CN101375474A - System and method for high power laser processing - Google Patents
System and method for high power laser processing Download PDFInfo
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- CN101375474A CN101375474A CNA2006800303756A CN200680030375A CN101375474A CN 101375474 A CN101375474 A CN 101375474A CN A2006800303756 A CNA2006800303756 A CN A2006800303756A CN 200680030375 A CN200680030375 A CN 200680030375A CN 101375474 A CN101375474 A CN 101375474A
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Abstract
A high power laser processing system is disclosed that includes a laser source and at least one optical element. The laser source provides a high power laser illumination of a first wavelength. The optical element includes a substrate that is substantially transparent to the first wavelength illumination, at least one highly reflective coating on a first side of the substrate, and at least one anti-reflective coating on a second side of the substrate.
Description
The priority of the U.S. Provisional Patent Application that the application requires to submit on July 12nd, 2005 U.S. Provisional Patent Application is submitted to number on March 7th, 60/698,592 and 2006 number 60/779,780.
Technical field
The present invention relates to laser processing system, and relate in particular to the optical element that is used for the high power laser treatment system.
Background technology
The power output of traditional commercially available laser can be the number multikilowatt.Because laser has low overall power efficiency, so they are not converted to the input power heating of effective output.Under the situation of typical overall efficiency 10%, the super amount heat of accumulation in the laser, and utilize circulating water, forced ventilation or their combination to remove this heat usually.Fixing or the semifixed optical element that is used for bending, focusing and guide outgoing laser beam is still more importantly shone by laser beam itself also by the waste heat of laser.Because these optical elements can not be transparent fully or have good reflectivity that so they absorb very a spot of laser power and convert thereof into extra heat, this heat also must be removed.Cavity mirror, folded flat, collimating telescope or the like be the part of individual laser package normally, therefore any device cooling that can easily use with this laser.
But, be used for laser beam is directed to system on the workpiece that is commonly called probe usually physically away from laser itself, and even can show as the form of the operating device of arm end, perhaps dynamically be connected to laser itself.Between laser and the processor this is long-range and dynamically is connected and makes and be difficult to using the built-in identical cooling system cooling scanning system of laser, and it is difficult and expensive usually that equivalent cooling system is set in the position of scanner.
The reason that scanning system need be cooled is as follows.Laser beam irradiation comprises the optics of one or two speculum and condenser lens usually.Although these optics outside thermal laser device environment, thereby and laser beam reduce the power density of laser beam in their position expansion, all power of shock-wave reflection mirror all are not reflected.A spot of laser beam power, be generally 0.3%-0.5% and can be used for heating each speculum.When laser beam power was 6kW, 0.3% was 30W, the major part of speculum can be heated to the temperature that can damage speculum if this power is absorbed.
The speculum that is used for laser itself is fixed on the appropriate location, therefore can with the thermo-contact securely of laser framework, if this framework is by active cooling then the conduction path with low thermal resistance that leads to active coolant can be provided.On the other hand, the speculum that is used for laser beam is directed to workpiece is supported in elongated actuator shaft usually, and this actuator shaft normally rotates the axle of limited torque-motor.For with the sensitiveness relevant reason of influence of motor to heating itself, this deliberately with the material with high thermal resistance for example stainless steel make.As a result, unique effective cooling mechanism of speculum is free convection.
Can illustrate, when surrounding space for example is 20 ℃ and flat board when for example being 50 ℃, the dull and stereotyped thermal loss that is caused by free convection approximately is 6.6 * 10 of a planar surface
-2W/cm
-2This set hope with flat board be the temperature of speculum remain or be lower than under 50 ℃ the situation should the absorbable power of flat board the upper limit.This normally wishes because otherwise the profile of speculum may change and depart from desired profile, and usually can be because of the heat variation because be connected to the performance of the actuator of this speculum.
