CN219349279U - Facula adjusting device and laser processing system - Google Patents

Facula adjusting device and laser processing system Download PDF

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Publication number
CN219349279U
CN219349279U CN202320262237.1U CN202320262237U CN219349279U CN 219349279 U CN219349279 U CN 219349279U CN 202320262237 U CN202320262237 U CN 202320262237U CN 219349279 U CN219349279 U CN 219349279U
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China
Prior art keywords
diaphragm
hole
laser
absorbing
spot
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CN202320262237.1U
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Chinese (zh)
Inventor
林潇俊
陈国栋
吕洪杰
杨朝辉
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Shenzhen Hans CNC Technology Co Ltd
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Shenzhen Hans CNC Technology Co Ltd
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Abstract

The application discloses facula adjusting device and laser beam system for adjust the facula of laser beam that the laser instrument sent, including absorbing part and diaphragm, absorbing part is equipped with first through-hole, and diaphragm and absorbing part interval set up, and the diaphragm includes body and reflectance coating, and the second through-hole has been seted up to the body, and second through-hole and first through-hole are configured to laser beam and can transmit between second through-hole and first through-hole, and the reflectance coating sets up in the surface of body towards one side of absorbing part, makes the laser beam that shines on the reflectance coating can reflect to absorbing part, with absorbed part absorption. According to the laser beam machining device, the reflecting film is arranged on the surface of one side, facing the absorbing part, of the diaphragm, laser beam irradiated onto the reflecting film is reflected to the absorbing part through the reflecting film, and then the laser beam is absorbed by the absorbing part, so that the diaphragm is prevented from being irradiated onto the diaphragm, thermal deformation caused by heating of laser energy is prevented, and the precision of a machining process is improved.

