CN105215548B - Laser soldering device - Google Patents
Laser soldering device Download PDFInfo
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- CN105215548B CN105215548B CN201510707746.0A CN201510707746A CN105215548B CN 105215548 B CN105215548 B CN 105215548B CN 201510707746 A CN201510707746 A CN 201510707746A CN 105215548 B CN105215548 B CN 105215548B
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- laser
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- emission
- cooling
- heat dissipating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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Abstract
The present invention relates to a kind of laser soldering device, including：An emission cavity is opened up in Laser emission main body, the Laser emission main body, the emission cavity has an opening；Generating laser, is arranged at one end away from the opening in the emission cavity, and the generating laser is towards the opening；Radiating piece, is connected with the Laser emission main body；Cooling duct, the cooling duct is through the Laser emission body interior, and the cooling duct is provided with coolant valve；Support base, is fixedly installed in the emission cavity, and is fixedly connected with the generating laser.Laser emission main body is radiated simultaneously by cooling duct and radiating piece, the heat of generating laser generation has effectively been dredged, has effectively extended the service life of laser soldering device.
Description
Technical field
The present invention relates to laser technology field, more particularly to laser soldering device.
Background technology
Laser has the characteristics of high directivity, brightness are high, focus temperature is high, is commonly used on laser soldering device, for pair
Welding between metal, the characteristics of laser welding has efficiency high, but due to the high characteristic of the focus temperature of laser, often laser
Transmitter produces substantial amounts of heat, for example, powerful laser soldering device, the energy of laser operationally is greatly, such as too late
When heat is dredged, will greatly reduce laser soldering device service life.
The content of the invention
Based on this, it is necessary to the substantial amounts of heat operationally sent for existing powerful laser soldering device, lack
The weary defect for being well heat dissipation is conducive to extending laser welding there is provided a kind of radiating effect preferably laser soldering device
The service life of device.
A kind of laser soldering device, including：
An emission cavity is opened up in Laser emission main body, the Laser emission main body, the emission cavity has an opening, described
Opening is provided with rake, and the diameter of the rake is gradually reduced from inside to outside, and the rake is interior with the emission cavity
Angle between wall is 32 °, and the rake periphery is provided with insulating collar, and the insulating collar is copper insulating collar, described to incline
Inclined portion is made up of copper-titanium alloy；
Generating laser, is arranged at one end away from the opening in the emission cavity, and the generating laser direction
The opening；
Focalizer, is arranged in the emission cavity close to one end of the opening, and the focalizer and laser hair
The geometric center of emitter and the opening is located along the same line；The focalizer also includes two speculums, the speculum
It is arranged in the emission cavity close to one end of the opening, axle of the distance between the two described speculums along the emission cavity
To being gradually reduced from the inside to the outside, the speculum fits in the rake, the inclination angle of the speculum and the rake phase
Together；
Radiating piece, is connected with the Laser emission main body, and the radiating piece is heat dissipating ring, and the heat dissipating ring winding is simultaneously abutted
In the Laser emission body outer surface, the heat dissipating ring is heat dissipation metal ring, the inner surface of the heat dissipating ring and the laser
The outer surface for launching main body is abutted, and the heat dissipating ring is provided with multiple tracks radiating groove, circumference of the radiating groove along the heat dissipating ring
The different setting of spacing that direction is arranged between the outer surface of the heat dissipating ring, radiating groove described in multiple tracks, and the radiating groove
Width is different to be set, and the heat dissipating ring rotates the outer surface for being arranged at the Laser emission main body, and the Laser emission main body is set
The annular guide part along the circumference setting of the Laser emission main body is equipped with, the guide part is provided with T-shaped portion, the radiating
Ring sets fluted, and the groove is provided with recessed conjunction portion, and the recessed conjunction portion of the groove is fastened on the T-shaped portion of the guide part, and
The groove can be slided along the guide part, and the Laser emission main body is connected with multiple temperature inductors；
Cooling duct, the cooling duct is provided with through the Laser emission body interior, and the cooling duct
Coolant valve, the cooling duct includes first passage and second channel, and the first passage is connected with the second channel, institute
State first passage and the second channel shape in an angle, circulation is provided with cold in the first passage and the second channel
But medium, the cooling medium is cooling fluid, and the cooling fluid is cooling liquid, and the cooling liquid is liquid nitrogen, described
First passage is respectively arranged with the first valve and the second valve with the second channel；
Support base, is fixedly installed in the emission cavity, and is fixedly connected with the generating laser；
Wherein, the Laser emission main body is additionally provided with secondary light source, and the light of the secondary light source transmitting swashs with described
The light ray parallel of optical transmitting set transmitting, the secondary light source includes infrared light supply and LED.
