CN107815279A - A kind of zinc-plated component bonding structure glue and preparation and application - Google Patents
A kind of zinc-plated component bonding structure glue and preparation and application Download PDFInfo
- Publication number
- CN107815279A CN107815279A CN201711114094.5A CN201711114094A CN107815279A CN 107815279 A CN107815279 A CN 107815279A CN 201711114094 A CN201711114094 A CN 201711114094A CN 107815279 A CN107815279 A CN 107815279A
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- Prior art keywords
- zinc
- component
- solder
- structure glue
- bonding structure
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of zinc-plated component bonding structure glue and preparation and application, the structure glue is by epoxy resin, curing agent and additive（Component A）With the solder ball of scaling powder cladding（B component）Composition.A, B component are fully mixed into simultaneously deaeration during use, being glued after-applied stress makes solder deformation of ball supplant solder and the component A on galvanized part contact surface, then 50 100% stress is removed, scaling powder is flowed back when adhesive is heating and curing and promotes the wetting and spreading of solder and remove dense film on galvanized part.A kind of zinc-plated component bonding of the present invention can realize the welding of solder and zinc-plated component with structure glue while curable adhesive layer is cementing, significantly improve adhesive strength and shear strength.
Description
Technical field
The invention belongs to adhesive technical field, more particularly to a kind of zinc-plated component bonding structure glue and preparation and use
Method.
Background technology
At present, many metal or alloy materials is reach attractive in appearance or rust-proof effect, using zincincation in surface metal or
Alloy material surface plates one layer of zinc.Because zinc is more active, basic zinc carbonate is easily generated in humid air, in hot and humid ring
Easily it is corroded under border so as to influence its barrier propterty.So zinc coat generally requires further Passivation Treatment, one layer of group is formed
Knit the smooth passivating film of densification.
The passivating film of galvanized part surface compact constrains bonding of the adhesive to such component significantly, causes adhesive strength not
It is high.Because the zinc under passivating film is more active, easily being reacted with adhesive composition causes various defects and influences adhesive strength.
So traditional technique being glued again that is first surface-treated no longer is applicable.The solder ball of scaling powder cladding is added in adhesive,
During adhesive is heating and curing, while realize welding.Scaling powder only plays striping effect in solder and galvanized part contact surface,
So avoid the situation for removing exposed zinc layers by dense film and being chemically reacted at high temperature with adhesive composition.At present still
Have not seen the report of similar solution.
In summary, exploitation is a realizes that the cementing sqtructural adhesive for being used for zinc-plated component bonding being combined with welding is
Very application prospect.
The content of the invention
The present invention provides a kind of zinc-plated component bonding structure glue and preparation and application, and solid-state is added in adhesive
The solder compositions of scaling powder cladding, scaling powder are removed while solder welds with the dense film realization on zinc-plated component contact surface not
Influence cementing, while avoid contact of the zinc with colloid, effectively improve the adhesive strength and shear strength of adhesive.
In order to solve the above-mentioned technical problem, the present invention uses following technical scheme：
A kind of zinc-plated component bonding structure glue, it is characterised in that by component A and solder B component in mass ratio 10:1-5 is formed；
The component A is made up of the raw material of following weight fraction：100 parts of epoxy resin, 5-15 part toughener, the solidification of 2-10 parts
Agent, 5-12 part curing accelerators, 1-5 part coupling agents, 3-10 part thixotropic agent, 0-10 part diluents；
The B component is made up of the raw material of following weight fraction：100 parts of solders, 1-8 part solid soldering fluxes, 0-3 parts are organic
Carrier；
The epoxy resin is diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin and glycidyl amine epoxy
One or more in resin；
The toughener is polyimides, PEI, liquid polysulfide rubber, nbr carboxyl terminal and LNBR
In one or more；
The curing agent is dicyandiamide.
The curing accelerator is imidazoles metallo-chelate, 2-ethyl-4-methylimidazole, thiocarbamide, ethylene thiourea and two
One or more in ethyl thiourea.
