CN105226485B - Laser radiating device - Google Patents
Laser radiating device Download PDFInfo
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- CN105226485B CN105226485B CN201510703573.5A CN201510703573A CN105226485B CN 105226485 B CN105226485 B CN 105226485B CN 201510703573 A CN201510703573 A CN 201510703573A CN 105226485 B CN105226485 B CN 105226485B
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Abstract
The present invention relates to a kind of laser radiating devices, comprising: laser module；Thermal insulation board, the thermal insulation board are provided with separator, and multiple separators are arranged at intervals on the thermal insulation board, and multiple laser modules are respectively arranged between separator；Cooling body, the cooling body are connect with the thermal insulation board；The cooling body includes cooling cylinder, and the cooling cylinder has barrel, and the thermal insulation board is connected to the barrel.It will be separated by between multiple laser modules by thermal insulation board, so that the heat between multiple laser modules can not be concentrated, simultaneously, thermal insulation board will be after heat absorption, heat is distributed by cooling body, the heat of laser module is effectively distributed, substantially increases the service life of laser module.
Description
Technical field
The present invention relates to laser technology fields, more particularly to laser radiating device.
Background technique
With the continuous development of laser technology, more and more mature laser technology is applied in each technical field, for example, swashing
Light mark, laser printing, laser cutting and laser ranging etc., laser have the characteristics that high directivity, brightness are high and energy is concentrated,
Therefore, laser light source often generates a large amount of heat at work, such as not in time distributes heat, it will influences laser light source
And the working efficiency of related work component, or even will likely result in burning for laser light source and related work component.
Summary of the invention
Based on this, it is necessary to lack good radiator structure for existing laser module, cause to generate at work a large amount of
Heat, and then influence the defect of the service life of laser module, a kind of laser radiating device be provided, laser is effectively absorbed
The amount of heat that module generates at work, and heat is distributed, substantially increase the service life of laser module.
A kind of laser radiating device, comprising:
Laser module；
Thermal insulation board, the thermal insulation board are provided with separator, and multiple separators are arranged at intervals on the thermal insulation board, more
A laser module is respectively arranged between separator；
Cooling body, the cooling body are connect with the thermal insulation board；
The cooling body includes cooling cylinder, and the cooling cylinder has barrel, and the thermal insulation board is connected to the barrel；
It further include heat-conducting mechanism, the heat-conducting mechanism is connect with the thermal insulation board；
The heat-conducting mechanism includes cooling fin, and the cooling fin is connect with the thermal insulation board, and the cooling fin is semiconductor
Cooling fin, the semiconductor heat-dissipating piece includes first end and second end, and the first end is connect with the thermal insulation board, and described second
End connect with the first end, and the quantity of the semiconductor heat-dissipating piece is four, the thermal insulation board be it is rectangular, four described partly to lead
Body cooling fin is set to four angles of rectangular thermal insulation board；
The cooling body includes multiple coldplates, and the coldplate includes sequentially connected first cooling layer, second cold
But layer and third cooling layer, first cooling layer are connect with the thermal insulation board, first cooling layer, the second cooling layer and
Three cooling layer one forging moldings, first cooling layer, the second cooling layer and third cooling layer are respectively the material of unlike material
Material synthesis.In one embodiment, the different setting of spacing between multiple separators.
In one embodiment, the spacing between multiple separators is equal.
In one embodiment, the separator is isolation bar.
In one embodiment, the separator is isolation board.
In one embodiment, the isolation plate thickness is set as 8mm~12mm.
In one embodiment, the isolation plate thickness is set as 9mm~10mm.
In one embodiment, the isolation plate thickness is set as 9.5mm.
