CN105238312B - A kind of automobile using structure glue and preparation method thereof - Google Patents
A kind of automobile using structure glue and preparation method thereof Download PDFInfo
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- CN105238312B CN105238312B CN201510603853.9A CN201510603853A CN105238312B CN 105238312 B CN105238312 B CN 105238312B CN 201510603853 A CN201510603853 A CN 201510603853A CN 105238312 B CN105238312 B CN 105238312B
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Abstract
The invention belongs to structure glue technical field, more particularly to a kind of automobile using structure glue and preparation method thereof.The present invention adds metallic particles in epoxide-resin glue component, can adjust bondline thickness, while plays a part of destroying surface oxide layer, promotes welding；Epoxide-resin glue is mixed with solder, can effective wetting metal component surface, and firm solder joint is formed between hardware, welding has synergy with solidification process；The automobile using structure glue of the present invention is while epoxy resin adhesive curing, realize the welding of brazing metal, excellent in mechanical performance, with the changing of solder dosage, T-shaped peel strength lifting 30%, cross tensile strength lifting 20%~55%, shear strength lifting 10%~30%, the structural bond of automobile body-in-white hardware, such as complete vehicle structure bonding, door-plate and floor bonding, folded edges bonding can be efficiently applied to.
Description
Technical field
The invention belongs to structure glue technical field, more particularly to a kind of automobile using structure glue and preparation method thereof.
Background technology
With the development of automotive light weight technology technology, numerous polymeric adhesion materials is developed application.Wherein structural bond
Material be used to substitute the modes such as traditional riveting, welding, and weight is greatly reduced on the premise of structural strength is ensured.State at present
The structure glue used in inside and outside automobile production mainly has epoxy resin adhesive, polyurethanes adhesive, polyacrylate
Adhesive, polyvinyl chloride adhesive etc. are more using different to realize the mechanical properties such as higher impact strength and modulus of elasticity
The high polymer material of type is modified processing, and the lifting of performance is often limited, the automotive engineering that can not meet quickly to update
It is required that.
Epoxy resin structure glue has the advantages that intensity is high, anticorrosive, wet-heat resisting, is the commonly used knot of automobile industry
Structure bonded adhesives, such as masses, Buick, general brand have use.But epoxy resin structure glue the problem of existing is fragility
Greatly, shock resistance stripping ability deficiency etc., the method used in the industry is confined to add the mode such as modified epoxy or toughener, right
The improvement limitation of mechanical property.
The glue welding technology used in auto manufacturing technology, be that adhesive is used in combination with spot-welding technology, by welding with
It is glued and has complementary advantages, obtains preferable antistripping, antifatigue and static strength.But such method complex operation is, it is necessary to special
Spot-welding equipment, and spot welding is high with glue cost, has ablation to glue-line in welding process.Not yet have been reported that structure glue and eutectic at present
Point solder combinations simultaneously synchronously realize the method being glued with welding.
In summary, develop it is a kind of possess high tenacity, the synchronization of high-adhesive-strength realizes that the structure glue of welding-splicing is ten
Divide with application prospect.
The content of the invention
The present invention be directed to above-mentioned the shortcomings of the prior art, there is provided a kind of automobile using structure glue of excellent in mechanical performance and
Its preparation method.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of automobile using structure glue, by epoxide-resin glue A groups
Divide and solder B component is 10 in mass ratio:(1~5) mixing composition；
Wherein described epoxide-resin glue component A includes by weight percentage：0~50% epoxy resin, 10~40%
Modified epoxy, 0~10% diluent, 2~10% latent curing agents, 0~5% coupling agent, 5~35% fillers, 1~
10% anti-settling agent and 1~10% metallic particles；
Described solder B component includes by weight percentage：90~96% solders, 1~4% scaling powder and 0~
6% flux vehicle.
The preparation method of automobile using structure glue described above, step are as follows：
(1) by 0~50wt% epoxy resin, 10~40wt% modified epoxies, 0~10wt% diluents, 2~
10wt% latent curing agents, 0~5wt% coupling agents, 5~35wt% fillers, 1~10wt% anti-settling agents and 1~10wt% gold
Metal particles are added in double-planet power mixer, and 20~30min is dispersed with stirring under the conditions of 5~35 DEG C, make each component scattered equal
It is even, it is evacuated to below -0.09MPa and continues 60~90min of stirring, obtains epoxide-resin glue component A；
(2) 0~6wt% flux vehicles are heated into 60~130 DEG C makes its melting, adds 1~4wt% scaling powders, stirs
30~60min is mixed, continuously adds 90~96wt% solders, 30min is stirred in -0.09MPa, is down to 20~25 DEG C, grinding
Decentralized processing, hermetically drying, obtain solder B component；
(3) by the epoxide-resin glue component A that step (1) obtains and the solder B component that step (2) obtains by being in mass ratio
10:(1~5) mix, produce automobile using structure glue.
