CN105215548A - Laser soldering device - Google Patents
Laser soldering device Download PDFInfo
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- CN105215548A CN105215548A CN201510707746.0A CN201510707746A CN105215548A CN 105215548 A CN105215548 A CN 105215548A CN 201510707746 A CN201510707746 A CN 201510707746A CN 105215548 A CN105215548 A CN 105215548A
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- laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
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Abstract
The present invention relates to a kind of laser soldering device, comprising: Laser emission main body, offer an emission cavity in described Laser emission main body, described emission cavity has an opening; Generating laser, be arranged at one end away from described opening in described emission cavity, and described generating laser is towards described opening; Radiating piece, is connected with described Laser emission main body; Cooling duct, described cooling duct is through described Laser emission body interior, and described cooling duct is provided with coolant valve; Supporting seat, is fixedly installed in described emission cavity, and is fixedly connected with described generating laser.Laser emission main body is dispelled the heat by cooling duct and radiating piece simultaneously, effectively dredged the heat that generating laser produces, effectively extended the service life of laser soldering device.
Description
Technical field
The present invention relates to laser technology field, particularly relate to laser soldering device.
Background technology
Laser has high directivity, brightness is high, focus temperature is high feature, be commonly used on laser soldering device, for to the welding between metal, laser weld has the high feature of efficiency, but due to the high characteristic of the focus temperature of laser, often generating laser produces a large amount of heats, such as, powerful laser soldering device, laser energy is operationally very big, as dredged heat not in time, will greatly reduce the service life of laser soldering device.
Summary of the invention
Based on this, be necessary a large amount of heat operationally sent for existing powerful laser soldering device, shortage is well the defect of heat dissipation, provides a kind of radiating effect preferably laser soldering device, is conducive to the service life extending laser soldering device.
A kind of laser soldering device, comprising:
Laser emission main body, offer an emission cavity in described Laser emission main body, described emission cavity has an opening;
Generating laser, be arranged at one end away from described opening in described emission cavity, and described generating laser is towards described opening;
Radiating piece, is connected with described Laser emission main body;
Cooling duct, described cooling duct is through described Laser emission body interior, and described cooling duct is provided with coolant valve;
Supporting seat, is fixedly installed in described emission cavity, and is fixedly connected with described generating laser.
In one embodiment, the first end of described supporting seat is fixedly connected on one end of described emission cavity, and the second end of described supporting seat is fixedly connected with described generating laser.
In one embodiment, the second end of described supporting seat is provided with U-shaped portion, and described generating laser is fixed in described U-shaped portion.
In one embodiment, the second end of described supporting seat is provided with V-shape portion, and described generating laser is fixed in described V-shape portion.
In one embodiment, the second end of described supporting seat is provided with recess, and described generating laser is fixed in described recess.
In one embodiment, the inwall of described emission cavity is provided with reflecting layer.
In one embodiment, the arranged outside in described reflecting layer has heat-conducting layer.
Above-mentioned laser soldering device, is dispelled the heat to Laser emission main body by cooling duct and radiating piece simultaneously, has effectively dredged the heat that generating laser produces, has effectively extended the service life of laser soldering device.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the laser soldering device of one embodiment of the invention;
Fig. 2 is the cross-sectional view along A-A embodiment illustrated in fig. 1;
Fig. 3 is the cross-sectional view of the laser soldering device of another embodiment of the present invention;
Fig. 4 is the cross-sectional view along B-B embodiment illustrated in fig. 3;
Fig. 5 is the cross-sectional view of the laser soldering device of another embodiment of the present invention;
Fig. 6 is the cross-sectional view of the laser soldering device of another embodiment of the present invention;
Fig. 7 is the cross-sectional view of the laser soldering device of another embodiment of the present invention;
Fig. 8 is a direction structure schematic diagram of the laser soldering device of another embodiment of the present invention.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make to disclosure of the present invention understand more thorough comprehensively.
