CN105238064A - Organosilicon material, preparation method thereof, and application method thereof in 3D printing - Google Patents
Organosilicon material, preparation method thereof, and application method thereof in 3D printing Download PDFInfo
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Abstract
The invention discloses an organosilicon material. The organosilicon material comprises: a component A comprising, by weight, 80-200 parts of organopolysiloxane, 20-60 parts of a reinforcing filler, 0-20 parts of silicon resin, 50-80 parts of a heat conduction filler, 2-20 parts of a structurized control agent, and 0.05-0.8 parts of a reaction catalyst; and a component B comprising, by weight, 80-200 parts of organopolysiloxane, 0.5-10 parts of organic hydrogen-containing polysiloxane, 20-60 parts of the reinforcing filler, 0-20 parts of silicon resin, 50-80 parts of the heat conduction filler, 2-20 parts of the structurized control agent, and 0.05-0.4 parts of a reaction inhibitor, wherein a weight ratio of the component A to the component B is 1:1. The invention also discloses a preparation method of the organosilicon material, and a method for applying the organosilicon material in 3D printing. The organosilicon material has the advantages of superior performances, safety and non-toxicity; the preparation method of the organosilicon material is simple and is easy to carry out; and application of the organosilicon material in 3D printing is maneuverable.
Description
Technical field
The present invention relates to a kind of organosilicon material, particularly relate to a kind of organosilicon material and preparation method thereof with its be applied to 3D print method.
Background technology
3D printing technique, also known as increasing material manufacturing technology, relates to multiple subjects such as forming materials processing, Automated condtrol, microcomputer modelling, materialogy.3D printing technique does not need complicated processing units and technique just can produce baroque product fast, solves the limitation that traditional technology difficulty of processing is large, can greatly reduce cost of labor and production cycle.Special in new product development, use 3D printing technique greatly to shorten the R&D cycle and to reduce R&D costs.Therefore, the application of 3D printing technique is more and more extensive.The equipment printed 3D in the industry at present and Controlling System are studied more deep, and relatively less for the research of material.3D printed material mainly comprises metallic substance, ceramic and macromolecular material.
Usually the macromolecular material adopted in prior art has urethane acrylate, oxypropylene acid esters, unsaturated polyester etc.The characteristic of this kind of material self makes the shortcomings such as its ubiquity high and low temperature resistance is poor, flexibility is poor, weather resisteant is poor.Be not suitable for the workpiece making and need to use in severe environment for a long time.Simultaneously because biocompatibility is poor, be not suitable for making artificial organ or human body implantation piece yet.
Summary of the invention
Primary and foremost purpose of the present invention is, provides a kind of durable, organosilicon material that biocompatibility is excellent, nontoxic.
Second object of the present invention provides a kind of preparation method of described organosilicon material.
3rd object of the present invention is, provides a kind of method described organosilicon material being applied to 3D and printing.
For reaching above technical purpose, the technical solution used in the present invention is as follows:
A kind of organosilicon material, it comprises
Component A:
Organopolysiloxane, 80 ~ 200 weight parts; Reinforced filling, 20 ~ 60 weight parts; Silicone resin, 0 ~ 20 weight part; Heat conductive filler, 50 ~ 80 weight parts; Antistructurizing agent, 2 ~ 20 weight parts; Catalysts, 0.05 ~ 0.8 weight part;
B component:
Organopolysiloxane, 80 ~ 200 weight parts; Organic hydrogen based polysiloxane, 0.5 ~ 10 weight part; Reinforced filling, 20 ~ 60 weight parts; Silicone resin, 0 ~ 20 weight part; Heat conductive filler, 50 ~ 80 weight parts; Antistructurizing agent, 2 ~ 20 weight parts; Reaction suppressor, 0.05 ~ 0.4 weight part;
Wherein, the weight ratio of described component A and B component is 1:1.
Preferably, described organopolysiloxane has following molecular structure:
Wherein, a=400 ~ 1500, b=0 ~ 80; Wherein, R1 is C2 ~ C4 alkenyl, and R2 is C1 ~ C6 alkyl or C2 ~ C4 alkenyl.
Preferably, described reinforced filling is silicon-dioxide, and its specific surface area is 100 ~ 350m
2/ g, tap density is 40 ~ 200kg/m
3.Described silicon-dioxide is one or both and above combination in fumed silica, precipitated silica, the fumed silica of hydrophobization process and the precipitated silica of hydrophobization process.
