CN100537119C - Low solid content cleaning-free welding aid used for leadless welding - Google Patents
Low solid content cleaning-free welding aid used for leadless welding Download PDFInfo
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- CN100537119C CN100537119C CNB2007100632887A CN200710063288A CN100537119C CN 100537119 C CN100537119 C CN 100537119C CN B2007100632887 A CNB2007100632887 A CN B2007100632887A CN 200710063288 A CN200710063288 A CN 200710063288A CN 100537119 C CN100537119 C CN 100537119C
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- scaling powder
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Abstract
The present invention relates to a low solid content non-cleaning soldering aid for lead-free soldering. Its composition includes (by wt%) 0.2%-1.0% of resin, 1.0%-2.0% of compounded active agent, 4%-10% of solvent with high boiling point, 0.2%-1.6% of organic acid and the rest is general solvent. Its preparation method includes the following steps: according to the ratio of formula adding resin and organic acid into general solvent, heating to 60 deg.C, stirring until they are dissolved, then adding solvent with high boiling point and compounded active agent, stirring for 5 min, standing still and filtering so as to obtain the invented product.
Description
Technical field
The present invention relates to a kind of low solid-material content cleaning-free scaling powder that is used to not have lead welding, belong to technical field of electronic materials.
Background technology
The scolder of traditional electronics and IT products welding usefulness is lead-tin solder, the use history that this scolder is existing a lot of years, and its feature is fusing point low (183 ℃), solderability is good, welds workable.Because having issued in 2003 about restriction, European Union uses six kinds of poisonous and harmful substances (lead, cadmium, mercury, Cr VIs, PBBs and PBDE) instruction, China has also issued " electronics and IT products pollution control management way " in 2006, make the use of lead-tin solder be restricted.At present, be the protection human ecological environment, increasing electronics and IT products have been used lead-free solder instead.But, to compare with plumber's solder, there is following shortcoming in the use of lead-free solder:
(1) fusing point height: such as Sn0.7Cu scolder fusing point commonly used is 227 ℃, and Sn3.0Ag0.5Cu is 217-219 ℃, and the fusing point height is the welding temperature height then, the electronic component heatproof is required just high.
(2) the easy oxidation of scolder forms scruff, causes waste.
(3) weldability is poor, forms rosin joint easily and leaks weldering, influences the reliability of complete machine.
Because the shortcoming that lead-free solder itself exists, the scaling powder that was used for lead-tin solder originally can not satisfy the welding requirements of lead-free solder.As everyone knows, the scaling powder too high solids content can cause printing component palette residue many on the one hand, and the plate face is unclean; On the other hand, materials such as the organic acid in the residue, salt can make insulaion resistance descend, and can impact the instrument complete machine when serious.
Summary of the invention
The objective of the invention is to propose a kind of low solid-material content cleaning-free scaling powder that is used to not have lead welding, change the prescription of existing scaling powder,, improve welding performance to reduce the solids content in the solder flux.
The low solid-material content cleaning-free scaling powder that is used to not have lead welding that the present invention proposes, wherein the percentage by weight of each component is:
Resin 0.2%～1.0%
Built reactive agent 1.0%～2.0%
High boiling solvent 4%～10%
Organic acid 0.2%～1.6%
The common solvent surplus
The preparation method is:
By formula rate resin and organic acid are joined in the common solvent together, be heated to about 60 ℃, stir simultaneously, add high boiling solvent and built reactive agent then, stirred again 5 minutes, leave standstill filtration promptly until dissolving.
Resin in the above-mentioned scaling powder can be in Foral, acrylic acid modified rosin or the newtrex any.
In the above-mentioned scaling powder the built reactive agent, can be by composite the forming of salt of halides and guanidine compound or halides and guanidine compound, the ratio of the two is 3～6:1.Halides wherein can be in dibromosuccinic acid, dibromo butene glycol or bromo 16 alkyl pyridines any.Guanidine compound wherein or its salt can be in diphenylguanidine hydrochloride, diphenylguanidine hydrogen bromide salt or the diphenylguanidine any.
High boiling solvent in the above-mentioned scaling powder can be in diethylene glycol ether, dipropylene glycol methyl ether, DPG ether or the DPG propyl ether any.