The process of traditional design laser treatment speculum is the selective light beam orifice, selects mirror size then, and this mirror size should must be enough to produce the focal spot size that is suitable for job in hand greatly.Required minimum beam diameter be D=(1.22 λ) (F)/focused spot diameter, wherein F is the focal length of lens and λ is an optical maser wavelength.For example, at CO
2(10.6 microns or 1.06 * 10 of the wavelength of laser
-3Cm) and under the focal length of 20cm, forming diameter is 1 * 10
-2The diameter of the minimum-value aperture that the focal spot of cm is required is (1.22) (1.06 * 10
-3) (20)/(1 * 10
-2)=2.59cm.The specified incidence angle operation and the permission that are designed to 45 degree are about 1.65D around the area that this clear aperature has the speculum with this aperture on some borders
2, perhaps in the case for being a bit larger tham 11cm
2, and air is can dissipate 6.6 * 10 under 20 ℃ the situation when temperature is 50 ℃ around
-2W/cm
2* 11cm
2=0.73W.(30 ℃ temperature rise, and absolute temperature is 50 ℃).Suppose 99.7% of reflectance coating folded light beam, this speculum can be used for the light beam power of about 0.73/0.003=244W, and this light beam power is only enough up to date.But, as indicated earlier, since present laser beam power kilowatt scope in, up to 25 times of the absorbable permission heat of this speculum, if, then need a kind of new, mirror design more efficiently so wish to avoid complexity, cost and the system deterioration that active cooling may cause occurring.We are called the low absorptivity speculum with this speculum.
Therefore, need a kind ofly to have improved laser treatment performance and do not rely on the economy of active cooling and high power laser treatment system efficiently.
Summary of the invention
The invention provides a kind of high power laser treatment system according to an embodiment of the invention, this system comprises lasing light emitter and at least one optical element.This lasing light emitter provides the high power laser illumination with first wavelength.It is transparent substrate substantially that optical element comprises for this first wavelength, at least one the strong reflection coating on first side of this substrate, and at least one antireflecting coating on second side of this substrate.According to additional embodiments, the present invention also provides a kind of method that high power laser is handled of carrying out.
According to another embodiment, the invention provides a kind of method that the high power laser treatment system is provided, this method comprises the step that the high power laser illumination with first wavelength is provided, and the step of at least one optical element is provided, and it is transparent substrate substantially that this at least one optical element comprises for this first wavelength illumination.At least one strong reflection coating is set on first side of this substrate, and on second side of this substrate, at least one antireflecting coating is set.
According to another embodiment of the invention, the invention provides a kind of high power laser treatment system, this system comprises lasing light emitter and at least one optical element that the high power laser illumination with first wavelength is provided, and this optical element comprises for the substrate of this first wavelength illumination substantially transparent, at least one the strong reflection coating on first side of substrate and at least one antireflecting coating on second side at substrate.Energy by this speculum is captured by radiator structure.
Description of drawings
Can further understand hereinafter explanation with reference to accompanying drawing, in the accompanying drawings:
Fig. 1 illustrates the exemplary diagram diagrammatic view of the laser processing system of use low absorptivity speculum according to an embodiment of the invention;
Fig. 2 illustrates the speculum that system according to an embodiment of the invention uses and the exemplary diagram diagrammatic view of rotor assembly;
Fig. 3 illustrates the speculum shown in Fig. 2 of the line 3-3 of Fig. 2 and the example illustration sectional view of rotor assembly;
Fig. 4-6 illustrates the example illustration sectional view of the speculum that the system according to other embodiments of the invention uses;
Fig. 7 illustrates the exemplary diagram diagrammatic view of the limited motor system of rotation according to an embodiment of the invention; And
Fig. 8 and 9 illustrates the exemplary diagram diagrammatic view according to the limited motor system of other rotation of other embodiments of the invention.
Shown accompanying drawing only is exemplary.
Embodiment
The applicant has been found that the high power laser treatment system can be designed to work and not need active cooling.This result can absorb and realizes by optical element especially speculum being configured such that the incident laser power of having only the seldom mirror that is reflected.In fact, the combination of primer and coating material is selected as making that the energy that is not reflected is not absorbed by speculum fully, and captured by such structure, promptly this structure becomes heat in the fixed position with this power conversion, can remove by free convection or conduction or their combination at this place, fixed position heat.