The coupling agent is two kinds of one kind or arbitrary proportion in silane coupling agent and titante coupling agent.
The thixotropic agent is aerosil.
The diluent is bicyclic epoxide and one kind in three epoxy radicals reactive diluents or two kinds of arbitrary proportion.
The solder is two or more mischmetals in tin, bismuth, zinc and silver；Solder melt point is 130-210 DEG C,
Particle diameter is 0.10-0.85mm.
The Solid flux be 80-120 DEG C under the conditions of be liquid solid soldering flux.
The organic carrier be paraffin, microwax, polyvinyl paraffin wax, rosin, hydrogenated rosin, newtrex, disproportionated rosin,
Maleic rosin, cetomacrogol 1000, polyethylene glycol 2000, Macrogol 4000, Macrogol 6000, PEG 8000 and poly-
One or more in ethylene glycol 10000.
The preparation method of zinc-plated component bonding structure glue, is followed the steps below：
1）Prepare component A：By epoxy resin, toughener, part curing agent, part curing accelerator, coupling agent, thixotropic agent, diluent
It is added in planetary power mixer, is 500-1800r/min in rotation rotating speed, under conditions of revolution rotating speed is 5-25r/min,
20-30min is dispersed with stirring, is vacuumized, vacuum pressure≤- 0.09MPa, continues to stir 90-120min, produces component A；
2）Prepare solder B component：By heat melting Solid flux be sprayed on solder ball, in planet gravity mixer with
Rotating speed disperses at a high speed 5-10min under the conditions of being 800-1500r/min, and the solder of Surface coating Solid flux is obtained after cooling
Ball；The organic carrier that melting is heated under the conditions of 80-120 DEG C is sprayed on the solder ball of above-mentioned Surface coating Solid flux,
In planet gravity mixer using rotating speed as 500-1000r/min under the conditions of at a high speed disperse 5-10min, cool down and produce solder B groups
Point.
The application method of zinc-plated component structure glue, comprises the following steps：
a）Component A is well mixed with B component, vacuumized, vacuum pressure is≤- 0.09MPa, deaeration 5-10min；
b）By structure glue coated on applying glue position, applying stress makes solder ball crimp, and extrusion solder contacts with zinc-plated component
Colloid between face；
c）Release 50-100% stress；
d）Be heating and curing 20-60min under 150-230 DEG C of temperature conditionss.
Invention has following advantageous effects：
By the combination of adhesive and solder, coordinate applicable glue-applying technique, realize cementing and solder bond, effectively solve gluing
Agent significantly improves adhesive strength and shear strength in the bonding problem of the smooth passivation layer of galvanized part.
Embodiment
Embodiment 1
A kind of preparation method of zinc-plated component structure glue is as follows：
（1）By 100 parts of bisphenol A type epoxy resins, 8 parts of LNBRs, 5 parts of dicyandiamides, 8 parts of ethylene thioureas, 3 parts of silicon
Alkane coupling agent, 8 parts of aerosils, 5 parts of diglycidyl ethers are added in planetary power mixer, under the conditions of 1500r/min
20-30min is dispersed with stirring, is evacuated to -0.098MPa, continues to stir 90-120min, obtains component A.
（2）4 parts of scaling powders for heating melting are sprayed on 100 parts of SnBi58 solder balls, on planet gravity mixer
It is scattered at a high speed with 1200r/min, the solder ball of Surface coating Solid flux is obtained after cooling, by the poly- second of 2 parts of heating meltings
Glycol 4000 is sprayed on the solder ball of above-mentioned Solid flux cladding, on planet gravity mixer with 1200r/min at a high speed
It is scattered, cool down to obtain solder B component.
A kind of application method of zinc-plated component structure glue, comprises the following steps：
（1）By component A and B component by weight 10：2 mixing, are vacuumized, under the conditions of pressure is -0.098MPa, deaeration
10min；
（2）By glue coated on applying glue position, applying stress makes solder ball crimp, extrudes between solder and zinc-plated component contact surface
Colloid.
（3）50-100% stress is released, be heating and curing 40min under the conditions of 180 DEG C.