In one embodiment, the first end of the support base is fixedly connected on one end of the emission cavity, the support
Second end of seat is fixedly connected with the generating laser.
In one embodiment, the second end of the support base is provided with U-shaped portion, and the generating laser is fixed on described
In U-shaped portion.
In one embodiment, the second end of the support base is provided with V-shape portion, and the generating laser is fixed on described
In V-shape portion.
In one embodiment, the second end of the support base is provided with recess, and the generating laser is fixed on described
In recess.
In one embodiment, the inwall of the emission cavity is provided with reflecting layer.
In one embodiment, it is provided with heat-conducting layer on the outside of the reflecting layer.
Above-mentioned laser soldering device, is radiated, effectively to Laser emission main body simultaneously by cooling duct and radiating piece
The heat of generating laser generation has been dredged on ground, effectively extends the service life of laser soldering device.
Brief description of the drawings
Fig. 1 is the cross-sectional view of the laser soldering device of one embodiment of the invention；
Fig. 2 is cross-sectional view of the embodiment illustrated in fig. 1 along A-A；
Fig. 3 is the cross-sectional view of the laser soldering device of another embodiment of the present invention；
Fig. 4 is cross-sectional view of the embodiment illustrated in fig. 3 along B-B；
Fig. 5 is the cross-sectional view of the laser soldering device of another embodiment of the present invention；
Fig. 6 is the cross-sectional view of the laser soldering device of another embodiment of the present invention；
Fig. 7 is the cross-sectional view of the laser soldering device of another embodiment of the present invention；
Fig. 8 is a direction structure schematic diagram of the laser soldering device of another embodiment of the present invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Plus it is thorough comprehensive.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more
The arbitrary and all combination of related Listed Items.
For example, a kind of laser soldering device, including Laser emission main body, a transmitting is opened up in the Laser emission main body
Chamber, the emission cavity has an opening；Generating laser, is arranged at one end away from the opening in the emission cavity, and institute
Generating laser is stated towards the opening；Radiating piece, is connected with the Laser emission main body；Cooling duct, the cooling duct
Through the Laser emission body interior, and the cooling duct is provided with coolant valve.
And for example, as depicted in figs. 1 and 2, its be a preferred embodiment of the present invention laser soldering device 10, including：Laser
Launch in main body 100, generating laser 120, radiating piece 200 and cooling duct 300, the Laser emission main body 100 and open up one
Emission cavity 110, the emission cavity 110 has an opening 111, and the generating laser 120 is arranged in the emission cavity 110 far
From one end of the opening 111, and the generating laser 120, towards the opening 111, the radiating piece 200 swashs with described
Light transmitting main body 100 is connected, and the cooling duct 300 is through inside the Laser emission main body 100, and the cooling duct
300 are provided with coolant valve 350, and the cooling duct 300 is by coolant valve 350 and ft connection, when the coolant valve
During 350 unlatching, the cooling duct 300 distributes rapidly the heat of the Laser emission main body 100 to outside so that described to swash
The heat of light transmitting main body 100 can be distributed rapidly, and the radiating piece 200 can also aid in the Laser emission main body 100
Heat distribute, Laser emission main body 100 is radiated simultaneously by cooling duct 300 and radiating piece 200, effectively dredged
The heat that generating laser 120 is produced, effectively extends the service life of laser soldering device 10.