It is as follows with the process that is fit to specific laser treatment application to be used to design the low absorptivity speculum.At first, determine the operation wavelength and the light beam power of the laser that will use.Then, mirror substrate material is selected as under this wavelength transparent as much as possible.Then, unit multiply by (1-R) for the light beam power of watt, and wherein R is the expectation reflectivity of speculum.This is the quantity of power of leaking by coating.This result multiply by (1-T) then, and wherein T is the expectation transparency of substrate.This is the absorbed quantity of power (P once by mirror substrate time that leaks by coating
A).Then, use the quantity of power of leaking to deduct this result (1-R)-(1-T) by coating.This is that leak and internal reflection that can be reflected mirror partially or completely absorbs or the dump power of transmission by the back side of speculum by coating.Transmission is determined by the fresnel reflection at the back side.This result multiply by (F) then, and wherein F is in the expectation fresnel reflection rate at this back side under the polished situation of mirror back surface.If the back side is not polished, then most of light will be scattered in the back reflective mirror and after repeatedly rebounding and be absorbed.For example, F can equal 0.5.This result is added to P
AOn.This is that unit is the gross power of the speculum absorption of watt.Then, by using The above results divided by 6.6 * 10
-2W/cm
2Determine the minimum required speculum area of unit for square centimeter.Then, use known thin film coated technical construction medium strong reflector to realize positive R.Then, use known thin film coated technical construction medium antireflecting coating to realize the F at the back side.
An example will illustrate advantages more of the present invention.Consider conventional mirror, and relatively conventional mirror and performance according to the speculum of said process design.In order to make variable minimum, suppose all to use in both cases the CO of light beam power as 6kW
2Laser and silicon substrate.Conventional mirror has the back side of burnishing surface and precise finiss.Reflectance coating is a gold, and the protection external coating is selected as that reflectivity reaches peak value under 10.6 microns wavelength, so reflectivity is 99.7%.The interior transparency of silicon is about 0.900 under this wavelength.By process steps, can find that this speculum will absorb the power of 9.9W.Certainly, if enough big, then it can be by free convection this 9.9W that dissipates.Generally speaking, the required 150cm of this heat that dissipates
2The speculum of (diameter is almost 100mm) is excessive naturally and be difficult to be assemblied in the laser aiming head, and drives this laser aiming required power and have no attraction economically.But, use all polished same substrate on both sides, and suppose full dielectric reflector lamination than antiradar reflectivity be 0.995 and expense alunite loss at the back side of working medium lamination antireflecting coating be 0.5%, then can find in this speculum, only to have absorbed 1.808W.This makes that the minute surface area is 27cm
2,, and can be well suited for the Commonly Used Size of laser guidance device less than (the traditional mirror area) 20%.In the case, leak out the power of 18W at speculum place light beam, 1.8W wherein is absorbed, and 16.2W is by this speculum, and enters the energy trapping of big this power that must be enough to harmlessly to dissipate.It shall yet further be noted that this mirror aperture, (27/1.65)
*-2=4.04cm is greater than forming the required minimum dimension of expection focal spot size.
Therefore, according to various embodiments of the present invention, the invention provides a kind of energy that leaves reflection lasering beam of maximum that makes and transmission is entered ligh trap by speculum rather than the method for the mirror absorption that is reflected.Usually, this method always produces is enough to realize that required spot size makes the beam diameter of the size minimum of speculum and associated actuator simultaneously.