Above-mentioned laser radiating device will be separated by by thermal insulation board between multiple laser modules so that multiple laser modules it
Between heat can not concentrate, meanwhile, thermal insulation board is distributed heat by cooling body, by after heat absorption so that laser module
Heat can effectively distribute, substantially increase the service life of laser module.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the laser radiating device of one embodiment of the invention；
Fig. 2 is the schematic diagram of the section structure of the laser radiating device of another embodiment of the present invention；
Fig. 3 is the schematic diagram of the section structure of the laser radiating device of another embodiment of the present invention；
Fig. 4 is the schematic diagram of the section structure of the laser radiating device of one embodiment of the invention；
Fig. 5 is the schematic diagram of the section structure of the laser radiating device of another embodiment of the present invention；
Fig. 6 is the schematic diagram of the section structure of the laser radiating device of another embodiment of the present invention；
Fig. 7 is the schematic diagram of the section structure in a direction of the laser radiating device of another embodiment of the present invention；
Fig. 8 is the schematic diagram of the section structure of the laser radiating device of another embodiment of the present invention；
Fig. 9 is the schematic diagram of the section structure of the laser radiating device of another embodiment of the present invention；
Figure 10 is the structural schematic diagram of the thermal insulation board of the laser radiating device of another embodiment of the present invention.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
For example, a kind of laser radiating device comprising: laser module；Thermal insulation board, the thermal insulation board are provided with separator,
Multiple separators are arranged at intervals on the thermal insulation board, and multiple laser modules are respectively arranged between separator；It is cold
But mechanism, the cooling body are connect with the thermal insulation board；The cooling body includes cooling cylinder, and the cooling cylinder has cylinder
Wall, the thermal insulation board are connected to the barrel.
The laser module is for emitting laser, for example, laser module transmitting laser carries out mark, for example, described
Laser module emits laser and carries out ranging, for example, laser module transmitting laser is for cutting, it should be understood that laser
Module can be applicable to different scenes, should not be limited to any of the above-described implement scene, and laser radiating device of the invention can root
It is arranged according to the different shape and size of laser module, following example is only used as one or more preferred embodiments of the invention
Expansion elaboration is carried out, is not applied only on the laser module of this type with limiting the present invention.
For example, as shown in Figure 1, it is a preferred embodiment of the present invention laser radiating device 10, comprising: laser module
100, thermal insulation board 200, cooling body 300 and heat-conducting mechanism 400, the thermal insulation board 200 are provided with separator, multiple isolation
Part is arranged at intervals on the thermal insulation board 200, and multiple laser modules 100 are respectively arranged between separator；The cooling
Mechanism 300 is connect with the thermal insulation board 200；The heat-conducting mechanism 400 is connect with the thermal insulation board 200；For another example, the cooler
Structure 300 includes cooling cylinder 310, and the cooling cylinder 310 has barrel 311, and the thermal insulation board 200 is connected to the barrel 311.
For example, referring again to Fig. 1, the cooling cylinder 310 be it is rectangular, the barrel 311 is in four orthogonal
Wall, the thermal insulation board 200 are four, and four thermal insulation boards 200 are connected to four logical inner walls of the cooling, i.e., described in four
Thermal insulation board 200 is arranged in a mutually vertical manner, and multiple laser modules 100 are respectively arranged between separator, will be more by the separator
A laser module 100 is spaced one from, so that the heat between multiple laser modules 100 can not be concentrated, is conducive to heat
It distributes, and laser module 100 described in multiple groups is separately positioned on different thermal insulation boards 200, can further spread the mode of laser
The heat of block 100, so that the heat of multiple laser modules 100 is further dispersed.
For example, the cooling cylinder 310 is polygon, the cooling cylinder 310 of the polygon has multiple inner walls, multiple heat-insulated
Plate 200 is correspondingly arranged on multiple inner walls, in this way, can be further such that the mode of laser on multiple thermal insulation boards 200
Block 100 is dispersed, for example, the cooling cylinder 310 is hexagon, for example, the cooling cylinder 310 is octagon.
In order to enable the uniform heat distribution of multiple laser modules 100, being conducive to the cooling cylinder 310 can be uniform
Ground absorbs the heat of the laser module 100, for example, as shown in Fig. 2, the cooling cylinder 310 is circle, for example, described heat-insulated
Plate 200 is arc, and the thermal insulation board 200 of arc is matched with 310 shape of cooling cylinder, and the thermal insulation board 200 is connected to institute
It states on the round tube wall 311 of cooling cylinder 310.
In order to enable heat is more uniformly spread, for example, the thermal insulation board 200 is provided with multiple thermal vias, it is described to dissipate
Heat through-hole is evenly distributed on the thermal insulation board 200, can accelerate the air circulation on thermal insulation board 200 in this way so that it is described every
Heat on hot plate 200 can distribute rapidly, and heat is more uniformly spread.
