CN105238064B - A kind of organosilicon material and preparation method thereof and its method for being applied to 3D printing - Google Patents
A kind of organosilicon material and preparation method thereof and its method for being applied to 3D printing Download PDFInfo
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Abstract
The present invention discloses a kind of organosilicon material comprising (1) component A: organopolysiloxane, 80~200 parts by weight;Reinforced filling, 20~60 parts by weight;Silicone resin, 0~20 parts by weight;Heat filling, 50~80 parts by weight;Antistructurizing agent, 2~20 parts by weight;Catalysts, 0.05~0.8 parts by weight;(2) component B: organopolysiloxane, 80~200 parts by weight;Organic hydrogen-based polysiloxanes, 0.5~10 parts by weight;Reinforced filling, 20~60 parts by weight;Silicone resin, 0~20 parts by weight;Heat filling, 50~80 parts by weight;Antistructurizing agent, 2~20 parts by weight;Reaction suppressor, 0.05~0.4 parts by weight;Wherein, the weight ratio of the component A and component B is 1:1.Also disclose a kind of method of the preparation method and the organosilicon material of organosilicon material applied to 3D printing.Organosilicon material superior performance of the invention, safe and non-toxic, preparation method is simple for the organosilicon material, which, which is applied to 3D printing, has operability.
Description
Technical field
The present invention relates to a kind of organosilicon materials more particularly to a kind of organosilicon material and preparation method thereof to be applied to it
The method of 3D printing.
Background technique
3D printing technique is also known as increases material manufacturing technology, is related to material processing and forming, automation control, computer modeling, material
Multiple subjects such as material.3D printing technique do not need complicated process equipment and technique can quickly produce it is complicated
Product solves the big limitation of traditional handicraft difficulty of processing, can substantially reduce cost of labor and production cycle.Especially in new product
When exploitation, the R&D cycle can be greatly shortened using 3D printing technique and reduces research and development cost.Therefore, the application of 3D printing technique
It is more and more extensive.Study relatively deeply to the equipment of 3D printing and control system in the industry at present, and for the research phase of material
To less.3D printing material mainly includes metal material, inorganic non-metallic material and high molecular material.
The high molecular material generallyd use in the prior art has urethane acrylate, oxypropylene acid esters, unsaturated polyester (UP)
Deng.The characteristic of this kind of material itself makes the disadvantages of its generally existing high and low temperature resistance is poor, flexibility is poor, weatherability is poor.It is uncomfortable
For making the workpiece for needing to use in harsh environment for a long time.Simultaneously because biocompatibility is poor, it is not suitable for making yet
Man-made organ or human body implantation piece.
Summary of the invention
Primary and foremost purpose of the invention is to provide a kind of organosilicon material durable, biocompatibility is excellent, nontoxic.
Second object of the present invention is to provide a kind of preparation method of organosilicon material.
Third object of the present invention is to provide a kind of method that the organosilicon material is applied to 3D printing.
To reach the above technical purpose, The technical solution adopted by the invention is as follows:
A kind of organosilicon material comprising
Component A:
Organopolysiloxane, 80~200 parts by weight;Reinforced filling, 20~60 parts by weight;Silicone resin, 0~20 parts by weight;
Heat filling, 50~80 parts by weight;Antistructurizing agent, 2~20 parts by weight;Catalysts, 0.05~0.8 parts by weight;
Component B:
Organopolysiloxane, 80~200 parts by weight;Organic hydrogen-based polysiloxanes, 0.5~10 parts by weight;Reinforced filling, 20
~60 parts by weight;Silicone resin, 0~20 parts by weight;Heat filling, 50~80 parts by weight;Antistructurizing agent, 2~20 parts by weight;
Reaction suppressor, 0.05~0.4 parts by weight;
Wherein, the weight ratio of the component A and component B is 1:1.
Preferably, the organopolysiloxane has following molecular structure:
Wherein, a=400~1500, b=0~80;Wherein, R1 is C2~C4 alkenyl, R2 be C1~C6 alkyl or C2~
C4 alkenyl.
Preferably, the reinforced filling is silica, and specific surface area is 100~350m2/ g, bulk density be 40~
200kg/m3.The silica is fumed silica, precipitated silica, the vapor phase method titanium dioxide of silicic acid anhydride
The combination of one or both of precipitated silica of silicon and silicic acid anhydride or more.
Preferably, the silicone resin has following molecular structure:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g
Wherein, e=0.2~0.6, f=0.1~0.4, g=1.