According to various embodiment, this realizes by using specific substrate and antireflecting coating.Optical element of the present invention can be used for high power laser treatment system as shown in Figure 1.The laser scanning system 10 that speculum of the present invention can be used for wherein comprises laser subsystem 12, this subsystem 12 guides laser beam to point to first speculum 14 by optics 13, and this first speculum 14 can be as rotating around first rotation 16 shown in the A.Energy (99.5%-99.8%) in most of laser beam is reflected at first speculum, 14 places, and points to second speculum 18 from first speculum 14, and this second transmitting mirror 18 can be as rotating around second rotation 20 shown in the B.The dump energy of laser beam be reflected partly that mirror 14 absorbs and the part transmission by speculum 14.A target of the present invention is to make the not part minimum of mirror 14 absorptions that is reflected of reflector laser beam energy, and makes the energy part of pointing to ligh trap 15 maximum.Ligh trap 15 can constitute by light absorbing material under optical maser wavelength by being selected as, and this material for example can be arranged to have the integrating sphere that repeatedly reflects the characteristic that luminous energy absorbed substantially fully up to luminous energy in inside.The optimum operation of laser processing system is to the temperature-insensitive of ligh trap, thereby this ligh trap can reach the absorption of heat balance in response to energy up to itself and surrounding environment by elevated temperature, and this moment, all absorbed energies were dissipated by free convection.In other words, the present invention moves to ligh trap with used heat from speculum, and this speculum can not dispel the heat under not overheated situation, ligh trap this used heat that can dissipate.Ligh trap can be designed to as requested by active cooling, and perhaps it can utilize fin to have required surface area, perhaps opposite natural heat dissipation.Second rotation 20 is arranged to and first rotation, 16 quadratures.Laser beam points to imaging surface 22 (they may be positioned at or not be positioned at focussing plane) from the reflecting surface 24 of speculum 18 by optics 21 then.Equally, the overwhelming majority of the energy in the laser beam is reflected, and the major part of dump energy is fully by speculum and by another ligh trap 19 interceptings.The position of laser beam on imaging surface 22 can by as at the position of rotation of regulating first speculum 14 shown in the A by as regulating along first direction shown in the C, and can by as at the position of rotation of regulating second speculum 18 shown in the B by as regulating in the second direction that is provided with along quadrature shown in the D.
Can select among the embodiment, speculum 14 and 18 can be placed on the support that can move with respect to imaging surface 22, and laser can be fixed away from described support and/or with respect to described support.Can utilize the condenser lens (back object lens scanning), optical fiber or other device that are arranged between the lasers and mirrors 14 that laser energy is passed to speculum 14.In addition, lens can be arranged on (preceding object lens scanning) between speculum 18 and the described imaging surface.
The applicant has been found that by careful selection reflecting mirror material, can keep the temperature rise of speculum to be equal to or less than the maximum temperature rise that is higher than ambient temperature of expection, for example is equal to or less than 30 ℃.Target is the heat that the restriction speculum absorbs.Common strong reflection coating is implemented in the reflection between 99.5% and 99.7%, and 0.003 to 0.005 impact substrate of energy remaining.The removable heat of free convection is approximately 6.6 * 10 of mirror surface under 30 ℃ delta temperature
-2W/cm
2Unless use the present invention so that major part reflected energy is not by speculum, otherwise speculum will absorb remaining not reflector laser energy.
For typical 15mm speculum, surface area is about 4.2cm
2Thereby the power that convection current is removed can be greater than 4.2cm
2* 6.6 * 10
-2W/cm
2=0.28W.If laser power is actual is 300W, then only has 0.3% of this laser power to impact substrate (0.003 * 300W=0.9W).This means that substrate can not absorb more than the 0.28/0.9=31% of reflected energy not.If the back side of substrate is not polished, then as ordinary circumstance, all 0.9W will finally be absorbed by multiple internal reflection.If the back side is polished, then because the high index of refraction of silicon, because the front is a strong reflector, so most of energy will be absorbed by whole internal reflections.
Shown in Fig. 2 and 3, the speculum mounting structure 30 that is used for system according to an embodiment of the invention comprises speculum can be gluing, welding or the translot that is fastened in it in addition, and can be received within the taper base portion 38 in the tapered opening 36 of rotor of output shaft axle 34.This preferably is welded in the installed part.This system may need to have between reflecting mirror material and the installed part material CTE coupling closely.For example, quartz substrate (UV or near IR) can have 32-5 alloy material installed part, and silicon can have the Mo installed part.