It should be noted that, when element is called as " being arranged at " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Such as, a kind of laser soldering device, comprises Laser emission main body, and offer an emission cavity in described Laser emission main body, described emission cavity has an opening; Generating laser, be arranged at one end away from described opening in described emission cavity, and described generating laser is towards described opening; Radiating piece, is connected with described Laser emission main body; Cooling duct, described cooling duct is through described Laser emission body interior, and described cooling duct is provided with coolant valve.
And for example, as depicted in figs. 1 and 2, it is the laser soldering device 10 of a preferred embodiment of the present invention, comprise: Laser emission main body 100, generating laser 120, radiating piece 200 and cooling duct 300, an emission cavity 110 is offered in described Laser emission main body 100, described emission cavity 110 has an opening 111, described generating laser 120 is arranged at the one end away from described opening 111 in described emission cavity 110, and described generating laser 120 is towards described opening 111, described radiating piece 200 is connected with described Laser emission main body 100, described cooling duct 300 is inner through described Laser emission main body 100, and described cooling duct 300 is provided with coolant valve 350, described cooling duct 300 is by coolant valve 350 and ft connection, when described coolant valve 350 is opened, the heat of described Laser emission main body 100 is distributed to outside rapidly by described cooling duct 300, the heat of described Laser emission main body 100 can be distributed rapidly, and described radiating piece 200 also can assist the heat of described Laser emission main body 100 to distribute, Laser emission main body 100 is dispelled the heat by cooling duct 300 and radiating piece 200 simultaneously, effectively dredge the heat that generating laser 120 produces, effectively extend the service life of laser soldering device 10.
Such as, refer to Fig. 1, described cooling duct 300 comprises first passage 310 and second channel 320, described first passage 310 is communicated with described second channel 320, and such as, described first passage 310 and described second channel 320 shape are in an angle, just as, this angle is acute angle, right angle or obtuse angle, such as, described first passage 310 and the interior circulation of described second channel 320 are provided with cooling medium, such as described cooling medium is cooling fluid, such as, described cooling fluid is cooling liquid, such as, described cooling liquid is liquid nitrogen, described liquid nitrogen circulation and described first passage 310 are with in described second channel 320, the heat of described Laser emission main body 100 can be taken away rapidly, such as, described first passage 310 is respectively arranged with the first valve 351 and the second valve 352 with described second channel 320, when described first valve 351 and described second valve 352 are opened simultaneously, described cooling liquid with described first valve 351 for entrance, with described second valve 352 for outlet, described cooling liquid flows through described first passage 310 and described second channel 320 with this, and flow to the outside of described Laser emission main body 100, effectively take away the heat of described Laser emission main body 100.
Although most of heat absorption of described Laser emission main body 100 can be taken away by described cooling duct 300, but described Laser emission main body 100 still residual fraction heat, as not in time this part heat dredged, heat is by accumulation and cause temperature in described emission cavity 110 sharply to rise, in order to absorb further effectively and dredge the heat of described heat sink body, as shown in Figure 3 and Figure 4, described radiating piece 200 is heat dissipating ring 210, the winding of described heat dissipating ring 210 is also connected to described Laser emission main body 100 outer surface, such as, described heat dissipating ring 210 is heat dissipation metal ring, the inner surface of described heat dissipating ring 210 abuts with the outer surface of described Laser emission main body 100, such as, described heat dissipating ring 210 is copper heat dissipating ring, copper has good thermal conductivity, can fast by the heat absorption of described Laser emission main body 100, and be distributed to outside, and described heat dissipating ring 210 fully abuts with described Laser emission main body 100, large with the contact area of described Laser emission main body 100, make described heat dissipating ring 210 can be abundant, absorb the heat of described Laser emission main body 100 efficiently,
In order to improve the heat-sinking capability of described heat dissipating ring 210, increase the surface of heat dissipating ring 210, such as, referring again to Fig. 3 and Fig. 4, described heat dissipating ring 210 is provided with multiple tracks radiating groove 211, described radiating groove 211 makes the thickness of described heat dissipating ring 210 reduce, more easily outside is delivered to make the heat of described Laser emission main body 100, in addition, described radiating groove 211 also add the surface area of described heat dissipating ring 210, described heat dissipating ring 210 is increased with the contact area of air, thus makes better heat-radiation effect.
