CN105223232A - A kind of thermal conductivity measuring instrument and measuring method - Google Patents
A kind of thermal conductivity measuring instrument and measuring method Download PDFInfo
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- CN105223232A CN105223232A CN201510717362.7A CN201510717362A CN105223232A CN 105223232 A CN105223232 A CN 105223232A CN 201510717362 A CN201510717362 A CN 201510717362A CN 105223232 A CN105223232 A CN 105223232A
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Abstract
The present invention relates to a kind of thermal conductivity measuring instrument and measuring method, particularly relate to a kind of bulk material thermal conductivity measuring instrument and measuring method.This measuring instrument comprises thermal source, multiple temperature sensor, temperature controller (12) and signal processor (11).Described temperature controller (12), is connected with the heating rod (1) of thermal source; Described signal processor (11) is connected with multiple temperature sensor, is also connected with the heating rod (1) of thermal source.This measuring method comprises the steps: that the layout → reading configuration → optimum configurations → data acquisition → thermal conductivity of measuring instrument calculates.Thermal conductivity measuring instrument of the present invention and measuring method, directly can measure the thermal conductivity of tested medium at the scene, decrease the various impacts that artificial interference brings test process, thus avoid and change environment to measurement result adverse effect because of sampling, substantially increase the measuring accuracy of tested medium thermal conductivity.
Description
Technical field
The present invention relates to a kind of thermal conductivity measuring instrument and measuring method, particularly relate to a kind of bulk material thermal conductivity measuring instrument and measuring method.
Background technology
Thermal conductivity is also known as " coefficient of heat conductivity ", and the size of reflection material conducts heat ability is an important indicator of thermophysical property.The thermal conductivity obtaining material can be divided into steady heat conduction and the large class of Unsteady Heat Transfer two according to principle difference.The former can the temperature field of sample reach stable after, directly measure the thermal conductivity of acquisition sample.The latter measures thermal diffusion coefficient a in the Unsteady Heat Transfer process of sample, and under the condition of the density p of known sample and the specific heat capacity c of sample, utilizes λ=a/c ρ, calculate the thermal conductivity λ of sample.
The feature of steady heat conduction determination method is that principle is simple, directly can record thermal conductivity, but it reaches equalized temperature and needs the long period, and current steady heat conduction mainly contains stable state cylinder method, heat flow meter method, Guarded hot plate.But said method all has its respective defect, need just can reach steady state (SS) in more than 7 hours as Guarded hot plate, and can not measure the thermal conductivity of the moisture natural material (soil as stochastic distribution) of occurring in nature, thickness and the area of sample have considerable influence to result, and the heat-insulating property of testing apparatus affects the accuracy of measurement result; Additive method is large to the interference of the thermal conductivity of loose shape random material (as soil, sandstone), needs sampling to make standard specimen aptitude test, disturb undoubtedly the primal environment of material of measuring and monitoring the growth of standing timber, thus cause its measuring accuracy not high enough.
Unstable state Conduction Coefficient Detector Basing has normal power transience plane heat source method, heat-pole method, thermoprobe method, Hot-strip Method, laser to shine method etc.Test duration can control at about 20 minutes by normal power transience plane heat source method, also can test under-40 DEG C of conditions by the sample of measured moisture content between 40-60%, can obtain thermal conductivity λ and thermal diffusivity a numerical value, and its data processing comparatively steady state method is complicated; Heat-pole method can measure the thermal conductivity of solid and liquid, also can test the thermal conductivity of anisotropy or heterogeneous material, and heat-pole method can record roughly specific heat and the thermal diffusivity of sample, but its manufacture is more exquisite, needs to penetrate measured material; Thermoprobe method can measure at the scene moistening soil thermal conductivity and also for the density of soil and factor of porosity impact less, measured value more accurately can be obtained, but the diameter of probe is generally 1-2mm and structure is more complicated, needs meticulous workmanship; Hot-strip Method can survey discrete material, porous media material, also can be used for measuring metallic materials, but its test disturbs to material virgin state.
