CN103881393A - Bi-component addition type organopolysiloxane composition and preparation method and application thereof - Google Patents
Bi-component addition type organopolysiloxane composition and preparation method and application thereof Download PDFInfo
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- CN103881393A CN103881393A CN201410106907.6A CN201410106907A CN103881393A CN 103881393 A CN103881393 A CN 103881393A CN 201410106907 A CN201410106907 A CN 201410106907A CN 103881393 A CN103881393 A CN 103881393A
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Abstract
The invention discloses a bi-component addition type organopolysiloxane composition. The bi-component addition type organopolysiloxane composition is prepared from a component A and a component B, wherein the component A is prepared from polymethylvinylsiloxane, a filler, a coupling agent, a cross-linking agent and an inhibitor; the component B is prepared from polymethylvinylsiloxane, a filler, a coupling agent and a catalyst. A preparation method of the bi-component addition type organopolysiloxane composition comprises the steps of preparing the component A: drying the filler, adding a solvent dilution substance of the coupling agent into the filler, dispersing, then, kneading with part of polymethylvinylsiloxane, so as to form paste, then, sequentially adding remaining polymethylvinylsiloxane, the inhibitor and the cross-linking agent, and dispersing uniformly; preparing the component B: drying the filler, adding a solvent dilution substance of the coupling agent into the filler, dispersing, then, kneading with part of polymethylvinylsiloxane, so as to form paste, then, sequentially adding remaining polymethylvinylsiloxane and the catalyst, and dispersing uniformly. The invention also discloses application of the composition in the encapsulation of the electronics industry. The composition disclosed by the invention has relatively good properties and is simple in process.
Description
Technical field
The present invention relates to bi-component addition type organopolysiloxane composition and preparation method thereof and application.
Background technology
Due to the good electrical insulating property of polysiloxane and the crosslinked no coupling product release of bi-component addition type organopolysiloxane, make it at electronic component, in electrical equipment encapsulation or embedding, there is more excellent performance.The production technology of organopolysiloxane and quality need further to be improved in the market.Electronic apparatus has certain radiating requirements substantially with two-pack embedding silica gel, how to improve the surface property of heat conductive filler, become and have heat conduction, good the construct key of bi-component addition type organopolysiloxane composition of mobility and package stability concurrently to improve its addition in organopolysiloxane and consistency.
Summary of the invention
The object of the present invention is to provide bi-component addition type organopolysiloxane composition and preparation method thereof and application.
The technical solution used in the present invention is:
Bi-component addition type organopolysiloxane composition, it is made up of A, B component; Described A component is made up of the raw material of following mass parts: 100 parts of poly-ethylene methacrylic radical siloxanes, 50 ~ 250 parts of fillers, 2 ~ 5 parts of coupling agents, 5 ~ 15 parts of linking agents, 0 ~ 1 part, inhibitor; Described B component is made up of the raw material of following mass parts: 100 parts of poly-ethylene methacrylic radical siloxanes, 50 ~ 250 parts of fillers, 2 ~ 5 parts of coupling agents, 0 ~ 1 part of catalyzer.
The viscosity of the poly-ethylene methacrylic radical siloxane in described A component and B component is 500-50000mPa.s.
Filler in described A component and B component is at least one in aluminum oxide, aluminium hydroxide, zinc oxide, silicon powder, calcium carbonate, magnesium oxide, talcum powder, clay, potter's clay, mica powder, kaolin, silicon-dioxide, barium sulfate, calcium sulfate, zirconium white.
Coupling agent in described A component and B component is at least one in silane coupling agent, titanate coupling agent, zirconium ester coupling agent, aluminate coupling agent, Aluminum zirconium coupling agent, titanium zirconium aluminate coupling agent.
Described linking agent is containing hydrogen silicone oil.
Described catalyzer is at least one in the Virahol complex compound of vinyl silanes complex compound, Platinic chloride of Platinic chloride, Platinic chloride.
