being pressed into this heat carrier, and by making the thickness of printed wiring board thinner, the heat that semiconductor element produces is dispelled the heat well.
But if increase the through hole for being pressed into this heat carrier, and make the thickness of printed wiring board thinner, relative to the area that printed wiring board semiconductor elements is occupied, the occupied area of through hole becomes large, and the problem that packing density declines can occur.
In addition, when being pressed into by the heat carrier that metal is formed, heat carrier can make through hole deform, and the insulating barrier of printed wiring board can crack, thus the problem that the insulating properties producing printed wiring board significantly declines.
The present invention completes in view of the above problems, its object is to, and provides a kind of and packing density can not be caused to decline and the printed wiring board excellent in reliability that can suppress to crack etc. and manufacture method thereof and the heat carrier for this printed wiring board.
The technical scheme of technical solution problem
In order to achieve the above object, printed wiring board of the present invention comprises: insulated substrate; The metal level that the surface of described insulated substrate is formed; The through hole of through described insulated substrate; And fill the heat carrier of described through hole, it is characterized in that, described heat carrier has the shape of the graphite flake wound into rolls by scribbling binding agent on the surface.
In above-mentioned printed wiring board, the pyroconductivity on the direction that the thermal conductivity ratio of described heat carrier on the bearing of trend of described through hole is orthogonal with described bearing of trend is high.In addition, the pyroconductivity of described heat carrier on the bearing of trend of described through hole is preferably 800W/mK ~ 1200W/mK.
In any one printed wiring board above-mentioned, be preferably described heat carrier, on the direction orthogonal with the bearing of trend of described through hole, there is retractility.
In any one printed wiring board above-mentioned, described heat carrier can comprise column core, has the structure be wound on by described graphite flake on described core.
In addition, in order to achieve the above object, the feature of the manufacture method of printed wiring board of the present invention is, comprising: the operation forming through hole on insulated substrate; The surface of described insulated substrate is formed the operation of metal level; The graphite flake wound into rolls being coated with binding agent is on the surface formed the operation of heat carrier; And in described through hole, fill the operation of described heat carrier.
In the operation of the described heat carrier of the filling in the manufacture method of above-mentioned printed wiring board, fill described heat carrier to make the pyroconductivity on direction that on the bearing of trend of described through hole, thermal conductivity ratio is orthogonal with described bearing of trend high.
In the operation of the described heat carrier of formation in the manufacture method of any one printed wiring board above-mentioned, described graphite flake can be wound on column core.
The manufacture method of any one printed wiring board above-mentioned can also have the operation of grinding described heat carrier, makes described heat carrier and described metal level at grade.In addition, the manufacture method of any one printed wiring board above-mentioned can also be included in the operation of filling covering metal on the exposing surface of described heat carrier after described heat carrier.
In order to achieve the above object, the feature of heat carrier of the present invention is to have: graphite flake and the binding agent be coated on the surface of described graphite flake, by described binding agent by described graphite flake wound into rolls.
Above-mentioned heat carrier, the pyroconductivity on the direction that the thermal conductivity ratio on the direction of principal axis of winding is orthogonal with described direction of principal axis is high.In addition, the pyroconductivity of described heat carrier on described direction of principal axis is preferably 800W/mK ~ 1200W/mK.
Any one heat carrier above-mentioned, preferably has retractility on the direction orthogonal with described direction of principal axis.
Any one heat carrier above-mentioned can comprise column core, has the structure be wound on by described graphite flake on described core.
Invention effect
In printed wiring board involved in the present invention and manufacture method thereof, owing to being filled in through hole by the heat carrier under winding graphite flake state, through printed wiring board direction forms the heat dissipation path with excellent heat conductivity.Thus, even if the caloric value of the semiconductor element be mounted on printed wiring board and radiator increases, without the need to increasing the size of heat carrier, also can dispel the heat fully, therefore, it is possible to prevent the reduction of packing density on printed wiring board.
In addition, in printed wiring board involved in the present invention and manufacture method thereof, heat carrier possesses retractility owing to comprising binding agent, when filling heat carrier, being positioned on the insulated substrate around through hole and can not being damaged and damaging.Thus, in the use of printed wiring board, excellent insulating properties can be kept, improve the reliability of printed wiring board itself.