Preferably, the heat filling is the group of one or both of aluminium oxide, zinc oxide or silicon carbide or more
It closes.
Preferably, the antistructurizing agent includes hexamethyldisilazane, three silazane of methyl, tetramethyl divinyl
One of disilazane, trim,ethylchlorosilane, trimethyl dichlorosilane, methyl trichlorosilane and dimethyl silicone polymer or two
Kind or more combination.
Preferably, the catalysts are one of platinum-type catalyst, palladium class catalyst and rhodium class catalyst.Its
In, the platinum-type catalyst includes one of reaction product of platinum black, platinum tetrachloride, chloroplatinic acid, chloroplatinic acid and hydroxyl alcohol or chlorine platinum
The complex compound or diacetyl platinum acetate of acid and alkene.
Preferably, organic hydrogen-based polysiloxanes has following molecular structure:
Wherein, c=6~60, d=10~130, R3 and R4 are methyl or hydrogen-based respectively.
Preferably, the reaction suppressor is 1- acetenyl -1- cyclohexanol, methyl butynol, 3,5- dimethyl -1- hexin
The combination of one or both of base -3- alcohol or more.
A kind of preparation method of foregoing organosilicon material comprising following steps:
(1) the component A of organosilicon material described before preparation:
A) organopolysiloxane for belonging to component A, reinforced filling, silicone resin, heat filling and structuring are controlled
Agent is uniformly mixed as the first mixture;
B) first mixture is vacuum-treated;
C) first mixture being vacuum-treated is subjected to first stage cooling, the catalysts is then added
Continueing to mix becomes the second mixture;
D) second mixture is subjected to second stage cooling, obtains the component A;
(2) the component B of organosilicon material described before preparation:
A) by part organopolysiloxane, reinforced filling, silicone resin, heat filling and the structuring for belonging to component B
Controlling agent is uniformly mixed as third mixture;
B) the third mixture is vacuum-treated;
C) the third mixture being vacuum-treated is subjected to first stage cooling, be then added remaining described organic
Hydrogen-based polysiloxanes and reaction suppressor are continuesd to mix as the 4th mixture;
D) the 4th mixture is subjected to second stage cooling, obtains the component B.
(3) the component A and component B is mixed.
Specifically, the incorporation time of first mixture and third mixture is 1~3 hour.
Further, the temperature that first mixture and third mixture are vacuum-treated is 120~180 DEG C, processing pressure
It is by force -0.05~-0.1Mpa, the processing time is 1~5 hour.
Further, the first stage is cooled to 25~65 DEG C.
Further, the incorporation time for forming the third mixture or the 4th mixture is 1~3 hour.
Further, the second stage is cooled to room temperature.
A method of apply foregoing organosilicon material to carry out 3D printing comprising following steps:
(4) it is obtained with computer analysis by the cross section information of printing objects;
(5) importing the cross section information includes in the printing device of master controller, printing head and print control platform;
(6) master controller passes out to printing by the printing head using the organosilicon material as printed material
In control platform, and control according to the cross section information motion track of the printing head.
Further, the printed material is made using the preparation method of foregoing organosilicon material.
Preferably, the component A and component B of the organosilicon material are uniformly mixed by weight 1:1 by static mixer
After be sent into printing head.
More preferably, the print control platform needs to preheat before being sent into the printed material.The print control platform
Preheating temperature be 80~150 DEG C.
Compared with prior art, the present invention has the advantage that
(1) organosilicon material provided by the invention, compared with other high molecular materials, especially polyurethane acroleic acid
Ester, oxypropylene acid esters, unsaturated polyester (UP) etc., linear shrinkage is small after solidification, and high temperature resistant is low temperature resistant, and flexibility is good, excellent weather resistance and hard
It is different, and biocompatibility is excellent, and safe and non-toxic, which is used to make needs for a long time in severe ring by this performance
Workpiece used in border, especially suitable for making artificial organ, human body artificial limb and human body implantation piece;
(2) organosilicon material provided by the invention, bi-component are liquid at normal temperature, this bi-component is mixed
Before can save heating melting equipment to raw material, save use cost;
(3) method of 3D printing provided by the invention has widened existing 3D using the organosilicon material as printed material
The selectable range of printed material, and can use the characteristic of the organosilicon material, produce workpiece above-mentioned, man-made organ,
Human body artificial limb and human body implantation piece.
Specific embodiment
Below in conjunction with specific embodiment, present invention is further described in detail.