Described inhibitor is at least one in acetylene compound, pyridine, vinyl cyanide, 2-vinyl Virahol, tetrachloroethylene, benzotriazole, metal-salt, alkenyl siloxane, unsaturated amine based compound, phenylhydrazine, methylhydrazine, tetramethyl guanidine carboxylicesters, triphenyl phosphite, triphenylphosphine, tributylamine, toxilic acid and derivative, fumaric acid and derivative.
The preparation method of bi-component addition type organopolysiloxane composition, comprise the following steps: the preparation of A component: dry filler, in filler, add the solvent cut thing of coupling agent and disperse, be kneaded into cream with the poly-ethylene methacrylic radical siloxane of part again, add successively more remaining poly-ethylene methacrylic radical siloxane, inhibitor, linking agent, be uniformly dispersed; The preparation of B component: dry filler, in filler, add the solvent cut thing of coupling agent and disperse, then being kneaded into cream with the poly-ethylene methacrylic radical siloxane of part, then adding successively remaining poly-ethylene methacrylic radical siloxane, catalyzer, be uniformly dispersed.
The application of bi-component addition type organopolysiloxane composition in electronic industry embedding.
The invention has the beneficial effects as follows: composition of the present invention has good performance, and technique is simple.
Specifically:
Composition prepared by the present invention has good construction mobility and certain thermal conductivity, and after placing for some time, finished product disperses resistance little, without obvious caking phenomenon.Preparation technology of the present invention is simple, and cost is low, and efficiency is high.
Embodiment
Bi-component addition type organopolysiloxane composition, it is made up of A, B component; Described A component is made up of the raw material of following mass parts: 100 parts of poly-ethylene methacrylic radical siloxanes, 50 ~ 250 parts of fillers, 2 ~ 5 parts of coupling agents, 5 ~ 15 parts of linking agents, 0 ~ 1 part, inhibitor; Described B component is made up of the raw material of following mass parts: 100 parts of poly-ethylene methacrylic radical siloxanes, 50 ~ 250 parts of fillers, 2 ~ 5 parts of coupling agents, 0 ~ 1 part of catalyzer.
The viscosity of the poly-ethylene methacrylic radical siloxane in described A component and B component is 500-50000mPa.s.
Filler in described A component and B component is at least one in aluminum oxide, aluminium hydroxide, zinc oxide, silicon powder, calcium carbonate, magnesium oxide, talcum powder, clay, potter's clay, mica powder, kaolin, silicon-dioxide, barium sulfate, calcium sulfate, zirconium white.
Coupling agent in described A component and B component is at least one in silane coupling agent, titanate coupling agent, zirconium ester coupling agent, aluminate coupling agent, Aluminum zirconium coupling agent, titanium zirconium aluminate coupling agent.
Described linking agent is containing hydrogen silicone oil.
Described catalyzer is at least one in the Virahol complex compound of vinyl silanes complex compound, Platinic chloride of Platinic chloride, Platinic chloride.
Described inhibitor is at least one in acetylene compound, pyridine, vinyl cyanide, 2-vinyl Virahol, tetrachloroethylene, benzotriazole, metal-salt, alkenyl siloxane, unsaturated amine based compound, phenylhydrazine, methylhydrazine, tetramethyl guanidine carboxylicesters, triphenyl phosphite, triphenylphosphine, tributylamine, toxilic acid and derivative, fumaric acid and derivative.
The preparation method of bi-component addition type organopolysiloxane composition, comprises the following steps: the preparation of A component: by coupling agent organic solvent diluting, obtain the solvent cut thing of coupling agent; Again filler is placed in to dry (100-110 DEG C, the 0.09-0.1Mpa) 2-4h of rotary vacuum dryer, then at 100-110 DEG C to the solvent cut thing that adds coupling agent in filler, disperse 30-60min to obtain dispersion; At 100-110 DEG C, the poly-ethylene methacrylic radical siloxane of this dispersion and 35-45% (being this 35-45% that walks poly-ethylene methacrylic radical siloxane used and account in A component poly-ethylene methacrylic radical siloxane total amount) is kneaded into cream again, add successively more remaining poly-ethylene methacrylic radical siloxane, inhibitor, linking agent, be uniformly dispersed; The preparation of B component: by coupling agent organic solvent diluting, obtain the solvent cut thing of coupling agent; Again filler is placed in to dry (100-110 DEG C, the 0.09-0.1Mpa) 2-4h of rotary vacuum dryer, then at 100-110 DEG C to the solvent cut thing that adds coupling agent in filler, disperse 30-60min to obtain dispersion; At 100-110 DEG C, the poly-ethylene methacrylic radical siloxane of this dispersion and 35-45% is kneaded into cream again, then adds successively remaining poly-ethylene methacrylic radical siloxane, catalyzer, be uniformly dispersed.