For example, referring to Fig. 1, the cooling duct 300 includes first passage 310 and second channel 320, and described first leads to
Road 310 is connected with the second channel 320, for example, the first passage 310 and the shape of the second channel 320 are in an angle,
Just as the angle is acute angle, right angle or obtuse angle；For example, circulation is set in the first passage 310 and the second channel 320
There is cooling medium, such as described cooling medium is cooling fluid, for example, the cooling fluid is cooling liquid, for example, described cold
But liquid is liquid nitrogen, in the liquid nitrogen circulation and the first passage 310 and the second channel 320 so that the laser hair
The heat for penetrating main body 100 can be taken away rapidly, for example, the first passage 310 is respectively arranged with the second channel 320
First valve 351 and the second valve 352, when first valve 351 and second valve 352 are opened simultaneously, the cooling
Liquid is entrance with first valve 351, is outlet with second valve 352, and the cooling liquid is flowed through described with this
First passage 310 and the second channel 320, and the outside of the Laser emission main body 100 is flowed to, effectively take away described
The heat of Laser emission main body 100.
Although the cooling duct 300 by most of heat absorption of the Laser emission main body 100 and can be taken away,
The Laser emission main body 100 still residual fraction heat, such as not in time dredges this partial heat, heat will build up on and cause institute
Temperature in emission cavity 110 is stated to steeply rise, in order to further effectively absorb and dredge the heat of the heat sink body, such as Fig. 3 and
Shown in Fig. 4, the radiating piece 200 is heat dissipating ring 210, and the winding of heat dissipating ring 210 is simultaneously connected to the Laser emission main body 100
Outer surface, for example, the heat dissipating ring 210 is heat dissipation metal ring, the inner surface of the heat dissipating ring 210 and the Laser emission main body
100 outer surface is abutted, for example, the heat dissipating ring 210 is copper heat dissipating ring, copper has good thermal conductivity, can be quickly by institute
State the heat absorption of Laser emission main body 100, and distribute to outside, and the heat dissipating ring 210 fully with the Laser emission master
Body 100 is abutted, and the contact area with the Laser emission main body 100 is big so that the heat dissipating ring 210 can fully, efficiently
The heat of the Laser emission main body 100 is absorbed,
In order to improve the heat-sinking capability of the heat dissipating ring 210, increase the surface of heat dissipating ring 210, for example, referring again to figure
3 and Fig. 4, the heat dissipating ring 210 is provided with multiple tracks radiating groove 211, and the radiating groove 211 causes the thickness of the heat dissipating ring 210
Reduce, to cause the heat of the Laser emission main body 100 to be easier to be delivered to outside, in addition, the radiating groove 211 also increases
The surface area of the heat dissipating ring 210 so that the contact area increase of the heat dissipating ring 210 and air, so that radiating effect
Fruit is more preferably.