Wherein, described epoxy resin is tetraglycidel ether epoxy resin, ethylene oxidic ester epoxy resin, glycidyl amine
Epoxy resin, cycloaliphatic epoxy resin, organosilicon epoxy resin, epoxy olefins resinoid or acid imide epoxy resin one kind or
Two or more mixing.
Described modified epoxy is carboxyl end of the liquid acrylonitrile-butadiene rubber modified epoxy or nano-rubber modified epoxy
The chemical work in HH-0801 or Japanese clocks deep pool of one or two kinds of mixing of resin, preferably Shenzhen West China Hong Ji Science and Technology Ltd.s
The MX-125 of industry Co., Ltd..
Described diluent is one or two kinds of combinations of bicyclic epoxide reactive diluent or three epoxy radicals reactive diluents,
Preferably diglycidyl ether, polypropylene glycol diglycidyl ether, polyethyleneglycol diglycidylether, glycerine three-glycidyl
One or more kinds of mixing of ether.
Described latent curing agent is guanidine and its derivative, urea and its derivative, imidazoles metal complex, borontrifluoride
Boron-amine complex compound, the complex compound of aromatic amine and inorganic salts, organic hydrazides, super coordination silicate or one kind of more amine salt or two
Kind is mixed above, preferably dicyandiamide, sebacic dihydrazide, 4,4 ' methylene-two (phenyl dimethyl urea), sebacic dihydrazide
Or one or more kinds of mixing of 1- neighbour's base Phenylbiguanide.
Described coupling agent is silane coupling agent, silicone coupling agents, titante coupling agent or aluminate coupling
One or more kinds of mixing of agent.
Described filler is one or more kinds of mixing of metal oxide, silicon powder, carbonate or silicate, preferably
For the one or more mixing of calcium carbonate, silicon powder or aluminum oxide.
Described anti-settling agent is aerosil, rilanit special, organobentonite or one kind of polyamide wax or two
Kind is mixed above.
Described metallic particles be 0.05~0.25mm of the particle diameter reduced iron powder with corner angle, stainless steel powder, aluminium powder or
One or more kinds of mixing of copper powder.
Described solder is the alloy of the two or more elements comprising tin (Sn), lead (Pb), bismuth (Bi) or antimony (Sb),
Fusing point is 100~180 DEG C, and particle diameter is 0.1~0.4mm.
Described scaling powder is polyhydroxy base class organic compound, carboxylic acid compound, amine, amine and organic acid complex
Or one or more kinds of combinations of nitrogen-containing heterocycle compound and its complex salt, preferably glutaric acid, adipic acid, succinic acid, the last of the ten Heavenly stems
Diacid, salicylic acid, benzoic acid, laurate, dimeric dibasic acid, itaconic acid, hydroxyacetic acid, citric acid, malic acid, ribose, cellulose, miaow
Zole derivatives, diethylamine, triethylamine, monoethanolamine, diethanol amine, triethanolamine, cyclohexylamine or DBU and its derivative one kind
Or two or more mixing.
Described flux vehicle is the polyesters of 50~130 DEG C of fusing point, polyethers, polyamide-based, TPO, rosin
And its one or more kinds of mixing of derivative, terpenoid resin or ethylene-vinyl acetate copolymer (EVA), it is preferably pine
It is perfume, pentalyn, ester gum, PEPA, ethylene-vinyl acetate copolymer, polyethylene, polypropylene, poly-
One or more kinds of mixing of acid amides, paraffin or palm wax.
The beneficial effects of the invention are as follows：
1st, the present invention adds metallic particles in epoxide-resin glue component, can adjust bondline thickness, while play destruction
Surface oxide layer, the effect for promoting welding.
2nd, the present invention mixes epoxide-resin glue with solder, can effective wetting metal component surface, and in hardware
Between form firm solder joint, welding has synergy with solidification process.