In addition, heat carrier involved in the present invention has the structure using binding agent winding graphite flake, therefore, the axis direction of winding has excellent heat conductivity.That is, heat carrier involved in the present invention utilizes heat conductivity excellent on the in-plane of graphite flake on the bearing of trend of heat carrier, realizes heat conductivity excellent on this bearing of trend.
Accompanying drawing explanation
Fig. 1 is the sectional view in each manufacturing process of the manufacture method of printed wiring board involved in the present invention.
Fig. 2 is the sectional view in each manufacturing process of the manufacture method of printed wiring board involved in the present invention.
Fig. 3 is the sectional view in each manufacturing process of the manufacture method of heat carrier for printed wiring board involved in the present invention.
Fig. 4 is the sectional view in each manufacturing process of the manufacture method of heat carrier for printed wiring board involved in the present invention.
Fig. 5 is the stereogram of heat carrier involved in the present invention.
Fig. 6 is the cutaway view in VI-VI line direction in Fig. 5.
Fig. 7 is the sectional view in each manufacturing process of the manufacture method of printed wiring board involved in the present invention.
Fig. 8 is the sectional view in each manufacturing process of the manufacture method of printed wiring board involved in the present invention.
Fig. 9 is the sectional view in each manufacturing process of the manufacture method of printed wiring board involved in the present invention.
Embodiment
Below, with reference to accompanying drawing, to embodiments of the present invention, be described in detail according to embodiment.In addition, the present invention is not limited to following description, not changing in the scope of its aim, change arbitrarily and implementing.In addition, accompanying drawing for illustration of embodiment is all schematically show printed wiring board of the present invention and heat carrier, in order to sharpen understanding local be emphasized, expanding, reduce or omission etc., sometimes not the ratio of Correct printed wiring board and heat carrier or shape etc.In addition, the various numerical value for embodiment are all represent an example, can carry out various change as required.
Below < embodiment >, for the manufacture method of the printed wiring board 10 involved by embodiments of the invention, is described in detail referring to figs. 1 through Fig. 9.Here, Fig. 1, Fig. 2 and Fig. 7 to Fig. 9 are the sectional views in each manufacturing process of the manufacture method of printed wiring board 10 involved by the present embodiment.In addition, Fig. 3 and Fig. 4 is the sectional view in each manufacturing process of the manufacture method of heat carrier 20 for the printed wiring board 10 involved by the present embodiment.In addition, Fig. 5 is the stereogram of the heat carrier 20 involved by the present embodiment, and Fig. 6 is the cutaway view in VI-VI line direction in Fig. 5.
First, as shown in Figure 1, ready insulated substrate 1 carries out the through hole formation process forming through hole 2.Specifically, prepare thickness of slab be the epoxy glass substrate of 1.6mm as insulated substrate 1, use drilling machine etc. on insulated substrate 1, form the through hole 2 of diameter 1mm.Here, in FIG, illustrate 1 through hole 2, in fact on insulated substrate 1, form multiple through hole 2.Suitable change can be carried out according to the caloric value etc. of the semiconductor element in the printed wiring board be arranged in the quantity of through hole 2 and opening footpath.Such as, suitable selection can be carried out in the opening footpath of through hole 2 in the scope of 1mm ~ 15mm.
In addition, in the present embodiment, although use epoxy glass substrate as insulated substrate 1, other the insulated substrate such as paper phenol substrate, Epoxide cellulose paper substrate, teflon (registered trade mark) substrate, aluminum oxide substrate or LTCC (LowTemperatureCo-firedCeramics: LTCC) substrate can also be used.And, according to the kind of the insulated substrate used, the formation method of through hole 2 suitably can be changed.Such as, through hole 2 can be formed by irradiating laser, or through hole 2 can be formed by chemical methodes such as etchings.