Preferably, described silicone resin has following molecular structure:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g
Wherein, e=0.2 ~ 0.6, f=0.1 ~ 0.4, g=1.
Preferably, described heat conductive filler is one or both and above combination in aluminum oxide, zinc oxide or silicon carbide.
Preferably, described antistructurizing agent comprises one or both and the above combination in hexamethyldisilazane, methyl three silazane, tetramethyl divinyl disilazane, trimethylchlorosilane, trimethylammonium dichlorosilane, METHYL TRICHLORO SILANE and polydimethylsiloxane.
Preferably, described catalysts is the one in platinum class catalyzer, palladium class catalyzer and rhodium class catalyzer.Wherein, described platinum class catalyzer comprises one of reaction product of platinum black, Tetrachloroplatinum, Platinic chloride, Platinic chloride and hydroxyl alcohol, or the complex compound of Platinic chloride and alkene, or diacetyl platinum acetate.
Preferably, described organic hydrogen based polysiloxane has following molecular structure:
Wherein, c=6 ~ 60, d=10 ~ 130, R3 and R4 is methyl or hydrogen base respectively.
Preferably, described reaction suppressor is one or both and the above combination in 1-ethynyl-1-hexalin, methylbutynol, 3,5-dimethyl-1-hexin base-3-alcohol.
A preparation method for foregoing organosilicon material, it comprises the steps:
(1) the component A of described before preparation organosilicon material:
A) being mixed by described organopolysiloxane, reinforced filling, silicone resin, heat conductive filler and the antistructurizing agent belonging to component A is the first mixture;
B) described first mixture is carried out vacuum-treat;
C) described vacuum treated first mixture is carried out first stage cooling, then add described catalysts and continue to be mixed into the second mixture;
D) described second mixture is carried out subordinate phase cooling, obtain described component A;
(2) B component of described before preparation organosilicon material:
A) being mixed by described part organopolysiloxane, reinforced filling, silicone resin, heat conductive filler and the antistructurizing agent belonging to B component is the 3rd mixture;
B) described 3rd mixture is carried out vacuum-treat;
C) described vacuum treated 3rd mixture is carried out first stage cooling, then add remaining described organic hydrogen based polysiloxane and reaction suppressor continues to be mixed into 4 mixture;
D) described 4 mixture is carried out subordinate phase cooling, obtain described B component.
(3) by described component A and B component mixing.
Particularly, the mixing time of described first mixture and the 3rd mixture is 1 ~ 3 hour.
Further, described first mixture and the vacuum treated temperature of the 3rd mixture are 120 ~ 180 DEG C, and process pressure is-0.05 ~-0.1Mpa, and the treatment time is 1 ~ 5 hour.
Further, the described first stage is cooled to 25 ~ 65 DEG C.
Further, the mixing time forming described 3rd mixture or 4 mixture is 1 ~ 3 hour.
Further, described subordinate phase is cooled to room temperature.
Apply the method that foregoing organosilicon material carries out 3D printing, it comprises the following steps:
(4) draw by the cross section information of printing objects with Computer Analysis;
(5) described cross section information importing is comprised in the printing device of principal controller, printing head and Print Control platform;
(6) described organosilicon material is passed out in Print Control platform as printed material by described printing head by described principal controller, and controls the motion track of described printing head according to described cross section information.
Further, described printed material adopts the preparation method of foregoing organosilicon material to obtain.
Preferably, the component A of described organosilicon material and B component send into printing head by weight 1:1 after static mixer mixes.
More preferably, described Print Control platform needs preheating before the described printed material of feeding.The preheating temperature of described Print Control platform is 80 ~ 150 DEG C.
Compared with prior art, the present invention has following advantage:
(1) organosilicon material provided by the invention, compared with other macromolecular materials, particularly urethane acrylate, oxypropylene acid esters, unsaturated polyester etc., after solidification, linear shrinkage is little, high temperature resistant low temperature resistant, flexibility is good, have excellent weather resistance, and biocompatibility is excellent, safety non-toxic, this organosilicon material is used for making the long-term workpiece used in severe environment of needs by this performance, is specially adapted to making artificial organ, human body artificial limb and human body implantation piece;
(2) organosilicon material provided by the invention, its two-pack is liquid at normal temperatures, can save raw-material heating and melting equipment, save use cost before this two-pack being mixed;
(3) method of 3D printing provided by the invention, utilize this organosilicon material as printed material, widen the selectable range of existing 3D printed material, and the characteristic of this organosilicon material can have been utilized, produce aforesaid workpiece, artificial organ, human body artificial limb and human body implantation piece.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment one:
In No. 1 vacuum planetary mixer, add the organopolysiloxane of 80 weight parts, (BET method specific surface area is 100m to the fumed silica of the hydrophobization process of 30 weight parts
2/ g, tap density is 80kg/m
3), 50 parts by weight of alumina, 2 weight part hexamethyldisilazanes, high-speed mixing 1 hour; Then be heated to 120 DEG C of vacuum-treat 1 hour, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 25 DEG C, adds the platinum acid chloride solution of 0.05 weight part, high-speed mixing 1 hour; Through three roller grindings, be cooled to room temperature, obtain component A.