For example, circumferencial direction of the radiating groove 211 along the heat dissipating ring 210 is arranged at the appearance of the heat dissipating ring 210
Face, i.e., described radiating groove 211 is coaxially disposed with the heat dissipating ring 210, and for example, and the radiating groove 211 is along the heat dissipating ring 210
The outer surface of the heat dissipating ring 210 is axially set in, for example, the width of the radiating groove 211 is equal, for example, being dissipated described in multiple tracks
The equal setting of spacing between heat channel 211, so so that the heat of the Laser emission main body 100 can be distributed equably；Again
Such as, the different setting of spacing between radiating groove 211 described in multiple tracks, and the different setting of width of the radiating groove 211, it should be appreciated that
Be the generating laser 120 in use, because the position for welding target is different so that the generating laser
120 deviation is different, so, and the heat produced in the emission cavity 110 also will be uneven, so that the laser
Launch the heat skewness of main body 100, in order that the heat of the uneven distribution of the Laser emission main body 100 can be with
More equably distribute, therefore the radiating groove 211 is unevenly distributed over the surface of heat dissipating ring 210 so that the laser
The heat of transmitting main body 100 more can be distributed equably to outside by the heat dissipating ring 210, in order to further such that described dissipate
The hot radiating effect of ring 210 is more uniformly distributed, for example, the heat dissipating ring 210 rotates the appearance for being arranged at the Laser emission main body 100
Face, for example, as shown in figure 5, the Laser emission main body 100 is provided with along the circumference setting of the Laser emission main body 100
The guide part of annular, the guide part is provided with T-shaped portion 101, and the heat dissipating ring 210 sets fluted, and the groove is provided with
Recessed conjunction portion 201, the recessed conjunction portion 201 of the groove is fastened on the T-shaped portion 101 of the guide part, and the groove can be led along described
Slided to portion, so that the heat dissipating ring 210 can be rotated along the circumferential surface of the Laser emission main body 100, in rotation
The inner surface of the heat dissipating ring 210 is abutted with the outer surface of the Laser emission main body 100, so, and the heat dissipating ring 210 can be with
Relevant position is turned to according to the Temperature Distribution of the outer surface of Laser emission main body 100 so that the heat dissipating ring 210 can be with
Equably by the heat absorption of the Laser emission main body 100 and distribute to outside, for example, the Laser emission main body 100 connects
Multiple temperature inductors are connected to, the laser can be directly obtained by the temperature value of the detection of multiple temperature inductors
Launch the Temperature Distribution of main body 100, so that the heat dissipating ring 210 is turned into suitable position, equably swashed with this by described
The heat of light transmitting main body 100 is distributed to outside.
In a further embodiment, the radiating piece 200 is radiating fin, and the radiating fin is vertically arranged at described sharp
Light launches the outer surface of main body 100, and the radiating fin has larger surface area, is conducive to distributing heat to outer rapidly
Portion, for example, the outer surface of the Laser emission main body 100 is provided with multiple radiating fins, for example, multiple radiating fins are equably
The outer surface of the Laser emission main body 100 is arranged on, for example, the radiating fin is set to waveform, corrugated radiating
Fin has larger surface area, is conducive to distributing for heat, and on the other hand, corrugated radiating fin can improve air
Velocity of liquid assets so that radiating efficiency is higher, for example, the edge of the radiating fin is provided with sawtooth portion, the sawtooth portion causes
The area increase of the radiating fin, is conducive to distributing for heat.
In order to which the laser for the transmitting for improving the generating laser 120 is more concentrated, focusing efficiency, laser of the present invention are improved
Welder 10 also includes focalizer, is arranged in the emission cavity 110 close to one end of the opening 111, and the focusing
The geometric center of device and the generating laser 120 and the opening 111 is located along the same line, when the generating laser
During 120 transmitting laser, laser passes sequentially through the focalizer and the opening 111 is projected, and the focalizer causes laser to project
Directionality is stronger afterwards, more concentrates, and improves welding efficiency, so, can effectively shorten the weld interval of single, to cause
The caloric value for stating generating laser 120 reduces.
For example, in order that the laser launched of the generating laser 120 is more concentrated, be difficult to distribute, for example, described
Emission cavity 110 is cylindrical shape, for example, the inwall of the cylindrical shape emission cavity 110 is set to smooth surface, columnar emission cavity
110 are conducive to laser greater concentration of is launched along the axial direction of the emission cavity 110 from one end to the other end, it is to avoid the hair of light
Dissipate so that the laser that the generating laser 120 is launched more is concentrated.
In order that the direction for obtaining the generating laser 120 is more accurate, for example, as shown in fig. 7, the focalizer includes
Speculum 400, the speculum 400 is arranged in the emission cavity 110 close to one end of the opening 111, for example, described poly-
Burnt device includes two speculums 400, the distance between two described speculums 400 along the emission cavity 110 axially by
Interior to outer to be gradually reduced, in other words, two speculums 400 favour the inwall of the emission cavity 110 respectively, along the hair
The axial direction for penetrating chamber 110 is tilted from the inside to the outside, so, and the speculum 400 can correct swashing for the transmitting of generating laser 120
Light so that the laser direction of the generating laser 120 is more accurate, for example, the focalizer includes multiple speculums
400, the distance between multiple described speculums 400 are gradually reduced from the inside to the outside along the axial direction of the emission cavity 110, so, are led to
The direction for the laser that the generating laser 120 is launched can effectively be corrected by crossing multiple speculums 400 so that the Laser emission
The direction for the laser that device 120 is launched is more accurate, more concentrates.