Such as, described radiating groove 211 is arranged at the outer surface of described heat dissipating ring 210 along the circumferencial direction of described heat dissipating ring 210, namely described radiating groove 211 is coaxially arranged with described heat dissipating ring 210, and and for example, described radiating groove 211 is along the outer surface being axially set in described heat dissipating ring 210 of described heat dissipating ring 210, such as, the width of described radiating groove 211 is equal, such as, and the equal setting of the spacing described in multiple tracks between radiating groove 211, like this, the heat of described Laser emission main body 100 can be distributed equably, and for example, the different setting of spacing described in multiple tracks between radiating groove 211, and the different setting of width of described radiating groove 211, it should be understood that described generating laser 120 in use, because the position of welding target is different, make the deflection of described generating laser 120 different, like this, the heat produced in described emission cavity 110 is also by uneven, thus make the heat skewness of described Laser emission main body 100, in order to the heat of the uneven distribution making described Laser emission main body 100 can distribute comparatively equably, therefore described radiating groove 211 is distributed in described heat dissipating ring 210 surface unevenly, make the heat of described Laser emission main body 100 can be distributed to outside by described heat dissipating ring 210 comparatively equably, in order to make described heat dissipating ring 210 radiating effect more even further, such as, described heat dissipating ring 210 rotates the outer surface being arranged at described Laser emission main body 100, such as, as shown in Figure 5, described Laser emission main body 100 is provided with the guide part of the annular that the circumference along described Laser emission main body 100 is arranged, described guide part is provided with T-shaped portion 101, described heat dissipating ring 210 is provided with groove, described groove is provided with recessed conjunction portion 201, the recessed conjunction portion 201 of described groove is fastened on the T-shaped portion 101 of described guide part, and described groove can slide along described guide part, thus described heat dissipating ring 210 can be rotated along the circumferential surface of described Laser emission main body 100, the inner surface of heat dissipating ring 210 described in rotation abuts with the outer surface of described Laser emission main body 100, like this, described heat dissipating ring 210 can turn to relevant position according to the Temperature Distribution of described Laser emission main body 100 outer surface, make described heat dissipating ring 210 equably the heat absorption of described Laser emission main body 100 can be distributed to outside, such as, described Laser emission main body 100 is connected with multiple temperature inductor, the Temperature Distribution of described Laser emission main body 100 directly can be got by the temperature value of the detection of multiple described temperature inductor, thus described heat dissipating ring 210 is turned to suitable position, equably the heat of described Laser emission main body 100 is distributed to outside with this.
In a further embodiment, described radiating piece 200 is radiating fin, described radiating fin is vertically arranged at the outer surface of described Laser emission main body 100, described radiating fin has larger surface area, heat is conducive to be distributed to outside rapidly, such as, the outer surface of described Laser emission main body 100 is provided with multiple radiating fin, such as, multiple radiating fin is arranged on the outer surface of described Laser emission main body 100 equably, such as, described radiating fin is set to waveform, corrugated radiating fin has larger surface area, be conducive to distributing of heat, on the other hand, corrugated radiating fin can improve the velocity of liquid assets of air, make radiating efficiency higher, such as, the edge of described radiating fin is provided with sawtooth portion, described sawtooth portion makes the area of described radiating fin increase, be conducive to distributing of heat.
In order to the laser of the transmitting improving described generating laser 120 is more concentrated, improve focusing efficiency, laser soldering device 10 of the present invention also comprises focalizer, be arranged in described emission cavity 110 near one end of described opening 111, and the geometric center of described focalizer and described generating laser 120 and described opening 111 is located along the same line, when described generating laser 120 Emission Lasers, laser is penetrated by described focalizer and described opening 111 successively, after described focalizer makes laser penetrate, directionality is stronger, more concentrated, improve welding efficiency, like this, effectively can shorten the weld interval of single, reduce to make the caloric value of described generating laser 120.
Such as, in order to the laser making described generating laser 120 launch is more concentrated, not easily distribute, such as, described emission cavity 110 is cylindrical shape, such as, the inwall of described cylindrical shape emission cavity 110 is set to smooth surface, columnar emission cavity 110 is conducive to more concentrated axially being launched to the other end by one end along described emission cavity 110 of laser, and avoid dispersing of light, the laser that described generating laser 120 is launched is more concentrated.