Embodiment one:
In No. 1 vacuum planetary mixer, the organopolysiloxane of 80 parts by weight, the silicic acid anhydride of 30 parts by weight is added
Fumed silica (BET method specific surface area be 100m2/ g, bulk density 80kg/m3), 50 parts by weight of alumina, 2 weights
Amount part hexamethyldisilazane, mixed at high speed 1 hour;Then it is heated to 120 DEG C to be vacuum-treated 1 hour, vacuum degree control
In -0.05MPa~-0.1MPa range;Sizing material is cooled to 25 DEG C, the platinum acid chloride solution of 0.05 parts by weight is added, high speed is mixed
It closes 1 hour;Through the grinding of three rollers, it is cooled to room temperature to get component A.
In No. 2 vacuum planetary mixers, 80 weight of organopolysiloxane are added, the silicic acid anhydride of 30 parts by weight
(BET method specific surface area is 100m to fumed silica2/ g, bulk density 80kg/m3), 50 parts by weight of alumina, 2 weight
Part hexamethyldisilazane, mixed at high speed 1 hour;Then it is heated to 120 DEG C to be vacuum-treated 1 hour, vacuum degree control
In -0.05MPa~-0.1MPa range;Sizing material is cooled to 25 DEG C, be added the organic hydrogen-based polysiloxanes of 0.5 parts by weight and
1- acetenyl -1- the cyclohexanol of 0.05 parts by weight, mixed at high speed 1 hour;Through the grinding of three rollers, it is cooled to room temperature to get component B.
The molecular formula of above-mentioned organopolysiloxane are as follows:
In formula, a=400, b=80;Wherein, R1 is vinyl, and R2 is methyl.
Above-mentioned silicone resin representation is as follows:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g,
In formula, e=0.2, f=0.4, g=1.
Above-mentioned organic hydrogen-based polysiloxane molecule formula are as follows:
In formula, c=6, d=130, R3 are methyl, and R4 is hydrogen-based.
The 3D forming method of above-mentioned material:
Computer models model, generates layer-by-layer cross section information;The heating system of open printing platform, temperature control
System is at 80 DEG C;Then component A, B is sent into printing head by static mixer by weight 1:1 after mixing, calculates machine-readable
The movement for taking model information control spray head, is successively printed, until completing 3D model.
Embodiment two:
In No. 1 vacuum planetary mixer, the organopolysiloxane of 100 parts by weight, the vapor phase method two of 20 parts by weight is added
(BET method specific surface area is 300m to silica2/ g, bulk density 50kg/m3), 10 parts by weight silicone resin, the oxidation of 80 parts by weight
Aluminium, 8 parts by weight trim,ethylchlorosilanes, mixed at high speed 2 hours;Then it is heated to 150 DEG C to be vacuum-treated 2 hours, vacuum degree
Control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 30 DEG C, the platinum acid chloride solution of 0.1 parts by weight, high speed is added
Mixing 2 hours;Through the grinding of three rollers, it is cooled to room temperature to get component A.
In No. 2 vacuum planetary mixers, 100 weight of organopolysiloxane, the vapor phase method dioxy of 20 parts by weight is added
(BET method specific surface area is 300m to SiClx2/ g, bulk density 50kg/m3), 10 parts by weight silicone resin, 80 parts by weight of alumina, 8
Parts by weight trim,ethylchlorosilane, mixed at high speed 2 hours;Then it is heated to 150 DEG C to be vacuum-treated 2 hours, vacuum degree control
In -0.05MPa~-0.1MPa range;Sizing material is cooled to 30 DEG C, the organic hydrogen-based polysiloxanes of 2 parts by weight and 0.1 weight is added
The methyl butynol of amount part, mixed at high speed 2 hours;Through the grinding of three rollers, it is cooled to room temperature to get component B.
The molecular formula of above-mentioned organopolysiloxane are as follows:
In formula, a=800, b=10;Wherein, R1 is vinyl, and R2 is methyl.
Above-mentioned silicone resin representation is as follows:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g,
In formula, e=0.3, f=0.3, g=1.
Above-mentioned organic hydrogen-based polysiloxane molecule formula are as follows:
In formula, c=20, d=80, R3 are hydrogen-based, and R4 is hydrogen-based.
The 3D forming method of above-mentioned material:
Computer models model, generates layer-by-layer cross section information;The heating system of open printing platform, temperature control
System is at 100 DEG C;Then component A, B is sent into printing head by static mixer by weight 1:1 after mixing, calculates machine-readable
The movement for taking model information control spray head, is successively printed, until completing 3D model.