In No. 2 vacuum planetary mixers, add 80 weight of organopolysiloxane, (BET method specific surface area is 100m to the fumed silica of the hydrophobization process of 30 weight parts
2/ g, tap density is 80kg/m
3), 50 parts by weight of alumina, 2 weight part hexamethyldisilazanes, high-speed mixing 1 hour; Then be heated to 120 DEG C of vacuum-treat 1 hour, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 25 DEG C, adds the 1-ethynyl-1-hexalin of the organic hydrogen based polysiloxane of 0.5 weight part and 0.05 weight part, high-speed mixing 1 hour; Through three roller grindings, be cooled to room temperature, obtain B component.
The molecular formula of above-mentioned organopolysiloxane is:
In formula, a=400, b=80; Wherein, R1 is vinyl, and R2 is methyl.
Above-mentioned silicone resin representation is as follows:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g，
In formula, e=0.2, f=0.4, g=1.
Above-mentioned organic hydrogen based polysiloxane molecular formula is:
In formula, c=6, d=130, R3 are methyl, and R4 is hydrogen base.
The 3D forming method of above-mentioned materials:
Computer carries out modeling to model, generates cross section information successively; The heating system of open printing platform, temperature controls at 80 DEG C; Then component A, B send into printing head by weight 1:1 after static mixer mixes, and the movement of computer reading model information Control shower nozzle, successively prints, until complete 3D model.
Embodiment two:
In No. 1 vacuum planetary mixer, add the organopolysiloxane of 100 weight parts, (BET method specific surface area is 300m to the fumed silica of 20 weight parts
2/ g, tap density is 50kg/m
3), 10 weight part silicone resin, 80 parts by weight of alumina, 8 weight part trimethylchlorosilanes, high-speed mixing 2 hours; Then be heated to 150 DEG C of vacuum-treat 2 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 30 DEG C, adds the platinum acid chloride solution of 0.1 weight part, high-speed mixing 2 hours; Through three roller grindings, be cooled to room temperature, obtain component A.
In No. 2 vacuum planetary mixers, add 100 weight of organopolysiloxane, (BET method specific surface area is 300m to the fumed silica of 20 weight parts
2/ g, tap density is 50kg/m
3), 10 weight part silicone resin, 80 parts by weight of alumina, 8 weight part trimethylchlorosilanes, high-speed mixing 2 hours; Then be heated to 150 DEG C of vacuum-treat 2 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 30 DEG C, adds the methylbutynol of the organic hydrogen based polysiloxane of 2 weight part and 0.1 weight part, high-speed mixing 2 hours; Through three roller grindings, be cooled to room temperature, obtain B component.
The molecular formula of above-mentioned organopolysiloxane is:
In formula, a=800, b=10; Wherein, R1 is vinyl, and R2 is methyl.
Above-mentioned silicone resin representation is as follows:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g，
In formula, e=0.3, f=0.3, g=1.
Above-mentioned organic hydrogen based polysiloxane molecular formula is:
In formula, c=20, d=80, R3 are hydrogen base, and R4 is hydrogen base.
The 3D forming method of above-mentioned materials:
Computer carries out modeling to model, generates cross section information successively; The heating system of open printing platform, temperature controls at 100 DEG C; Then component A, B send into printing head by weight 1:1 after static mixer mixes, and the movement of computer reading model information Control shower nozzle, successively prints, until complete 3D model.
Embodiment three:
In No. 1 vacuum planetary mixer, add the organopolysiloxane of 150 weight parts, (BET method specific surface area is 200m to the precipitated silica of 60 weight parts
2/ g, tap density is 200kg/m
3), 15 weight part silicone resin, 60 part by weight of zinc oxide, 20 weight part METHYL TRICHLORO SILANE, high-speed mixing 2.5 hours; Then be heated to 160 DEG C of vacuum-treat 3 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 40 DEG C, adds the diacetyl platinum acetate solution of 0.4 weight part, high-speed mixing 3 hours; Through three roller grindings, be cooled to room temperature, obtain component A.