In order to make the direction of described generating laser 120 more accurate, such as, as shown in Figure 7, described focalizer comprises speculum 400, described speculum 400 is arranged at the one end away from described opening 111 in described emission cavity 110, such as, described focalizer comprises two described speculums 400, distance between two described speculums 400 axially reducing gradually from the inside to the outside along described emission cavity 110, in other words, two described speculums 400 favour the inwall of described emission cavity 110 respectively, axis along described emission cavity 110 tilts from the inside to the outside, like this, described speculum 400 can correct the laser that described generating laser 120 is launched, make the laser direction of described generating laser 120 more accurate, such as, described focalizer comprises multiple described speculum 400, distance between multiple described speculum 400 axially reducing gradually from the inside to the outside along described emission cavity 110, like this, the direction of the laser that described generating laser 120 is launched effectively can be corrected by multiple speculum 400, the direction of the laser that described generating laser 120 is launched is more accurate, more concentrated.
In order to better laser focusing, such as, as shown in Figure 3, described focalizer comprises convex lens 500, described convex lens 500 are arranged at the one end away from described opening 111 in described emission cavity 110, such as, described convex lens 500 are bull's-eye 500, such as, described convex lens 500 plane orthogonal is in the axis of described emission cavity 110, like this, the laser that described transmitter is launched is when penetrating described convex lens 500, produce refraction, originally the light dispersed is through superrefraction, thus focus on point-blank, make described laser more concentrated, thus raising welding efficiency, effectively can shorten the weld interval of single, reduce to make the caloric value of described generating laser 120.
In order to improve the welding precision of laser further, make Laser emission direction more concentrated, such as, referring again to Fig. 7, the inwall of described emission cavity 110 is provided with reflecting layer 112, described reflecting layer 112 can make at the laser through described emission cavity 110 more concentrated, can effectively avoid diffuse reflection to cause energy loss, in order to avoid described reflecting layer 112 is heated and deformation, such as, the arranged outside in described reflecting layer 112 has heat-conducting layer 113, such as, described heat-conducting layer 113 is metal guide thermosphere, such as, described metal guide thermosphere is copper heat-conducting layer, such as, described metal guide thermosphere is copper-titanium alloy heat-conducting layer, described heat-conducting layer 113 has extremely strong heat resistance, and there is good heat absorption, heat conduction and heat-sinking capability, the heat in described reflecting layer 112 can be absorbed fast, and it is by described heat dissipating ring 210, heat Quick diffusing is extremely outside, avoid described reflecting layer 112 to be heated and produce deformation and then make laser produce diffuse reflection.
Disperse to avoid described laser further, the laser that described generating laser 120 is launched is more concentrated, such as, refer to Fig. 5, described opening 111 is provided with rake 114, such as, the diameter of described rake 114 reduces from inside to outside gradually, it should be understood that, angle between described rake 114 and the inwall of described emission cavity 110 and the inclination angle of described rake 114 should not be excessive, the inclination angle of described rake 114 is excessive, then easily stop laser, cause energy loss, if the inclination angle of described rake 114 is too little, the restriction of then dispersing laser is too little, cannot laser be effectively avoided to disperse, such as, angle between described rake 114 and the inwall of described emission cavity 110 is 25 ° ~ 40 °, preferably, angle between described rake 114 and the inwall of described emission cavity 110 is 28 ° ~ 36 °, preferably, preferably, angle between described rake 114 and the inwall of described emission cavity 110 is 32 °, like this, the stop of described rake 114 pairs of laser is less on the one hand, on the other hand, effective guiding is formed to laser, laser can be avoided to disperse.Such as, described speculum 400 fits in described rake 114, and namely the inclination angle of described speculum 400 is identical with described rake 114, such that described speculum 400 can better reflect, the direction of propagation of calibration of laser.