In a word, on-the-spot material in large natural environment as the thermal conductivity of soil, sandstone because it is at random random, be difficult to measure by effect of multiple parameters, its thermal conductivity of accurate acquisition contributes to the accurate size of Exact Design as ground source heat pump imbedded pipe, soil heating cooling pipe laying, avoids distance of embedded pipe excessive or not enough.The thermal conductivity of soil, sandstone natural material is usually relevant with its composition, density, water percentage, temperature etc.Adopt at present usually Routine Test Lab sampling and testing method, record in laboratory as sampled soil, sampling and testing method affect density and the water percentage of soil, to starting material generation artificial interference, and can not the thermal conductivity of Accurate Determining former state material.Current field experiment well method of testing testing soil thermal conductivity is for obtaining the average thermal conductivity of soil source heat pump underground pipe surrounding soil, require that the well size that experiment well and engineering design in advance is identical with structure, heat interchanger arrangement in well is also consistent with designing in advance, this causes test job amount huge, the expense of testing tool is also very high, not easily promotes the use of.
Summary of the invention
The invention provides a kind of thermal conductivity measuring instrument and measuring method, the problem that the thermal conductivity measuring accuracy of bulk material in prior art is poor can be solved.
For achieving the above object, technical scheme of the present invention is as follows:
A kind of thermal conductivity measuring instrument, comprise: thermal source, surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9, heating muff inner wall temperature sensor 10, signal processor 11 and temperature controller 12, wherein
Described thermal source comprises: heating rod 1, heating muff 2, reinforcing filler 3 and taper bit 4, wherein, heating rod 1 is positioned at the inside of heating muff 2, and reinforcing filler 3 is arranged in the inner space except heating rod 1 of heating muff 2, and taper bit 4 is arranged on the lower end of heating muff 2;
Described temperature controller 12, is connected with the heating rod 1 of thermal source;
The temperature sense probe of surface temperature sensor 5 is positioned at earth's surface; The temperature sense probe of atmosphere temperature transducer 6 is arranged in air; The temperature sense probe of the first temperature sensor 7 and the second temperature sensor 8 is arranged in measured material; The temperature sense probe of heating muff surface temperature sensor 9 is close to the outer wall of heating muff 2; Heating muff inner wall temperature sensor 10 is connected with temperature controller 12, and its temperature sense probe is fixed on the inwall of heating muff 2;
Described signal processor 11 is connected with heating muff inner wall temperature sensor 10 with surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9, described signal processor 11 comprises data acquisition module 14, data store and processing module 15, human-computer interaction module 16, power module 17 and servicing unit 18, and data acquisition module 14, human-computer interaction module 16, power module 17 and servicing unit 18 are stored by data and be connected each other with processing module 15.
Described heating muff 2 outer diameter D is less than 0.1 with the ratio of the length H of heating muff 2.
Described reinforcing filler 3 is heat-conducting resin.
The temperature of described heating rod 1 is higher than environment temperature 20 DEG C-30 DEG C.
Described signal processor 11 also has external communication interface, is connected with host computer 13.
Described data acquisition module 14 comprises anti-aliasing filter module 19, multi-channel switch 20, A/D modular converter 21 and voltage acquisition module 22, wherein, anti-aliasing filter module 19 connects multi-channel switch 20 and A/D modular converter 21 successively, and voltage acquisition module 22 connects A/D modular converter 21;
Described data store and to comprise MCU core controller 23, FLASH memory module 24 and crystal oscillator and reset circuit 25, MCU core controller 23 with processing module 15 and be connected with FLASH memory module 24 and crystal oscillator and reset circuit 25 respectively;
Human-computer interaction module 16 comprises LCD MODULE 26 and keyboard interface module 27, and both store with data respectively and are connected with the MCU core controller 23 of processing module 15;
Power module 17 comprises 5V power transfer module 28;
Servicing unit 18 comprises internal temperature sensor 29, clock module 30 and serial communication modular 31, and three stores the MCU core controller 23 with processing module 15 respectively with data.