In No. 2 vacuum planetary mixers, add the organopolysiloxane of 150 weight parts, (BET method specific surface area is 200m to the precipitated silica of 60 weight parts
2/ g, tap density is 200kg/m
3), 15 weight part silicone resin, 60 part by weight of zinc oxide, 20 weight part METHYL TRICHLORO SILANE, high-speed mixing 2.5 hours; Then be heated to 160 DEG C of vacuum-treat 3 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 40 DEG C, adds 3,5-dimethyl-1-hexin base-3-alcohol of the organic hydrogen based polysiloxane of 6 weight part and 0.2 weight part, high-speed mixing 3 hours; Through three roller grindings, be cooled to room temperature, obtain B component.
The molecular formula of above-mentioned organopolysiloxane is:
In formula, a=1500, b=0; Wherein, R1 is vinyl.
Above-mentioned silicone resin representation is as follows:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g，
In formula, e=0.6, f=0.1, g=1.
Above-mentioned organic hydrogen based polysiloxane molecular formula is:
In formula, c=60, d=10, R3 are hydrogen base, and R4 is hydrogen base.
The 3D forming method of above-mentioned materials:
Computer carries out modeling to model, generates cross section information successively; The heating system of open printing platform, temperature controls at 150 DEG C; Then component A, B send into printing head by weight 1:1 after static mixer mixes, and the movement of computer reading model information Control shower nozzle, successively prints, until complete 3D model.
Embodiment four:
In No. 1 vacuum planetary mixer, add the organopolysiloxane of 200 weight parts, (BET method specific surface area is 350m to the fumed silica of 50 weight parts
2/ g, tap density is 40kg/m
3), 20 weight part silicone resin, 30 parts by weight of alumina and 30 weight part silicon carbide, 15 weight part hexamethyldisilazanes, high-speed mixing 3 hours; Then be heated to 180 DEG C of vacuum-treat 4 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 65 DEG C, adds the platinum acid chloride solution of 0.8 weight part, high-speed mixing 2 hours; Through three roller grindings, be cooled to room temperature, obtain component A.
In No. 2 vacuum planetary mixers, add the organopolysiloxane of 200 weight parts, (BET method specific surface area is 350m to the fumed silica of 50 weight parts
2/ g, tap density is 40kg/m
3), 20 weight part silicone resin, 30 parts by weight of alumina and 30 weight part silicon carbide, 15 weight part hexamethyldisilazanes, high-speed mixing 3 hours; Then be heated to 180 DEG C of vacuum-treat 4 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 65 DEG C, adds the 1-ethynyl-1-hexalin of the organic hydrogen based polysiloxane of 10 weight part and 0.4 weight part, high-speed mixing 2 hours; Through three roller grindings, be cooled to room temperature, obtain B component.
The molecular formula of above-mentioned organopolysiloxane is:
In formula, a=1000, b=5; Wherein, R1 is vinyl, and R2 is vinyl.
Above-mentioned silicone resin representation is as follows:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g，
In formula, e=0.4, f=0.2, g=1.
Above-mentioned organic hydrogen based polysiloxane molecular formula is:
In formula, c=40, d=50, R3 are methyl, and R4 is hydrogen base.
The 3D forming method of above-mentioned materials:
Computer carries out modeling to model, generates cross section information successively; The heating system of open printing platform, temperature controls at 120 DEG C; Then component A, B send into printing head by weight 1:1 after static mixer mixes, and the movement of computer reading model information Control shower nozzle, successively prints, until complete 3D model.
Embodiment five:
In No. 1 vacuum planetary mixer, add the organopolysiloxane of 150 weight parts, (BET method specific surface area is 350m to the fumed silica of 15 weight parts
2/ g, tap density is 40kg/m
3), (BET method specific surface area is 100m to the fumed silica of the hydrophobization process of 5 weight parts
2/ g, tap density is 80kg/m
3), 18 weight part silicone resin, 20 part by weight of zinc oxide and 30 weight part silicon carbide, 15 weight part hexamethyldisilazanes, high-speed mixing 2.5 hours; Then be heated to 180 DEG C of vacuum-treat 5 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 50 DEG C, adds the diacetyl platinum acetate solution of 0.6 weight part, high-speed mixing 3 hours; Through three roller grindings, be cooled to room temperature, obtain component A.