3rd, automobile using structure glue of the invention realizes the welding of brazing metal, mechanics while epoxy resin adhesive curing
Excellent performance, with the change of solder dosage, T-shaped peel strength lifting 15%~30%, cross tensile strength lifting 20%
~55%, shear strength lifting 10%~30%, the structural bond of automobile body-in-white hardware can be efficiently applied to, it is such as whole
Bassinet structure bonding, door-plate and floor bonding, folded edges bonding etc..
Embodiment
The principle and feature of the present invention are described below in conjunction with example, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
The method of testing that the embodiment of the present invention uses for：
1st, cross extension test
Test is galvanized steel strap (2mm is thick, and 38mm is wide, 100mm length) with test piece, surface alcohol wipe oil removing.By automobile
Structure glue is scratched in a steel disc center section, and is bonded with another pair steel disc in middle section square crossing, is fixed with fixture, clearly
Except unnecessary glue.The right-angled intersection fixed is bonded into test piece by 180 DEG C/30min to solidify, is slowly cooled to room temperature.23
Tested at ± 2 DEG C, 5 pairs of test piece tests of every group of carry out, loading speed 1mm/min, record maximum pull and tensile strength.
2nd, T peel tests
Tested according to GB/T 2798.
Test is galvanized steel plain sheet (0.8mm is thick, and 25mm is wide, 200mm length) with test piece, surface alcohol wipe oil removing.By vapour
Bassinet structure glue is scratched on a steel disc, and is alignd and be bonded along center line with another steel disc, is fixed with fixture, is removed and is overflowed glue.
The test piece fixed is solidified by 180 DEG C/30min, is slowly cooled to room temperature.Tested at 23 ± 2 DEG C, loading speed
200mm/min, record peel off maximum, force and intensity and failure mode.
3rd, shearing test
Tested according to GB/T 7124.
Test piece used in survey is galvanized steel plain sheet (2mm is thick, and 25mm is wide, 100mm length), tests and is carried out at 23 ± 2 DEG C.Steel plate table
Face alcohol wipe oil removing, fixed, solidified by 180 DEG C/30min, and be slowly cooled to room temperature with fixture by after regulation gluing
After tested.5 pairs of test piece tests of every group of carry out, record average shear strength.
Embodiment 1
A kind of preparation method of automobile using structure glue, step are as follows：
(1) by 19wt% epoxy resin E-51,30wt% nano-rubber modified epoxies (HH-0801), the poly- second of 3wt%
Hexanediol diglycidyl ether, 18wt% nano-calcium carbonates, 10wt% silicon powders, 1.5wt% silicone coupling agents, 5wt% gas phases
Silica, 2wt% rilanit specials, 3wt% dicyandiamides, 0.5wt%4,4 ' methylene-two (phenyl dimethyl urea) and
8wt% (0.2mm) reduced iron powder is added in double-planet power mixer, and 20~30min is dispersed with stirring under the conditions of 5~35 DEG C,
Each component is uniformly dispersed, be evacuated to below -0.09MPa and continue 60~90min of stirring, obtain epoxide-resin glue component A；
(2) 3wt% pentalyns are heated into 130 DEG C makes its melting, add 0.5wt%DBU caprylates and
1.5wt% imdazole derivatives, 30~60min is stirred, continuously adds 95wt% sn-bi alloy (42%Sn and 58%Bi) ,-
0.09MPa stirs 30min, is down to 20~25 DEG C of room temperature, grinding distribution processing, hermetically drying, obtains solder B component；
(3) it is in mass ratio by the solder B component that the epoxide-resin glue component A that step (1) obtains obtains with step (2)
10:3 mixing, produce automobile using structure glue.
Obtained automobile using structure glue is tested, test result is shown in Table 1.
Embodiment 2
A kind of preparation method of automobile using structure glue, step are as follows：
(1) by 15wt% epoxy resin E-51,25wt% nbr carboxyl terminals modified epoxy, 7wt% poly- the third two
Alcohol diglycidyl ether, 25wt% nano-calcium carbonates, 10wt% silicon powders, 1wt% titanate coupling agents, 3wt% hydrogenated castors
Oil, 2.5wt% sebacic dihydrazides, 1.5wt% dicyandiamides and 10wt% (0.2mm) powder of stainless steel add double-planet power and mixed
In conjunction machine, 20~30min is dispersed with stirring under the conditions of 5~35 DEG C, each component is uniformly dispersed, is evacuated to below -0.09MPa
Continue 60~90min of stirring, obtain epoxide-resin glue component A；
(2) 5wt% PEPAs are heated 80 DEG C to melting, adds 0.5wt% imdazole derivatives, 1.1wt% penta 2
Acid and 1.4wt% triethanolamines, 30~60min is stirred, continuously adds 92wt% solders (48%Bi, 9%Sb, 28.5%
Pb and 14.5%Sn), 30min is stirred in -0.09MPa, 20~25 DEG C of room temperature is down to, grinding distribution processing, hermetically drying, must weld
Expect B component；
(3) the solder B component that the epoxide-resin glue component A for obtaining step (1) obtains with step (2) is 2 in mass ratio:
1 mixing, produces automobile using structure glue.