Organic acid in the above-mentioned scaling powder can be fumaric acid or brown Palm acid.
Common solvent in the above-mentioned scaling powder can be isopropyl alcohol.
The low solid-material content cleaning-free scaling powder that is used to not have lead welding that the present invention proposes, its advantage is:
1, by selecting appropriate resin, the rational composite and high boiling solvent of activating agent, reduced the solids content in the solder flux, the solids content in the scaling powder is less than 3%.Solid residue is few on the welding printing component palette, and the plate face is clean, and ionic pollution degree is low, and the insulaion resistance height can satisfy the cleaning requirement of exempting from of printing component palette.The present invention adopts high boiling solvent and suitable activating agent and suitably composite, makes scaling powder under higher welding temperature, still has welding performance preferably, thereby satisfies the requirement of no lead welding.
2, scaling powder of the present invention, composite with halides and guanidine compound or its salt as activating agent, the advantage of halides wherein is to have good welding activity, simultaneously, owing to do not have ionic compound after the welding, therefore, postwelding insulaion resistance height, ionic pollution degree is low, and it is reliable and stable to print component palette welding back, can be in order to avoid clean.Guanidine wherein is a kind of aminated compounds, itself has the welding activity.Its hydrogen halides hydrochlorate also is a kind of welding active material.Because the guanidine compound molecular weight is big, molecular polarity is less, and decomposition temperature is higher, and welding back insulaion resistance is also higher, and simultaneously, guanidine and hydrogen halides hydrochlorate resolvability thereof are good, therefore, are the fine raw materials that is used for lead-free solder soldering fluid.
With the composite use of two or more activating agent is important feature of the present invention.Different activating agents has different active temperature intervals, and the scaling powder speed of welding of low decomposition temperature is fast, and the activating agent of high decomposition temperature is long active perdurabgility.Make the existing speed of welding faster of scaling powder, arranged long active perdurabgility again, just two or more activating agent must be used, experiment showed, rationally to be used, better than single result of use.
3, scaling powder of the present invention with ethers as high boiling solvent, with the low mass molecule alcohol class as common solvent.Because lead-free solder fusing point height, the welding temperature height requires scaling powder can bear higher temperature, therefore, has added more high boiling solvent in the scaling powder of the present invention.
The specific embodiment
The halides that the present invention is used, from the dibromo butene glycol, dibromosuccinic acid, bromo 16 alkyl pyridines, bromo ethyl phenenyl, dibromo pyridine, compounds such as dibromobenzoic acid and bromotetradecane yl pyridines.
Guanidine compound that the present invention is used and salt thereof is from guanidine acetate, guanidine carbonate, guanidine hydrochloride, diphenylguanidine, compounds such as diphenylguanidine hydrochloride, diphenylguanidine hydrogen bromide salt.
The used high boiling solvent of this scaling powder is selected from butyl glycol ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether, the diethylene glycol butyl ether, dipropylene glycol methyl ether, the DPG ether, DPG propyl ether etc., common solvent is ethanol and isopropyl alcohol.
A kind of (for example bromo 16 alkyl pyridines) in the halides and a kind of (for example diphenylguanidine hydrochloride) in guanidine compound or its salt are made into the built reactive agent by weight the ratio of 3～6:1.Resin (being selected from acrylic acid modified rosin, newtrex, Foral), built reactive agent, high boiling solvent and common solvent are mixed according to a certain ratio and dissolve, promptly get low solid-material content cleaning-free scaling powder.In order to adjust the wetability of scaling powder, also to add suitable organic acid in the prescription, organic acid is from oxalic acid, succinic acid, adipic acid, decanedioic acid, fumaric acid, brown Palm acid, stearic acid and phthalic acid.
Embodiment 1
Foral: 1.0%
The built reactive agent (dibromosuccinic acid: the diphenylguanidine hydrochloride=3:1): 1.8%
Diethylene glycol ether: 5%
Fumaric acid: 0.2%
Isopropyl alcohol: surplus.