Measure a measuring method for thermal conductivity, comprise the steps:
A, the layout of measuring instrument: heating rod 1 will be comprised, heating muff 2, measured material is inserted together with the heating muff inner wall temperature sensor 10 that thermal source and the temperature sense probe of reinforcing filler 3 and taper bit 4 are arranged in heating muff 2 inwall, the temperature sense probe placement of surface temperature sensor 5 is in earth's surface, the temperature sense probe placement of atmosphere temperature transducer 6 is in air, the temperature sense probe placement of the first temperature sensor 7 and the second temperature sensor 8 is in measured material, the temperature sense probe of heating muff surface temperature sensor 9 is close to the outer wall of heating muff 2, and heating rod 1 and each temperature sensor are connected to signal processor 11,
B, reading configuration: start measuring instrument, MCU core controller 23 reads configuration data;
C, optimum configurations: the temperature of set temperature controller 12, test duration, the resistance value of heating rod and surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, the location parameter of heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10, to earth's surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 return to zero, open temp controller 12, temperature controller 12 is by the temperature of heating muff inner wall temperature sensor 10 induction heating sleeve pipe 2, and heating rod 1 is heated,
D, data acquisition: the temperature information of surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 be collection per second once, calculating per minute mean value, is stored in FLASH memory module 24;
E, thermal conductivity calculate: the position changing the first temperature sensor 7 obtains the temperature T (x1, y1) of the first temperature sensor 7, changes the temperature T (x2, y2) that the second temperature sensor 8 position obtains the second temperature sensor 8,
Signal processor 11 obtains the temperature of the first temperature sensor 7 and the temperature of the second temperature sensor 8, and signal processor 11 calculates measured material thermal conductivity, and thermal conductivity result is exported, wherein,
The computing method of thermal conductivity are as follows:
Wherein, λ is thermal conductivity, q is thermal power, H is the length of heating rod 1, T (x1, y1) be that the first temperature sensor 7 is at (x1, y1) temperature at place, T (x2, y2) be that the second temperature sensor 8 is at (x2, y2) temperature at place, x1, x2 is respectively the distance of measurement point apart from heating rod 1 central shaft of the first temperature sensor 7 and the second temperature sensor 8, y1, y2 is respectively the distance of measurement point apart from ground of the first temperature sensor 7 and the second temperature sensor 8, measurement point coordinate meets following relation: x1 ≠ x2 and x1<x2, x1 >=5D, x2>5D also can meet according to test data adjustment: T (x1, y1)-T (x2, y2) >=5 DEG C, wherein, D is the external diameter of heating muff 2.
In step a, shelter from heat or light windproof to measured earth's surface.
In step e, the calculating acquiescence employing glide filter method of 30 minutes of thermal conductivity is carried out the level and smooth of data and is calculated, when test is within 30 minutes, export without thermal conductivity information, test duration is greater than 30 minutes, then start heat outputting conductance information, until the test duration terminates or measurement result reaches the condition of convergence, wherein
The described condition of convergence is that in 5 minutes, heat outputting conductance fluctuation range is less than or equal to 3%.
After step a, before step b, also comprise the steps: after host computer 13 arranges port communication speed, start host computer 13.
Beneficial effect of the present invention is:
Thermal conductivity measuring instrument of the present invention and measuring method, directly can measure the thermal conductivity of tested medium at the scene, cause is without the need to sending medium to be measured into laboratory, decrease the various impacts that artificial interference brings test process, thus avoid because of sampling change environment to measurement result adverse effect, substantially increase the measuring accuracy of tested medium thermal conductivity.In addition, the present invention can measure shallow stratum thermal conductivity, this also contribute to studying agriculture water and soil Changing Pattern as upper soll layer transpiration, conduct heat with rules such as soil moisture changes.
Accompanying drawing explanation
Fig. 1 shows the layout schematic diagram of the temperature sensor of thermal conductivity measuring instrument of the present invention;
Fig. 2 shows the overall schematic of thermal conductivity measuring instrument of the present invention;
Fig. 3 shows the relation schematic diagram of signal processor 11 modules of thermal conductivity measuring instrument of the present invention;
Fig. 4 shows the process flow diagram adopting thermal conductivity measuring instrument of the present invention to measure thermal conductivity.