In a further embodiment, as shown in Figure 6, the diameter of described rake 114 increases from inside to outside gradually, described rake 114 is outwards in horn-like expansion, although the rake 114 expanded outwardly cannot effectively avoid laser to disperse, but be conducive to heat radiation, because laser penetrates described emission cavity 110 from described opening 111, therefore, the mean temperature of the more described emission cavity 110 of temperature of described opening 111 wants high, if the stop of described rake 114 pairs of laser is too large, rake 114 is then easily caused to be heated excessively, likely cause described rake 114 impaired, and although the rake 114 expanded outwardly cannot be dispersed the propagation of laser and limits, but be conducive to distributing of the heat of described opening 111.
Such as, in order to limit dispersing of laser, and reduce the temperature of described opening 111, such as, described opening 111 is provided with rake 114, and the diameter of described rake 114 reduces from inside to outside gradually, described rake 114 periphery is provided with insulating collar, such as, described insulating collar is metallic insulation circle, such as, described insulating collar is copper insulating collar, described insulating collar effectively improves the heat resistance of opening 111, be conducive to distributing of the heat of opening 111 simultaneously, reduce the temperature of opening 111, in order to improve the heat resistance of described insulating collar further, described insulating collar is copper-titanium alloy insulating collar, such as, described rake 114 is made for copper-titanium alloy, rake 114 1 aspect of the insulating collar of copper-titanium alloy is conducive to heat radiation, the heat of opening 111 is conducive to distribute, reduce the temperature of opening 111, on the other hand there is extremely strong heat resistance, extend the service life of described Laser emission main body 100.
Before welding, need to calibrate welding position, in order to improve calibration efficiency, avoid the long-time direct irradiation of laser when calibrating, cause the temperature of product too high, incorporated by reference to Fig. 1 and Fig. 2, described Laser emission main body 100 is also provided with secondary light source 600, the light that described secondary light source 600 is launched and the light ray parallel that described generating laser 120 is launched, when calibrating, described generating laser 120 quits work, described secondary light source 600 works, described secondary light source 600 is radiated on product, make welding personnel can according to the position correction of described secondary light source 600 direction of Laser emission main body 100, described generating laser 120 is alignd and needs the position of welding, such as, described secondary light source 600 is arranged at described opening 111 side, such as, as shown in Figure 8, described secondary light source 600 is circular, like this, the region that described secondary light source 600 irradiates rear formation is a round dot, the position of described generating laser 120 transmitting can be calculated by the point of irradiation of described secondary light source 600, and for example, as shown in Figure 2, described secondary light source 600 is annular, such as, described secondary light source 600 is arranged around described opening 111, like this, the region that described secondary light source 600 irradiates is annular, the position that described generating laser 120 irradiates then is positioned at the annular region that described secondary light source 600 irradiates, and makes calibrating position more accurate
Such as, in order to improve the precision of described secondary light source 600, such as, described secondary light source 600 is infrared light supply, it is strong that IR has penetrability, the feature that caloric value is little, its heat is unlikely to impact the product of calibration, because IR is black light, calibration personnel is by the calibrating position of infrared detection Equipment Inspection to described infrared light supply, directly calibrating position is observed by naked eyes in order to allow calibration personnel, such as, described secondary light source 600 comprises LED, the visible ray that LED sends makes calibration personnel directly observe calibrating position by naked eyes, substantially increase calibration efficiency.Such as, described secondary light source 600 comprises infrared light supply and LED, and calibration personnel can control infrared light supply or LED works independently, and also can work simultaneously, and infrared light supply precision is higher, and the light of LED is then conducive to improving calibration efficiency.
In order to improve the cooling effectiveness of described cooling duct 300, such as, as shown in Figure 3, laser soldering device 10 of the present invention also comprises cooling generating device 700, described cooling generating device 700 is communicated with described cooling duct 300 by described coolant valve 350, such as, described cooling generating device 700 is communicated with described first passage 310 by described first valve 351, and be communicated with by second channel 320 described in described second valve 352, described cooling generating device 700 is for cooling the cooling medium in described cooling duct 300, such as, described cooling generating device 700 is refrigerating plant, such as, described refrigerating plant comprises the condenser connected successively, choke valve, evaporimeter and compressor, cooling medium in institute cooling duct 300 is by described evaporimeter, the heat of cooling medium is absorbed in a large number by described evaporimeter, described coolant temperature is declined, after described cooling generating device 700 makes described cooling medium cool, cooling medium enters described first passage 310 through described first valve 351, described cooling medium circulates in described first passage 310 with described second channel 320, absorb the heat of described Laser emission main body 100, subsequently, described cooling generating device 700 is again entered through described second valve 352, the temperature of described cooling medium is reduced, circulation and the exchange heat of cooling medium is realized with this, further increase cooling effectiveness.
