CN105239118A - Electroplating jig - Google Patents
Electroplating jig Download PDFInfo
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- CN105239118A CN105239118A CN201410270541.6A CN201410270541A CN105239118A CN 105239118 A CN105239118 A CN 105239118A CN 201410270541 A CN201410270541 A CN 201410270541A CN 105239118 A CN105239118 A CN 105239118A
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- electroplate liquid
- electroplate
- space
- jig
- conductor wire
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Abstract
The invention provides an electroplating jig. The electroplating jig is provided with a clamping assembly capable of elastically clamping and positioning a round electric lead. The clamping assembly can cover a nonselective area of the clamped round electric lead and uncover a selective area of the clamped round electric lead so as to make contact with an electroplate liquid, only the selective area of the round electric lead can be electroplated during electroplating, so that waste of an electroplating material in the electroplate liquid is reduced, and the electroplating jig can be used for a manufacturing process of twisted-pair connector conductive terminals so as to reduce gold waste. Besides, the electroplating jig is further provided with a jig flow guide cover which can decrease flow speed of the electroplate liquid inside the electroplating jig.
Description
Technical field
The present invention relates to a kind of electroplate jig, particularly relate to a kind of in plating tank to the electroplate jig electroplated of selective area of circle conductor wire.
Background technology
Along with the universal of network and development, the twisted pair connector that can be used for signal high-speed transfer is widely used, twisted pair connector is mainly divided into two kinds, and a kind of RJ11 junctor used for communication network, another kind is the RJ45 junctor of LAN and broad band network application.The conducting terminal of twisted pair connector can select copper to become usually; but copper reduces electroconductibility through using easily generation oxidation for a long time; for increasing electroconductibility and the oxidation-resistance of copper; usually also one deck nickel can be plated on copper; because the reduction potential of nickel is less than copper; and easilier than copper to be oxidized, fine and close nickel oxide layer can be formed at the outside surface of copper, to protect copper not oxidized.In addition, also can plated with gold on the outside surface of conducting terminal nickel dam, with the conductivity utilizing gold excellent, improve the signal transmission capabilities of conducting terminal.
Because gold is noble metal, therefore the manufacturers of each large conducting terminal thinks hard invariably, in the making processes of conducting terminal, how to reduce the usage quantity of gold, increases the competitive power of product to save the expenditure of material cost.Because the conductive contact position of conducting terminal is usually only at regional area, so someone proposes only gold-plated signal transmission capabilities of just reaching to promote in the contact site of conducting terminal then, use the idea of the usage quantity of saving gold.The conducting terminal of current twisted pair connector, the copper cash that someone can have a circular cross section with whole bundle is made through the mode cutting and bend, so can reduce the production process of conducting terminal and the loss of copper material, but there is no effective ways at present can only carry out gold-plated for the regional area of the circular copper cash of whole bundle, cause the outside surface of the circular copper cash of whole bundle all must be coated with thickness golden uniformly, the consume of gold is remained high.
Based on aforementioned, how gold-plated at the regional area of circular copper cash, with in the process making twisted pair connector conducting terminal, reduce the waste of gold, the real problem in the urgent need to address by art personage.
Summary of the invention
The problems such as the shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of electroplate jig, and the consumption for solving gold in prior art is large.
For achieving the above object and other relevant objects, the invention provides a kind of electroplate jig, for electroplating the selective area of circle conductor wire in plating tank, comprise: jig body, there is the tool electroplate liquid fluid-space, and the electroplate liquid entrance exposed, the electroplate liquid of described plating tank can enter the described tool electroplate liquid fluid-space by described electroplate liquid entrance; Tool pod, is located in the described tool electroplate liquid fluid-space, has the guide face of the top being positioned at described electroplate liquid entrance, guide the flowing of the electroplate liquid entered by described electroplate liquid entrance, to slow down the flow velocity of electroplate liquid in the described tool plating fluid-space; Clamp assemblies, be located at the top of described tool pod, comprise upper and lower holder and upper and lower cushion, described upper and lower holder extends frame respectively to form upper and lower interior concave space respectively, the adjacent at two ends, described upper and lower holder frame left and right is arranged with upper and lower hole slot respectively, and the width dimensions of described upper and lower hole slot and summation height dimension are greater than the wire diameter size of described round conductor wire; Described upper and lower cushion is placed in described upper and lower interior concave space respectively, and end face is respectively higher than the bottom surface of described upper and lower hole slot, for relatively near and resilient clamp described in circle conductor wire; The position of the corresponding described round conductor wire selective area in described clamp assemblies position is also formed with multiple electroplate liquid runner, run through described upper and lower holder and upper and lower cushion, the electroplate liquid that described tool is electroplated in the fluid-space flows into, and with described by clamping the exterior surface of circle conductor wire selective area to carry out selective electroplating; And lid, engage the upper holder of described clamp assemblies, there is the lid electroplate liquid fluid-space, and the electroplate liquid outlet exposed, the electroplate liquid flowed out by described upper holder can enter the described lid electroplate liquid fluid-space, and flows out via described electroplate liquid outlet and get back to described plating tank.