Reference numeral
1 heating rod 2 heating muff
3 reinforcing filler 4 taper bits
5 surface temperature sensor 6 atmosphere temperature transducers
7 first temperature sensor 8 second temperature sensors
Ancient piece of jade, round, flat and with a hole in its centre temperature sensor in 9 heating muff surface temperature sensor 10 heating muffs
11 signal processor 12 temperature controllers
13 host computer 14 data acquisition modules
15 data store and processing module 16 human-computer interaction module
17 power module 18 servicing units
19 anti-aliasing filter module 20 multi-channel switch
21A/D modular converter 22 voltage acquisition module
23MCU core controller 24FLASH memory module
25 crystal oscillators and reset circuit 26 LCD MODULE
27 keyboard interface module 285V power transfer module
29 internal temperature sensor 30 clock modules
31 serial communication modulars
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.
The theoretical foundation of thermal conductivity measuring instrument of the present invention and measuring method is stable state Imaging Method, theory shows, when a thin bar is vertically imbedded underground as thermal source and is controlled the temperature of this thin bar, this thin bar produces stable thermo parameters method to the material be embedded in around it, and its thermo parameters method and thermal conductivity are in determining relation.The present invention is a kind of measuring instrument developed in this theoretical foundation, and its principle is: bury the thin bar of reasonable size underground, heat thin bar and control the temperature of thin bar, then according to the temperature field on average adding heat and peripheral test point, measure heat conductivity value as calculated.Therefore, when measuring the thermal conductivity of loose shape natural material as soil, can keep the original state of soil, measurement result more meets soil field condition.
As shown in Figure 1-2, thermal conductivity measuring instrument of the present invention comprises: thermal source, surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9, heating muff inner wall temperature sensor 10, signal processor 11 and temperature controller 12.
Thermal source, dispel the heat towards periphery with predetermined temperature, comprise: heating rod 1, heating muff 2, reinforcing filler 3 and taper bit 4, wherein, heating rod 1 is positioned at the inside of heating muff 2, reinforcing filler 3 is arranged in the inner space except heating rod 1 of heating muff 2, and taper bit 4 is arranged on the lower end of heating muff 2, to enter medium to be measured; Wherein, heating muff 2 outer diameter D is less than 0.1 with the ratio of the length H of heating muff 2, to ensure that test macro meets thin bar Model Condition, reduces error.Reinforcing filler 3 is heat-conducting resin, to strengthen heating rod 1 and the heat transfer property of heating muff 2 and the temperature homogeneity of heating muff 2 tube wall.In order to improve measuring accuracy, the temperature of heating rod 1 is higher than environment temperature 20 DEG C-30 DEG C.
Temperature controller 12, be connected with the heating rod 1 of thermal source, for providing thermal power for heating rod 1 and controlling the temperature of heating rod 1, make heating rod 1 temperature higher than environment temperature 20 DEG C-30 DEG C, thus temperature survey environment parameter when stable state Imaging Method is measured remain in claimed range.
The change of temperature field that surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 produce for the heat detected because thermal source sends.Wherein, the temperature sense probe of surface temperature sensor 5 is positioned at earth's surface, for measuring soil surface temperature; The temperature sense probe of atmosphere temperature transducer 6 is arranged in air, for measures ambient temperature, thus judges that whether environment temperature is constant in meet stable state Imaging Method model needs; The temperature sense probe of the first temperature sensor 7 and the second temperature sensor 8 is arranged in measured material, for measuring the temperature of measured material; The temperature sense probe of heating muff surface temperature sensor 9 is close to the outer wall of heating muff 2, for measuring the temperature on heating muff 2 surface; Heating muff inner wall temperature sensor 10 is connected with temperature controller 12, and its temperature sense probe is fixed on the inwall of heating muff 2, for the temperature signal of thermal source being supplied to temperature controller 12 thus being controlled the temperature of heating rod 1 by temperature controller 12.
Described signal processor 11 is connected with heating muff inner wall temperature sensor 10 with surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9, for gathering, the temperature of storing temperature sensor; Like this, signal processor 11 just can according to the temperature computation of the temperature of thermal source and surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8 survey the thermal conductivity of medium.Signal processor 11 also has external communication interface, is connected, communicates with host computer 13, to facilitate analyzing and processing.