Comparative example 1
Only it is bonded with the difference of embodiment 1 in applying glue with component A in embodiment 1.
Tested according to GB/T 7124-2008, using the galvanized steel plain sheet sample preparation of surface passivating treatment, at the alcohol wipe of surface
Reason.
The embodiment 1 of table 1 contrasts with the performance test results of comparative example 1
| Sample | Embodiment 1 | Comparative example 1 |
| Shear strength | 23 | 18 |
As can be seen from Table 1, adhesive strength is higher after adding solder ball, is advantageous to structural bond.
Embodiment 2
A kind of preparation method of zinc-plated component structure glue is as follows：
（1）By 100 parts of bisphenol A type epoxy resins, 8 parts of LNBRs, 5 parts of dicyandiamides, 8 parts of ethylene thioureas, 3 parts of silane
Coupling agent, 8 parts of aerosils, 5 parts of diglycidyl ethers are added in planetary power mixer, are stirred under the conditions of 1500r/min
Scattered 20-30min is mixed, is evacuated to -0.098MPa, continues to stir 90-120min, obtains component A.
（2）4 parts of scaling powders for heating melting are sprayed on 100 parts of SnBi58 solder balls, on planet gravity mixer
It is scattered at a high speed with 1200r/min, the solder ball of Surface coating Solid flux is obtained after cooling, by the poly- second of 2 parts of heating meltings
Glycol 4000 is sprayed on the solder ball of above-mentioned Solid flux cladding, on planet gravity mixer with 1200r/min at a high speed
It is scattered, cool down to obtain solder B component.
A kind of application method of zinc-plated component structure glue, comprises the following steps：
（1）By component A and B component by weight 10：4 mixing, are evacuated to -0.098MPa, deaeration 10min
（2）By glue coated on applying glue position, applying stress makes solder ball crimp, extrudes between solder and zinc-plated component contact surface
Colloid.
（3）50-100% stress is released, be heating and curing 40min under the conditions of 180 DEG C.
Comparative example 2
Only it is bonded with the difference of embodiment 1 in applying glue with component A in embodiment 2.
Tested according to GB/T 7124-2008, using the galvanized steel plain sheet sample preparation of surface passivating treatment, at the alcohol wipe of surface
Reason.
The embodiment 2 of table 2 contrasts with the performance test results of comparative example 2
| Sample | Embodiment 2 | Comparative example 2 |
| Shear strength | 25 | 18 |
As can be seen from Table 2, adhesive strength is higher after adding solder ball, is advantageous to structural bond.
Embodiment 3
A kind of preparation method of zinc-plated component structure glue is as follows：
（1）By 60 parts of bisphenol A type epoxy resins, 40 parts of bisphenol f type epoxy resin parts, 10 parts of LNBRs, 6 parts of double cyanogen
Amine, 9 parts of ethylene thioureas, 3 parts of silane couplers, 10 parts of aerosils, 2 parts of glycerin triglycidyl ethers add planet
In power mixer, 20-30min is dispersed with stirring under the conditions of 1500r/min, is evacuated to -0.098MPa, continues to stir 90-
120min, obtain component A.
（2）4 parts of scaling powders for heating melting are sprayed on 100 parts of SnBi58 solder balls, on planet gravity mixer
It is scattered at a high speed with 1200r/min, the solder ball of Surface coating Solid flux is obtained after cooling, by the poly- second of 2 parts of heating meltings
Glycol 4000 is sprayed on the solder ball of above-mentioned Solid flux cladding, on planet gravity mixer with 1200r/min at a high speed
It is scattered, cool down to obtain solder B component.
A kind of application method of zinc-plated component structure glue, comprises the following steps：
（1）By component A and B component by weight 10：3 mixing, are evacuated to -0.098MPa, deaeration 10min；
（2）By glue coated on applying glue position, applying stress makes solder ball crimp, extrudes between solder and zinc-plated component contact surface
Colloid；
（3）50-100% stress is released, be heating and curing 50min under the conditions of 170 DEG C.
