CN105223232B - A kind of thermal conductivity measuring instrument and measuring method - Google Patents
A kind of thermal conductivity measuring instrument and measuring method Download PDFInfo
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- CN105223232B CN105223232B CN201510717362.7A CN201510717362A CN105223232B CN 105223232 B CN105223232 B CN 105223232B CN 201510717362 A CN201510717362 A CN 201510717362A CN 105223232 B CN105223232 B CN 105223232B
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Abstract
The present invention relates to a kind of thermal conductivity measuring instrument and measuring method, more particularly to a kind of bulk material thermal conductivity measuring instrument and measuring method.The measuring instrument includes thermal source, multiple temperature sensors, temperature controller (12) and signal processor (11).The temperature controller (12), it is connected with the heating rod (1) of thermal source；The signal processor (11) is connected with multiple temperature sensors, is also connected with the heating rod (1) of thermal source.The measuring method comprises the following steps：The arrangement of measuring instrument → reading configuration → parameter setting → data acquisition → thermal conductivity calculates.The thermal conductivity measuring instrument and measuring method of the present invention, can at the scene direct measurement be tested medium thermal conductivity, reduce the various influences that artificial disturbance is brought on test process, change environment to measurement result adverse effect so as to avoid to change because of sampling, substantially increase the measurement accuracy of tested medium thermal conductivity.
Description
Technical field
The present invention relates to a kind of thermal conductivity measuring instrument and measuring method, more particularly to a kind of bulk material thermal conductivity measuring instrument
And measuring method.
Background technology
Thermal conductivity is also known as " thermal conductivity factor ", reflects the size of material conducts heat ability, is an important finger of thermophysical property
Mark.Steady heat conduction and the major class of Unsteady Heat Transfer two can be divided into according to principle difference by obtaining the thermal conductivity of material.The former can be
After the temperature field of sample reaches stable, direct measurement obtains the thermal conductivity of sample.The latter is the Unsteady Heat Transfer mistake in sample
Thermal diffusion coefficient a is determined in journey, and under conditions of the density p of known sample and the specific heat capacity c of sample, utilizes λ=a/c ρ, meter
Calculation obtains the thermal conductivity λ of sample.
The characteristics of steady heat conduction determination method is that principle is simple, can directly measure thermal conductivity, but it reaches equalized temperature needs
Long period, at present steady heat conduction mainly have stable state cylinder method, heat-flow meter method, Guarded hot plate.But the above method has its each
From the defects of, can be only achieved within more than 7 hours stable state as Guarded hot plate generally requires, and to aqueous natural in nature
The thermal conductivity of material (soil of such as random distribution) can not determine, and the thickness and area of sample have considerable influence to result, test
The heat-insulating property of equipment influences the accuracy of measurement result；Thermal conductivity of the other method to bulk random material (such as soil, sandstone)
Rate interference is big to be made standard specimen aptitude test, it is necessary to sample, and the primal environment of measured and monitored the growth of standing timber material is undoubtedly disturbed, so as to cause it
Measurement accuracy is not high enough.
Unstable state Conduction Coefficient Detector Basing has normal power transience plane heat source method, heat-pole method, thermoprobe method, Hot-strip Method, laser
The method that shines etc..Normal power transience plane heat source method will can control at 20 minutes or so the testing time, can measured moisture content in 40-60%
Between sample and can be tested under the conditions of -40 DEG C, thermal conductivity λ and temperature diffusivity a numerical value can be obtained, its data processing is compared with stable state
Method is complicated；The thermal conductivity of the measurable solid of heat-pole method and liquid, anisotropy or the thermal conductivity of heterogeneous material can be also tested, heat
Collimation method can measure the specific heat and thermal diffusivity of sample roughly, but its manufacture is more exquisite, it is necessary to penetrate measured material；Thermoprobe method
The thermal conductivity of moistening soil can be measured at the scene and the density for soil and porosity influence are smaller, can be obtained accurate
Measured value, but the diameter of probe is generally 1-2mm and structure is more complicated, it is necessary to fine workmanship；Hot-strip Method can survey discrete material,
Porous media material, it may also be used for measuring metallic materials, but its test disturbs to material reset condition.
In a word, the thermal conductivity of such as soil, sandstone of the live material in large natural environment is because its is at random random, by multi-parameter
Influence is difficult to measure, and accurately obtaining its thermal conductivity contributes to Exact Design such as ground source heat pump imbedded pipe, soil heating cooling pipe laying
Accurate size, avoid pipe laying spacing excessive or insufficient.Soil, sandstone natural material thermal conductivity generally with its composition, density, contain
Water rate, temperature etc. are relevant.Generally use Routine Test Lab sampling and testing method at present, such as soil is sampled and surveyed in laboratory
, sampling and testing method influences the density and moisture content of soil, produces artificial disturbance to raw material, it is impossible to Accurate Determining former state material
Thermal conductivity.Current field experiment well test method testing soil thermal conductivity is used to obtain soil source heat pump underground pipe surrounding soil
Average thermal conductivity, it is desirable to experiment well is identical with well size and structure that engineering is pre-designed, the heat exchanger arrangement side in well
Formula is also consistent with being pre-designed, and this causes test job amount huge, and the expense of testing tool is also very high, and being not easy popularization makes
With.