Alternatively, described electroplate jig also has erection bar, through described jig body, so that described jig body is set up in described plating tank.
Alternatively, described tool pod has " ㄇ " font section of opening end towards described electroplate liquid entrance.
Alternatively, described electroplate jig also has lid pod, is located in the described lid electroplate liquid fluid-space, changes or limit the flowing of the electroplate liquid flowed out by described upper holder, to slow down the flow velocity of electroplate liquid in the described lid electroplate liquid fluid-space.Described lid pod has " ㄇ " font section of opening end towards described upper holder.
Alternatively, described multiple electroplate liquid runner separates equidistant or non-isometric distance.
Alternatively, the upper and lower holder of described jig body, tool pod, clamp assemblies and lid are made up of polypropylene material.
Alternatively, the width dimensions of described upper and lower hole slot is at least greater than four times of sizes of described round conductor wire wire diameter.
Alternatively, described upper holder has identical structure with lower holder, and described upper cushion has identical structure with lower cushion.
Alternatively, described upper and lower cushion is attached to described upper and lower holder respectively.
Compared to prior art, electroplate jig of the present invention, for electroplating the selective area of circle conductor wire in plating tank.Described electroplate jig arranges the clamp assemblies with cushion, and described clamp assemblies can utilize cushion effective clamping position circle conductor wire, electroplates for circle conductor wire.Described cushion can in time clamping circle conductor wire, the effect providing and cover is used in the non-selective region of coated round conductor wire, stop non-selective region and the plating solution contacts of circle conductor wire, even if circle conductor wire is led to upper cathodic electricity, the surface in the non-selective region of circle conductor wire also can not be reacted with electroplate liquid and generate one deck plated material, so can reduce the waste of plated material in plating tank.In addition, electroplate jig of the present invention is provided with multiple electroplate liquid runner in the position of corresponding circle conductor wire optionally plating area, to make selective area energy and the plating solution contacts of circle conductor wire, and reaches and electroplates the selective area of circle conductor wire.
Accompanying drawing explanation
Fig. 1 is the component decomposition map of an embodiment of electroplate jig of the present invention.
The partial component exploded view at clamp assemblies first visual angle that Fig. 2 is electroplate jig shown in Fig. 1.
The partial component exploded view at clamp assemblies second visual angle that Fig. 3 is electroplate jig shown in Fig. 1.
Fig. 4 is the three-dimensional combination figure of electroplate jig shown in Fig. 1.
Fig. 5 is the enlarged view in E region in electroplate jig shown in Fig. 4.
The sectional view that Fig. 6 cuts off along A-A line segment for electroplate jig shown in Fig. 4.
The sectional view that Fig. 7 cuts off along B-B line segment for electroplate jig shown in Fig. 4, the direction of arrow indicated in Fig. 7 is the flow direction of electroplate liquid in electroplate jig.
The sectional view that Fig. 8 cuts off along C-C line segment for electroplate jig shown in Fig. 4, the round conductor wire shown in Fig. 8 is clamp by the upper and lower cushion of clamp assemblies respectively.
Fig. 9 is the enlarged view in F region in electroplate jig shown in Fig. 8.
Reference numerals explanation
1 electroplate jig
11 jig body
The 111 tool electroplate liquid fluid-spaces
112 electroplate liquid entrances
12 tool pods
13 clamp assemblies
Holder on 131
1311 frames
Hole slot on 13111
Concave space on 1312
132 times holders
1321 frames
13211 times hole slots
Concave space in 1322 times
Cushion on 133
134 times cushions
135 electroplate liquid runners
14 lids
The 141 lid electroplate liquid fluid-spaces
142 electroplate liquid outlets
15 erection bars
2 circle conductor wires
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this specification sheets can understand other advantages of the present invention and effect easily.