Then, as shown in Figure 2, on the surface of insulated substrate 1, (more specifically, the sidepiece of the 1st 1a, the 2nd 1b and through hole 2) carries out the metal level formation process forming metal level 3.Specifically, by electric field plating method, the surface of insulated substrate 1 forms the metal level 3 formed by copper plating film.In addition, as the method formed as the film of metal level 3, be not limited to electrolytic plating method, electroless plating also can be adopted to cover the general film build method such as method, chemical vapour deposition technique (CVD) or physical vaporous deposition (PVD method).
Then, carrying out heat carrier formation process, forming the heat carrier in the through hole 2 for being filled in formation on insulated substrate 1.Specifically, as shown in Figure 3, applied adhesive 5 on the surface of graphite flake 4, thus on the surface of graphite flake 4, form the film of binding agent 5.That is, the conducting strip 6 formed by graphite flake 4 and binding agent 5 is first prepared.
Here, graphite flake 4 uses the electrographite of flexibility excellence compared with native graphite.In addition, graphite flake 4 pyroconductivity is in the thickness direction thereof about 10W/mK, and the pyroconductivity in the plane orthogonal with thickness direction is about 1000W/mK ~ 2000W/mK.And graphite flake 4 preferably can tolerate general folding resistance test (R=2mm, 270 °, 10,000 times).This is because graphite flake 4 and binding agent 5 will be made in operation afterwards together to bend.The GRAPHINITY (registered trade mark) that the present embodiment uses Co., Ltd. KANEKA (Co., Ltd. カ ネ カ) to make is as graphite flake 4.
As binding agent 5, the binding agent of such as epoxy resin can be used.Binding agent 5 is not limited to epoxy resin, also can use the general binding agent with flexibility and retractility.In addition, the film forming binding agent 5 on the surface of graphite flake 4 is not limited to applied adhesive 5, also can paste the binding agent 5 being formed as sheet on the surface of graphite flake 4.
As the next operation forming heat carrier 20, as shown in Figure 4, using the central shaft of ready column core 7 as winding, conducting strip 6 that core 7 reels is to form the operation of heat carrier 20.Here, copper or aluminium etc. is used to have the metal of high thermal conductance as core 7.This is to prevent the synthesis pyroconductivity of heat carrier 20 from reducing.
From Fig. 5 and Fig. 6, if be wound on core 7 by conducting strip 6, then core 7 is as central shaft, and the film alternately configuration of graphite flake 4 and binding agent 5, conducting strip 6 is formation tubular around core 7.In addition, as shown in Figure 6, the layer inside graphite flake 4 and form helical form relative to the layer bonding that the layer inside this is positioned at outer one deck, can make the form trait tubular of conducting strip 6 by bonding like this.
In addition, because the pyroconductivity of graphite flake 4 on its thickness direction is about 10W/mK, in heat carrier 20, the heat trnasfer on the radioactive ray direction using core 7 as center becomes difficulty.On the other hand, because the pyroconductivity of graphite flake 4 in the plane orthogonal with thickness direction is about 1000W/mK ~ 2000W/mK, in heat carrier 20, the bearing of trend heat trnasfer along core 7 becomes easy.That is, the pyroconductivity on the direction that the thermal conductivity ratio of heat carrier 20 on the direction of principal axis of winding is orthogonal with this direction of principal axis is high.Heat carrier 20 involved by the present embodiment comprises binding agent 5, although lower than the pyroconductivity of graphite flake 4 monomer, the pyroconductivity on this axis direction is about 900W/mK.
Here, the pyroconductivity of heat carrier 20 decides according to the synthesis of each pyroconductivity of graphite flake 4, binding agent 5 and core 7.Thus, by changing the ratio of the sectional area of each parts in figure 6, the pyroconductivity of heat carrier 20 can easily be changed.Such as, the pyroconductivity of heat carrier 20 can be done and suitably adjust in the scope of 400W/mK ~ 1200W/mK.In addition, because the pyroconductivity of core 7 monomer is about 400W/mK, the pyroconductivity of heat carrier 20 preferably adjusts, thereby, it is possible to make full use of the characteristic of graphite flake 4 in the scope of 800W/mK ~ 1200W/mK.
Further, in the heat carrier 20 involved by the present embodiment, due to the binding agent 5 reeling soft around core 7, on the radioactive ray direction centered by core 7, heat carrier 20 can stretch.In other words, heat carrier 20 possesses retractility on the direction orthogonal with the bearing of trend of core 7.