The content of the invention
The invention provides a kind of thermal conductivity measuring instrument and measuring method, can solve the thermal conductivity of bulk material in the prior art
The problem of rate measurement accuracy is poor.
To achieve the above object, technical scheme is as follows：
A kind of thermal conductivity measuring instrument, including：Thermal source, surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature pass
Sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9, heating muff inner wall temperature sensor 10, at signal
Device 11 and temperature controller 12 are managed, wherein,
The thermal source includes：Heating rod 1, heating muff 2, reinforcing filler 3 and taper bit 4, wherein, heating rod 1
In the inside of heating muff 2, reinforcing filler 3 is located in the space inside heating muff 2 in addition to heating rod 1, taper bit 4
It is arranged on the lower end of heating muff 2；
The temperature controller 12, it is connected with the heating rod 1 of thermal source；
The temperature sense probe of surface temperature sensor 5 is located at earth's surface；The temperature sense probe position of atmosphere temperature transducer 6
In air；The temperature sense probe of first temperature sensor 7 and second temperature sensor 8 is located in measured material；Heating mantle
The temperature sense probe of pipe surface temperature sensor 9 is close to the outer wall of heating muff 2；Heating muff inner wall temperature sensor 10
It is connected with temperature controller 12, its temperature sense probe is fixed on the inwall of heating muff 2；
The signal processor 11 and surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, the
Two temperature sensors 8, heating muff surface temperature sensor 9 are connected with heating muff inner wall temperature sensor 10, the signal
Processor 11 include data acquisition module 14, data storage and processing module 15, human-computer interaction module 16, power module 17 and
Servicing unit 18, data acquisition module 14, human-computer interaction module 16, power module 17 and servicing unit 18 pass through data storage
It is connected each other with processing module 15.
The ratio between length H of the outer diameter D of heating muff 2 and heating muff 2 is less than 0.1.
The reinforcing filler 3 is heat-conducting resin.
The temperature of the heating rod 1 is higher than 20 DEG C -30 DEG C of environment temperature.
The signal processor 11 also has external communication interface, is connected with host computer 13.
The data acquisition module 14 includes anti-aliasing filter module 19, multi-channel switch 20, the and of A/D modular converters 21
Voltage acquisition module 22, wherein, anti-aliasing filter module 19 is sequentially connected multi-channel switch 20 and A/D modular converters 21, electricity
Acquisition module 22 is pressed to connect A/D modular converters 21；
The data storage and processing module 15 are including MCU core controllers 23, FLASH memory modules 24 and crystal oscillator and again
Position circuit 25, MCU core controllers 23 are connected with FLASH memory modules 24 and crystal oscillator and reset circuit 25 respectively；
Human-computer interaction module 16 includes LCD MODULE 26 and keyboard interface module 27, both respectively with data storage with
The MCU core controllers 23 of processing module 15 connect；
Power module 17 includes 5V power transfer modules 28；
Servicing unit 18 includes internal temperature sensor 29, clock module 30 and serial communication modular 31, three respectively with
The MCU core controllers 23 of data storage and processing module 15.