In No. 2 vacuum planetary mixers, add the organopolysiloxane of 150 weight parts, (BET method specific surface area is 350m to the fumed silica of 15 weight parts
2/ g, tap density is 40kg/m
3), (BET method specific surface area is 100m to the fumed silica of the hydrophobization process of 5 weight parts
2/ g, tap density is 80kg/m
3), 18 weight part silicone resin, 20 part by weight of zinc oxide and 30 weight part silicon carbide, 15 weight part hexamethyldisilazanes, high-speed mixing 2.5 hours; Then be heated to 180 DEG C of vacuum-treat 5 hours, vacuum degree control is in-0.05MPa ~-0.1MPa scope; Sizing material is cooled to 50 DEG C, adds the methylbutynol of the organic hydrogen based polysiloxane of 8 weight part and 0.3 weight part, high-speed mixing 3 hours; Through three roller grindings, be cooled to room temperature, obtain B component.
The molecular formula of above-mentioned organopolysiloxane is:
In formula, a=600, b=70; Wherein, R1 is vinyl, and R2 is methyl.
Above-mentioned silicone resin representation is as follows:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g，
In formula, e=0.5, f=0.1, g=1.
Above-mentioned organic hydrogen based polysiloxane molecular formula is:
In formula, c=30, d=60, R3 are hydrogen base, and R4 is hydrogen base.
The 3D forming method of above-mentioned materials:
Computer carries out modeling to model, generates cross section information successively; The heating system of open printing platform, temperature controls at 130 DEG C; Then component A, B send into printing head by weight 1:1 after static mixer mixes, and the movement of computer reading model information Control shower nozzle, successively prints, until complete 3D model.
In sum, organosilicon material superior performance of the present invention, safety non-toxic, the preparation method of this organosilicon material is simple, and this organosilicon material is applied to 3D printing and has operability.
Above-described embodiment is the present invention's preferably embodiment; but be not merely restricted to the described embodiments; change, the modification done under other any does not deviate from spirit of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be all included within protection scope of the present invention.
Claims (22)
1. an organosilicon material, is characterized in that, it comprises
Component A:
B component:
Wherein, the weight ratio of described component A and B component is 1:1.
2. organosilicon material as claimed in claim 1, it is characterized in that, described organopolysiloxane has following molecular structure:
Wherein, a=400 ~ 1500, b=0 ~ 80; Wherein, R1 is C2 ~ C4 alkenyl, and R2 is C1 ~ C6 alkyl or C2 ~ C4 alkenyl.
3. organosilicon material as claimed in claim 1, it is characterized in that: described reinforced filling is silicon-dioxide, its specific surface area is 100 ~ 350m
2/ g, tap density is 40 ~ 200kg/m
3.
4. organosilicon material as claimed in claim 3, is characterized in that: described silicon-dioxide is one or both and above combination in fumed silica, precipitated silica, the fumed silica of hydrophobization process and the precipitated silica of hydrophobization process.
5. organosilicon material as claimed in claim 1, it is characterized in that, described silicone resin has following molecular structure:
[(CH
3)
3SiO
1/2]
e[(CH
2＝CH)(CH
3)
2SiO
1/2]
f[SiO
4/2]
g
Wherein, e=0.2 ~ 0.6, f=0.1 ~ 0.4, g=1.
6. organosilicon material as claimed in claim 1, is characterized in that: described heat conductive filler is one or both and above combination in aluminum oxide, zinc oxide or silicon carbide.
7. organosilicon material as claimed in claim 1, is characterized in that: described antistructurizing agent comprises one or both and above combination in hexamethyldisilazane, methyl three silazane, tetramethyl divinyl disilazane, trimethylchlorosilane, trimethylammonium dichlorosilane, METHYL TRICHLORO SILANE and polydimethylsiloxane.
8. organosilicon material as claimed in claim 1, is characterized in that: described catalysts is the one in platinum class catalyzer, palladium class catalyzer and rhodium class catalyzer.
9. organosilicon material as claimed in claim 8, is characterized in that: described platinum class catalyzer comprises one of reaction product of platinum black, Tetrachloroplatinum, Platinic chloride, Platinic chloride and hydroxyl alcohol, or the complex compound of Platinic chloride and alkene, or diacetyl platinum acetate.