Embodiment three:
In No. 1 vacuum planetary mixer, the organopolysiloxane of 150 parts by weight, the precipitation method two of 60 parts by weight are added
(BET method specific surface area is 200m to silica2/ g, bulk density 200kg/m3), 15 parts by weight silicone resin, the oxidation of 60 parts by weight
Zinc, 20 parts by weight methyl trichlorosilanes, mixed at high speed 2.5 hours;Then it is heated to 160 DEG C to be vacuum-treated 3 hours, vacuum
Degree control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 40 DEG C, the diacetyl platinum acetate of 0.4 parts by weight is added
Solution, mixed at high speed 3 hours;Through the grinding of three rollers, it is cooled to room temperature to get component A.
In No. 2 vacuum planetary mixers, the organopolysiloxane of 150 parts by weight, the precipitation method two of 60 parts by weight are added
(BET method specific surface area is 200m to silica2/ g, bulk density 200kg/m3), 15 parts by weight silicone resin, the oxidation of 60 parts by weight
Zinc, 20 parts by weight methyl trichlorosilanes, mixed at high speed 2.5 hours;Then it is heated to 160 DEG C to be vacuum-treated 3 hours, vacuum
Degree control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 40 DEG C, the organic hydrogen-based polysiloxanes of 6 parts by weight is added
And 0.2 parts by weight 3,5- dimethyl -1- hexin base -3- alcohol, mixed at high speed 3 hours;It through the grinding of three rollers, is cooled to room temperature, i.e.,
Obtain component B.
The molecular formula of above-mentioned organopolysiloxane are as follows:
In formula, a=1500, b=0;Wherein, R1 is vinyl.
Above-mentioned silicone resin representation is as follows:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g,
In formula, e=0.6, f=0.1, g=1.
Above-mentioned organic hydrogen-based polysiloxane molecule formula are as follows:
In formula, c=60, d=10, R3 are hydrogen-based, and R4 is hydrogen-based.
The 3D forming method of above-mentioned material:
Computer models model, generates layer-by-layer cross section information;The heating system of open printing platform, temperature control
System is at 150 DEG C;Then component A, B is sent into printing head by static mixer by weight 1:1 after mixing, calculates machine-readable
The movement for taking model information control spray head, is successively printed, until completing 3D model.
Example IV:
In No. 1 vacuum planetary mixer, the organopolysiloxane of 200 parts by weight, the vapor phase method two of 50 parts by weight is added
(BET method specific surface area is 350m to silica2/ g, bulk density 40kg/m3), 20 parts by weight silicone resin, 30 parts by weight of alumina
With 30 parts by weight silicon carbide, 15 parts by weight hexamethyldisilazane, mixed at high speed 3 hours;Then 180 DEG C of vacuum are heated to
Processing 4 hours, vacuum degree control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 65 DEG C, 0.8 parts by weight are added
Platinum acid chloride solution, mixed at high speed 2 hours;Through the grinding of three rollers, it is cooled to room temperature to get component A.
In No. 2 vacuum planetary mixers, the organopolysiloxane of 200 parts by weight, the vapor phase method two of 50 parts by weight is added
(BET method specific surface area is 350m to silica2/ g, bulk density 40kg/m3), 20 parts by weight silicone resin, 30 parts by weight of alumina
With 30 parts by weight silicon carbide, 15 parts by weight hexamethyldisilazane, mixed at high speed 3 hours;Then 180 DEG C of vacuum are heated to
Processing 4 hours, vacuum degree control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 65 DEG C, 10 parts by weight, which are added, to be had
1- acetenyl -1- the cyclohexanol of machine hydrogen-based polysiloxanes and 0.4 parts by weight, mixed at high speed 2 hours;Through the grinding of three rollers, it is cooled to
Room temperature is to get component B.
The molecular formula of above-mentioned organopolysiloxane are as follows:
In formula, a=1000, b=5;Wherein, R1 is vinyl, and R2 is vinyl.
Above-mentioned silicone resin representation is as follows:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g,
In formula, e=0.4, f=0.2, g=1.
Above-mentioned organic hydrogen-based polysiloxane molecule formula are as follows:
In formula, c=40, d=50, R3 are methyl, and R4 is hydrogen-based.
The 3D forming method of above-mentioned material:
Computer models model, generates layer-by-layer cross section information;The heating system of open printing platform, temperature control
System is at 120 DEG C;Then component A, B is sent into printing head by static mixer by weight 1:1 after mixing, calculates machine-readable
The movement for taking model information control spray head, is successively printed, until completing 3D model.