Then, the size of the through hole 2 of the heat carrier 20 coordinated insulation substrate 1 formed through above-mentioned operation is cut off, as shown in Figure 7, carries out heat carrier filling work procedure, the heat carrier 20 after above-mentioned cut-out is filled in the through hole 2 of insulated substrate 1.Here, the cut-out of heat carrier 20 uses general metal-shearing machine, and heat carrier 20 is slightly longer than the degree of depth of through hole 2.This is in order to by grinding step afterwards, makes heat carrier 20 and metal level 3 at grade.
In addition, when filling heat carrier 20, the direction of adjustment heat carrier 20 makes the bearing of trend of the core 7 of heat carrier 20 parallel with the bearing of trend (depth direction) of through hole 2.In other words, in through hole 2, fill heat carrier 20, the pyroconductivity on the direction making the thermal conductivity ratio on the bearing of trend of through hole 2 orthogonal with this bearing of trend is high.Take this, heat can be delivered to another face from a face the 1st of insulated substrate 1 the 1a and the 2nd 1b well via heat carrier 20.That is, the heat dissipation path of through insulated substrate 1 is formed.
Here, although the diameter of heat carrier 20 is set as slightly larger than the diameter of through hole 2, but as mentioned above because heat carrier 20 has retractility on the direction orthogonal with the bearing of trend of core 7, the periphery of through hole 2 need not be destroyed, can easily heat carrier 20 be filled in through hole 2.In addition, being filled into after in through hole 2 by heat carrier 20, because the diameter of heat carrier 20 is slightly larger than the diameter of through hole 2, heat carrier 20 can not come off from through hole 2.In addition, when the diameter of heat carrier 20 is slightly less than the diameter of through hole 2, other binding agents can be coated with on the surface of heat carrier 20, by this binding agent, heat carrier 20 be fixed in through hole 2.
Then, as shown in Figure 8, carry out grinding step, grinding heat carrier 20 makes metal level 3 and heat carrier 20 at grade.Grinding uses general lapping device, and the outstanding part of heat carrier 20 of pruning, makes the surface of the exposing surface of heat carrier 20 and metal level 3 be positioned at same plane.The reason implementing such grinding step is because on printed wiring board 10 when semiconductor element mounted thereon or radiator, from the view point of raising radiating efficiency, can directly over heat carrier 20 or immediately below configure this semiconductor element or radiator.That is, the installed surface in order to the mounting related components making semiconductor element or radiator etc. is smooth, implements grinding step.
Then, as shown in Figure 9, the exposing surface of heat carrier 20 carries out the operation of covering metal.Specifically, identical with formation metal level 3, by electric field plating method, the exposing surface of heat carrier 20 and the surface of metal level 3 form the metal level 8 formed by copper plating film.Like this, by forming metal level 8, to be not only directly over heat carrier 20 or immediately below the heat that produces, the heat produced around it also can be dispelled the heat by metal level 8 and heat carrier 20, thus as printed wiring board 10, can have more excellent thermal diffusivity.In addition, by forming metal level 8, can reliably prevent heat carrier 20 from coming off in through hole 2.
In addition, form the method for the film as metal level 8, electroless plating can be adopted to cover the general film build method such as method, chemical vapour deposition technique (CVD) or physical vaporous deposition (PVD method).
Through above-mentioned manufacturing process, complete printed wiring board 10 as shown in Figure 9.Printed wiring board 10 involved by the present embodiment metal level 3, the through hole 2 of through insulated substrate 1 and the heat carrier 20 of filling vias 2 that by insulated substrate 1, on the surface of insulated substrate 1, (side of the 1st 1a, second 1b, through hole 2) is formed are formed.Here, heat carrier 20 is described above, possesses and will be coated with the shape of graphite flake 4 using core 7 as the central shaft wound into rolls of winding of binding agent 5 from the teeth outwards.