As shown in Figure 3, described signal processor 11 comprises data acquisition module 14, data store and processing module 15, human-computer interaction module 16, power module 17 and servicing unit 18.Wherein, data acquisition module 14, human-computer interaction module 16, power module 17 and servicing unit 18 are stored by data and are connected each other with processing module 15.
Surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, the temperature signal of heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 or the voltage signal of heating rod 1 gather via data acquisition module 14, be conveyed into data after being converted to digital signal to store and processing module 15, storage and the calculating of carrying out data with processing module 15 is stored by data, last by human-computer interaction module 16 display measurement result, or be connected with host computer 13 via the serial communication modular 31 in servicing unit 18, display measurement result is analyzed at host computer 13.
Wherein:
Data acquisition module 14 for surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and the temperature signal of heating muff inner wall temperature sensor 10 and the voltage signal of heating rod 1 conditioning, gather and change, comprise anti-aliasing filter module 19, multi-channel switch 20, A/D modular converter 21 and voltage acquisition module 22, wherein, anti-aliasing filter module 19 connects multi-channel switch 20 and A/D modular converter 21 successively, and voltage acquisition module 22 connects A/D modular converter 21.The temperature signal of surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 carries out signal condition through anti-aliasing filter module 19, input A/D modular converter 21 by multi-channel switch 20 timesharing again, import data after being converted to digital signal into and store and processing module 15; The voltage signal of heating rod 1 is gathered by the voltage acquisition module 22 containing anti-aliasing filter, then carries out analog to digital conversion by A/D modular converter 21, imports data into and store and processing module 15 after being finally converted to digital signal.
Data store and comprise MCU core controller 23, FLASH memory module 24 and crystal oscillator and reset circuit 25 with processing module 15, and wherein, MCU core controller 23 is connected with FLASH memory module 24 and crystal oscillator and reset circuit 25 respectively.First data from data acquisition module 14 are saved into FLASH memory module 24, interval at regular intervals, carry out the calculating of thermal conductivity by MCU core controller 23 and measure the judgement of termination condition, crystal oscillator and reset circuit 25 are that the normal work of MCU core controller 23 provides support.
Human-computer interaction module 16, for the man-machine interactive operation of measuring instrument, comprises LCD MODULE 26 and keyboard interface module 27, and both store with data respectively and are connected with the MCU core controller 23 of processing module 15.
Power module 17, for providing electric energy for modules, comprises 5V power transfer module 28, is mainly 5v voltage 220v voltage transitions, is supplied to modules and uses.
Servicing unit 18 provides subsidiary function for giving MCU core controller 23, as real-time clock, housing temperature sensing, temperature compensation, serial communication, comprise internal temperature sensor 29, clock module 30 and serial communication modular 31, three stores with data respectively and is connected with the MCU core controller 23 of processing module 15.Internal temperature sensor 29 can detect the internal node temperature of surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10, for the temperature compensation of surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10.Clock module 30 provides real-time clock, ensures that system clock runs errorless.Serial communication modular 31 carries out data communication for connecting host computer 13.