Embodiment five:
In No. 1 vacuum planetary mixer, the organopolysiloxane of 150 parts by weight, the vapor phase method two of 15 parts by weight is added
(BET method specific surface area is 350m to silica2/ g, bulk density 40kg/m3), the vapor phase method two of the silicic acid anhydride of 5 parts by weight
(BET method specific surface area is 100m to silica2/ g, bulk density 80kg/m3), 18 parts by weight silicone resin, 20 part by weight of zinc oxide
With 30 parts by weight silicon carbide, 15 parts by weight hexamethyldisilazane, mixed at high speed 2.5 hours;Then 180 DEG C are heated to very
Vacancy is managed 5 hours, and vacuum degree control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 50 DEG C, 0.6 weight is added
The diacetyl platinum acetate solution of part, mixed at high speed 3 hours;Through the grinding of three rollers, it is cooled to room temperature to get component A.
In No. 2 vacuum planetary mixers, the organopolysiloxane of 150 parts by weight, the vapor phase method two of 15 parts by weight is added
(BET method specific surface area is 350m to silica2/ g, bulk density 40kg/m3), the vapor phase method two of the silicic acid anhydride of 5 parts by weight
(BET method specific surface area is 100m to silica2/ g, bulk density 80kg/m3), 18 parts by weight silicone resin, 20 part by weight of zinc oxide
With 30 parts by weight silicon carbide, 15 parts by weight hexamethyldisilazane, mixed at high speed 2.5 hours;Then 180 DEG C are heated to very
Vacancy is managed 5 hours, and vacuum degree control is in -0.05MPa~-0.1MPa range;Sizing material is cooled to 50 DEG C, 8 parts by weight are added
The methyl butynol of organic hydrogen-based polysiloxanes and 0.3 parts by weight, mixed at high speed 3 hours;Through the grinding of three rollers, it is cooled to room temperature,
Up to component B.
The molecular formula of above-mentioned organopolysiloxane are as follows:
In formula, a=600, b=70;Wherein, R1 is vinyl, and R2 is methyl.
Above-mentioned silicone resin representation is as follows:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g,
In formula, e=0.5, f=0.1, g=1.
Above-mentioned organic hydrogen-based polysiloxane molecule formula are as follows:
In formula, c=30, d=60, R3 are hydrogen-based, and R4 is hydrogen-based.
The 3D forming method of above-mentioned material:
Computer models model, generates layer-by-layer cross section information;The heating system of open printing platform, temperature control
System is at 130 DEG C;Then component A, B is sent into printing head by static mixer by weight 1:1 after mixing, calculates machine-readable
The movement for taking model information control spray head, is successively printed, until completing 3D model.
In conclusion organosilicon material superior performance of the invention, safe and non-toxic, the preparation method letter of the organosilicon material
Single easy, which, which is applied to 3D printing, has operability.
The above embodiment is a preferred embodiment of the present invention, but is not merely restricted to the described embodiments, other
Any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention, should be equivalent
Substitute mode is all included in the scope of protection of the present invention.
Claims (17)
1. a kind of organosilicon material, which is characterized in that it includes
Component A:
Component B:
Wherein, the weight ratio of the component A and component B is 1:1;
The reaction suppressor is 1- acetenyl -1- cyclohexanol, in methyl butynol, 3,5- dimethyl -1- hexin base -3- alcohol
One or two kinds of or more combinations;
The organosilicon material passes out in print control platform as printed material, and the print control platform is described in the feeding
It needs to be preheated to 80~150 DEG C before printed material;
The organopolysiloxane has following molecular structure:
Wherein, a=400~1500, b=0~80;Wherein, R1For C2~C4 alkenyl, R2For C1~C6 alkyl or C2~C4 chain
Alkenyl;
The silicone resin has following molecular structure:
[(CH3)3SiO1/2]e[(CH2=CH) (CH3)2SiO1/2]f[SiO4/2]g;
Wherein, e=0.2~0.6, f=0.1~0.4, g=1.
2. organosilicon material as described in claim 1, it is characterised in that: the reinforced filling is silica, specific surface
Product is 100~350m2/ g, bulk density are 40~200kg/m3。
3. organosilicon material as claimed in claim 2, it is characterised in that: the silica is fumed silica, sinks
One of precipitated silica of shallow lake method silica, the fumed silica of silicic acid anhydride and silicic acid anhydride or
Two kinds or more of combination.