Preferably, the Virahol that the solvent cut thing of coupling agent is coupling agent and the dilution of toluene.
The application of bi-component addition type organopolysiloxane composition in electronic industry embedding.
Below in conjunction with specific embodiment, formula composition of the present invention is described further:
embodiment 1:
Bi-component addition type organopolysiloxane composition, formed by A component, B component, the formula of described A component consists of that (" part " is wherein " mass parts ", lower with): the silicon powder of 150 parts, the γ of 0.5 part-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, the titanic acid ester of 0.5 part, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the hexadecyl Trimethoxy silane of 1.5 parts, alkynyl ring alcohol, the containing hydrogen silicone oil (hydrogen content is 0.8%) of 12 parts of 0.02 part;
The formula of B component consists of that (" part " is wherein " mass parts ", lower with): the silicon powder of 150 parts, the γ of 0.5 part-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, the titanic acid ester of 0.5 part, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the hexadecyl Trimethoxy silane of 1.5 parts, the vinyl complex compound (platinum content is 5000ppm) of Platinic chloride of 0.5 part.
embodiment 2:
Bi-component addition type organopolysiloxane composition, formed by A component, B component, the formula of described A component consists of: the silicon powder of 150 parts, the γ of 0.5 part-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, the titanic acid ester of 0.5 part, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the vinyl three ('beta '-methoxy Ethoxysilane) of 1.5 parts, alkynyl ring alcohol, the containing hydrogen silicone oil (hydrogen content is 0.8%) of 12 parts of 0.02 part;
The formula of B component consists of (" part " is wherein " mass parts "): the silicon powder of 150 parts, the γ of 0.5 part-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, the titanic acid ester of 0.5 part, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the vinyl three ('beta '-methoxy Ethoxysilane) of 1.5 parts, the vinyl complex compound (platinum content is 5000ppm) of Platinic chloride of 0.5 part.
embodiment 3:
Bi-component addition type organopolysiloxane composition, formed by A component, B component, the formula of described A component consists of: the aluminium hydroxide of 150 parts, the γ of 0.5 part-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, the titanic acid ester of 0.5 part, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the hexadecyl Trimethoxy silane of 1.5 parts, alkynyl ring alcohol, the containing hydrogen silicone oil (hydrogen content is 0.8%) of 12 parts of 0.02 part;
The formula of B component consists of: the aluminium hydroxide of 150 parts, the γ of 0.5 part-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, the titanic acid ester of 0.5 part, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the hexadecyl Trimethoxy silane of 1.5 parts, the vinyl complex compound (platinum content is 5000ppm) of Platinic chloride of 0.5 part.
comparative example 1:
Bi-component addition type organopolysiloxane composition, be made up of A component, B component, the formula of described A component consists of the silicon powder of 150 parts, the poly-ethylene methacrylic base silane of 100 parts, alkynyl ring alcohol, the containing hydrogen silicone oil (hydrogen content: 0.8%) of 12 parts of 0.02 part;
The formula of B component consists of: the silicon powder of 150 parts, the poly-ethylene methacrylic base silane (viscosity: 1000mPa.s) of 100 parts, the vinyl complex compound (platinum content is 5000ppm) of Platinic chloride of 0.5 part.