For example, the different setting of spacing between multiple separators, i.e., spacing between multiple separators not phase
Deng in this way, different spacing can place the laser module 100 of different specifications, size, to meet the needs of different.Alternatively,
In order to enable the heat of the laser module 100 on the thermal insulation board 200 distributes more uniformly, and as depicted in figs. 1 and 2, Duo Gesuo
The spacing stated between separator is equal, is set to the spacing phase of multiple laser modules 100 between multiple separators in this way
Deng absorbing the heat of multiple laser modules 100 distributed uniformly by the thermal insulation board 200, avoid described
The heat of laser module 100 is excessively concentrated.
In one embodiment, the separator is isolation bar, for example, 200 one of the isolation bar and the thermal insulation board
Effectively multiple laser modules 100 can be isolated for molding setting, the isolation bar, avoid heat from excessively concentrating, for example, the isolation
Muscle is provided with arc-shaped surface.
In a further embodiment, as shown in Figures 1 to 6, the separator is isolation board 210, for example, the isolation board
210 are vertically arranged on the thermal insulation board 200, for example, the isolation board 210 and the thermal insulation board 200 are integrally formed and are arranged, example
Such as, as shown in Figures 4 to 6, the two sides of the laser module 100 are connected to the thermal insulation board 200 of adjacent two, in this way, institute
It states laser module 100 not only to connect by bottom with thermal insulation board 200, heat is allowed to pass through the bottom of the laser module 100
Portion is transmitted to thermal insulation board 200, can also transfer heat to isolation board 210 by two sides, and the isolation board 210 can will be warm
Amount is transferred to thermal insulation board 200 rapidly, and the radiating efficiency of the laser module 100 is further increased with this.
For example, the isolation board 210 and the integrated forging molding of the thermal insulation board 200, for example, the isolation board 210 and institute
Stating thermal insulation board 200 is metal material, for example, the isolation board 210 and the thermal insulation board 200 are alloy material, for example, the conjunction
Golden material is copper alloy, for example, the isolation board 210 and the thermal insulation board 200 include each component of following mass parts:
60 parts~75 parts of copper, 4 parts~4.5 parts of aluminium, silver 2.5 parts~4.5 parts, 0.6 part~0.8 part of titanium, 4 parts~4.5 parts of magnesium,
1 part~1.5 parts of iron, 1 part~1.2 parts of nickel, 0.2 part~0.4 part of manganese, 0.5 part~2 parts of graphene, 0.7 part of chromium~0.8 part, vanadium
0.6 part~0.8 part and 1.2 parts~15 parts of silicon.
Preferably, each component of the isolation board 210 with the thermal insulation board 200 including following mass parts:
72 parts of copper, 4.3 parts of aluminium, silver-colored 3.5 parts, 0.7 part of titanium, 4 parts of magnesium, 1.2 parts of iron, 1.1 parts of nickel, 0.3 part of manganese, graphene
1.6 parts, 0.75 part of chromium, 0.75 part of vanadium and 1.3 parts of silicon.
The alloy synthesized by above-mentioned component, have good heat absorption and heating conduction, wherein the thermal conductivity of copper be 500~
600W/ (m* DEG C), the thermal conductivity of aluminium are 200~300W/ (m* DEG C), using both metals as the alloy of primary raw material with compared with
Strong heating conduction, and 600~750W/ of thermal conductivity (m* DEG C) of silver, silver in the alloy more preferably effectively heating conduction of alloy.
It is too thick it should be understood that the thickness of the isolation board 210 should not be too thick, can not reduce heat conduct to every
The speed of hot plate 200, and if thickness is too thin, be easy so that 100 spacing of laser module of 210 two sides of isolation board too
Closely, it is unfavorable for heat to distribute, and is easy so that the heat of the laser module 100 of 210 two sides of isolation board influences each other, in order to enable
210 one side of isolation board can absorb rapidly heat, on the other hand reduce the heat of the laser module 100 of 210 two sides of isolation board
Interaction, for example, 210 thickness of the isolation board is set as 8mm~12mm, it is preferable that 210 thickness of isolation board setting
For 9mm~10mm, it is preferable that 210 thickness of isolation board is set as 9.5mm, in this way, making the heat transfer efficiency of isolation board 210
It is improved, thermal insulation board 200 will can be transferred to rapidly after the heat absorption of laser module 100, on the other hand, avoid two
The spacing of adjacent laser module 100 is too close, so that heat between the two influences each other, causes local temperature excessively high, thus
Influence the service life of laser module 100.