Adopt thermal conductivity measuring instrument of the present invention to measure the measuring method of thermal conductivity, comprise the steps, as shown in Figure 4:
A, the layout of measuring instrument: heating rod 1 will be comprised, heating muff 2, measured material is inserted together with the heating muff inner wall temperature sensor 10 that thermal source and the temperature sense probe of reinforcing filler 3 and taper bit 4 are arranged in heating muff 2 inwall, the temperature sense probe placement of surface temperature sensor 5 is in earth's surface, the temperature sense probe placement of atmosphere temperature transducer 6 is in air, the temperature sense probe placement of the first temperature sensor 7 and the second temperature sensor 8 is in measured material, the temperature sense probe of heating muff surface temperature sensor 9 is close to the outer wall of heating muff 2, and by heating rod 1 and surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 are connected to signal processor 11, shelter from heat or light windproof to measured earth's surface during measuring, to prevent adverse weather to the excessive interference of the soil moisture, to make surface temperature should keep comparatively constant, fluctuating range is no more than 2 DEG C, thus improves measuring accuracy,
B, reading configuration: start measuring instrument, MCU core controller 23 reads configuration data;
C, optimum configurations: the temperature of set temperature controller 12, test duration, the resistance value of heating rod and surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, the location parameter of heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10, to earth's surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 return to zero, open temp controller 12, temperature controller 12 is by the temperature of heating muff inner wall temperature sensor 10 induction heating sleeve pipe 2, and heating rod 1 is heated,
D, data acquisition: the temperature information of surface temperature sensor 5, atmosphere temperature transducer 6, first temperature sensor 7, second temperature sensor 8, heating muff surface temperature sensor 9 and heating muff inner wall temperature sensor 10 be collection per second once, calculating per minute mean value, is stored in FLASH memory module 24;
E, thermal conductivity calculate: the position changing the first temperature sensor 7 obtains the temperature T (x1, y1) of the first temperature sensor 7, changes the temperature T (x2, y2) that the second temperature sensor 8 position obtains the second temperature sensor 8,
Signal processor 11 obtains the temperature of the first temperature sensor 7 and the temperature of the second temperature sensor 8, and signal processor 11 calculates measured material thermal conductivity, and thermal conductivity result is exported, wherein,
The computing method of thermal conductivity are as follows:
Wherein, λ is thermal conductivity, q is thermal power, heating rod 1 is supplied by temperature controller 12, H is the length of heating rod 1, T (x1, y1) be that the first temperature sensor 7 is at (x1, y1) temperature at place, T (x2, y2) be that the second temperature sensor 8 is at (x2, y2) temperature at place, x1, x2 is respectively the distance of measurement point apart from heating rod 1 central shaft of the first temperature sensor 7 and the second temperature sensor 8, y1, y2 is respectively the distance of measurement point apart from ground of the first temperature sensor 7 and the second temperature sensor 8, such T (x1, y1) be span ground be y1, apart from the temperature that heating rod 1 central shaft is x1 place, T (x2, y2) be span ground be y2, apart from the temperature that heating rod 1 central shaft is x2 place, wherein (x1, y1) determining apart from ground is respectively y1, apart from the contour that heating rod 1 central shaft is x1 place, (x2, y2) determining apart from ground is respectively y2, apart from the contour that heating rod 1 central shaft is x2 place, i.e. coordinate (the x1 of the first temperature sensor 7, y1), coordinate (the x2 of the second temperature sensor 8, y2) be for true origin with the intersection point on heating rod 1 central shaft and ground, measurement point coordinate meets following relation: x1 ≠ x2 and x1<x2, x1 >=5D, x2>5D also can meet according to test data adjustment: T (x1, y1)-T (x2, y2) >=5 DEG C, wherein, D is the external diameter of heating muff 2,
Such as, the coordinate of the first temperature sensor 7 is (10,30), and namely it is 10cm apart from the central shaft of heating rod 1, is 30cm apart from the ground degree of depth; The coordinate of the second temperature sensor 8 is (20,30), and namely it is 20cm apart from the central shaft of heating rod 1, apart from ground degree of depth 30cm;
The calculating acquiescence employing glide filter method of 30 minutes of thermal conductivity is carried out the level and smooth of data and is calculated, when test is within 30 minutes, export without thermal conductivity information, the test duration is greater than 30 minutes, then start heat outputting conductance information, until the test duration terminates or measurement result reaches the condition of convergence.
The measurement result condition of convergence is that in 5 minutes, heat outputting conductance fluctuation range is less than or equal to 3%.
In measuring process, if measurement environment does not meet data model requirement, gauger can be pointed out to improve measurement environment at the display interface of LCD MODULE 26, this prompting can continue to till measurement environment meets the requirements always.
Adopt thermal conductivity measuring instrument of the present invention to measure the measuring method of thermal conductivity, after step a, before step b, also comprise the steps: after host computer 13 arranges port communication speed, start host computer 13.
Adopt the measurement result of the embodiment 1 of thermal conductivity measuring instrument of the present invention and measuring method measurement thermal conductivity, embodiment 2 as shown in table 2.