Description

Facula adjusting device and laser processing system
Technical Field
The application relates to the field of laser equipment, in particular to a light spot adjusting device and a laser processing system.
Background
The diaphragm is used for filtering a part of laser to realize 'adjusting and trimming' of laser spots, but because of the thermal influence of high-power laser, the diaphragm can cause thermal expansion deformation, when the power of a laser is overlarge or the part (power) of the diaphragm to be filtered is overlarge, the blocked heat acting on the diaphragm is enough to cause the diaphragm to generate thermal expansion deformation, the shape of a light passing hole of the diaphragm is influenced, the shape of the laser spots passing through the diaphragm is further directly deteriorated, and the influence caused by microscopic deformation is particularly prominent under the high-precision application process requirement.
In the prior art, in order to solve the problem of thermal deformation of the diaphragm, people in the industry take away the heat of the diaphragm in an air cooling mode, and the heat dissipation purpose is achieved by making a structure such as a radiating fin on the diaphragm and adding or not adding a fan; some people take away the heat of the diaphragm in a water cooling mode, and take away the heat of the diaphragm through cooling water by making a channel for cooling water to flow in the diaphragm. Both schemes have the inherent disadvantage that the diaphragm is heated by laser and then takes away heat, the diaphragm is heated before heat deformation and the diaphragm is cooled after heat deformation, so that the thermal deformation of the diaphragm can not be controlled well.
Disclosure of Invention
In order to overcome the problems of the prior art, a main object of the present application is to provide a spot adjusting device and a laser processing system for preventing a diaphragm from being heated by laser energy and further causing thermal deformation.
In order to achieve the above purpose, the present application specifically adopts the following technical scheme:
the first aspect of the application discloses a facula adjusting device, facula adjusting device is used for adjusting the facula of the laser light that the laser instrument sent, includes:
an absorbing member provided with a first through hole;
the diaphragm, the diaphragm with absorbing member interval sets up, just the diaphragm includes body and reflective film, the second through-hole has been seted up to the body, the second through-hole with first through-hole is configured as laser can be in the second through-hole with first through-hole between the transmission, the reflective film set up in the body orientation the surface of absorbing member's one side makes the laser that shines on the reflective film can reflect to absorbing member, in order to be absorbed by absorbing member.
In some embodiments, the centerline of the second through hole is collinear with the centerline of the first through hole.
In some embodiments, the first via has a cross-section that is larger than the area of the laser spot and the second via has a cross-section that is smaller than the area of the laser spot.
In some embodiments, the distance between the absorbing member and the diaphragm ranges from 100mm to 800mm.
In some embodiments, the spot-adjusting apparatus further comprises a heat-dissipating assembly for dissipating heat from the absorbing member.
In some embodiments, the heat dissipation assembly dissipates heat from the absorbent member by water cooling and/or air cooling.
In some embodiments, a side of the absorbing component facing the diaphragm is provided with a first absorbing surface, and the first absorbing surface is a frosted surface;
or alternatively, the process may be performed,
the light spot adjusting device further comprises a light absorbing layer, wherein the light absorbing layer is arranged on one side of the absorbing component, which faces the diaphragm, so that a first absorbing surface is formed on one side of the absorbing component, which faces the diaphragm.
In some embodiments, a second absorption surface is arranged on one side of the absorption part facing away from the diaphragm, and the second absorption surface is a frosted surface;
or alternatively, the process may be performed,
the light spot adjusting device further comprises a light absorbing layer, wherein the light absorbing layer is arranged on one side of the absorbing component, which is away from the diaphragm, so that a second absorbing surface is formed on one side of the absorbing component, which is away from the diaphragm.
In some embodiments, the reflective film is attached to the body by means of gluing, or the reflective film is disposed on the body by means of electroplating.
A second aspect of the present application discloses a laser processing system, including a laser and a spot adjusting device according to any one of the embodiments of the first aspect.
The application discloses facula adjusting device for adjust the facula of laser instrument sent, including absorbing part and diaphragm, absorbing part is equipped with first through-hole, the diaphragm with absorbing part interval sets up, just the diaphragm includes body and reflective film, the second through-hole has been seted up to the body, the second through-hole with first through-hole is configured to laser can the second through-hole with first through-hole is transmitted between, the reflective film set up in the body orientation absorbing part's one side surface makes the laser that shines on the reflective film can reflect to absorbing part, in order to by absorbing part absorbs. According to the laser beam machining device, the reflecting film is arranged on the surface of one side of the diaphragm, which faces the absorbing component, the laser beam irradiated onto the reflecting film is reflected to the absorbing component through the reflecting film and then absorbed by the absorbing component, so that the laser beam is prevented from being irradiated onto the diaphragm, thermal deformation caused by heating of the diaphragm by laser energy is prevented, and the precision of a machining process is improved.
Drawings
Fig. 1 is a schematic structural view of a spot adjusting device in the prior art.
Fig. 2 is a schematic structural diagram of a spot adjusting device according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a laser irradiation spot adjusting device according to an embodiment of the present application.
Fig. 4 is an axial schematic view of a spot adjusting device according to an embodiment of the present application.
Reference numerals:
1. an absorbent member; 11. a first through hole; 12. a first absorbent surface; 13. a second absorbent surface;
2. a diaphragm; 21. a body; 210. a second through hole; 22. a reflective film;
3. laser light reflected by the reflective film;