In order to improve heat dissipation effect, as shown in Figures 3 to 6, the cooling body 300 further includes multiple coldplates 320, institute
It states coldplate 320 to connect with the thermal insulation board 200, multiple coldplates 320 connect internal formation cooling chamber 330, for example, institute
It states multiple coldplates 320 and is in turn connected to form cooling cylinder 310, for example, multiple coldplates 320 connect internal formation cooling chamber
330, for example, multiple coldplates 320 are integrally formed connection, the internal cooling cylinder 310 with cooling chamber 330 is formed, for example,
330 shape of cooling chamber is matched with 310 shape of cooling cylinder, for example, the cooling cylinder 310 is rectangular, the then cooling
Chamber 330 is Q-RING, and the cooling chamber 330 is arranged around the cooling cylinder 310, for example, Fig. 3 is referred to, the cooling cylinder 310
For circle, then the cooling chamber 330 is circular rings, and the cooling chamber 330 is arranged around the cooling cylinder 310.The coldplate
320 by after the heat absorption of the thermal insulation board 200, and the cooling chamber 330 by heat absorption and distributes rapidly, so that the laser
The heat of module 100 can distribute rapidly.
In order to further increase the heat absorption capacity of the cooling chamber 330, as shown in figure 4, the cooling body 300 further includes
Cooler 340, the cooler 340 are connected to the cooling chamber 330, by 200 heat of thermal insulation board in the cooling chamber 330
Air can be cooled down by cooler 340 so that more heats can be absorbed in the interior air of the cooling chamber 330,
Heat absorption efficiency is higher.
For example, the cooling body 300 further includes cooling tube 350 referring again to Fig. 4, the cooler 340 passes through cold
But pipe 350 is connected to the cooling chamber 330, for example, the cooling tube 350 includes first circulation pipe 351 and second circulation pipe
352, the cooling chamber 330 has the first communication port 331 and the first communication port 332, and the cooler 340 is followed by described first
Endless tube 351 is connected to first communication port 331 of the cooling chamber 330, and passes through the second circulation pipe 352 and described the
One communication port 332 connection, in this way, absorbing the air of heat can be entered by the first communication port 331 and first circulation pipe 351
Cooler 340, under the cooler 340 effect, heat is absorbed and is discharged by the cooler 340, logical through cooling air
It crosses second circulation pipe 352 and the first communication port 332 is again introduced into cooling chamber 330, so that the temperature of cooling chamber 330 is dropped
It is low, improve the heat absorption capacity of cooling chamber 330.
For example, being provided with cooling medium in the cooling chamber 330, for example, the cooling medium is air, air is good
Heat transfer medium, be easy to obtain, have velocity of liquid assets fast, be easy to the characteristics of transmitting, air can rapidly in cooling chamber 330 and
It circulates in cooler 340, so that heat exchanger effectiveness improves, in order to further increase the endothermic effect of the cooling body 300, example
Such as, the cooling medium is coolant liquid, for example, the coolant liquid is cooling water, water has the characteristics that specific heat capacity is big, and has valence
The advantages of lattice are cheap, are easily obtained can effectively take away the heat of coldplate 320 when cooling water circulates in cooling chamber 330
Amount, and heat is distributed by cooler 340, since specific heat capacity is big, cooling water can fully absorb the heat of coldplate 320
Amount, and temperature is unlikely to increase excessively, has good endothermic effect.For example, the cooler 340 includes water cooling box 360, institute
It states water cooling box 360 and goes pipe to be connected to the cooling chamber 330 by cold, such as be provided with multiple copper pipes in the water cooling box 360, institute
It states copper pipe and is connect with the radiating fin 361 being set to outside the water cooling box 360, cooling water is by the heat of the cooling chamber 330
It takes in water cooling box 360, after the copper pipe in the water cooling box 360 absorbs the heat of cooling water, transfers heat to radiating fin
Piece 361, radiating fin 361 distribute heat.
For example, in order to improve the heat absorption efficiency of cooling water in cooling chamber 330, referring again to Fig. 4, the cooling chamber 330
It is inside provided with metallic particles 333, for example, the metallic particles 333 is copper particle, for example, the metallic particles 333 is aluminium copper
Grain, metallic particles 333 have good heat-conducting effect, can fully absorb the heat of coldplate 320, and metallic particles 333 increases
The contact area with cooling water is added, during flow of cooling water, metallic particles 333 can be filled in multiple angles with cooling water
Tap touching, allows heat to be sufficiently transferred to cooling water by metallic particles 333, improves thermal conversion efficiency.