Comparative example 3
Only it is bonded with the difference of embodiment 3 in applying glue with component A in embodiment 3.
Tested according to GB/T 7124-2008, using the galvanized steel plain sheet sample preparation of surface passivating treatment, at the alcohol wipe of surface
Reason.
The embodiment 3 of table 3 contrasts with the performance test results of comparative example 3
| Sample | Embodiment 3 | Comparative example 3 |
| Shear strength | 25 | 20 |
As can be seen from Table 3, adhesive strength is higher after adding solder ball, is advantageous to structural bond.
Embodiment 4
A kind of preparation method of zinc-plated component structure glue is as follows：
（1）By 100 parts of bisphenol A type epoxy resins, 8 parts of LNBRs, 5 parts of dicyandiamides, 8 parts of ethylene thioureas, 3 parts of silicon
Alkane coupling agent, 8 parts of aerosils, 5 parts of diglycidyl ethers are added in planetary power mixer, are stirred with 1200r/min
Scattered 20-30min, is evacuated to -0.098MPa, continues to stir 90-120min, obtains component A.
（2）4 parts of scaling powders for heating melting are sprayed on 100 parts of SnBi58 solder balls, on planet gravity mixer
It is scattered at a high speed, the solder ball of Surface coating Solid flux is obtained after cooling, the Macrogol 4000 of 2 parts of heating meltings is sprayed
To the solder ball of above-mentioned Solid flux cladding, scattered at a high speed with 1200r/min on planet gravity mixer, cooling down to weld
Expect B component.
A kind of application method of zinc-plated component structure glue, comprises the following steps：
（1）By component A and B component by weight 10：2 is well mixed, evacuated pressure to -0.098MPa deaerations 8min.
（2）By glue coated on applying glue position, applying stress makes solder ball crimp, and extrusion solder contacts with zinc-plated component
Colloid between face.
（3）Be heating and curing 40min under the conditions of 180 DEG C.
Tested according to GB/T 7124-2008, using the galvanized steel plain sheet sample preparation of surface passivating treatment, at the alcohol wipe of surface
Reason.
The embodiment 4 of table 4 contrasts with the performance test results of embodiment 1
| Sample | Embodiment 1 | Embodiment 4 |
| Shear strength | 23 | 16 |
As can be seen from Table 4, stress is not removed, and adhesive strength, which is significantly less than, removes stress bonding, does not remove stress and is unfavorable for welding
Expect welding process.
Present pre-ferred embodiments are the foregoing is only, are not intended to limit the invention, it is all in the spiritual and former of the present invention
Within then, any modification, equivalent substitution, improvement etc. for being made should be included in the scope of the protection.
Claims (10)
1. a kind of zinc-plated component bonding structure glue, it is characterised in that by component A and solder B component in mass ratio 10:1-5 groups
Into；
The component A is made up of the raw material of following weight fraction：100 parts of epoxy resin, 5-15 part toughener, the solidification of 2-10 parts
Agent, 5-12 part curing accelerators, 1-5 part coupling agents, 3-10 part thixotropic agent, 0-10 part diluents；
The B component is made up of the raw material of following weight fraction：100 parts of solders, 1-8 part solid soldering fluxes, 0-3 parts are organic
Carrier；
The epoxy resin is diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin and glycidyl amine epoxy
One or more in resin；
The toughener is polyimides, PEI, liquid polysulfide rubber, nbr carboxyl terminal and LNBR
In one or more；
The curing agent is dicyandiamide.
2. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the curing accelerator is imidazoles gold
Belong to the one or more in chelate, 2-ethyl-4-methylimidazole, thiocarbamide, ethylene thiourea and diethyl thiourea.
3. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the coupling agent is coupled for silanes
Two kinds of one kind or arbitrary proportion in agent and titante coupling agent.
4. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the thixotropic agent is gas phase titanium dioxide
Silicon.
5. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the diluent be bicyclic epoxide and
Two kinds of one kind or arbitrary proportion in three epoxy radicals reactive diluents.
6. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the solder is tin, bismuth, zinc
With two or more mischmetals in silver；Solder melt point is 130-210 DEG C, particle diameter 0.10-0.85mm.
7. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the Solid flux is 80-120
It is the solid soldering flux of liquid under the conditions of DEG C.
8. zinc-plated component bonding structure glue according to claim 1, it is characterised in that the organic carrier is paraffin, micro-
Brilliant wax, polyvinyl paraffin wax, rosin, hydrogenated rosin, newtrex, disproportionated rosin, maleic rosin, cetomacrogol 1000, poly- second two
One or more in alcohol 2000, Macrogol 4000, Macrogol 6000, PEG 8000 and PEG20000.
9. the preparation method of zinc-plated component bonding structure glue according to claim 1, it is characterised in that according to following steps
Carry out：
1）Prepare component A：By epoxy resin, toughener, part curing agent, part curing accelerator, coupling agent, thixotropic agent, diluent
It is added in planetary power mixer, is 500-1800r/min in rotation rotating speed, under conditions of revolution rotating speed is 5-25r/min,
20-30min is dispersed with stirring, is vacuumized, vacuum pressure≤- 0.09MPa, continues to stir 90-120min, produces component A；
2）Prepare solder B component：By heat melting Solid flux be sprayed on solder ball, in planet gravity mixer with
Rotating speed disperses at a high speed 5-10min under the conditions of being 800-1500r/min, and the solder of Surface coating Solid flux is obtained after cooling
Ball；The organic carrier that melting is heated under the conditions of 80-120 DEG C is sprayed on the solder ball of above-mentioned Surface coating Solid flux,
In planet gravity mixer using rotating speed as 500-1000r/min under the conditions of at a high speed disperse 5-10min, cool down and produce solder B groups
Point.
10. the application method of zinc-plated component structure glue according to claim 1, it is characterised in that application method is included such as
Lower step：
a）Component A is well mixed with B component, vacuumized, vacuum pressure is≤- 0.09MPa, deaeration 5-10min；
b）By structure glue coated on applying glue position, applying stress makes solder ball crimp, and extrusion solder contacts with zinc-plated component
Colloid between face；
c）Release 50-100% stress；
d）Be heating and curing 20-60min under 150-230 DEG C of temperature conditionss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711114094.5A CN107815279A (en) | 2017-11-13 | 2017-11-13 | A kind of zinc-plated component bonding structure glue and preparation and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711114094.5A CN107815279A (en) | 2017-11-13 | 2017-11-13 | A kind of zinc-plated component bonding structure glue and preparation and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107815279A true CN107815279A (en) | 2018-03-20 |
Family
ID=61609694
Family Applications (1)
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|---|---|---|---|
| CN201711114094.5A Pending CN107815279A (en) | 2017-11-13 | 2017-11-13 | A kind of zinc-plated component bonding structure glue and preparation and application |
Country Status (1)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543385A (en) * | 2001-06-29 | 2004-11-03 | 富士电机株式会社 | Solder composition |
| CN105238312A (en) * | 2015-09-21 | 2016-01-13 | 烟台德邦科技有限公司 | Structural adhesive used for automobile and preparation method thereof |
| CN106914710A (en) * | 2015-12-28 | 2017-07-04 | 松下知识产权经营株式会社 | Rosin flux soldering paste and assembling structure |
-
2017
- 2017-11-13 CN CN201711114094.5A patent/CN107815279A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543385A (en) * | 2001-06-29 | 2004-11-03 | 富士电机株式会社 | Solder composition |
| CN105238312A (en) * | 2015-09-21 | 2016-01-13 | 烟台德邦科技有限公司 | Structural adhesive used for automobile and preparation method thereof |
| CN106914710A (en) * | 2015-12-28 | 2017-07-04 | 松下知识产权经营株式会社 | Rosin flux soldering paste and assembling structure |
Non-Patent Citations (1)
| Title |
|---|
| 张兆隆等: "《金属工艺学》", 31 August 2016, 北京理工大学出版社 * |
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Application publication date: 20180320 |