Refer to Fig. 1 to Fig. 9.Notice, structure, ratio, size etc. that this specification sheets institute accompanying drawings illustrates, content all only in order to coordinate specification sheets to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionlity or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification sheets as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
The invention provides a kind of electroplate jig, for clamping circle conductor wire in plating tank, and the non-selective region (i.e. the region of the online inessential plating of circle conduction) of round conductor wire can be covered, only allow the selective area of round conductor wire (i.e. the region of the online necessary plating of circle conduction) contact electricity plating solution, cause circle conductor wire after being led to cathodic electricity, circle conductor wire only can carry out electrolytic reaction with electroplate liquid and plates one deck plated material in selective region, and so can effectively reduce is such as the waste of the plated material of gold.Seeing also Fig. 1 to Fig. 9, is the structural representation of electroplate jig one embodiment of the present invention.
As shown in Figure 1, Figure 2 and Figure 3, electroplate jig 1 of the present invention has jig body 11, tool pod 12, clamp assemblies 13 and lid 14.Described jig body 11 can be made up of polypropylene material, and the surrounding of jig body 11 is equipped with sidewall to form the tool electroplate liquid fluid-space 111, and jig body 11 also has perforation to form the electroplate liquid entrance 112 exposed.Electroplate liquid in plating tank can enter the tool electroplate liquid fluid-space 111 of jig body 11 by electroplate liquid entrance 112.Electroplate jig 1 shown in Fig. 1 also has the erection bar 15 through jig body 11, so that jig body 11 is set up in plating tank, to provide location to jig body 11.Tool pod 12 is also optional to be made up of polypropylene material.Tool pod 12 is placed in the tool electroplate liquid fluid-space 111, there is the guide face be positioned at above electroplate liquid entrance 112, the bootable flowing of electroplate liquid at specific direction being entered the electroplate liquid fluid-space 111 by electroplate liquid entrance 112, use the flow velocity slowing down electroplate liquid in the tool plating fluid-space 111, make the height of the electroplate liquid in each region in the plating fluid-space 111 increase and be tending towards synchronous, and avoid the tool electroplate liquid electroplated in the fluid-space 111 that turbulent flow occurs, and make the electroplating effect of circle conductor wire selective area uneven.As shown in Figure 7, tool pod 12 has " ㄇ " font section (also can in for " n " font section, or fall " U " font section) of opening end towards electroplate liquid entrance 112.As shown in Figure 8, clamp assemblies 13 is located at the top of tool pod 12, has cushion with resilient clamp circle conductor wire 2.
About clamp assemblies, as shown in Figures 2 and 3, clamp assemblies 13 has upper and lower holder 131,132 and upper and lower cushion 133,134.Preferably, upper holder 131 has identical structure with lower holder 132, and upper cushion 133 has identical structure with lower cushion 134.The side of upper and lower holder 131,132 extends frame 1311,1321 respectively, to form upper and lower interior concave space 1312,1322 respectively.Upper and lower cushion 133,134 can be placed in upper and lower interior concave space 1312,1322 respectively, and can be attached to upper and lower holder 131,132 respectively.The adjacent at two ends, upper and lower holder 131,132 frame left and right is arranged with upper and lower hole slot 13111,13211 respectively.Shown in Fig. 5, the width dimensions W3 of upper and lower hole slot and summation height dimension H is greater than the wire diameter dimension D of round conductor wire 2, with avoid upper and lower holder 131,132 relatively near time folder bad circle conductor wire 2, make circle conductor wire 2 can stretch out clamp assemblies 13 via upper and lower hole slot smoothly.Preferably, the width dimensions W3 of upper and lower hole slot is at least greater than four times of round conductor wire 2 wire diameter dimension D, and electroplate jig of the present invention can be electroplated the selective area of the round conductor wire 2 of at least four simultaneously.
Be placed in the end face of the upper and lower cushion 133,134 of upper and lower interior concave space 1312,1322 respectively respectively higher than the bottom surface of upper and lower hole slot 13111,13211, when upper and lower cushion 133,134 relatively near time can by both end face resilient clamp circle conductor wire, with to circle conductor wire clamping position is provided.The privileged site of clamp assemblies 13 corresponding circle conductor wire selective area also has through hole to form multiple electroplate liquid runner 135, described multiple electroplate liquid runner 135 runs through described upper and lower holder 131,132 and upper and lower cushion 133,134, make the electroplate liquid in the tool plating fluid-space 111, clamp assemblies 13 can be flow to by electroplate liquid runner 135, and contact is subject to the selective area of the round conductor wire that clamp assemblies 13 clamps, to electroplate the selective area of circle conductor wire.Now, the non-selective region of the coated round conductor wire 2 of upper and lower cushion 133,134 meeting is to provide the effect of covering, stop non-selective region and the plating solution contacts of circle conductor wire 2, even if therefore circle conductor wire is led to upper cathodic electricity, the non-selective region surface of circle conductor wire also can not be coated with plated material, so can reduce the waste of plated material in plating tank.