The back side of speculum is coated, and very low reflector for example comprises antireflecting coating thereby it is reflectivity.Now, on the incidence angle of being concerned about, the alunite loss of taking at the back side will be less than 0.5%, and the silicon at 10.6 microns places in be transmitted as about 90%.The result is that 10% of 0.9W is absorbed by the bulk absorption of silicon, and 0.5% of dump power is absorbed by the fresnel reflection at the back side, add up to 0.09W+0.004W=0.094W, this is much smaller than the 0.28W that can be removed under 30 ℃ temperature rise, thereby the temperature of speculum approximately reduces by 1/2.Therefore, the systemic heat of speculum can be removed by convection current and can not be surpassed the temperature limitation of speculum.Traditional speculum is according to some embodiments of the present invention 3 times at substrate absorbable energy, and is 10 times of best embodiment, and model is as follows:
CO
2Laser (10.6 micron wave length)
Conventional mirror, quartz substrate, the back side of fine gtinding
Front reflectivity 0.997
Internal transmittance 0.2
Backside reflection rate scattering (0.5)
Power absorbed ratio (1-0.997) (1-0.2)=2.4 * 10
*-3W/W
((1-0.997)-(2.4×10
＊-3))(0.5)＝3×10
＊-4W/W
Amount to: 2.7 * 10
*-3W/W
Conventional mirror, quartz substrate, polished back face
Front reflectivity 0.997
Internal transmittance 0.2
Backside reflection rate 0.04
Power absorbed ratio (1-0.997) (1-0.2)=2.4 * 10
*-3W/W
((1-0.997)-(2.4×10
＊-3))(0.04)＝2.4×10
＊-5W/W
Amount to: 2.42 * 10
*-3W/W
Conventional mirror, silicon substrate, the fine gtinding back side
Front reflectivity 0.997
Internal transmittance 0.9
Backside reflection rate scattering (0.5)
Power absorbed ratio (1-0.997) (1-0.9)=3 * 10
*-4W/W
((1-0.997)-(3×10
＊-4))(0.5)＝1.35×10
＊-3W/W
Amount to: 1.65 * 10
*-3W/W
Conventional mirror, silicon substrate, polished back face
Front reflectivity 0.997
Internal transmittance 0.9
Backside reflection rate 0.3
Power absorbed ratio (1-0.997) (1-0.9)=3.0 * 10
*-4W/W
((1-0.997)-(3×10
＊-4))(0.3)＝8.1×10
＊-4W/W
Amount to: 1.1 * 10
*-3W/W
The low absorptivity speculum, silicon substrate
Front reflectivity 0.997
Internal transmittance 0.9
Backside reflection rate 0.005
Power absorbed ratio (1-0.997) (1-0.9)=3 * 10
*-4W/W
((1-0.997)-(3×10
＊-4))(0.005)＝1.35×10
＊-5W/W
Amount to: 3.13 * 10
*-4W/W
The absorbable power ratio of low absorption speculum has the conventional mirror of transparent substrates and lacks 3.5 times, and almost lacks 9 times than the conventional mirror with opaque substrate.
According to an example, system of the present invention provides a kind of high power laser treatment system with lasing light emitter and at least one beam deflector.Lasing light emitter produces output beam (for example, the CO with laser energy
2, 10.6 μ m, power output).Beam deflector receives this output beam with laser energy (at least a portion).The beam direction device is included in optical maser wavelength and (for example, has the 10.6 μ m CO of wavelength just
2) under have high-transmission rate () mirror substrate (for example, silicon) preferably, near maximum be so that avoid the major part of light beam to be absorbed by substrate.Substrate is gone up at first substrate surface (front) and (is for example formed the HR coating, dielectric stack) almost to reflect the laser energy that all receive, and (for example in the last formation of second surface (back side) AR coating, zinc sulphide, 1/4 wavelength thickness=2.5 micron), thereby avoid not reflected energy by a large amount of reflected backs almost making transmission all unreflected laser energies by substrate leave this back side.The combination restriction of strong reflection coating (HR), substrate transmission and antireflecting coating (AR) temperature rise of substrate, and provide the laser treatment that need not mirror substrate is carried out any pressure cooling.In a further embodiment, lasing light emitter for example can be high-power YAG lasing light emitter.