The preparation method of the composition of comparative example is as follows: the preparation method of A component is: the poly-ethylene methacrylic radical siloxane of filler and 50% is added and in dispersing apparatus, is kneaded into cream, dewatered and dispersed 2 hours under 110 DEG C, 0.09-0.1Mpa vacuum condition, add remaining poly-ethylene methacrylic radical siloxane, alkynyl ring alcohol, containing hydrogen silicone oil, be uniformly dispersed;
The preparation method of B component is: the poly-ethylene methacrylic radical siloxane of filler and 50% is added and in dispersing apparatus, is kneaded into cream, dewatered and dispersed 2 hours under 110 DEG C, 0.09-0.1Mpa vacuum condition, add remaining poly-ethylene methacrylic radical siloxane, the vinyl complex compound of Platinic chloride, be uniformly dispersed.
The product of embodiment, comparative example is tested, and acquired results is as following table:
table 1:
Claims (9)
1. bi-component addition type organopolysiloxane composition, is characterized in that: it is made up of A, B component; Described A component is made up of the raw material of following mass parts: 100 parts of poly-ethylene methacrylic radical siloxanes, 50 ~ 250 parts of fillers, 2 ~ 5 parts of coupling agents, 5 ~ 15 parts of linking agents, 0 ~ 1 part, inhibitor; Described B component is made up of the raw material of following mass parts: 100 parts of poly-ethylene methacrylic radical siloxanes, 50 ~ 250 parts of fillers, 2 ~ 5 parts of coupling agents, 0 ~ 1 part of catalyzer.
2. bi-component addition type organopolysiloxane composition according to claim 1, is characterized in that: the viscosity of the poly-ethylene methacrylic radical siloxane in described A component and B component is 500-50000mPa.s.
3. bi-component addition type organopolysiloxane composition according to claim 1, is characterized in that: the filler in described A component and B component is at least one in aluminum oxide, aluminium hydroxide, zinc oxide, silicon powder, calcium carbonate, magnesium oxide, talcum powder, clay, potter's clay, mica powder, kaolin, silicon-dioxide, barium sulfate, calcium sulfate, zirconium white.
4. bi-component addition type organopolysiloxane composition according to claim 1, is characterized in that: the coupling agent in described A component and B component is at least one in silane coupling agent, titanate coupling agent, zirconium ester coupling agent, aluminate coupling agent, Aluminum zirconium coupling agent, titanium zirconium aluminate coupling agent.
5. bi-component addition type organopolysiloxane composition according to claim 1, is characterized in that: described linking agent is containing hydrogen silicone oil.
6. bi-component addition type organopolysiloxane composition according to claim 1, is characterized in that: described catalyzer is at least one in the Virahol complex compound of vinyl silanes complex compound, Platinic chloride of Platinic chloride, Platinic chloride.
7. bi-component addition type organopolysiloxane composition according to claim 1, is characterized in that: described inhibitor is at least one in acetylene compound, pyridine, vinyl cyanide, 2-vinyl Virahol, tetrachloroethylene, benzotriazole, metal-salt, alkenyl siloxane, unsaturated amine based compound, phenylhydrazine, methylhydrazine, tetramethyl guanidine carboxylicesters, triphenyl phosphite, triphenylphosphine, tributylamine, toxilic acid and derivative, fumaric acid and derivative.
8. the preparation method of bi-component addition type organopolysiloxane composition claimed in claim 1, it is characterized in that: comprise the following steps: the preparation of A component: dry filler, in filler, add the solvent cut thing of coupling agent and disperse, be kneaded into cream with the poly-ethylene methacrylic radical siloxane of part again, add successively more remaining poly-ethylene methacrylic radical siloxane, inhibitor, linking agent, be uniformly dispersed; The preparation of B component: dry filler, in filler, add the solvent cut thing of coupling agent and disperse, then being kneaded into cream with the poly-ethylene methacrylic radical siloxane of part, then adding successively remaining poly-ethylene methacrylic radical siloxane, catalyzer, be uniformly dispersed.