Obtained automobile using structure glue is tested, test result is shown in Table 1.
Embodiment 3
A kind of preparation method of automobile using structure glue, step are as follows：
(1) by 30wt% epoxy resin E-55,15wt% nano-rubber modified epoxies (MX-125), 4wt% fourths two
Alcohol diglycidyl ether, 20wt% nano-calcium carbonates, 15wt% aluminum oxide, 1wt% titanate coupling agents, the organic swellings of 3wt%
Soil, 2wt% aerosils, 4wt%1- neighbour's base Phenylbiguanide and 6wt% (0.2mm) nickel powder add double-planet power mixer
In, 20~30min is dispersed with stirring under the conditions of 5~35 DEG C, each component is uniformly dispersed, is evacuated to below -0.09MPa and continues
60~90min is stirred, obtains epoxide-resin glue component A；
(2) 6wt% ethylene-vinyl acetate copolymers are heated into 100 DEG C extremely to melt, addition 2wt% methylimidazolium butyrates,
1.5wt%DBU phenolates and 0.5wt% citric acids, stir 30~60min, continuously add 90wt% sn-bi alloy (42%Sn and
58%Bi), 30min is stirred in -0.09MPa, is down to 20~25 DEG C, grinding distribution processing, hermetically drying, obtains solder B component；
(3) the solder B component that the epoxide-resin glue component A for obtaining step (1) obtains with step (2) is 5 in mass ratio:
1 mixing, produces automobile using structure glue.
Obtained automobile using structure glue is tested, test result is shown in Table 1.
Embodiment 4
A kind of preparation method of automobile using structure glue, step are as follows：
(1) by 39wt% epoxy resin E-44s, 20wt% nano-rubbers modified epoxy (MX-125), 5wt% the third three
Alcohol triglycidyl ether, 10wt% nano-calcium carbonates, 10wt% silicon powders, 1wt% silane couplers, 3wt% organobentonites,
2wt% aerosils, 4wt%1- neighbour's base Phenylbiguanide and 6wt% (0.2mm) copper powder are added in double-planet power mixer,
20~30min is dispersed with stirring under the conditions of 5~35 DEG C, each component is uniformly dispersed, is evacuated to below -0.09MPa and continues to stir
60~90min is mixed, obtains epoxide-resin glue component A；
(2) by 100 DEG C of 6wt% heating paraffins to melting, add 2.5wt% dimeric dibasic acids, 0.5wt% malic acid and
1.0wt% ethyl imidazol(e)s, 30~60min is stirred, continuously adds 90wt% solders (42%Sn and 58%Bi) ,-
0.09MPa stirs 30min, is down to 20~25 DEG C, grinding distribution processing, hermetically drying, obtains solder B component；
(3) it is in mass ratio by the solder B component that the epoxide-resin glue component A that step (1) obtains obtains with step (2)
10:1 mixing, produces automobile using structure glue.
Obtained automobile using structure glue is tested, test result is shown in Table 1.
Embodiment 5
A kind of preparation method of automobile using structure glue, step are as follows：
(1) by 40wt% nano-rubbers modified epoxy (MX-125), 3wt% glycerin triglycidyl ethers,
32wt% nano-calcium carbonates, 10wt% silicon powders, 2wt% organobentonites, 3wt% aerosils, 5wt%1- neighbour's base benzene
Biguanides and 5wt% (0.2mm) copper powder are added in double-planet power mixer, it is dispersed with stirring 20 under the conditions of 5~35 DEG C~
30min, each component is uniformly dispersed, be evacuated to below -0.09MPa and continue 60~90min of stirring, obtain epoxide-resin glue A groups
Point；
(2) 2.5wt% dimeric dibasic acids, 0.5wt% malic acid and 1.0wt% ethyl imidazol(e)s are mixed into 30~60min, after
It is continuous to add 96wt% solders (42%Sn and 58%Bi), 30min is stirred in -0.09MPa, is down to 20~25 DEG C, grinding point
Processing is dissipated, hermetically drying, obtains solder B component；
(3) by the epoxide-resin glue component A that step (1) obtains and the solder B component that step (2) obtains by being in mass ratio
10:1 mixing, produces automobile using structure glue.