In order to improve the cooling effectiveness of described cooling duct 300 further, as Fig. 1, Fig. 3, shown in Fig. 5 and Fig. 6, laser soldering device 10 of the present invention also comprises cooling circuit 330, described cooling circuit 330 is communicated with described cooling duct 300, and described cooling circuit 330 is located on described emission cavity 110, such as, described first passage 310, described cooling circuit 330 is communicated with successively with described second channel 320, like this, through the cooled cooling medium of described cooling generating device 700 by described first passage 310, after entering described cooling circuit 330, fully contact with described Laser emission main body 100 at cooling circuit 330, described cooling medium adds the contact area with described Laser emission main body 100, fully carry out heat exchange with described Laser emission main body 100, improve cooling effectiveness, such as, described cooling circuit 330 is coaxially arranged with described emission cavity 110, and described cooling circuit 330 diameter is greater than described emission cavity 110, make described cooling circuit 330 can fully be coated on outside described emission cavity 110 like this, make the heat of described emission cavity 110 can be delivered evenly to described cooling circuit 330.
In order to improve the cooling effectiveness of described cooling duct 300 further, such as, as shown in Figure 5, described cooling duct 300 is provided with multiple U 340, the two ends of described U 340 are communicated with described cooling duct 300, such as, described first passage 310, described cooling circuit 330 is respectively arranged with multiple U 340 with described second channel 320, described first passage 310, described cooling circuit 330 can flow into described U 340 through one end of described U 340 respectively with the cooling medium of described second channel 320, and again flow into described first passage 310 respectively through the other end of described U 340, described cooling circuit 330 and described second channel 320, the active strokes of cooling medium can be extended like this, increase the contact area of cooling medium and described Laser emission main body 100, thus improve the cooling effectiveness of described cooling duct 300 further.
It should be understood that, the diameter of described U 340 is unsuitable excessive, the diameter of described U 340 is excessive, and described Laser emission main body 100 boring fraction is increased, the structure of described Laser emission main body 100 is made to become unstable, the diameter of described U 340 too small, is unfavorable for the circulation of cooling medium in U 340, easily result in blockage, reduce cooling effectiveness, the diameter of described U 340 and the diameter ratio of described cooling duct 300 are 1:8, like this, the diameter of described U 340 can be avoided impacting the mechanism of described Laser emission main body 100, on the other hand, described cooling medium can be made to circulate in described U 340 swimmingly, improve cooling effectiveness.
It is worth mentioning that, because cooling medium is after described cooling generating device 700 cools, temperature can significantly reduce, but the too low cooling medium of temperature impacts to the operating efficiency of described generating laser 120, therefore the operating power controlling described cooling generating device 700 is needed, to regulate the chilling temperature of cooling medium, but the frequent operating power regulating described cooling generating device 700, likely cause decline the service life of described cooling generating device 700 or operating efficiency reduction, in order to avoid to impacting the service life of described cooling generating device 700, such as, the present invention also comprises cylinder (not shown), described coolant valve 350 is connected with cylinder, the opening and closing of described coolant valve 350 are controlled by described cylinder, to realize the control of cooling medium in the velocity of liquid assets of described cooling duct 300, thus reduce the frequency of the described cooling generating device 700 of adjustment, extend the service life of described cooling generating device 700, on the other hand, by the velocity of liquid assets of controlled cooling model medium in described cooling duct 300, thus the control achieved the temperature of cooling medium in described cooling duct 300, avoid the too low decline causing the operating efficiency of described generating laser 120 of temperature, and for example, the present invention also comprises magnetic valve (not shown), described coolant valve 350 is connected with described magnetic valve, such as, when the temperature of described Laser emission main body 100 is lower than predetermined threshold value, described electromagnetic valve work, described coolant valve 350 is closed, cooling medium is made to stop circulation, avoid the coolant temperature in described cooling duct 300 too low, described generating laser 120 is impacted, when the temperature of described Laser emission main body 100 is higher than predetermined threshold value, described in described solenoid-driven, coolant valve 350 is opened, cooling medium is circulated, the temperature of the cooling medium in described cooling duct 300 is reduced with this, make the heat of described Laser emission main body 100 can Quick diffusing.