In addition, in printed wiring board 10, the pyroconductivity being filled in the heat carrier 20 in through hole 2 is about 900W/mK on the bearing of trend of through hole, and the direction orthogonal with the bearing of trend of through hole is about 10W/mK.Namely, in the printed wiring board 10 of the present embodiment, bearing of trend along heat carrier 20 has excellent thermal diffusivity, the heat that of printed wiring board 10 face produces can be delivered on another face well, and can dispel the heat on this another face.
In the printed wiring board 10 that the present embodiment relates to, because the graphite flake 4 had than the heat carrier be only made up of metal (such as copper) more high thermoconductivity is wound into helical form relative to core 7, by graphite flake 4 plane on pyroconductivity be used as pyroconductivity on the bearing of trend of heat carrier 20, thickness direction along printed wiring board 10 forms the heat dissipation path (that is, heat carrier 20) had than the heat dissipation path be made up of metallic monomer more high thermoconductivity.Utilize the structure of such printed wiring board 10, even if the caloric value of the semiconductor element carried and radiator increases, compared with the situation of metallic monomer, also do not need to increase heat carrier 20, can not packing density be reduced.In addition, by changing the composition of the graphite flake 4, binding agent 5 and the core 7 that form heat carrier 20, the pyroconductivity of heat carrier 20 freely can be set in the scope of 400W/mK ~ 1200W/mK, therefore without the need to changing the size of heat carrier 20 (namely, remain on smaller size), the heat dissipation path of the characteristic of the most applicable semiconductor element and radiator can be formed.
In addition, in the printed wiring board 10 that the present embodiment relates to, because heat carrier 20 comprises the binding agent 5 with flexibility, when filling heat carrier 20, damaged and damage can not be there is on the insulated substrate 1 be positioned at around through hole 2.Thus, also can keep excellent insulation tolerance when using printed wiring board 10, improving the reliability of printed wiring board 10 itself.
In addition, in the above-described embodiment, although use core 7 to form heat carrier 20, also can not use core 7, but form heat carrier 20 by graphite flake 4 and binding agent 5.By adopting such structure, the pyroconductivity as heat carrier 20 becomes higher, improves the thermal diffusivity of printed wiring board 10.
Symbol description
1 insulated substrate
1a the 1st
1b the 2nd
2 through holes
3 metal levels
4 graphite flakes
5 binding agents
6 conducting strips
7 cores
8 metal levels
10 printed wiring boards
20 heat carriers
Claims (15)
1. a printed wiring board, is characterized in that, comprising:
Insulated substrate;
The metal level that the surface of described insulated substrate is formed;
The through hole of through described insulated substrate; And
Fill the heat carrier of described through hole,
Described heat carrier has the shape of the graphite flake wound into rolls by being coated with binding agent on the surface.
2. printed wiring board as claimed in claim 1, is characterized in that,
Pyroconductivity on the direction that the thermal conductivity ratio of described heat carrier on the bearing of trend of described through hole is orthogonal with described bearing of trend is high.
3. printed wiring board as claimed in claim 1 or 2, is characterized in that,
The pyroconductivity of described heat carrier on the bearing of trend of described through hole is 800W/mK ~ 1200W/mK.
4. printed wiring board as claimed any one in claims 1 to 3, is characterized in that,
Described heat carrier has retractility on the direction orthogonal with the bearing of trend of described through hole.
5. the printed wiring board according to any one of Claims 1-4, is characterized in that,
Described heat carrier comprises column core, has the structure be wound on by described graphite flake on described core.
6. a manufacture method for printed wiring board, is characterized in that, comprising:
Insulated substrate is formed the operation of through hole;
The surface of described insulated substrate is formed the operation of metal level;
The graphite flake wound into rolls being coated with binding agent is on the surface formed the operation of heat carrier; And
The operation of described heat carrier is filled in described through hole.
7. the manufacture method of printed wiring board as claimed in claim 6, is characterized in that,
In the operation of filling described heat carrier, it is high with the pyroconductivity on the direction making the thermal conductivity ratio on the bearing of trend of described through hole orthogonal with described bearing of trend to fill described heat carrier.
8. the manufacture method of printed wiring board as claimed in claims 6 or 7, is characterized in that,
In the operation forming described heat carrier, described graphite flake is wound on column core.