In order to avoid metallic particles 333 flows out the cooling chamber 330 with the flowing of cooling water, as shown in figure 4, described
First communication port 331 and first communication port 332 of cooling chamber 330 are respectively arranged with strainer 334, the strainer 334
With filter opening, the diameter of the filter opening is less than the diameter of the metallic particles 333, it should be understood that the metallic particles 333
Diameter cannot be excessive, if the diameter of metallic particles 333 is excessive, the quality of metallic particles 333 is increased with it, then influence described in
The mobility of metallic particles 333 reduces metal so that metallic particles 333 is unable to fully the flowing with cooling water and moves
The contact frequency of particle 333 and cooling water, and the diameter of metallic particles 333 is also unsuitable too small, too small then metallic particles 333 is easy
It is lost from cooling chamber 330, and in order to avoid the too small metallic particles 333 of diameter is lost, then the diameter of filter opening then will accordingly subtract
Small, the reduction of the diameter of filter opening then reduces the mobility of cooling water, in order to improve the flexibility ratio of metallic particles 333, and makes
The more flowability of cooling water, for example, 333 diameter of the metallic particles be 3mm~6mm, the filter opening diameter be 1.8mm~
3.5mm；Preferably, 333 diameter of metallic particles is 5mm, and the filter opening diameter is 3mm, in this way, metallic particles 333 has
Lesser volume and quality, flexibility ratio is higher, can move with flow of cooling water and quickly, increases the contact frequency with cooling water,
On the other hand, the control of filter opening can abundant filtering metal particle 333, avoid metallic particles 333 from being lost, and have good logical
The property crossed, so that cooling water has preferable mobility, so that cooling water can rapidly take away heat.
In order to further increase endothermic effect, for example, the coolant liquid is ethyl alcohol, ethyl alcohol has volatile characteristic, when
Ethyl alcohol is heated readily volatilized in the cooling chamber 330, can absorb the heat of the coldplate 320 rapidly, when ethyl alcohol circulates
When to cooler 340, heat is released under the action of cooler 340, ethyl alcohol cohesion is liquid, is circulated again into cooling chamber 330
It is interior, to realize the circulation of heat absorption and heat dissipation, substantially increase the radiating efficiency of coldplate 320.
For example, the cooling medium is liquid nitrogen, liquid nitrogen has extremely low temperature, has extraordinary endothermic effect, when
When liquid nitrogen circulates in cooling chamber 330, the heat of cooling version can be absorbed as quick as thought, so that cooling version has extraordinary heat absorption
Effect can rapidly substantially increase the heat absorption of thermal insulation board 200 so that laser module 100 works at a normal temperature
The service life of laser module 100.
In order to further increase the cooling effect of cooling body 300, for example, the cooling medium is refrigerant, for example, institute
Stating refrigerant is R417A, for example, as shown in figure 5, the cooler 340 includes compressor 341, throttle valve 342 and condenser
343, one end of the compressor 341 is connect with 343 one end of condenser, the other end and the throttle valve 342 of the condenser 343
One end connection, the other end of the throttle valve 342 are connect with one end of cooling chamber 330, the other end and pressure of the cooling chamber 330
The other end of contracting machine 341 connects, and in concrete application, compressor 341 works, and is high pressure gaseous refrigeration by refrigerant compression
Agent, refrigerant enter condenser 343 after compression, and under the cooling effect of condenser 343, the gaseous refrigerant of high temperature and pressure is cold
It but is the liquid refrigerant of cryogenic high pressure, cryogenic high pressure liquid refrigerant becomes low-temp low-pressure under 342 antihypertensive effect of throttle valve
Liquid refrigerant after low-temp low-pressure liquid refrigerant enters cooling chamber 330, absorbs the heat in cooling chamber 330, volatilizees rapidly,
So that the temperature of cooling chamber 330 and coldplate 320 reduces rapidly, so that the heat of thermal insulation board 200 is largely absorbed, volatilization
It after gaseous refrigerant afterwards enters compressor 341, is compressed, is constantly recycled with this process again, worked in laser module 100
When for 100 low temperature of laser module working environment, extend laser module 100 service life.