10. organosilicon material as claimed in claim 1, it is characterized in that, described organic hydrogen based polysiloxane has following molecular structure:
Wherein, c=6 ~ 60, d=10 ~ 130, R3 and R4 is methyl or hydrogen base respectively.
11. organosilicon materials as claimed in claim 1, is characterized in that: described reaction suppressor is one or both and above combination in 1-ethynyl-1-hexalin, methylbutynol, 3,5-dimethyl-1-hexin base-3-alcohol.
The preparation method of 12. 1 kinds of organosilicon materials as described in claim 1 ~ 11 any one, is characterized in that, it comprises the steps:
(1) the component A of described organosilicon material is prepared:
A) being mixed by described organopolysiloxane, reinforced filling, silicone resin, heat conductive filler and the antistructurizing agent belonging to component A is the first mixture;
B) described first mixture is carried out vacuum-treat;
C) described vacuum treated first mixture is carried out first stage cooling, then add described catalysts and continue to be mixed into the second mixture;
D) described second mixture is carried out subordinate phase cooling, obtain described component A;
(2) B component of described organosilicon material is prepared:
A) being mixed by described part organopolysiloxane, reinforced filling, silicone resin, heat conductive filler and the antistructurizing agent belonging to B component is the 3rd mixture;
B) described 3rd mixture is carried out vacuum-treat;
C) described vacuum treated 3rd mixture is carried out first stage cooling, then add remaining described organic hydrogen based polysiloxane and reaction suppressor continues to be mixed into 4 mixture;
D) described 4 mixture is carried out subordinate phase cooling, obtain described B component;
(3) by described component A and B component mixing.
The preparation method of 13. organosilicon materials as claimed in claim 12, is characterized in that: the mixing time of described first mixture and the 3rd mixture is 1 ~ 3 hour.
The preparation method of 14. organosilicon materials as claimed in claim 12, is characterized in that: described first mixture and the vacuum treated temperature of the 3rd mixture are 120 ~ 180 DEG C, and process pressure is-0.05 ~-0.1Mpa, and the treatment time is 1 ~ 5 hour.
The preparation method of 15. organosilicon materials as claimed in claim 12, is characterized in that: the described first stage is cooled to 25 ~ 65 DEG C.
The preparation method of 16. organosilicon materials as claimed in claim 12, is characterized in that: the mixing time forming described second mixture or 4 mixture is 1 ~ 3 hour.
The preparation method of 17. organosilicon materials as claimed in claim 12, is characterized in that: described subordinate phase is cooled to room temperature.
The organosilicon material of 18. 1 kinds of application as described in claim 1 ~ 11 any one carries out the method for 3D printing, and it is characterized in that, it comprises the following steps:
(1) draw by the cross section information of printing objects with Computer Analysis;
(2) described cross section information importing is comprised in the printing device of principal controller, printing head and Print Control platform;
(3) described organosilicon material is passed out in Print Control platform as printed material by described printing head by described principal controller, and controls the motion track of described printing head according to described cross section information.
The method that 19. 3D as claimed in claim 18 print, is characterized in that: described printed material adopts the preparation method of the organosilicon material as described in claim 12 ~ 17 any one to obtain.
The method that 20. 3D as described in claim 18 or 19 print, is characterized in that: the component A of described organosilicon material and B component send into printing head by weight 1:1 after static mixer mixes.
The method that 21. 3D as claimed in claim 18 print, is characterized in that: described Print Control platform needs preheating before the described printed material of feeding.
The method that 22. 3D as claimed in claim 21 print, is characterized in that: the preheating temperature of described Print Control platform is 80 ~ 150 DEG C.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106221238A (en) * | 2016-08-19 | 2016-12-14 | 广东恒大新材料科技有限公司 | A kind of organosilicon material of 3D printer resin storage tank and preparation method thereof |
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| CN109650901A (en) * | 2019-01-31 | 2019-04-19 | 哈尔滨工业大学 | A kind of BN-Mg2Al4Si5O18Diphase ceramic material, preparation method and ceramic component |
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Address after: 511356 No. 18 Shanjiang South Road, Changgang Village, Yongning Street, Zengcheng District, Guangzhou City, Guangdong Province Patentee after: Guangdong Biaomei Silicon and Fluoride New Materials Co., Ltd. Address before: Room 1501, Tower B, Central Thailand International Plaza, No. 161 Linhe West Road, Tianhe District, Guangzhou City, Guangdong Province Patentee before: Guangdong Biaomei Silicon and Fluoride New Materials Co., Ltd. |