In order to preferably focus on laser, for example, as shown in figure 3, the focalizer includes convex lens 500, the convex lens
500 are arranged at close to one end of the opening 111 in the emission cavity 110, for example, the convex lens 500 are bull's-eye
500, for example, the plane of the convex lens 500 is perpendicular to the axial direction of the emission cavity 110, so, the laser of the transmitter transmitting
When penetrating the convex lens 500, refraction is produced, the light dissipated originally is through superrefraction, so as to focus on point-blank so that
The laser is more concentrated, so as to improve welding efficiency, can effectively shorten the weld interval of single, to cause the laser to send out
The caloric value of emitter 120 reduces.
In order to further improve the welding precision of laser so that Laser emission direction is more concentrated, for example, referring again to
Fig. 7, the inwall of the emission cavity 110 is provided with reflecting layer 112, and the reflecting layer 112 can cause through the emission cavity
110 laser is more concentrated, and can be prevented effectively from diffusing reflection and be caused energy loss；In order to avoid the reflecting layer 112 is heated and shape
Become, for example, the outside in the reflecting layer 112 is provided with heat-conducting layer 113, for example, the heat-conducting layer 113 is metal heat-conducting layer, example
Such as, the metal heat-conducting layer is copper heat-conducting layer, for example, metal heat-conducting layer is copper-titanium alloy heat-conducting layer, the heat-conducting layer 113
With extremely strong heat resistance, and with good heat absorption, heat conduction and heat-sinking capability, it can quickly absorb the reflecting layer 112
Heat, and by the heat dissipating ring 210 by heat Quick diffusing to outside, it is to avoid the reflecting layer 112 is heated to be produced deformation and enter
And cause laser to produce diffusing reflection.
In order to further avoid the laser from dissipating so that the laser that the generating laser 120 is launched more is concentrated, example
Such as, Fig. 5 is referred to, the opening 111 is provided with rake 114, for example, the diameter of the rake 114 is from inside to outside gradually
Reduce, it should be understood that the angle between the inwall of the rake 114 and the emission cavity 110 is the rake 114
Inclination angle it is unsuitable excessive, the inclination angle of the rake 114 is excessive, then easily stops laser, energy loss is caused, if described incline
The inclination angle of inclined portion 114 is too small, then the limitation dissipated laser is too small, it is impossible to laser diverging is prevented effectively from, for example, the rake
Angle between 114 and the inwall of the emission cavity 110 is 25 °~40 °, it is preferable that the rake 114 and the emission cavity
Angle between 110 inwall is 28 °~36 °, it is preferable that preferably, and the rake 114 is interior with the emission cavity 110
Angle between wall is 32 °, so, and on the one hand stop of the rake 114 to laser is smaller, on the other hand, to laser shape
Into effective guiding, laser can be avoided to dissipate.For example, the speculum 400 fits in the rake 114, i.e., it is described anti-
The inclination angle for penetrating mirror 400 is identical with the rake 114 so that the speculum 400 can preferably reflect, the biography of calibration of laser
Broadcast direction.
In a further embodiment, it is described to incline as shown in fig. 6, the diameter of the rake 114 gradually increases from inside to outside
Inclined portion 114 is in outwards horn-like expansion, although the rake 114 expanded outwardly can not be prevented effectively from laser diverging, but favourable
In radiating, because laser is to project the emission cavity 110 from the opening 111, therefore, the temperature of the opening 111 is more described
The mean temperature of emission cavity 110 is high, if stop of the rake 114 to laser is too big, easily causes rake 114
It is heated excessive, it is possible to cause the rake 114 to be damaged, although and the rake 114 that expands outwardly can not be to the biography of laser
Broadcast it is scattered limited, but be conducive to the heat of the opening 111 to distribute.