It should be noted that as shown in Figure 1, described multiple electroplate liquid runner 135 according to the scope of circle conductor wire 2 selective area, can separate equidistant or non-isometric distance.Multiple electroplate liquid runner 135 stated by tool pod 12 also incomplete shelter, the electroplate liquid that tool is electroplated in the fluid-space 111 flows into clamp assemblies 13 via described multiple electroplate liquid runner 135 smoothly, to contact the selective area being subject to the round conductor wire that clamp assemblies 13 clamps.
About lid 14 of the present invention, can be made up of polypropylene material, and can engage with the upper holder 131 of described clamp assemblies 13.The surrounding of lid 14 is equipped with sidewall to form the lid electroplate liquid fluid-space 141, and there is perforation to form the electroplate liquid outlet 142 exposed, the electroplate liquid flowed out by upper holder 131 can enter in the lid electroplate liquid fluid-space 141, and gets back to plating tank via electroplate liquid outlet 142 outflow electroplate jig 1.Electroplate jig of the present invention also can arrange lid pod in the described lid electroplate liquid fluid-space, with flowing towards specific direction of the electroplate liquid flowed out by upper holder by guiding, reach slowing down of electroplate liquid flow velocity in the lid electroplate liquid fluid-space, in one embodiment of the invention, lid pod can have " ㄇ " font section (also can in for " n " font section, or fall " U " font section) of opening end towards upper holder.
In sum, the present invention provides a kind of electroplate jig, has clamp assemblies, to utilize cushion resilient clamp circle conductor wire, and when electroplating, circle conductor wire is provided to location and covers.The position of the selective area of clamp assemblies corresponding circle conductor wire is also formed with multiple electroplate liquid runner, enable electroplate liquid through clamp assemblies, and contact with the selective area of the round conductor wire of clamping, to electroplate the selective area of circle conductor wire, so to reduce the waste of plated material, electroplate jig of the present invention is used in the processing procedure of twisted pair connector conducting terminal, to reduce the waste of gold.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (10)
1. an electroplate jig, for electroplating the selective area of circle conductor wire in plating tank, is characterized in that, comprise:
Jig body, has the tool electroplate liquid fluid-space, and the electroplate liquid entrance exposed, and the electroplate liquid of described plating tank can enter the described tool electroplate liquid fluid-space by described electroplate liquid entrance;
Tool pod, is located in the described tool electroplate liquid fluid-space, has the guide face of the top being positioned at described electroplate liquid entrance, guide the flowing of the electroplate liquid entered by described electroplate liquid entrance, to slow down the flow velocity of electroplate liquid in the described tool plating fluid-space;
Clamp assemblies, be located at the top of described tool pod, comprise upper and lower holder and upper and lower cushion, described upper and lower holder extends frame respectively to form upper and lower interior concave space respectively, the adjacent at two ends, described upper and lower holder frame left and right is arranged with upper and lower hole slot respectively, and the width dimensions of described upper and lower hole slot and summation height dimension are greater than the wire diameter size of described round conductor wire; Described upper and lower cushion is placed in described upper and lower interior concave space respectively, and end face is respectively higher than the bottom surface of described upper and lower hole slot, for relatively near and resilient clamp described in circle conductor wire; The position of the corresponding described round conductor wire selective area in described clamp assemblies position is also formed with multiple electroplate liquid runner, run through described upper and lower holder and upper and lower cushion, the electroplate liquid that described tool is electroplated in the fluid-space flows into, and with described by clamping the exterior surface of circle conductor wire selective area to carry out selective electroplating; And
Lid, engage the upper holder of described clamp assemblies, there is the lid electroplate liquid fluid-space, and the electroplate liquid outlet exposed, the electroplate liquid flowed out by described upper holder can enter the described lid electroplate liquid fluid-space, and flows out via described electroplate liquid outlet and get back to described plating tank.
2. electroplate jig according to claim 1, is characterized in that: also have erection bar, through described jig body, so that described jig body is set up in described plating tank.