9. the application of bi-component addition type organopolysiloxane composition claimed in claim 1 in electronic industry embedding.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104497578A (en) * | 2014-12-17 | 2015-04-08 | 苏州锦腾电子科技有限公司 | Low-velocity liquid silicon rubber and preparation method thereof |
| CN105238064A (en) * | 2015-09-29 | 2016-01-13 | 广东标美硅氟新材料有限公司 | Organosilicon material, preparation method thereof, and application method thereof in 3D printing |
| CN105238065A (en) * | 2015-11-03 | 2016-01-13 | 深圳市沃尔核材股份有限公司 | Liquid ceramic silicone rubber and preparation method thereof |
| CN105623273A (en) * | 2015-10-30 | 2016-06-01 | 深圳市沃尔核材股份有限公司 | Coatable ceramic silicone rubber and preparation method therefor |
| CN104292843B (en) * | 2014-09-24 | 2016-08-17 | 惠州市安品新材料有限公司 | The preparation method of bi-component addition type organosilicon heat conduction casting glue |
| CN106497509A (en) * | 2016-11-04 | 2017-03-15 | 烟台德邦先进硅材料有限公司 | A kind of high impact-resistant type organosilicon bonded adhesives |
| CN111630097A (en) * | 2018-09-28 | 2020-09-04 | 株式会社Lg化学 | Release composition and release film comprising cured product thereof |
| WO2021241036A1 (en) * | 2020-05-26 | 2021-12-02 | 信越化学工業株式会社 | Two-pack type addition curable silicone rubber composition |
| JPWO2022138627A1 (en) * | 2020-12-21 | 2022-06-30 |
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| CN103102689A (en) * | 2011-11-15 | 2013-05-15 | 佛山市金戈消防材料有限公司 | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103102689A (en) * | 2011-11-15 | 2013-05-15 | 佛山市金戈消防材料有限公司 | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104292843B (en) * | 2014-09-24 | 2016-08-17 | 惠州市安品新材料有限公司 | The preparation method of bi-component addition type organosilicon heat conduction casting glue |
| CN104497578A (en) * | 2014-12-17 | 2015-04-08 | 苏州锦腾电子科技有限公司 | Low-velocity liquid silicon rubber and preparation method thereof |
| CN105238064A (en) * | 2015-09-29 | 2016-01-13 | 广东标美硅氟新材料有限公司 | Organosilicon material, preparation method thereof, and application method thereof in 3D printing |
| CN105238064B (en) * | 2015-09-29 | 2019-04-09 | 广东标美硅氟新材料有限公司 | A kind of organosilicon material and preparation method thereof and its method for being applied to 3D printing |
| CN105623273A (en) * | 2015-10-30 | 2016-06-01 | 深圳市沃尔核材股份有限公司 | Coatable ceramic silicone rubber and preparation method therefor |
| CN105238065A (en) * | 2015-11-03 | 2016-01-13 | 深圳市沃尔核材股份有限公司 | Liquid ceramic silicone rubber and preparation method thereof |
| CN106497509A (en) * | 2016-11-04 | 2017-03-15 | 烟台德邦先进硅材料有限公司 | A kind of high impact-resistant type organosilicon bonded adhesives |
| CN106497509B (en) * | 2016-11-04 | 2019-07-09 | 烟台德邦科技有限公司 | A kind of high impact-resistant type organosilicon bonded adhesives |
| CN111630097A (en) * | 2018-09-28 | 2020-09-04 | 株式会社Lg化学 | Release composition and release film comprising cured product thereof |
| CN111630097B (en) * | 2018-09-28 | 2022-04-15 | 株式会社Lg化学 | Release composition and release film comprising cured product thereof |
| WO2021241036A1 (en) * | 2020-05-26 | 2021-12-02 | 信越化学工業株式会社 | Two-pack type addition curable silicone rubber composition |
| CN115667408A (en) * | 2020-05-26 | 2023-01-31 | 信越化学工业株式会社 | Two-liquid addition curing type silicone rubber composition |
| JPWO2022138627A1 (en) * | 2020-12-21 | 2022-06-30 | ||
| WO2022138627A1 (en) * | 2020-12-21 | 2022-06-30 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Water-resistant adhesive polyorganosiloxane composition |
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Application publication date: 20140625 |