This substrate can be for example silicon, germanium or zinc sulphide (being used for infrared ray), perhaps can be for example quartzy, sapphire or magnesium fluoride (being used for visible light or near infrared ray).Reflectance coating can by in titanium dioxide, silicon dioxide, thallium fluoride or the zinc selenide any or be combined to form, and antireflecting coating can by in magnesium fluoride, aluminium oxide or the zinc sulphide any or be combined to form.For example, for YAG laser system (centre wavelength is about 1.06 μ m), can use two groups of TiO that replace
2And SiO
2Film is as the reflectance coating on the vitreosil, and antireflecting coating can be five groups of MgF
2And Al
2O
3For CO
2Laser system (centre wavelength is about 10.64 μ m), two groups of ThF that replace
4Can be used as reflectance coating on the silicon with the ZnSe film, and antireflecting coating can comprise two groups of ThF that replace
4With the ZnS film.
Director system can comprise the limited motor system (for example, galvanometer system) of rotation, and this high power laser treatment system can be used for for example welding, cuts or holes or the like.This system also can comprise various optics and/or mechanical organ (for example, joint arm) with light beam from laser directs at least one speculum.Object lens and back object lens settings (focusing on workpiece or the like) before guider can be arranged to the laser energy that will be reflected.
Preferably, speculum is soldered and avoid using glue.This is because laser beam usually may be crossed the engaging zones between speculum and its installed part.During this accident, laser beam can make glue or epoxy evaporates, and some volatile matters will be deposited on the mirror surface inevitably.These deposits have undesirable optical characteristics, comprise the strong absorbent to laser beam energy.Best situation is the local reflectance that these deposits reduce speculum, and under worst case, deposit will cause speculum that catastrophic breaking-up takes place by localized heating on mirror surface " sclerosis ".Had the High Reflective Surface, high-termal conductivity of light if welding correctly uses, with the good thermal coupling of installed part and than the volatilization temperature of glue and the high hundreds of degree of epoxy resin.As a result, adventitious exposure is harmless in laser beam slightly for solder joint.
According to an embodiment, beam deflector (subsystem) can be carried by manipulator or other joint assembly, perhaps can randomly comprise active cooling.The present invention also provides the red method by using laser frequency transparent substrates and antireflecting coating realization high power laser to handle that is derived from.
Conventional mirror can act on usually up to about 22W/cm
2Irradiance (100W on the speculum of 15mm), about 0.003% absorbed power dissipates by free convection simultaneously.Dielectric coated/transparent substrates/antireflecting coating solution can act on up to about 110W/cm
2The power of irradiance (500W on the speculum of 15mm), this is because as conventional mirror, only has 1/5 of this power to be absorbed by substrate.After this, forced convertion acts on respectively up to about 100W/cm
2(500W on the speculum of 15mm) and about 2.5kW/cm
2(10.5kW on the speculum of 15mm).For higher power, need carry out water cooling to keep speculum near ambient temperature.Every kind of cooling means is useful on the laser power of certain limit.The 60mm speculum of conventional construction can pass through to force cooling processing 6kW, and 56mm speculum manufactured according to the present invention can be handled 6kW and need not to use any active cooling.
Although often used in the prior art and can be effectively from the speculum heat extraction, forced convertion cooling (air injections) must shock-wave reflection mirror could be effective.Therefore, impact and the power of Bernoulli stream effect generation on the speculum reaction force that the servo system that is increased on the algebra in the speed of traditional high power laser processing method inner control speculum and position is subjected to.The amplitude of these power and direction depend on the moment attitude of speculum with respect to jet, are non-linear, and extremely important.As a result, the velocity accuracy of high power laser treatment system and positional precision are owing to the forced convertion cooling of using speculum reduces.In addition, the turbulent flow that heated air is passed through light beam causes optical aberration, and this will increase the size that I realizes the focal spot of size, further makes the deterioration in accuracy of system.Certainly, the cost of beam delivery system and complexity also increase.For those reasons, by eliminating performance and the cost that the needs of cooling speculum has been improved the high power laser treatment system.
As shown in Figure 4, being used for optical element 40 according to an embodiment of the invention provides as in the superpower reflection to incident laser irradiation 42 shown in 44, makes any refractive power (as shown in 46) mainly be removed from element 40 (as shown in 50) rather than as feeding back to element 40 shown in 42 simultaneously.Particularly, Fig. 5 illustrates the optical element of the antireflecting coating 54 that comprises substrate 50, strong reflection coating 52 and go up overleaf.High power laser illumination 56 major parts of incident are reflected (as shown in 58), and any refractive illumination is designed to be removed from this element.The part 60 of optical element (comprising substrate 50 and coating 54) is selected as it and can absorb laser radiation, and antireflecting coating 54 makes the irradiation of minute quantity be fed back substrate 50.Therefore, as shown in 62, a big chunk that is refracted to the irradiation in this element is left this element.