A kind of measuring method for measuring thermal conductivity, comprises the following steps：
A, the arrangement of measuring instrument：By the thermal source including heating rod 1, heating muff 2, reinforcing filler 3 and taper bit 4 and
The heating muff inner wall temperature sensor 10 that temperature sense probe is located at the inwall of heating muff 2 is inserted in measured material together, ground
The temperature sense probe of table temperature sensor 5 is positioned over earth's surface, and the temperature sense probe of atmosphere temperature transducer 6 is positioned over air
In, the temperature sense probe of the first temperature sensor 7 and second temperature sensor 8 is positioned in measured material, heating muff table
The temperature sense probe of face temperature sensor 9 is close to the outer wall of heating muff 2, and by heating rod 1 and each TEMP
Device is connected to signal processor 11；
B, configuration is read：Start measuring instrument, MCU core controllers 23 read configuration data；
C, parameter setting：Temperature, testing time, the resistance value of heating rod and the surface temperature of temperature controller 12 is set to pass
Sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9
It is warm to earth's surface temperature sensor 5, atmosphere temperature transducer 6, first with the location parameter of heating muff inner wall temperature sensor 10
Degree sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 are adjusted
Zero, opening temperature controller 12, the temperature that temperature controller 12 passes through the sensing heating sleeve pipe 2 of heating muff inner wall temperature sensor 10
Degree, and heating rod 1 is heated；
D, data acquisition：Surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature pass
The temperature information of sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 is collection one per second
It is secondary, average value of calculating per minute, it is stored in FLASH memory modules 24；
E, thermal conductivity calculates：Change the first temperature sensor 7 position obtain the temperature T of the first temperature sensor 7 (x1,
Y1), change the position of second temperature sensor 8 and obtain the temperature T (x2, y2) of second temperature sensor 8,
Signal processor 11 obtains the temperature of the first temperature sensor 7 and the temperature of second temperature sensor 8, signal transacting
Device 11 calculates measured material thermal conductivity, and thermal conductivity result is exported, wherein,
The computational methods of thermal conductivity are as follows：
Wherein, λ is thermal conductivity, and q is thermal power, and H is the length of heating rod 1, and T (x1, y1) is that the first temperature sensor 7 exists
The temperature at (x1, y1) place, T (x2, y2) are temperature of the second temperature sensor 8 at (x2, y2) place, and x1, x2 are respectively the first temperature
The distance of sensor 7 and the measurement point of second temperature sensor 8 away from the central shaft of heating rod 1 is spent, y1, y2 are respectively that the first temperature passes
Distance of the measurement point of sensor 7 and second temperature sensor 8 away from ground, measurement point coordinates meet following relation：X1 ≠ x2 and x1<
X2, x1 >=5D, x2>5D simultaneously disclosure satisfy that according to test data adjustment：T (x1, y1)-T (x2, y2) >=5 DEG C, wherein, D is heating
The external diameter of sleeve pipe 2.
In step a, measured earth's surface shelter from heat or light windproof.
In step e, the calculating acquiescence of thermal conductivity carried out the smooth of data and meter using the glide filter method of 30 minutes
Calculate, when within testing 30 minutes, no thermal conductivity information output, the testing time is more than 30 minutes, then starts to export thermal conductivity letter
Breath, until the testing time terminates or measurement result reaches the condition of convergence, wherein,
The condition of convergence is to export thermal conductivity fluctuation range in 5 minutes to be less than or equal to 3%.
After step a, before step b, also comprise the following steps：After host computer 13 sets port communication speed, open
Dynamic host computer 13.
The beneficial effects of the present invention are：
The present invention thermal conductivity measuring instrument and measuring method, can at the scene direct measurement be tested medium thermal conductivity, because of nothing
Medium to be measured need to be sent into laboratory, reduce the various influences that artificial disturbance is brought on test process, so as to avoid because adopting
Sample and change and change environment to measurement result adverse effect, substantially increase the measurement essence of tested medium thermal conductivity
Degree.In addition, the measurable shallow stratum thermal conductivity of the present invention, this also contributes to study such as upper soll layer transpiration of agriculture water and soil changing rule
Effect, conduct heat with rules such as soil moisture changes.
Brief description of the drawings
Fig. 1 shows the arrangement schematic diagram of the temperature sensor of the thermal conductivity measuring instrument of the present invention；
Fig. 2 shows the overall schematic of the thermal conductivity measuring instrument of the present invention；
Fig. 3 shows the relation schematic diagram of the modules of signal processor 11 of the thermal conductivity measuring instrument of the present invention；
Fig. 4 shows the flow chart of the thermal conductivity measuring instrument measurement thermal conductivity using the present invention.
Reference
The heating muff of 1 heating rod 2
The taper bit of 3 reinforcing filler 4
The atmosphere temperature transducer of 5 surface temperature sensor 6
The second temperature sensor of 7 first temperature sensor 8
Wall temperature sensor in the heating muff of 9 heating muff surface temperature sensor 10
The temperature controller of 11 signal processor 12
The data acquisition module of 13 host computer 14
15 data storages and the human-computer interaction module of processing module 16
The servicing unit of 17 power module 18
The multi-channel switch of 19 anti-aliasing filter module 20
The voltage acquisition module of 21 A/D modular converters 22
The FLASH memory modules of 23 MCU core controllers 24
25 crystal oscillators and the LCD MODULE of reset circuit 26
The 5V power transfer modules of 27 keyboard interface module 28
The clock module of 29 internal temperature sensor 30
31 serial communication modulars
Embodiment
With reference to the accompanying drawings and examples, the embodiment of the present invention is described in further detail.
The thermal conductivity measuring instrument and the theoretical foundation of measuring method of the present invention is stable state Imaging Method, and theory shows, when by one
When individual thin bar is vertically embedded to underground as thermal source and controls the temperature of the thin bar, the thin bar produces to the material being embedded in around it
Stable thermo parameters method, and its thermo parameters method and thermal conductivity are in determination relation.The present invention is opened in this theoretical foundation
A kind of measuring instrument of hair, its principle are：The thin bar of embedded reasonable size, the temperature for being heated to thin bar and controlling thin bar, Ran Hougen
According to average heating amount and the temperature field of peripheral test point, it is computed measuring heat conductivity value.Therefore, in measure bulk natural material
As soil thermal conductivity when, the original state of soil can be kept, measurement result more meets soil field condition.