In order to further increase the heat absorption and the capacity of heat transmission of the coldplate 320, please referring also to Fig. 6 and Fig. 7, described cold
But cooling capillary 325 is provided in plate 320, for example, the cooling capillary 325 is connected to the cooling chamber 330, in this way,
The contact area that cooling chamber 330 Yu coldplate 320 can be increased by the cooling capillary 325, further increases cooling chamber
330 heat absorption efficiency allows the heat of the thermal insulation board 200 to be efficiently transmitted to cooling chamber by the coldplate 320
330, and distributed by cooling chamber 330.
For example, coolant liquid is provided in the cooling capillary 325, such as the coolant liquid is cooling water, for example, described
Cooling water contacts cooling water sufficiently with coldplate 320, cooling by being circulated to cooling capillary 325 in cooling chamber 330
Water can fully absorb the heat of coldplate 320, and take away heat in the cyclic process of cooling water, and distribute.
It should be understood that the diameter of the cooling capillary 325 should not be too large, the diameter of excessive cooling capillary 325
Decline the heat absorption capacity of coldplate 320, the coolant liquid can not also be made sufficiently to contact with the coldplate 320, and
The diameter of the cooling capillary 325 is also unsuitable too small, and the diameter of too small cooling capillary 325 will affect the stream of coolant liquid
It is logical, in order to increase the contact area of coolant liquid Yu coldplate 320, and improve stream of the coolant liquid in cooling capillary 325
Logical speed, for example, 325 diameter of cooling capillary is set as 2mm~6mm, it is preferable that cooling 325 diameter of capillary
It is set as 3mm~5mm, it is preferable that cooling 325 diameter of capillary is set as 4mm, for example, setting in the coldplate 320
There are multiple cooling capillaries 325, what such lesser 325 to one, cooling capillaries of diameter multiple in this way were relatively large in diameter
The surface area of cooling capillary 325 is bigger, to considerably increase the contact area of coolant liquid Yu the coldplate 320, improves
On the other hand the heat absorption capacity of coolant liquid so that coolant liquid can swimmingly circulate in the cooling capillary 325, mentions
High heat exchanger effectiveness.In order to enable coolant liquid can contact more uniformly with the coldplate 320, for example, multiple described cold
But capillary 325 is uniformly arranged in the coldplate 320, for example, multiple cooling capillaries 325 are parallel to each other and uniform
It is arranged in the coldplate 320, for example, as shown in fig. 7, multiple cooling capillaries 325 are in head and the tail sequentially connected " U "
Shape setting, on the one hand increases the contact area of coolant liquid Yu coldplate 320, so that each position of coolant liquid and coldplate 320
Contact more uniformly, on the other hand allows coolant liquid in the cooling chamber 330 and cooling 325 inner recirculation flow of capillary
It is logical, further increase heat exchanger effectiveness.
In order to further increase the heat absorption and heat-sinking capability of the coldplate 320, as shown in Figure 8 and Figure 9, the cooler
Structure 300 includes multiple coldplates 320, and the coldplate 320 includes sequentially connected first cooling layer 321, the second cooling layer 322
With third cooling layer 323, first cooling layer 321 is connect with the thermal insulation board 200, for example, first cooling layer 321,
Second cooling layer 322 and the integrated forging molding of third cooling layer 323, for example, first cooling layer 321, the second cooling layer 322
The metal of unlike material is respectively set to third cooling layer 323, for example, first cooling layer 321, the second cooling layer 322
It is respectively the materials synthesis of unlike material with third cooling layer 323, for example, first cooling layer 321 is set as thermally conductive carbon fiber
Dimension, second cooling layer 322 are set as copper, and the third cooling layer 323 is set as aluminium.
In order to improve the heat transmitting effect between first cooling layer 321, the second cooling layer 322 and third cooling layer 323
Rate, for example, being provided with silica gel between first cooling layer 321, the second cooling layer 322 and third cooling layer 323.