Table 2: the measurement result of embodiment 1, embodiment 2
* recorded thermal conductivity is the heat conductivity value under the condition of convergence.Soil quality water percentage is the soil moisture content (g) of embodiment and the ratio of dry soil.
The Soil Thermal Conductivity that embodiments of the invention 1 and embodiment 2 record is higher than sampling the heat conductivity value recorded in laboratory by unstable state plane heat source method, this may to decline and with the unworthiness of instrument itself because the sampling disturbance of unstable state plane heat source method causes voidage to increase water percentage, data are less than embodiment and record numerical value, logic shows, thermal conductivity measuring instrument of the present invention and measuring method are more with truly close, and the data recorded are more reasonable.
Claims (10)
1. a thermal conductivity measuring instrument, is characterized in that:
Comprise: thermal source, surface temperature sensor (5), atmosphere temperature transducer (6), the first temperature sensor (7), the second temperature sensor (8), heating muff surface temperature sensor (9), heating muff inner wall temperature sensor (10), signal processor (11) and temperature controller (12), wherein
Described thermal source comprises: heating rod (1), heating muff (2), reinforcing filler (3) and taper bit (4), wherein, heating rod (1) is positioned at the inside of heating muff (2), reinforcing filler (3) is arranged in the inner space except heating rod (1) of heating muff (2), and taper bit (4) is arranged on the lower end of heating muff (2);
Described temperature controller (12), is connected with the heating rod (1) of thermal source;
The temperature sense probe of surface temperature sensor (5) is positioned at earth's surface; The temperature sense probe of atmosphere temperature transducer (6) is arranged in air; The temperature sense probe of the first temperature sensor (7) and the second temperature sensor (8) is arranged in measured material; The temperature sense probe of heating muff surface temperature sensor (9) is close to the outer wall of heating muff (2); Heating muff inner wall temperature sensor (10) is connected with temperature controller (12), and its temperature sense probe is fixed on the inwall of heating muff (2);
Described signal processor (11) and surface temperature sensor (5), atmosphere temperature transducer (6), first temperature sensor (7), second temperature sensor (8), heating muff surface temperature sensor (9) is connected with heating muff inner wall temperature sensor (10), described signal processor (11) comprises data acquisition module (14), data store and processing module (15), human-computer interaction module (16), power module (17) and servicing unit (18), data acquisition module (14), human-computer interaction module (16), power module (17) and servicing unit (18) are stored by data and are connected each other with processing module (15).
2. thermal conductivity measuring instrument as claimed in claim 1, is characterized in that:
The ratio of the length H of described heating muff (2) outer diameter D and heating muff (2) is less than 0.1.
3. thermal conductivity measuring instrument as claimed in claim 1, is characterized in that:
Described reinforcing filler (3) is heat-conducting resin.
4. thermal conductivity measuring instrument as claimed in claim 1, is characterized in that:
The temperature of described heating rod (1) is higher than environment temperature 20 DEG C-30 DEG C.
5. thermal conductivity measuring instrument as claimed in claim 1, is characterized in that:
Described signal processor (11) also has external communication interface, is connected with host computer (13).
6. thermal conductivity measuring instrument as claimed in claim 1, is characterized in that:
Described data acquisition module (14) comprises anti-aliasing filter module (19), multi-channel switch (20), A/D modular converter (21) and voltage acquisition module (22), wherein, anti-aliasing filter module (19) connects multi-channel switch (20) and A/D modular converter (21) successively, and voltage acquisition module (22) connects A/D modular converter (21);
Described data store and comprise MCU core controller (23), FLASH memory module (24) and crystal oscillator and reset circuit (25) with processing module (15), and MCU core controller (23) is connected with FLASH memory module (24) and crystal oscillator and reset circuit (25) respectively;
Human-computer interaction module (16) comprises LCD MODULE (26) and keyboard interface module (27), and both store with data respectively and are connected with the MCU core controller (23) of processing module (15);
Power module (17) comprises 5V power transfer module (28);
Servicing unit (18) comprises internal temperature sensor (29), clock module (30) and serial communication modular (31), and three stores the MCU core controller (23) with processing module (15) respectively with data.