For difference with the prior art of the present invention is better described, following comparative example is now enumerated.
Comparative example 1
Automobile using structure glue is prepared only with the epoxide-resin glue component A in embodiment 1, is tested, test result is shown in
Table 1.
Comparative example 2
Automobile using structure glue is prepared only with the epoxide-resin glue component A in embodiment 2, is tested, test result is shown in
Table 1.
Comparative example 3
Automobile using structure glue is prepared only with the epoxide-resin glue component A in embodiment 3, is tested, test result is shown in
Table 1.
Comparative example 4
Automobile using structure glue is prepared only with the epoxide-resin glue component A in embodiment 4, is tested, test result is shown in
Table 1.
Comparative example 5
Automobile using structure glue is prepared only with the epoxide-resin glue component A in embodiment 5, is tested, test result is shown in
Table 1.
Table 1
Show that automobile using structure glue is compared to comparative example made from 1-5 of the embodiment of the present invention, hence it is evident that has by the analysis of table 1
Higher cross tensile strength, T-shaped peel strength and lap shear strength, while epoxy resin adhesive curing, realizes metal
The welding of solder, excellent in mechanical performance, with the change of solder dosage, T-shaped peel strength lifting 15%~30%, cross is drawn
Strength enhancing 20%~55% is stretched, shear strength lifting 10%~30%, automobile body-in-white hardware can be efficiently applied to
Structural bond, such as complete vehicle structure bonding, door-plate and floor bonding, folded edges bonding.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (7)
1. a kind of automobile using structure glue, it is characterised in that be 10 in mass ratio by epoxide-resin glue component A and solder B component:(1
~5) mixing composition；
Wherein described epoxide-resin glue component A includes by weight percentage：0~50% epoxy resin, 10~40% are modified
Epoxy resin, 0~10% diluent, 2~10% latent curing agents, 0~5% coupling agent, 5~35% fillers, 1~10% are prevented
Heavy agent and 1~10% metallic particles；
Described solder B component includes by weight percentage：90~96% solders, 1~4% scaling powder and 0~6wt%
Flux vehicle；
Wherein, described epoxy resin is tetraglycidel ether epoxy resin, ethylene oxidic ester epoxy resin, glycidyl amine epoxy
Resin, cycloaliphatic epoxy resin, organosilicon epoxy resin, the one or two of epoxy olefins resinoid or acid imide epoxy resin
It is mixed above；
Described modified epoxy is carboxyl end of the liquid acrylonitrile-butadiene rubber modified epoxy or nano-rubber modified epoxy
One or more kinds of mixing；
Described diluent is one or more kinds of mixing of bicyclic epoxide reactive diluent or three epoxy radicals reactive diluents；
Described latent curing agent is guanidine and its derivative, urea and its derivative, imidazoles metal complex, boron trifluoride-amine
Class complex compound, the complex compound of aromatic amine and inorganic salts, organic hydrazides, the super one or more for being coordinated silicate or more amine salt
Mixing；
Described coupling agent is silane coupling agent, silicone coupling agents, titante coupling agent or aluminate coupling agent
One or more mixing；
Described filler is one or more kinds of mixing of metal oxide, silicon powder, carbonate or silicate；
Described anti-settling agent be aerosil, rilanit special, organobentonite or polyamide wax it is one or two kinds of with
Upper mixing；
Described metallic particles is 0.05~0.25mm of the particle diameter reduced iron powder with corner angle, stainless steel powder, aluminium powder or copper powder
One or more kinds of mixing；
Wherein, described solder is the conjunction of the two or more elements comprising tin (Sn), lead (Pb), bismuth (Bi) or antimony (Sb)
Gold, fusing point are 100~180 DEG C, and particle diameter is 0.1~0.4mm；
Described scaling powder is polyhydroxy base class organic compound, carboxylic acid compound, amine, amine and organic acid complex or contained
One or more kinds of mixing of nitrogen heterocyclic and its complex salt；
Described flux vehicle is the polyesters of 50~130 DEG C of fusing point, polyethers, polyamide-based, TPO, rosin and its
One or more kinds of mixing of derivative, terpenoid resin or ethylene-vinyl acetate copolymer.