2', a diaphragm; 22', through holes; 3', laser light not passing through the aperture; 4', laser light having passed through the aperture.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In the description of the present application, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, and the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In the description of the present application, it should be understood that the terms "upper," "lower," and the like in the embodiments of the present application are described in terms of angles shown in the accompanying drawings, and should not be construed as limiting the embodiments of the present application. In the context of this document, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on the other element or be indirectly on the other element through intervening elements.
A laser device generally uses laser light generated by a laser as a processing tool for processing. However, the spot shape of the laser light emitted from the laser is not good (mainly refers to the precision of shape, shape includes but is not limited to circular, rectangular) due to the laser itself. For the processing technology with high requirements, better laser spot shapes (including but not limited to circular and rectangular) are needed, when the better laser spot shapes (taking the circular spot with higher roundness as an example here) are needed, 1 diaphragm is generally added behind the outlet of the laser (namely in the light path), the diaphragm is processed to have a circular light-passing hole with very high precision, the needed laser passes through the circular light-passing hole of the diaphragm, and stray light at the edge is blocked by the diaphragm, so that the laser spot shape with higher roundness can be obtained.
(if other shapes of laser spots are desired, correspondingly shaped light passing holes are processed in the diaphragm, and so on).
In a practical application scenario, as shown in fig. 1, fig. 1 is a schematic structural diagram of a spot adjusting device in the prior art. In the prior art, when laser 3 'which is emitted by a laser and does not pass through a diaphragm passes through the diaphragm 2', part of the laser is blocked by the diaphragm 2 'and directly acts on the diaphragm 2', so that the diaphragm 2 'is subjected to thermal expansion deformation to influence the shape of a through hole 22' of the diaphragm 2', and further, the shape of a light spot of the laser 4' which passes through the diaphragm is directly caused to be deformed, and the accuracy of a processing technology is influenced.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a spot adjusting device according to an embodiment of the present application. The application discloses facula adjusting device for adjust the facula of laser instrument outgoing laser, this facula adjusting device includes absorption part 1 and diaphragm 2, and absorption part 1 and diaphragm 2 interval set up, and absorption part 1 is equipped with first through-hole 11, and diaphragm 2 is equipped with second through-hole 210, and second through-hole 210 and first through-hole 11 are configured to laser and can transmit between second through-hole 210 and first through-hole 11, make the laser instrument outgoing laser can penetrate first through-hole 11 and second through-hole 210 in proper order, in order to obtain required laser spot shape. Specifically, the diaphragm 2 includes a body 21 and a reflective film 22, the second through hole 210 is opened in the body 21, and the reflective film 22 is provided on a surface of the body 21 on a side facing the absorbing member 1, so that the excessive laser light irradiated to the diaphragm 2 can be reflected by the reflective film 22 to the absorbing member 1 to be absorbed by the absorbing member 1.
In this embodiment, the center lines of the second through hole 210 and the first through hole 11 are on the same straight line, so that concentricity of the second through hole 210 and the first through hole 11 is ensured, and further, when laser passes through the second through hole 210, light in the center of the laser can completely pass through, so that the quality of laser beams is improved, and the quality of laser processing is improved. In this embodiment, the cross section of the second through hole 210 is smaller than the area of the laser spot, so that after the laser passes through the second through hole 210, the laser spot with the same shape as the second through hole 210 can be obtained.
In the present embodiment, the reflective film 22 is attached to the main body 21 by electroplating, so that the adhesion of the reflective film 22 is enhanced, and the reflective film 22 is firmly attached to the diaphragm 2. It will be appreciated that in other embodiments, the reflective film 22 may be disposed on the body 21 by other means, and when the reflective film 22 has a certain thickness, the reflective film 22 may be disposed on the body 21 by, for example, gluing, physical embedding, screw fastening, or plasma coating.
In this embodiment, the second through hole 210 is circular. It is understood that in other embodiments, the second through hole 210 may have other shapes, such as square.
The surface of one side of the diaphragm 2 facing the absorption part 1 is provided with the reflection film 22, laser irradiated onto the diaphragm is reflected to the absorption part 1 through the reflection film 22 and then absorbed by the absorption part 1, so that the laser is prevented from being irradiated onto the diaphragm 2, thermal deformation caused by heating of laser energy of the diaphragm 2 is prevented, and the precision of a processing technology is improved.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a laser irradiation spot adjusting device according to an embodiment of the present application. The cross section of the first through hole 11 is larger than the area of the laser spot, so that the laser is prevented from being irradiated on the surface of the side of the absorbing member 1 facing away from the diaphragm 2, and the first through hole 11 is prevented from being deformed after the absorbing member 1 is thermally deformed due to the absorption of the laser light 3 reflected by the reflective film, which causes the laser light emitted from the influencing laser to pass through the first through hole 11.
In this embodiment, the reflectivity of the reflective film 22 may reach 99.99% or more, so as to minimize the influence of thermal deformation caused by the laser energy directly acting on the diaphragm 2, and it is understood that in other embodiments, the reflectivity of the reflective film 22 may be lower than 99.99%, so long as the reflective film is suitable for application, thereby improving economy and reducing cost.
With continued reference to fig. 3, the side of the absorbing member 1 facing the diaphragm 2 is provided with a first absorbing surface 12, and the first absorbing surface 12 is a frosted surface, which facilitates absorption of the laser light 3 reflected by the reflective film by the absorbing member 1.
In other embodiments, the flare adjusting device may further include a light absorbing layer disposed on a side of the absorbing member 1 facing the diaphragm 2, such that the side of the absorbing member 1 facing the diaphragm 2 forms the first absorbing surface 12 so as to absorb the laser light 3 reflected by the reflective film. Wherein the light absorbing layer may be made of a material with high absorptivity, such as a black silicon material.