As shown in Figure 1-2, thermal conductivity measuring instrument of the invention includes：Thermal source, surface temperature sensor 5, atmospheric temperature pass
Sensor 6, the first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9, wall temperature in heating muff
Spend sensor 10, signal processor 11 and temperature controller 12.
Thermal source, radiated with predetermined temperature to surrounding, including：Heating rod 1, heating muff 2, reinforcing filler 3 and tapered bur
First 4, wherein, heating rod 1 is located at the inside of heating muff 2, and reinforcing filler 3 is located inside heating muff 2 in addition to heating rod 1
Space in, taper bit 4 is arranged on the lower end of heating muff 2, so as to enter medium to be measured；Wherein, the outer diameter D of heating muff 2
It is less than 0.1 with the ratio between the length H of heating muff 2, to ensure that test system meets thin bar Model Condition, reduces error.Enhancing is filled out
It is heat-conducting resin to fill agent 3, uniform to strengthen the temperature of the heat transfer property of heating rod 1 and heating muff 2 and the tube wall of heating muff 2
Property.In order to improve measurement accuracy, the temperature of heating rod 1 is higher than 20 DEG C -30 DEG C of environment temperature.
Temperature controller 12, it is connected with the heating rod 1 of thermal source, for providing thermal power for heating rod 1 and controlling heating rod 1
Temperature, the temperature of heating rod 1 is higher than 20 DEG C -30 DEG C of environment temperature so that stable state Imaging Method measure when temperature measuring ring
Border parameter is remained in claimed range.
Surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature sensor 8, heating
Sleeve surface temperature sensor 9 and heating muff inner wall temperature sensor 10 be used to detecting because of heat that thermal source is sent and caused by
Change of temperature field.Wherein, the temperature sense probe of surface temperature sensor 5 is located at earth's surface, for measuring soil surface temperature；Greatly
The temperature sense probe of gas temperature sensor 6 is located in air, for measuring environment temperature, so as to judge whether environment temperature is permanent
Determine to meet stable state Imaging Method model needs；The temperature sense probe of first temperature sensor 7 and second temperature sensor 8 is located at
In measured material, for measuring the temperature of measured material；The temperature sense probe of heating muff surface temperature sensor 9 is close to
The outer wall of heating muff 2, for measuring the temperature on the surface of heating muff 2；Heating muff inner wall temperature sensor 10 and temperature control
Device 12 processed connects, and its temperature sense probe is fixed on the inwall of heating muff 2, for the temperature signal of thermal source to be supplied into temperature
Controller 12 is so as to pass through the temperature that temperature controller 12 controls heating rod 1.
The signal processor 11 and surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, the
Two temperature sensors 8, heating muff surface temperature sensor 9 are connected with heating muff inner wall temperature sensor 10, for gathering,
The temperature of storage temperature sensor；So, signal processor 11 can be according to the temperature and surface temperature sensor 5 of thermal source, big
Gas temperature sensor 6, the first temperature sensor 7, the temperature computation of second temperature sensor 8 survey the thermal conductivity of medium.Signal
Processor 11 also has external communication interface, is connected, is communicated with host computer 13, to facilitate analyzing and processing.
As shown in figure 3, the signal processor 11 includes data acquisition module 14, data storage and processing module 15, people
Machine interactive module 16, power module 17 and servicing unit 18.Wherein, data acquisition module 14, human-computer interaction module 16, power supply
Module 17 and servicing unit 18 are connected each other by data storage with processing module 15.
Surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature sensor 8, heating
The voltage signal warp of the temperature signal or heating rod 1 of sleeve surface temperature sensor 9 and heating muff inner wall temperature sensor 10
It is acquired by data acquisition module 14, transmits into data storage and processing module 15 after being converted to data signal, deposited by data
Storage carries out the storage and calculating of data with processing module 15, finally shows measurement result by human-computer interaction module 16, or via auxiliary
The serial communication modular 31 helped in device 18 is connected with host computer 13, is analyzed in host computer 13 and shows measurement result.
Wherein：
Data acquisition module 14 is used for surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, the
Two temperature sensors 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 temperature signal and add
Conditioning, collection and the conversion of the voltage signal of hot pin 1, including anti-aliasing filter module 19, multi-channel switch 20, A/D conversion
Module 21 and voltage acquisition module 22, wherein, anti-aliasing filter module 19 is sequentially connected multi-channel switch 20 and A/D moduluss of conversion
Block 21, voltage acquisition module 22 connect A/D modular converters 21.Surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature
Sensor 7, second temperature sensor 8, the temperature of heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10
Spend signal and carry out signal condition by anti-aliasing filter module 19, then A/D modular converters are inputted by the timesharing of multi-channel switch 20
21, be converted to incoming data storage and processing module 15 after data signal；The voltage signal of heating rod 1 is by containing anti-aliasing filter
The voltage acquisition module 22 of ripple is acquired, then carries out analog-to-digital conversion by A/D modular converters 21, after being finally converted to data signal
Incoming data stores and processing module 15.