9. the manufacture method of the printed wiring board according to any one of claim 6 to 8, is characterized in that,
There is the operation of grinding described heat carrier, make described heat carrier and described metal level at grade.
10. the manufacture method of the printed wiring board according to any one of claim 6 to 9, is characterized in that,
After the described heat carrier of filling, there is the operation of covering metal on the exposing surface of described heat carrier.
11. 1 kinds of heat carriers, is characterized in that, comprising:
Graphite flake; And
Be coated on the binding agent on the surface of described graphite flake,
By described binding agent by described graphite flake wound into rolls.
12. heat carriers as claimed in claim 11, is characterized in that,
Pyroconductivity on the direction that thermal conductivity ratio on the direction of principal axis of winding is orthogonal with described direction of principal axis is high.
13. heat carriers as described in claim 11 or 12, is characterized in that,
Pyroconductivity on described direction of principal axis is 800W/mK ~ 1200W/mK.
14. heat carriers according to any one of claim 11 to 13, is characterized in that,
The direction orthogonal with described direction of principal axis has retractility.
15. heat carriers according to any one of claim 11 to 14, is characterized in that,
Described heat carrier comprises column core, has described graphite flake around the structure on described core.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2013/061581 WO2014171004A1 (en) | 2013-04-19 | 2013-04-19 | Printed wiring board, manufacturing method for same, and thermally conductive body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105247968A true CN105247968A (en) | 2016-01-13 |
Family
ID=51730973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380077071.5A Pending CN105247968A (en) | 2013-04-19 | 2013-04-19 | Web page output selection |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5873214B2 (en) |
| KR (1) | KR20150143578A (en) |
| CN (1) | CN105247968A (en) |
| TW (1) | TW201513738A (en) |
| WO (1) | WO2014171004A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108353498B (en) * | 2015-12-24 | 2020-10-09 | 名幸电子股份有限公司 | Substrate and method for manufacturing substrate |
| KR102505443B1 (en) * | 2017-11-16 | 2023-03-03 | 삼성전기주식회사 | Printed circuit board |
| CN115884526B (en) * | 2022-09-06 | 2023-09-15 | 珠海越亚半导体股份有限公司 | Manufacturing method of high-heat-dissipation hybrid substrate and semiconductor structure |
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| JP2010003981A (en) * | 2008-06-23 | 2010-01-07 | Kaneka Corp | Heat-conducting sheet with graphite oriented in thickness direction |
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| EP1480269A1 (en) | 2003-05-13 | 2004-11-24 | Agilent Technologies Inc | Printed Circuit Board with improved cooling of electrical component |
| JP2010080572A (en) * | 2008-09-25 | 2010-04-08 | Denso Corp | Electronic equipment |
| JP5546778B2 (en) | 2009-03-04 | 2014-07-09 | 株式会社日立国際電気 | Printed circuit board and printed circuit board manufacturing method |
-
2013
- 2013-04-19 KR KR1020157031783A patent/KR20150143578A/en not_active Application Discontinuation
- 2013-04-19 CN CN201380077071.5A patent/CN105247968A/en active Pending
- 2013-04-19 WO PCT/JP2013/061581 patent/WO2014171004A1/en active Application Filing
- 2013-04-19 JP JP2015512263A patent/JP5873214B2/en not_active Expired - Fee Related
-
2014
- 2014-03-26 TW TW103111183A patent/TW201513738A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003981A (en) * | 2008-06-23 | 2010-01-07 | Kaneka Corp | Heat-conducting sheet with graphite oriented in thickness direction |
| JP2010263003A (en) * | 2009-04-30 | 2010-11-18 | Nippon Dourooingu:Kk | Heat-conducting structure of printed board |
| CN102057083A (en) * | 2009-07-21 | 2011-05-11 | 丰田自动车株式会社 | Seed-crystal shaft for single-crystal growth by solution method |
| CN102883519A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2014171004A1 (en) | 2017-02-16 |
| KR20150143578A (en) | 2015-12-23 |
| TW201513738A (en) | 2015-04-01 |
| JP5873214B2 (en) | 2016-03-01 |
| WO2014171004A1 (en) | 2014-10-23 |
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