7. adopt the thermal conductivity measuring instrument as described in one of claim 1-6 to measure a measuring method for thermal conductivity, it is characterized in that:
Comprise the steps:
A, the layout of measuring instrument: heating rod (1) will be comprised, heating muff (2), measured material is inserted together with the heating muff inner wall temperature sensor (10) that the thermal source of reinforcing filler (3) and taper bit (4) and temperature sense probe are arranged in heating muff (2) inwall, the temperature sense probe placement of surface temperature sensor (5) is in earth's surface, the temperature sense probe placement of atmosphere temperature transducer (6) is in air, the temperature sense probe placement of the first temperature sensor (7) and the second temperature sensor (8) is in measured material, the temperature sense probe of heating muff surface temperature sensor (9) is close to the outer wall of heating muff (2), and heating rod (1) and each temperature sensor are connected to signal processor (11),
B, reading configuration: start measuring instrument, MCU core controller (23) reads configuration data;
C, optimum configurations: the temperature of set temperature controller (12), test duration, the resistance value of heating rod and surface temperature sensor (5), atmosphere temperature transducer (6), first temperature sensor (7), second temperature sensor (8), the location parameter of heating muff surface temperature sensor (9) and heating muff inner wall temperature sensor (10), to earth's surface temperature sensor (5), atmosphere temperature transducer (6), first temperature sensor (7), second temperature sensor (8), heating muff surface temperature sensor (9) and heating muff inner wall temperature sensor (10) zeroing, open temp controller (12), temperature controller (12) is by the temperature of heating muff inner wall temperature sensor (10) induction heating sleeve pipe (2), and heating rod (1) is heated,
D, data acquisition: the temperature information of surface temperature sensor (5), atmosphere temperature transducer (6), the first temperature sensor (7), the second temperature sensor (8), heating muff surface temperature sensor (9) and heating muff inner wall temperature sensor (10) be collection per second once, calculating per minute mean value, is stored in FLASH memory module (24);
E, thermal conductivity calculate: the position changing the first temperature sensor (7) obtains the temperature T (x1 of the first temperature sensor (7), y1), change the temperature T (x2 that the second temperature sensor (8) position obtains the second temperature sensor (8), y2)
Signal processor (11) obtains the temperature of the first temperature sensor (7) and the temperature of the second temperature sensor (8), signal processor (11) calculates measured material thermal conductivity, and thermal conductivity result is exported, wherein
The computing method of thermal conductivity are as follows:
Wherein, λ is thermal conductivity, q is thermal power, H is the length of heating rod (1), T (x1, y1) be that the first temperature sensor (7) is at (x1, y1) temperature at place, T (x2, y2) be that the second temperature sensor (8) is at (x2, y2) temperature at place, x1, x2 is respectively the distance of measurement point apart from heating rod (1) central shaft of the first temperature sensor (7) and the second temperature sensor (8), y1, y2 is respectively the distance of measurement point apart from ground of the first temperature sensor (7) and the second temperature sensor (8), measurement point coordinate meets following relation: x1 ≠ x2 and x1<x2, x1 >=5D, x2>5D also can meet according to test data adjustment: T (x1, y1)-T (x2, y2) >=5 DEG C, wherein, D is the external diameter of heating muff (2).
8. the measuring method measuring thermal conductivity as claimed in claim 7, is characterized in that:
In step a, shelter from heat or light windproof to measured earth's surface.
9. the measuring method measuring thermal conductivity as claimed in claim 7, is characterized in that:
In step e, the calculating acquiescence employing glide filter method of 30 minutes of thermal conductivity is carried out the level and smooth of data and is calculated, when test is within 30 minutes, export without thermal conductivity information, test duration is greater than 30 minutes, then start heat outputting conductance information, until the test duration terminates or measurement result reaches the condition of convergence, wherein
The described condition of convergence is that in 5 minutes, heat outputting conductance fluctuation range is less than or equal to 3%.
10. the measuring method measuring thermal conductivity as claimed in claim 7, is characterized in that:
After step a, before step b, also comprise the steps: after host computer (13) arranges port communication speed, start host computer (13).
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