In order to make described generating laser 120 more firm, thus make welding precision higher, as Fig. 1, shown in Fig. 3 and Fig. 5, laser soldering device 10 of the present invention also comprises supporting seat 116, described supporting seat 116 is fixedly installed in described emission cavity 110, and be fixedly connected with described generating laser 120, such as, the first end of described supporting seat 116 is fixedly connected on one end of described emission cavity 110, second end of described supporting seat 116 is fixedly connected with described generating laser 120, fixing by described supporting seat 116, make described generating laser 120 more firm, avoid in described Laser emission main body 100 when moving, thus effectively avoid the generation of described generating laser 120 rock and cause laser offset.
Such as, as shown in Figure 1, the second end of described supporting seat 116 is provided with U-shaped portion 116a, and described generating laser 120 is fixed in described U-shaped portion 116a; And for example, as shown in Figure 3, the second end of described supporting seat 116 is provided with V-shape portion 116b, and described generating laser 120 is fixed in described V-shape portion 116b; And for example, as shown in Figures 5 to 7, second end of described supporting seat 116 is provided with recess 116c, described generating laser 120 is fixed in described recess 116c, bottom and the both sides of described generating laser 120 are fixed by the U-shaped portion 116a of the second end of described supporting seat 116 or V-shape portion 116b or recess 116c, make described generating laser 120 more firm, effectively avoid described generating laser 120 rock in the generation when moving of described Laser emission main body 100 and cause laser offset, improve welding precision with this.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (7)
1. a laser soldering device, is characterized in that, comprising:
Laser emission main body, offer an emission cavity in described Laser emission main body, described emission cavity has an opening;
Generating laser, be arranged at one end away from described opening in described emission cavity, and described generating laser is towards described opening;
Radiating piece, is connected with described Laser emission main body;
Cooling duct, described cooling duct is through described Laser emission body interior, and described cooling duct is provided with coolant valve;
Supporting seat, is fixedly installed in described emission cavity, and is fixedly connected with described generating laser.
2. laser soldering device according to claim 1, is characterized in that, the first end of described supporting seat is fixedly connected on one end of described emission cavity, and the second end of described supporting seat is fixedly connected with described generating laser.
3. laser soldering device according to claim 2, is characterized in that, the second end of described supporting seat is provided with U-shaped portion, and described generating laser is fixed in described U-shaped portion.
4. laser soldering device according to claim 2, is characterized in that, the second end of described supporting seat is provided with V-shape portion, and described generating laser is fixed in described V-shape portion.
5. laser soldering device according to claim 2, is characterized in that, the second end of described supporting seat is provided with recess, and described generating laser is fixed in described recess.
6. laser soldering device according to claim 1, is characterized in that, the inwall of described emission cavity is provided with reflecting layer.
7. laser soldering device according to claim 1, is characterized in that, the arranged outside in described reflecting layer has heat-conducting layer.
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| CN201510707746.0A CN105215548B (en) | 2015-10-26 | 2015-10-26 | Laser soldering device |
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| CN201510707746.0A CN105215548B (en) | 2015-10-26 | 2015-10-26 | Laser soldering device |
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| CN105215548A true CN105215548A (en) | 2016-01-06 |
| CN105215548B CN105215548B (en) | 2017-09-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100213A (en) * | 2023-04-11 | 2023-05-12 | 四川科新机电股份有限公司 | Large stainless steel sheet welding anti-deformation device and method |
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| CN105215548B (en) | 2017-09-12 |
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