Data storage includes MCU core controllers 23, FLASH memory modules 24 and crystal oscillator with processing module 15 and resets electricity
Road 25, wherein, MCU core controllers 23 are connected with FLASH memory modules 24 and crystal oscillator and reset circuit 25 respectively.From data
The data of acquisition module 14 are saved into FLASH memory modules 24 first, are spaced at regular intervals, by MCU core controllers
23 carry out the calculating of thermal conductivities and measure the judgement of termination condition, crystal oscillator and reset circuit 25 be MCU core controllers 23 just
Often work provides support.
Human-computer interaction module 16 is used for the man-machine interactive operation of measuring instrument, including LCD MODULE 26 and keyboard interface mould
Block 27, both are connected with data storage with the MCU core controllers 23 of processing module 15 respectively.
Power module 17 is used to provide electric energy, including 5V power transfer modules 28 for modules, mainly 220v electricity
Pressure is converted to 5v voltages, there is provided is used to modules.
Servicing unit 18 be used for give MCU core controllers 23 provide miscellaneous function, as real-time clock, housing temperature sensing,
Temperature-compensating, serial communication, including internal temperature sensor 29, clock module 30 and serial communication modular 31, three respectively with
Data storage is connected with the MCU core controllers 23 of processing module 15.Internal temperature sensor 29 can detect surface temperature biography
Sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9
With the internal node temperature of heating muff inner wall temperature sensor 10, for surface temperature sensor 5, atmosphere temperature transducer 6,
First temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensing
The temperature-compensating of device 10.Clock module 30 provides real-time clock, ensures that system clock operation is errorless.Serial communication modular 31 is used for
Connection host computer 13 enters row data communication.
Using the measuring method of the thermal conductivity measuring instrument measurement thermal conductivity of the present invention, comprise the following steps, as shown in Figure 4：
A, the arrangement of measuring instrument：By the thermal source including heating rod 1, heating muff 2, reinforcing filler 3 and taper bit 4 and
The heating muff inner wall temperature sensor 10 that temperature sense probe is located at the inwall of heating muff 2 is inserted in measured material together, ground
The temperature sense probe of table temperature sensor 5 is positioned over earth's surface, and the temperature sense probe of atmosphere temperature transducer 6 is positioned over air
In, the temperature sense probe of the first temperature sensor 7 and second temperature sensor 8 is positioned in measured material, heating muff table
The temperature sense probe of face temperature sensor 9 is close to the outer wall of heating muff 2, and heating rod 1 and surface temperature are sensed
Device 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature sensor 8, the and of heating muff surface temperature sensor 9
Heating muff inner wall temperature sensor 10 is connected to signal processor 11；Measured earth's surface shelter from heat or light during measurement anti-
Wind, to prevent excessive interference of the adverse weather to the soil moisture, to make surface temperature to keep more constant, fluctuating range is not
More than 2 DEG C, so as to improve measurement accuracy；
B, configuration is read：Start measuring instrument, MCU core controllers 23 read configuration data；
C, parameter setting：Temperature, testing time, the resistance value of heating rod and the surface temperature of temperature controller 12 is set to pass
Sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9
It is warm to earth's surface temperature sensor 5, atmosphere temperature transducer 6, first with the location parameter of heating muff inner wall temperature sensor 10
Degree sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 are adjusted
Zero, opening temperature controller 12, the temperature that temperature controller 12 passes through the sensing heating sleeve pipe 2 of heating muff inner wall temperature sensor 10
Degree, and heating rod 1 is heated；
D, data acquisition：Surface temperature sensor 5, atmosphere temperature transducer 6, the first temperature sensor 7, second temperature pass
The temperature information of sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 is collection one per second
It is secondary, average value of calculating per minute, it is stored in FLASH memory modules 24；
E, thermal conductivity calculates：Change the first temperature sensor 7 position obtain the temperature T of the first temperature sensor 7 (x1,
Y1), change the position of second temperature sensor 8 and obtain the temperature T (x2, y2) of second temperature sensor 8,
Signal processor 11 obtains the temperature of the first temperature sensor 7 and the temperature of second temperature sensor 8, signal transacting
Device 11 calculates measured material thermal conductivity, and thermal conductivity result is exported, wherein,
The computational methods of thermal conductivity are as follows：
Wherein, λ is thermal conductivity, and q is thermal power, and heating rod 1 is supplied by temperature controller 12, and H is the length of heating rod 1, T
(x1, y1) is temperature of first temperature sensor 7 at (x1, y1) place, and T (x2, y2) is second temperature sensor 8 at (x2, y2)
The temperature at place, x1, x2 are respectively the measurement point of the first temperature sensor 7 and second temperature sensor 8 away from the central shaft of heating rod 1