It should be understood that since first cooling layer 321, the second cooling layer 322 and third cooling layer 323 be not using
With material be made, therefore first cooling layer 321, the second cooling layer 322 and third cooling layer 323 have it is different thermally conductive
Rate, in order to enable the heat transmitting of first cooling layer 321, the second cooling layer 322 and third cooling layer 323 is more uniform, high
Effect, for example, the thickness of first cooling layer 321, the second cooling layer 322 and third cooling layer 323 is sequentially reduced, above-mentioned
In one embodiment, first cooling layer 321 is thermally conductive carbon fiber, and the thermal conductivity of thermally conductive carbon fiber is 600~900W/ (m*
DEG C), second cooling layer 322 is copper, and the thermal conductivity of copper is 500~600W/ (m* DEG C), and third cooling layer 323 is aluminium, aluminium
Thermal conductivity be 200~300W/ (m* DEG C), for example, first cooling layer 321 is connect with the thermal insulation board 200, described second
Cooling layer 322 and the third cooling layer 323 are sequentially connected to the side far from the thermal insulation board 200, the third cooling layer
323 are located at the outermost of coldplate 320, and first cooling layer 321 can quickly absorb the heat of thermal insulation board 200, and will be hot
To second cooling layer 322, the second cooling layer 322 conducts heat to third cooling layer 323, third cooling layer for amount conduction
323 distribute heat, due to the heat of first cooling layer 321, second cooling layer 322 and the third cooling layer 323
Conductance is gradually reduced, and therefore, in order to enable heat transference efficiency improves, needs to reduce second cooling layer 322 and the third
The thickness of cooling layer 323, so that heat transmitting can be passed by second cooling layer 322 and the third cooling layer 323 rapidly
It is delivered to the external world, it is preferable that the thickness ratio of first cooling layer 321, the second cooling layer 322 and third cooling layer 323 is 7:6:
3, in this way, not only having improved the endothermic effect of coldplate 320, but also the heat of coldplate 320 is distributed rapidly to the external world.
In order to further increase the heat absorption capacity of the coldplate 320, for example, Fig. 9 is referred to, second cooling layer
322 are provided with multiple cooling hollow bubbles 324, for example, cooling hollow bubble 324 is evenly distributed on second cooling layer 322,
For example, it is provided with ethyl alcohol in the cooling hollow bubble 324, in this way, make 322 endothermic effect of the second cooling layer more evenly,
And there is stronger heat absorption capacity, for example, cooling hollow bubble 324 has circular configuration or circular cross-section, for example, described cold
But 324 diameter of Rubus Tosaefulins is 0.8mm~1.2mm, it is preferable that it is 1mm that the cooling hollow, which steeps 324 diameters,.In other implementation
In example, the cooling hollow bubble 324 is polyhedron, in this way, Rubus Tosaefulins 324 can be cooling from described in each face uniform pickup second
The heat of layer 322.
In one embodiment, as shown in Fig. 1 and Figure 10, the heat-conducting mechanism 400 includes cooling fin 410, the heat dissipation
Piece 410 is connect with the thermal insulation board 200, for example, the cooling fin 410 is semiconductor heat-dissipating piece 410, when the semiconductor heat-dissipating
When piece 410 is powered, the heat of the cooling fin 410 is transferred to hot end by cold end, for example, the semiconductor heat-dissipating piece 410 includes
First end and second end, the first end are connect with the thermal insulation board 200, and the second end is connect with the first end, works as institute
When stating the energization of semiconductor heat-dissipating piece 410, the heat absorption of thermal insulation board 200 is transferred to the second end by the first end, is made
The temperature of the thermal insulation board 200 can reduce rapidly, it is worth mentioning at this point that, by the semiconductor heat-dissipating piece 410 to described
It is active heat removal that thermal insulation board 200, which carries out heat dissipation, when 200 temperature of thermal insulation board is not high, can also be forced by being powered by the
The heat transfer of one end is to second end, so that the temperature of thermal insulation board 200 is lower, without when 200 temperature of thermal insulation board is higher
Time just radiates, and can substantially increase radiating efficiency in this way.