3. electroplate jig according to claim 1, is characterized in that: described tool pod has " ㄇ " font section of opening end towards described electroplate liquid entrance.
4. electroplate jig according to claim 1, it is characterized in that: also there is lid pod, be located in the described lid electroplate liquid fluid-space, change or limit the flowing of the electroplate liquid flowed out by described upper holder, to slow down the flow velocity of electroplate liquid in the described lid electroplate liquid fluid-space.
5. electroplate jig according to claim 4, is characterized in that: described lid pod has " ㄇ " font section of opening end towards described upper holder.
6. electroplate jig according to claim 1, is characterized in that: described multiple electroplate liquid runner separates equidistant or non-isometric distance.
7. electroplate jig according to claim 1, is characterized in that: upper and lower holder and the lid of described jig body, tool pod, clamp assemblies are made up of polypropylene material.
8. electroplate jig according to claim 1, is characterized in that: the width dimensions of described upper and lower hole slot is at least greater than four times of sizes of described round conductor wire wire diameter.
9. electroplate jig according to claim 1, is characterized in that: described upper holder has identical structure with lower holder, and described upper cushion has identical structure with lower cushion.
10. electroplate jig according to claim 1, is characterized in that: described upper and lower cushion is attached to described upper and lower holder respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410270541.6A CN105239118B (en) | 2014-06-17 | 2014-06-17 | Electroplate jig |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410270541.6A CN105239118B (en) | 2014-06-17 | 2014-06-17 | Electroplate jig |
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| CN105239118A true CN105239118A (en) | 2016-01-13 |
| CN105239118B CN105239118B (en) | 2017-10-31 |
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| CN201410270541.6A Active CN105239118B (en) | 2014-06-17 | 2014-06-17 | Electroplate jig |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111455438A (en) * | 2020-03-11 | 2020-07-28 | 贵州振华群英电器有限公司（国营第八九一厂） | Local electroplating fixture for relay base |
| CN112725853A (en) * | 2021-01-27 | 2021-04-30 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN116427002A (en) * | 2023-04-20 | 2023-07-14 | 黄山广捷表面处理科技有限公司 | Surface treatment process of pin type heat dissipation substrate and selective plating jig |
| CN117488386A (en) * | 2024-01-02 | 2024-02-02 | 深圳市星汉激光科技股份有限公司 | Fitting and partial plating method of laser housing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111455438A (en) * | 2020-03-11 | 2020-07-28 | 贵州振华群英电器有限公司（国营第八九一厂） | Local electroplating fixture for relay base |
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| CN112725853A (en) * | 2021-01-27 | 2021-04-30 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN112725853B (en) * | 2021-01-27 | 2022-09-09 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN116427002A (en) * | 2023-04-20 | 2023-07-14 | 黄山广捷表面处理科技有限公司 | Surface treatment process of pin type heat dissipation substrate and selective plating jig |
| CN116427002B (en) * | 2023-04-20 | 2023-10-24 | 黄山广捷表面处理科技有限公司 | Surface treatment process of pin type heat dissipation substrate and selective plating jig |
| CN117488386A (en) * | 2024-01-02 | 2024-02-02 | 深圳市星汉激光科技股份有限公司 | Fitting and partial plating method of laser housing |
| CN117488386B (en) * | 2024-01-02 | 2024-05-07 | 深圳市星汉激光科技股份有限公司 | Fitting and partial plating method of laser housing |
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| CN105239118B (en) | 2017-10-31 |
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Effective date of registration: 20190527 Address after: 518100 1st floor, 187 Tengfeng Avenue, Phoenix Community, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SONG FU ELECTRONICS CO.,LTD. Address before: 4th Floor, 302 Yingming Road, Lingya District, Kaohsiung City, Taiwan, China Patentee before: Yu Changhong |
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Effective date of registration: 20210112 Address after: 523000 No.1 Shangnan Road, Shangjiao community, Chang'an Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN SIWEB CONNECTORS Co.,Ltd. Address before: 518100 1st floor, 187 Tengfeng Avenue, Phoenix Community, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN SONG FU ELECTRONICS Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 303, Building 1, No.1, Zhupingsha Keji 5th Road, Wangniudun Town, Dongguan City, Guangdong Province, 523215 Patentee after: Dongguan Sisuo Technology Co.,Ltd. Address before: 523000 No.1 Shangnan Road, Shangjiao community, Chang'an Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN SIWEB CONNECTORS Co.,Ltd. |