Distance, y1, y2 are respectively distance of the measurement point away from ground of the first temperature sensor 7 and second temperature sensor 8, such T
(x1, y1) is that span ground is y1, is the temperature at x1 away from the central shaft of heating rod 1, and T (x2, y2) is span ground for y2, away from adding
The central shaft of hot pin 1 is the temperature at x2, wherein (x1, y1) determines that away from ground be y1, is at x1 away from the central shaft of heating rod 1 respectively
Contour, (x2, y2) determines that away from ground be y2, is the contour at x2, i.e. the first TEMP away from the central shaft of heating rod 1 respectively
The coordinate (x1, y1) of device 7, the coordinate (x2, y2) of second temperature sensor 8 be using the central shaft of heating rod 1 and the intersection point on ground as
The origin of coordinates, measurement point coordinates meet following relation：X1 ≠ x2 and x1<X2, x1 >=5D, x2>5D simultaneously adjusts according to test data
It disclosure satisfy that：T (x1, y1)-T (x2, y2) >=5 DEG C, wherein, D is the external diameter of heating muff 2；
For example, the coordinate of the first temperature sensor 7 is (10,30), i.e. its central shaft away from heating rod 1 is 10cm, away from ground
Face depth is 30cm；The coordinate of second temperature sensor 8 is (20,30), i.e. its central shaft away from heating rod 1 is 20cm, away from ground
Face depth 30cm；
The calculating acquiescence of thermal conductivity carried out the smooth of data with calculating using the glide filter method of 30 minutes, in test 30
When within minute, no thermal conductivity information output, the testing time is more than 30 minutes, then starts to export thermal conductivity information, until test
Time terminates or measurement result reaches the condition of convergence.
The measurement result condition of convergence is to export thermal conductivity fluctuation range in 5 minutes to be less than or equal to 3%.
In measurement process, if measuring environment does not meet data model requirement, in display circle of LCD MODULE 26
Face can prompt gauger to improve measuring environment, and the prompting can be continued for untill measuring environment meets the requirements.
Using the measuring method of the thermal conductivity measuring instrument measurement thermal conductivity of the present invention, after step a, before step b, go back
Comprise the following steps：After host computer 13 sets port communication speed, start host computer 13.
Using the measurement knot of the embodiment 1 of thermal conductivity measuring instrument and measuring method the measurement thermal conductivity of the present invention, embodiment 2
Fruit is as shown in table 2.
Table 2：The measurement result of embodiment 1, embodiment 2
* the thermal conductivity recorded is the heat conductivity value under the condition of convergence.Soil quality moisture content is the soil of embodiment
The ratio between water content (g) and dry soil.
The Soil Thermal Conductivity that embodiments of the invention 1 and embodiment 2 measure is higher than to exist by the sampling of unstable state plane heat source method
The heat conductivity value that laboratory measures, this is due to that the sampling disturbance of unstable state plane heat source method causes voidage increase moisture content can
It can decline and the unworthiness with instrument in itself, data measure numerical value less than embodiment, logic shows, thermal conductivity of the invention
More with true close, the data measured are more reasonable for measuring instrument and measuring method.
Claims (10)
- A kind of 1. thermal conductivity measuring instrument, it is characterised in that：Including：Thermal source, surface temperature sensor (5), atmosphere temperature transducer (6), the first temperature sensor (7), second temperature Sensor (8), heating muff surface temperature sensor (9), heating muff inner wall temperature sensor (10), signal processor (11) With temperature controller (12), wherein,The thermal source includes：Heating rod (1), heating muff (2), reinforcing filler (3) and taper bit (4), wherein, heating rod (1) it is located at the inside of heating muff (2), reinforcing filler (3) is located at the internal sky in addition to heating rod (1) of heating muff (2) Between in, taper bit (4) is arranged on the lower end of heating muff (2)；The temperature controller (12), it is connected with the heating rod (1) of thermal source；The temperature sense probe of surface temperature sensor (5) is located at earth's surface；The temperature sense probe position of atmosphere temperature transducer (6) In air；The temperature sense probe of first temperature sensor (7) and second temperature sensor (8) is located in measured material；Add The temperature sense probe of thermal sleeve surface temperature sensor (9) is close to the outer wall of heating muff (2)；Heating muff inner wall temperature Sensor (10) is connected with temperature controller (12), and its temperature sense probe is fixed on the inwall of heating muff (2)；The signal processor (11) and surface temperature sensor (5), atmosphere temperature transducer (6), the first temperature sensor (7), second temperature sensor (8), heating muff surface temperature sensor (9) and heating muff inner wall temperature sensor (10) phase Even, the signal processor (11) includes data acquisition module (14), data storage and processing module (15), human-computer interaction module (16), power module (17) and servicing unit (18), data acquisition module (14), human-computer interaction module (16), power module (17) and servicing unit (18) is connected each other by data storage with processing module (15).