According to other embodiments of the invention, can use the optical element of the reflection multilayer part that comprises substrate, this substrate may comprise for example multilayer strong reflection coating.For example, optical element as shown in Figure 6 comprises substrate 70, and a side of this substrate 70 is provided with a plurality of strong reflection coatings, and the opposite side of this substrate 70 is provided with antireflecting coating 77.The strong reflection coating provides first 74, this first 74 is designed to provide a big chunk of the reflection of incident laser irradiation 72, and substrate 70 and one or more antireflecting coating 77 provide second portion 76, and this second portion 76 is arranged to as removing the reflector laser irradiation as much as possible from this optical element shown in 78.
As shown in Figure 7, the scanner component that comprises armature spindle and speculum mounting structure according to an embodiment of the invention can comprise the scanner motor 80 with rotatable rotor, this rotor has aforesaid output shaft 88, and the transducer 82 that is used for the position of monitor shaft is connected to this rotor one end, and scanning element 84 is connected to the output shaft of scanner motor 80 in the opposite end of this position transducer, and this scanning element 84 may comprise speculum.According to other embodiment, scan element 84 and position transducer 82 and all can be connected to rotor in the same side of rotor.This system also can comprise feedback control system 46, and this feedback control system 46 is coupled to transducer 82 and motor 80 speed and/or the position with the control motor as shown in figure.
As shown in Figure 8, speculum mounting structure according to an embodiment of the invention can use with system 90, and this system 90 comprises break iron 92, stator coil 94 and is fixed on magnet 96 on the axle 98.Axle 98 is rotatably installed on the shell structure (not shown) via bearing 104.Scanner element for example speculum 100 is installed on the end of axle 98, and position transducer 102 is installed on the other end of axle 98.
As shown in Figure 9, the limited torque-motor assembly 110 of rotation according to another embodiment of the invention comprises break iron 92, stator coil 114 as described above and is fixed on the magnet 116 of axle on 118.Speculum 120 is connected on the axle via speculum mounting structure of the present invention, and this beam warp rotatably is fixed on the shell structure (not shown) by bearing 124.Assembly 110 also can comprise aforesaid position transducer.
It will be understood by those skilled in the art that and to make many changes and modification to the foregoing description and can not deviate from the spirit and scope of the present invention.
Claims (24)
1. high power laser treatment system, this system comprises lasing light emitter and at least one optical element of the high power laser illumination that is used to provide first wavelength, this at least one optical element comprise for described first wavelength illumination be transparent substrate substantially, at least one the strong reflection coating on first side of described substrate and at least one antireflecting coating on second side at described substrate.
2. according to the high power laser treatment system of claim 1, wherein said substrate comprises silicon.
3. according to the high power laser treatment system of claim 1, wherein said strong reflection coating comprises metal oxide.
4. according to the high power laser treatment system of claim 1, wherein said antireflecting coating comprises at least one in magnesium fluoride, aluminium oxide, thallium fluoride and the zinc sulphide.
5. according to the high power laser treatment system of claim 1, the irradiation that wherein said substrate is selected as for described first wavelength is transparent substantially.
6. according to the high power laser treatment system of claim 1, wherein said optical element comprises a plurality of coatings of being made by antireflection material.
7. according to the high power laser treatment system of claim 1, wherein said system is used for welding, cutting or boring.
8. according to the high power laser treatment system of claim 1, wherein said system also comprises the heat radiation trap that is used to admit by the irradiation of described optical element.
9. according to the high power laser treatment system of claim 1, wherein said system comprises a plurality of heat radiation traps of irradiation that are used for admitting by each of a plurality of optical elements.
10. according to the high power laser treatment system of claim 1, wherein said lasing light emitter comprises CO
2Described first wavelength of laser and about 10.6 μ m.