In other embodiments, a second absorption surface 13 may be provided on the side of the absorption member 1 facing away from the diaphragm 2, the second absorption surface 13 being a frosted surface. The light-absorbing layer may be provided on the side of the absorbing member 1 facing away from the diaphragm 2, and the side of the absorbing member 1 facing away from the diaphragm 2 may be provided with a second absorbing surface 13. It is also possible to provide all surfaces of the absorbent member 1 as frosted surfaces or to provide all surfaces with a material of high absorptivity.
In this embodiment, the absorbing member 1 is made of a metal material, which is resistant to high temperature and has a strong heat dissipation capability, so that the absorbing member 1 is prevented from thermal deformation after absorbing the laser light 3 reflected by the reflective film, and heat dissipation of the absorbing member 1 is facilitated. It will be appreciated that in other embodiments, the metal component may be made of a non-metallic material.
In the present embodiment, the distance between the absorbing member 1 and the diaphragm 2 is D, and 100 mm.ltoreq.D.ltoreq.800 mm. Specifically, D may be 100mm, 200mm, 300mm, 400mm, 500mm, 600mm, 700mm, 800mm, etc.
Referring to fig. 4, fig. 4 is an axial schematic view of a spot adjusting device according to an embodiment of the present application. The flare adjusting device further comprises a heat dissipation component for dissipating heat of the absorption member 1, so as to prevent the absorption member 1 from thermal deformation or affecting the absorption capacity of the absorption member 1 after absorbing the laser light reflected by the reflection film.
In the present embodiment, the absorption member 1 radiates heat by water cooling, and the heat of the laser light irradiated on the reflection film 22 absorbed by the absorption member 1 is taken by cooling water by making a passage for the flow of water inside the absorption member 1. It will be appreciated that in other embodiments, the absorption member 1 may dissipate heat by air cooling, for example, a heat sink is provided on the absorption member 1, and a fan is provided beside the absorption member 1. The absorption member 1 may be cooled by natural cooling or by cooling with a refrigerant.
The application also discloses a laser processing system, including laser instrument and the facula adjusting device of any embodiment above, facula adjusting device sets up in the laser outgoing end of laser instrument, makes the laser that the laser instrument sent can penetrate first through-hole 11 and second through-hole 210 in proper order to obtain required laser spot shape, thereby be convenient for adopt this laser to process.
The surface of one side of the diaphragm 2 facing the absorption part 1 is provided with the reflection film 22, laser irradiated onto the diaphragm is reflected to the absorption part 1 through the reflection film 22 and then absorbed by the absorption part 1, so that the laser is prevented from being irradiated onto the diaphragm 2, thermal deformation caused by heating of laser energy of the diaphragm 2 is prevented, and the precision of a processing technology is improved.
The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a facula adjusting device, its characterized in that, facula adjusting device is used for adjusting the facula of the laser that laser instrument sent, includes:
an absorbing member provided with a first through hole;
the diaphragm, the diaphragm with absorbing member interval sets up, the diaphragm includes body and reflective film, the second through-hole has been seted up to the body, the second through-hole with first through-hole is configured as laser can be in the second through-hole with first through-hole between the transmission, the reflective film set up in the body orientation the surface of one side of absorbing member makes the laser that shines on the reflective film can reflect to absorbing member, in order to be absorbed by absorbing member.
2. The spot-adjusting apparatus according to claim 1, wherein a center line of the second through hole is on a same line as a center line of the first through hole.
3. The spot-adjusting apparatus according to claim 2, wherein a cross section of the first through hole is larger than an area of the laser spot, and a cross section of the second through hole is smaller than the area of the laser spot.
4. A spot-adjusting apparatus according to claim 1, wherein the distance between the absorbing member and the diaphragm is in the range of 100mm to 800mm.
5. The spot-adjusting apparatus according to claim 1, further comprising a heat-dissipating assembly for dissipating heat from the absorbing member.
6. The spot-adjusting apparatus according to claim 5, wherein the heat-dissipating assembly dissipates heat from the absorbing member by water cooling and/or air cooling.
7. The spot-adjusting apparatus according to claim 1, wherein a side of the absorbing member facing the diaphragm is provided with a first absorbing surface, the first absorbing surface being a frosted surface;
or alternatively, the process may be performed,
the light spot adjusting device further comprises a light absorbing layer, wherein the light absorbing layer is arranged on one side of the absorbing component, which faces the diaphragm, so that a first absorbing surface is formed on one side of the absorbing component, which faces the diaphragm.
8. The spot-adjusting apparatus according to claim 1, wherein a second absorption surface is provided on a side of the absorption member facing away from the aperture, the second absorption surface being a frosted surface;
or alternatively, the process may be performed,
the light spot adjusting device further comprises a light absorbing layer, wherein the light absorbing layer is arranged on one side of the absorbing component, which is away from the diaphragm, so that a second absorbing surface is formed on one side of the absorbing component, which is away from the diaphragm.
9. The spot adjusting apparatus according to any one of claims 1 to 8, wherein the reflecting film is attached to the body by means of adhesion or the reflecting film is provided to the body by means of electroplating.
10. A laser processing system comprising a laser and a spot-adjusting device as claimed in any one of claims 1 to 9.
CN202320262237.1U 2023-02-10 2023-02-10 Facula adjusting device and laser processing system Active CN219349279U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320262237.1U CN219349279U (en) 2023-02-10 2023-02-10 Facula adjusting device and laser processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320262237.1U CN219349279U (en) 2023-02-10 2023-02-10 Facula adjusting device and laser processing system

Publications (1)

Publication Number Publication Date
CN219349279U true CN219349279U (en) 2023-07-14

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ID=87077743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320262237.1U Active CN219349279U (en) 2023-02-10 2023-02-10 Facula adjusting device and laser processing system

Country Status (1)

Country Link
CN (1) CN219349279U (en)

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