- 2. thermal conductivity measuring instrument as claimed in claim 1, it is characterised in that：The ratio between length H of heating muff (2) outer diameter D and heating muff (2) is less than 0.1.
- 3. thermal conductivity measuring instrument as claimed in claim 1, it is characterised in that：The reinforcing filler (3) is heat-conducting resin.
- 4. thermal conductivity measuring instrument as claimed in claim 1, it is characterised in that：The temperature of the heating rod (1) is higher than 20 DEG C -30 DEG C of environment temperature.
- 5. thermal conductivity measuring instrument as claimed in claim 1, it is characterised in that：The signal processor (11) also has external communication interface, is connected with host computer (13).
- 6. thermal conductivity measuring instrument as claimed in claim 1, it is characterised in that：The data acquisition module (14) includes anti-aliasing filter module (19), multi-channel switch (20), A/D modular converters (21) and voltage acquisition module (22), wherein, anti-aliasing filter module (19) is sequentially connected multi-channel switch (20) and A/D turns Change the mold block (21), voltage acquisition module (22) connection A/D modular converters (21)；The data storage and processing module (15) include MCU core controllers (23), FLASH memory modules (24) and crystal oscillator and Reset circuit (25), MCU core controllers (23) connect with FLASH memory modules (24) and crystal oscillator and reset circuit (25) respectively Connect；Human-computer interaction module (16) includes LCD MODULE (26) and keyboard interface module (27), both respectively with data storage It is connected with the MCU core controllers (23) of processing module (15)；Power module (17) includes 5V power transfer modules (28)；Servicing unit (18) includes internal temperature sensor (29), clock module (30) and serial communication modular (31), San Zhefen It is not connected with data storage with the MCU core controllers (23) of processing module (15).
- 7. a kind of measuring method of thermal conductivity measuring instrument measurement thermal conductivity using as described in one of claim 1-6, its feature It is：Comprise the following steps：A, the arrangement of measuring instrument：The heat of heating rod (1), heating muff (2), reinforcing filler (3) and taper bit (4) will be included The heating muff inner wall temperature sensor (10) that source and temperature sense probe are located at heating muff (2) inwall is inserted measured and monitored the growth of standing timber together In material, the temperature sense probe of surface temperature sensor (5) is positioned over earth's surface, and the temperature sense of atmosphere temperature transducer (6) is visited Head is positioned in air, and the temperature sense probe of the first temperature sensor (7) and second temperature sensor (8), which is positioned over, is measured and monitored the growth of standing timber In material, the temperature sense probe of heating muff surface temperature sensor (9) is close to the outer wall of heating muff (2), and will heating Rod (1) and each temperature sensor are connected to signal processor (11)；B, configuration is read：Start measuring instrument, MCU core controllers (23) read configuration data；C, parameter setting：Temperature, testing time, the resistance value of heating rod and the surface temperature sensing of temperature controller (12) are set Device (5), atmosphere temperature transducer (6), the first temperature sensor (7), second temperature sensor (8), heating muff surface temperature The location parameter of sensor (9) and heating muff inner wall temperature sensor (10), to earth's surface temperature sensor (5), atmospheric temperature Sensor (6), the first temperature sensor (7), second temperature sensor (8), heating muff surface temperature sensor (9) and heating Internal surface of sleeve pipe temperature sensor (10) returns to zero, and opening temperature controller (12), temperature controller (12) passes through heating muff inwall The temperature of temperature sensor (10) sensing heating sleeve pipe (2), and heating rod (1) is heated；D, data acquisition：Surface temperature sensor (5), atmosphere temperature transducer (6), the first temperature sensor (7), second temperature The temperature information of sensor (8), heating muff surface temperature sensor (9) and heating muff inner wall temperature sensor (10) is every Second collection once, average value of calculating per minute, is stored in FLASH memory modules (24)；E, thermal conductivity calculates：Change the first temperature sensor (7) position obtain the temperature T of the first temperature sensor (7) (x1, Y1), change second temperature sensor (8) position obtains the temperature T (x2, y2) of second temperature sensor (8),Signal processor (11) obtains