11. according to the high power laser treatment system of claim 1, wherein said lasing light emitter does not comprise active cooling system.
12. method that the high power laser treatment system is provided, this method comprises the step of the high power laser illumination that first wavelength is provided, with the step that at least one optical element is provided, this at least one optical element comprise for described first wavelength illumination be transparent substrate substantially, at least one the strong reflection coating on first side of described substrate and at least one antireflecting coating on second side at described substrate.
13. according to the method for claim 12, wherein said substrate comprises silicon.
14. according to the method for claim 12, wherein said strong reflection coating comprises metal oxide.
15. according to the method for claim 12, wherein said antireflecting coating comprises at least one in magnesium fluoride, aluminium oxide, thallium fluoride and the zinc sulphide.
16. according to the method for claim 12, the irradiation that wherein said substrate is selected as for described first wavelength is transparent substantially.
17. according to the method for claim 12, wherein said optical element comprises a plurality of coatings of being made by antireflection material.
18. according to the method for claim 12, wherein said method also comprises the step of using described laser radiation to weld, cut or hole.
19. according to the method for claim 12, wherein said lasing light emitter comprises CO
2Laser and described first wavelength are about 10.6 μ m.
20. according to the method for claim 12, wherein said method does not comprise the step of the described optical element of active cooling.
21. high power laser treatment system, this system comprises lasing light emitter and at least one optical element of the high power laser illumination that is used to provide first wavelength, this at least one optical element comprise for described first wavelength illumination be transparent substrate substantially, at least one the strong reflection coating on first side of described substrate and at least one antireflecting coating on second side at described substrate, wherein captured by radiator structure by the not reflected energy of speculum.
22. according to the system of claim 21, wherein said radiator structure is cooled off by free convection.
23. according to the system of claim 21, wherein said radiator structure is forced to the convection current cooling.
24. according to the system of claim 21, wherein said radiator structure is cooled by circulating cooling liquid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69859205P | 2005-07-12 | 2005-07-12 | |
| US60/698,592 | 2005-07-12 | ||
| US60/779,780 | 2006-03-07 |
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| CN101375474A true CN101375474A (en) | 2009-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800303756A Pending CN101375474A (en) | 2005-07-12 | 2006-07-07 | System and method for high power laser processing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103969827A (en) * | 2013-02-05 | 2014-08-06 | 精工爱普生株式会社 | Light scanner, image display device, head-mounted display, and method of manufacturing light scanner |
| CN104076508A (en) * | 2013-03-25 | 2014-10-01 | 精工爱普生株式会社 | Optical scanner manufacturing method, optical scanner, image display device, and head-mounted display |
| CN111032271A (en) * | 2017-08-16 | 2020-04-17 | 通快机床两合公司 | Laser processing head with an optical element for filtering ultraviolet process radiation and corresponding laser processing method |
| CN114563870A (en) * | 2022-02-28 | 2022-05-31 | 华中科技大学 | Laser galvanometer scanning device |
-
2006
- 2006-07-07 CN CNA2006800303756A patent/CN101375474A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103969827A (en) * | 2013-02-05 | 2014-08-06 | 精工爱普生株式会社 | Light scanner, image display device, head-mounted display, and method of manufacturing light scanner |
| CN103969827B (en) * | 2013-02-05 | 2018-02-27 | 精工爱普生株式会社 | Photoscanner and its manufacture method, image display device, head mounted display |
| CN104076508A (en) * | 2013-03-25 | 2014-10-01 | 精工爱普生株式会社 | Optical scanner manufacturing method, optical scanner, image display device, and head-mounted display |
| CN111032271A (en) * | 2017-08-16 | 2020-04-17 | 通快机床两合公司 | Laser processing head with an optical element for filtering ultraviolet process radiation and corresponding laser processing method |
| CN111032271B (en) * | 2017-08-16 | 2021-10-29 | 通快机床两合公司 | Laser processing head with an optical element for filtering ultraviolet process radiation and corresponding laser processing method |
| CN114563870A (en) * | 2022-02-28 | 2022-05-31 | 华中科技大学 | Laser galvanometer scanning device |
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