Embodiment 2
Acrylic acid modified rosin: 0.8%
The built reactive agent (the dibromo butene glycol: the diphenylguanidine hydrogen bromide salt=5:1): 1.5%
Dipropylene glycol methyl ether: 6%
Fumaric acid: 0.7%
Isopropyl alcohol: surplus.
Embodiment 3
Acrylic acid modified rosin: 0.5%
The built reactive agent (dibromosuccinic acid: diphenylguanidine=6:1): 1.2%
DPG ether: 8%
Palm fibre Palm acid: 1.3%
Isopropyl alcohol: surplus.
Embodiment 4
Newtrex: 0.2%
The built reactive agent (the dibromo butene glycol: the diphenylguanidine hydrochloride=3:1): 2.0%
DPG propyl ether: 10%
Palm fibre Palm acid: 0.8%
Isopropyl alcohol: surplus.
Embodiment 5
Acrylic acid modified rosin 0.8%
The built reactive agent (bromo 16 alkyl pyridines: the diphenylguanidine hydrochloride=3:1): 1.4%
Dipropylene glycol methyl ether: 6%
Fumaric acid: 0.8%
Isopropyl alcohol: surplus.
Required amount by prescription adds resin, built reactive agent and organic acid in the isopropyl alcohol, is heated to about 60 ℃, stirs simultaneously until dissolving, adds high boiling solvent then, stirs 5 minutes again, leaves standstill filtration promptly.
Claims (1)
1, a kind of low solid-material content cleaning-free scaling powder that is used to not have lead welding is characterized in that the percentage by weight of each component in this scaling powder is:
Resin 0.2%～1.0%
Built reactive agent 1.0%～2.0%
High boiling solvent 4%～10%
Organic acid 0.2%～1.6%
The common solvent surplus
Wherein said resin is any in Foral, acrylic acid modified rosin or the newtrex; Wherein said built reactive agent is by composite the forming of salt of halides and guanidine compound or halides and guanidine compound, the ratio of the two is 3～6: 1, halides is any in dibromosuccinic acid, dibromo butene glycol or bromo 16 alkyl pyridines, and guanidine compound or its salt are any in diphenylguanidine hydrochloride, diphenylguanidine hydrogen bromide salt or the diphenylguanidine; Wherein said high boiling solvent is any in diethylene glycol ether, dipropylene glycol methyl ether, DPG ether or the DPG propyl ether; Wherein said organic acid is fumaric acid or brown Palm acid; Wherein said common solvent is an isopropyl alcohol;
The preparation method is:
By formula rate resin and organic acid are joined in the common solvent together, be heated to 60 ℃, stir simultaneously, add high boiling solvent and built reactive agent then in proportion, stirred again 5 minutes, leave standstill filtration promptly until dissolving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100632887A CN100537119C (en) | 2007-01-08 | 2007-01-08 | Low solid content cleaning-free welding aid used for leadless welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100632887A CN100537119C (en) | 2007-01-08 | 2007-01-08 | Low solid content cleaning-free welding aid used for leadless welding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN100999044A CN100999044A (en) | 2007-07-18 |
| CN100537119C true CN100537119C (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100632887A Expired - Fee Related CN100537119C (en) | 2007-01-08 | 2007-01-08 | Low solid content cleaning-free welding aid used for leadless welding |
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| Country | Link |
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| CN (1) | CN100537119C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101972906B (en) * | 2010-09-17 | 2012-06-27 | 丹凤县荣毅电子有限公司 | Lead-free environmentally friendly soldering flux and preparation method thereof |
| CN103862198B (en) * | 2014-03-24 | 2016-08-17 | 吉安谊盛电子材料有限公司 | A kind of special scaling powder of solar energy automatic welding |
| CN104117786B (en) * | 2014-07-25 | 2016-12-28 | 青岛申达众创技术服务有限公司 | A kind of scaling powder |
| CN112643248A (en) * | 2020-12-25 | 2021-04-13 | 佛山市大笨象化工新材料有限公司 | Lead-free splash-free low-solid-content cleaning-free soldering flux |
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2007
- 2007-01-08 CN CNB2007100632887A patent/CN100537119C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100999044A (en) | 2007-07-18 |
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Granted publication date: 20090909 Termination date: 20100208 |