the temperature of the first temperature sensor (7) and the temperature of second temperature sensor (8), at signal Manage device (11) and calculate measured material thermal conductivity, and thermal conductivity result is exported, wherein,The computational methods of thermal conductivity are as follows：<mrow> <mi>&lambda;</mi> <mo>=</mo> <mfrac> <mi>q</mi> <mrow> <mn>4</mn> <mi>&pi;</mi> </mrow> </mfrac> <mrow> <mo>{</mo> <mfrac> <mrow> <mi>l</mi> <mi>n</mi> <mo>&lsqb;</mo> <mfrac> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>1</mn> </msub> <mo>+</mo> <mi>H</mi> <mo>)</mo> <mo>+</mo> <msqrt> <mrow> <msubsup> <mi>x</mi> <mn>2</mn> <mn>2</mn> </msubsup> <mo>+</mo> <msup> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>2</mn> </msub> <mo>-</mo> <mi>H</mi> <mo>)</mo> </mrow> <mn>2</mn> </msup> </mrow> </msqrt> </mrow> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>1</mn> </msub> <mo>-</mo> <mi>H</mi> <mo>)</mo> <mo>+</mo> <msqrt> <mrow> <msubsup> <mi>x</mi> <mn>1</mn> <mn>2</mn> </msubsup> <mo>+</mo> <msup> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>1</mn> </msub> <mo>-</mo> <mi>H</mi> <mo>)</mo> </mrow> <mn>2</mn> </msup> </mrow> </msqrt> </mrow> </mfrac> <mo>&rsqb;</mo> <mo>-</mo> <mi>l</mi> <mi>n</mi> <mo>&lsqb;</mo> <mfrac> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>2</mn> </msub> <mo>+</mo> <mi>H</mi> <mo>)</mo> <mo>+</mo> <msqrt> <mrow> <msubsup> <mi>x</mi> <mn>2</mn> <mn>2</mn> </msubsup> <mo>+</mo> <msup> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>2</mn> </msub> <mo>-</mo> <mi>H</mi> <mo>)</mo> </mrow> <mn>2</mn> </msup> </mrow> </msqrt> </mrow> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>2</mn> </msub> <mo>-</mo> <mi>H</mi> <mo>)</mo> <mo>+</mo> <msqrt> <mrow> <msubsup> <mi>x</mi> <mn>1</mn> <mn>2</mn> </msubsup> <mo>+</mo> <msup> <mrow> <mo>(</mo> <msub> <mi>y</mi> <mn>1</mn> </msub> <mo>-</mo> <mi>H</mi> <mo>)</mo> </mrow> <mn>2</mn> </msup> </mrow> </msqrt> </mrow> </mfrac> <mo>&rsqb;</mo> </mrow> <mrow> <mi>T</mi> <mrow> <mo>(</mo> <msub> <mi>x</mi> <mn>1</mn> </msub> <mo>,</mo> <msub> <mi>y</mi> <mn>1</mn> </msub> <mo>)</mo> </mrow> <mo>-</mo> <mi>T</mi> <mrow> <mo>(</mo> <msub> <mi>x</mi> <mn>2</mn> </msub> <mo>,</mo> <msub> <mi>y</mi> <mn>2</mn> </msub> <mo>)</mo> </mrow> </mrow> </mfrac> <mo>}</mo> </mrow> </mrow>Wherein, λ is thermal conductivity, and q is thermal power, and H is the length of heating rod (1), and T (x1, y1) is that the first temperature sensor (7) exists The temperature at (x1, y1) place, T (x2, y2) be second temperature sensor (8) in the temperature at (x2, y2) place, x1, x2 are respectively first Distance of the measurement point of temperature sensor (7) and second temperature sensor (8) away from heating rod (1) central shaft, y1, y2 are respectively Distance of the measurement point away from ground of one temperature sensor (7) and second temperature sensor (8), measurement point coordinates meet such as ShiShimonoseki System：X1 ≠ x2 and x1<X2, x1 >=5D, x2>5D simultaneously disclosure satisfy that according to test data adjustment：T(x1,y1)-T(x2,y2)≥5 DEG C, wherein, D is the external diameter of heating muff (2).
- 8. the measuring method of measurement thermal conductivity as claimed in claim 7, it is characterised in that：In step a, measured earth's surface shelter from heat or light windproof.
- 9. the measuring method of measurement thermal conductivity as claimed in claim 7, it is characterised in that：In step e, the calculating acquiescence of thermal conductivity carried out the smooth of data with calculating using the glide filter method of 30 minutes, When within testing 30 minutes, no thermal conductivity information output, the testing time is more than 30 minutes, then starts to export thermal conductivity information, directly Terminate to the testing time or measurement result reaches the condition of convergence, wherein,The condition of convergence is to export thermal conductivity fluctuation range in 5 minutes to be less than or equal to 3%.
- 10. the measuring method of measurement thermal conductivity as claimed in claim 7, it is characterised in that：After step a, before step b, also comprise the following steps：After host computer (13) sets port communication speed, start Host computer (13).
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| CN112067651B (en) * | 2020-08-10 | 2021-11-05 | 中国科学院空间应用工程与技术中心 | Heat flow measuring thermal probe inside resident type outer star body and measuring method |
| CN116413310B (en) * | 2023-06-12 | 2023-08-22 | 深圳大学 | Test device and method for measuring heat conductivity coefficient under dynamic temperature condition |
| CN117288803B (en) * | 2023-11-24 | 2024-02-27 | 抚顺市明尧石油机械有限公司 | Liquid phase sensor and method for detecting oil content of crude oil produced liquid |
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