2. automobile using structure glue according to claim 1, it is characterised in that described diluent be diglycidyl ether,
Polypropylene glycol diglycidyl ether, polyethyleneglycol diglycidylether, the one or more of glycerin triglycidyl ether
Mixing.
3. automobile using structure glue according to claim 1, it is characterised in that described latent curing agent be dicyandiamide,
One or more kinds of mixing of sebacic dihydrazide, 4,4 ' methylene-two (phenyl dimethyl urea) or 1- neighbour's base Phenylbiguanide.
4. automobile using structure glue according to claim 1, it is characterised in that described filler be calcium carbonate, silicon powder or
One or more kinds of mixing of aluminum oxide.
5. automobile using structure glue according to claim 1, it is characterised in that described scaling powder be glutaric acid, adipic acid,
Succinic acid, decanedioic acid, salicylic acid, benzoic acid, laurate, dimeric dibasic acid, itaconic acid, hydroxyacetic acid, citric acid, malic acid, ribose,
Cellulose, imdazole derivatives, diethylamine, triethylamine, monoethanolamine, diethanol amine, triethanolamine, cyclohexylamine or DBU and its spread out
One or more kinds of mixing of biology.
6. automobile using structure glue according to claim 1, it is characterised in that described flux vehicle is rosin, rosin
Pentaerythritol ester, ester gum, PEPA, ethylene-vinyl acetate copolymer, polyethylene, polypropylene, polyamide, stone
One or more kinds of mixing of wax or palm wax.
7. the preparation method of automobile using structure glue described in a kind of claim 1, it is characterised in that step is as follows：
(1) 0~50wt% epoxy resin, 10~40wt% modified epoxies, 0~10wt% diluents, 2~10wt% are dived
Volt property curing agent, 0~5wt% coupling agents, 5~35wt% fillers, 1~10wt% anti-settling agents and 1~10wt% metallic particles add
Enter in double-planet power mixer, be dispersed with stirring 20~30min under the conditions of 5~35 DEG C, each component is uniformly dispersed, vacuumize
Continue 60~90min of stirring to below -0.09MPa, obtain epoxide-resin glue component A；
(2) 0~6wt% flux vehicles are heated into 60~130 DEG C makes its melting, adds 1~4wt% scaling powders, stirring 30
~60min, 90~96wt% solders are continuously added, stir 30min in -0.09MPa, be down to 20~25 DEG C, grinding distribution
Processing, hermetically drying, obtains solder B component；
(3) the solder B component that the epoxide-resin glue component A for obtaining step (1) and step (2) obtain is by being 10 in mass ratio:
(1~5) mix, produce automobile using structure glue.
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| CN105238312B true CN105238312B (en) | 2017-12-19 |
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| CN107815279A (en) * | 2017-11-13 | 2018-03-20 | 烟台德邦科技有限公司 | A kind of zinc-plated component bonding structure glue and preparation and application |
| US10899109B2 (en) | 2019-03-11 | 2021-01-26 | Honda Motor Co., Ltd. | Multi-material joint and method of making thereof |
| JP7161510B2 (en) * | 2020-09-15 | 2022-10-26 | 株式会社タムラ製作所 | Solder composition and electronic substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2675188B2 (en) * | 1990-10-05 | 1997-11-12 | サンスター技研株式会社 | Structural adhesive |
| CN1579698A (en) * | 2003-08-08 | 2005-02-16 | 株式会社东芝 | Thermal-setting welding-assistant, welding paste and welding method |
| CN102189354A (en) * | 2011-04-22 | 2011-09-21 | 大连理工大学 | Adhesive special for melting and glue welding of magnesium-aluminum dissimilar metals and preparation method thereof |
-
2015
- 2015-09-21 CN CN201510603853.9A patent/CN105238312B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2675188B2 (en) * | 1990-10-05 | 1997-11-12 | サンスター技研株式会社 | Structural adhesive |
| CN1579698A (en) * | 2003-08-08 | 2005-02-16 | 株式会社东芝 | Thermal-setting welding-assistant, welding paste and welding method |
| CN102189354A (en) * | 2011-04-22 | 2011-09-21 | 大连理工大学 | Adhesive special for melting and glue welding of magnesium-aluminum dissimilar metals and preparation method thereof |
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