4. organosilicon material as described in claim 1, it is characterised in that: the heat filling be aluminium oxide, zinc oxide or
The combination of one or both of silicon carbide or more.
5. organosilicon material as described in claim 1, it is characterised in that: the antistructurizing agent includes two silicon nitrogen of hexamethyl
Alkane, three silazane of methyl, tetramethyl divinyl disilazane, trim,ethylchlorosilane, trimethyl dichlorosilane, methyl trichlorine silicon
The combination of one or both of alkane and dimethyl silicone polymer or more.
6. organosilicon material as described in claim 1, it is characterised in that: the catalysts are platinum-type catalyst, palladium class
One of catalyst and rhodium class catalyst.
7. organosilicon material as claimed in claim 6, it is characterised in that: the platinum-type catalyst include platinum black, platinum tetrachloride,
The complex compound or diacetyl platinum acetate of one of reaction product of chloroplatinic acid, chloroplatinic acid and hydroxyl alcohol or chloroplatinic acid and alkene.
8. organosilicon material as described in claim 1, which is characterized in that organic hydrogen-based polysiloxanes has following molecule
Structure:
Wherein, c=6~60, d=10~130, R3And R4It is methyl or hydrogen-based respectively.
9. a kind of preparation method of the organosilicon material as described in claim 1~8 any one, which is characterized in that it includes
Following steps:
(1) the component A of the organosilicon material is prepared:
A) organopolysiloxane for belonging to component A, reinforced filling, silicone resin, heat filling and antistructurizing agent are mixed
Closing uniformly is the first mixture;
B) first mixture is vacuum-treated;
C) first mixture being vacuum-treated is subjected to first stage cooling, the catalysts is then added and continue
It is mixed into the second mixture;
D) second mixture is subjected to second stage cooling, obtains the component A;
(2) the component B of the organosilicon material is prepared:
A) the part organopolysiloxane for belonging to component B, reinforced filling, silicone resin, heat filling and structuring are controlled
Agent is uniformly mixed as third mixture;
B) the third mixture is vacuum-treated;
C) the third mixture being vacuum-treated is subjected to first stage cooling, remaining organic hydrogen-based is then added
Polysiloxanes and reaction suppressor are continuesd to mix as the 4th mixture;
D) the 4th mixture is subjected to second stage cooling, obtains the component B;
(3) the component A and component B is mixed.
10. the preparation method of organosilicon material as claimed in claim 9, it is characterised in that: first mixture and third
The incorporation time of mixture is 1~3 hour.
11. the preparation method of organosilicon material as claimed in claim 9, it is characterised in that: first mixture and third
The temperature that mixture is vacuum-treated is 120~180 DEG C, and processing pressure is -0.05~-0.1Mpa, and the processing time is 1~5 hour.
12. the preparation method of organosilicon material as claimed in claim 9, it is characterised in that: the first stage is cooled to 25
~65 DEG C.
13. the preparation method of organosilicon material as claimed in claim 9, it is characterised in that: formed second mixture or
The incorporation time of 4th mixture is 1~3 hour.
14. the preparation method of organosilicon material as claimed in claim 9, it is characterised in that: the second stage is cooled to room
Temperature.
15. the method that a kind of organosilicon material of application as described in claim 1~8 any one carries out 3D printing, feature
It is comprising following steps:
(1) it is obtained with computer analysis by the cross section information of printing objects;
(2) importing the cross section information includes in the printing device of master controller, printing head and print control platform;
(3) master controller passes out to print control by the printing head using the organosilicon material as printed material
In platform, and the motion track of the printing head is controlled according to the cross section information, the print control platform is being sent into
It needs to preheat before the printed material, the preheating temperature of the print control platform is 80~150 DEG C.
16. the method for 3D printing as claimed in claim 15, it is characterised in that: the printed material uses such as claim 9
The preparation method of organosilicon material described in~14 any one is made.
17. the method for the 3D printing as described in claim 15 or 16, it is characterised in that: the component A of the organosilicon material and
Component B is sent into printing head by static mixer by weight 1:1 after mixing.
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Address after: 511356 No. 18 Shanjiang South Road, Changgang Village, Yongning Street, Zengcheng District, Guangzhou City, Guangdong Province Patentee after: Guangdong Biaomei Silicon and Fluoride New Materials Co., Ltd. Address before: Room 1501, Tower B, Central Thailand International Plaza, No. 161 Linhe West Road, Tianhe District, Guangzhou City, Guangdong Province Patentee before: Guangdong Biaomei Silicon and Fluoride New Materials Co., Ltd. |