In order to further increase radiating efficiency, for example, as shown in Figure 10, four semiconductor heat-dissipating pieces 410 are set, from
And the radiating efficiency of heat-conducting mechanism 400 is improved, for example, the thermal insulation board 200 is rectangular, four semiconductor heat-dissipating pieces
410 are set to four angles of rectangular thermal insulation board 200 or four semiconductor heat-dissipating pieces 410 are set to rectangular thermal insulation board 200
Four sides, in this way, four semiconductor heat-dissipating pieces 410 can equably absorb the heat of thermal insulation board 200, so that thermal insulation board
200 heat distributes more uniformly, so that multiple laser modules 100 can obtain effective temperature-reducing, extends and uses
Service life.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (8)
1. a kind of laser radiating device characterized by comprising
Laser module；
Thermal insulation board, the thermal insulation board are provided with separator, and multiple separators are arranged at intervals on the thermal insulation board, Duo Gesuo
Laser module is stated to be respectively arranged between separator；
Cooling body, the cooling body are connect with the thermal insulation board；
The cooling body includes cooling cylinder, and the cooling cylinder has barrel, and the thermal insulation board is connected to the barrel；
It further include heat-conducting mechanism, the heat-conducting mechanism is connect with the thermal insulation board；
The heat-conducting mechanism includes cooling fin, and the cooling fin is connect with the thermal insulation board, and the cooling fin is semiconductor heat-dissipating
Piece, the semiconductor heat-dissipating piece includes first end and second end, and the first end is connect with the thermal insulation board, the second end with
First end connection, the quantity of the semiconductor heat-dissipating piece are four, the thermal insulation board be it is rectangular, four semiconductors dissipate
Backing is set to four angles of rectangular thermal insulation board；
The cooling body includes multiple coldplates, and the coldplate includes sequentially connected first cooling layer, the second cooling layer
With third cooling layer, first cooling layer is connect with the thermal insulation board, and first cooling layer, the second cooling layer and third are cold
But layer one forging molding, first cooling layer, the second cooling layer and third cooling layer are respectively that the material of unlike material closes
At.
2. laser radiating device according to claim 1, which is characterized in that the spacing between multiple separators is different
Setting.
3. laser radiating device according to claim 1, which is characterized in that the spacing phase between multiple separators
Deng.
4. laser radiating device according to claim 1, which is characterized in that the separator is isolation bar.
5. laser radiating device according to claim 1, which is characterized in that the separator is isolation board.
6. laser radiating device according to claim 1, which is characterized in that the isolation plate thickness be set as 8mm~
12mm。
7. laser radiating device according to claim 6, which is characterized in that the isolation plate thickness be set as 9mm~
10mm。
8. laser radiating device according to claim 7, which is characterized in that the isolation plate thickness is set as 9.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703573.5A CN105226485B (en) | 2015-10-23 | 2015-10-23 | Laser radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703573.5A CN105226485B (en) | 2015-10-23 | 2015-10-23 | Laser radiating device |
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| Publication Number | Publication Date |
|---|---|
| CN105226485A CN105226485A (en) | 2016-01-06 |
| CN105226485B true CN105226485B (en) | 2019-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510703573.5A Active CN105226485B (en) | 2015-10-23 | 2015-10-23 | Laser radiating device |
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| CN112709963A (en) * | 2020-12-30 | 2021-04-27 | 陈月明 | Ornamental buried lamp with heat-proof maintenance function |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1674372A (en) * | 2005-04-21 | 2005-09-28 | 中国科学院上海光学精密机械研究所 | Polygonal large power semiconductor laser laminated array module |
| CN101689744A (en) * | 2006-12-12 | 2010-03-31 | D-戴欧德有限责任公司 | Scalable thermally efficient pump diode systems |
| CN102208751A (en) * | 2011-05-16 | 2011-10-05 | 西安炬光科技有限公司 | Combined type high-power semiconductor laser side pumping source and preparation method thereof |
| CN205051159U (en) * | 2015-10-23 | 2016-02-24 | 惠州市杰普特电子技术有限公司 | Laser heat abstractor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7515346B2 (en) * | 2006-07-18 | 2009-04-07 | Coherent, Inc. | High power and high brightness diode-laser array for material processing applications |
-
2015
- 2015-10-23 CN CN201510703573.5A patent/CN105226485B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1674372A (en) * | 2005-04-21 | 2005-09-28 | 中国科学院上海光学精密机械研究所 | Polygonal large power semiconductor laser laminated array module |
| CN101689744A (en) * | 2006-12-12 | 2010-03-31 | D-戴欧德有限责任公司 | Scalable thermally efficient pump diode systems |
| CN102208751A (en) * | 2011-05-16 | 2011-10-05 | 西安炬光科技有限公司 | Combined type high-power semiconductor laser side pumping source and preparation method thereof |
| CN205051159U (en) * | 2015-10-23 | 2016-02-24 | 惠州市杰普特电子技术有限公司 | Laser heat abstractor |
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| Publication number | Publication date |
|---|---|
| CN105226485A (en) | 2016-01-06 |
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