For example, in order to limit the diverging of laser, and the temperature of the opening 111 is reduced, for example, the opening 111 is set
There is rake 114, and the diameter of the rake 114 is gradually reduced from inside to outside, the periphery of rake 114 is provided with
Insulating collar, for example, the insulating collar is metallic insulation circle, for example, the insulating collar is copper insulating collar, the insulating collar is effectively carried
The high heat resistance of opening 111, while be conducive to distributing for the heat of opening 111, the temperature of reduction opening 111, in order to enter one
Step improves the heat resistance of the insulating collar, and the insulating collar is copper-titanium alloy insulating collar, for example, the rake 114 is copper titanium
Alloy is made, and the one side of rake 114 of the insulating collar of copper-titanium alloy is conducive to radiating, is conducive to the heat by opening 111 to dissipate
Hair, the temperature of reduction opening 111, on the other hand with extremely strong heat resistance, extends the use longevity of the Laser emission main body 100
Life.
Before welding, it is necessary to be calibrated to welding position, in order to improve calibration efficiency, it is to avoid when in calibration, laser is long
Between direct irradiation, cause the temperature of product too high, incorporated by reference to Fig. 1 and Fig. 2, the Laser emission main body 100 is additionally provided with auxiliary
Light source 600, the light ray parallel that the light that the secondary light source 600 is launched is launched with the generating laser 120, in calibration,
The generating laser 120 is stopped, and the secondary light source 600 works, and the secondary light source 600 is radiated on product, is made
Welding personnel can according to the position correction of the secondary light source 600 Laser emission main body 100 direction so that it is described
The alignment of generating laser 120 needs the position welded, for example, the secondary light source 600 is arranged at 111 sides of the opening, example
Such as, as shown in figure 8, the secondary light source 600 is circle, so, the region that the secondary light source 600 is formed after irradiating is one
Round dot, the position that the generating laser 120 is launched can be calculated by the point of irradiation of the secondary light source 600；And for example, such as
Shown in Fig. 2, the secondary light source 600 is annular, for example, the secondary light source 600 is set around the opening 111, it is so, described
The region that secondary light source 600 irradiates is annular, and the position that the generating laser 120 irradiates then is located at the secondary light source
In the annular region of 600 irradiations so that calibrating position is more accurate,
For example, the precision in order to improve the secondary light source 600, for example, the secondary light source 600 is infrared light supply, it is red
UV light has penetrability strong, and the characteristics of caloric value is small, its heat is unlikely to impact the product of calibration, due to infrared light
Line is black light, and calibration personnel can detect the calibrating position of the infrared light supply by infrared detection equipment, in order to allow school
Quasi- personnel are directly observed calibrating position by naked eyes, for example, the secondary light source 600 includes LED, what LED was sent can
Light is seen so that calibration personnel can substantially increase calibration efficiency by visually be directly observed calibrating position.For example, the auxiliary
Light source 600 includes infrared light supply and LED, and calibration personnel can control infrared light supply or LED to work independently, can also be simultaneously
Work, infrared light supply precision is higher, and the light of LED is then conducive to improving calibration efficiency.
In order to improve the cooling effectiveness of the cooling duct 300, for example, as shown in figure 3, the laser soldering device of the present invention
10 also include cooling generating device 700, and the cooling generating device 700 passes through the coolant valve 350 and the cooling duct
300 connections, for example, the cooling generating device 700 is connected by first valve 351 with the first passage 310, and lead to
Second channel 320 described in crossing second valve 352 is connected, and the cooling generating device 700 is used to cool down the cooling duct
Cooling medium in 300, for example, the cooling generating device 700 is refrigerating plant, for example, the refrigerating plant is included successively
Cooling medium in condenser, choke valve, evaporator and the compressor of connection, institute cooling duct 300 is cold by the evaporator
But the heat of medium is largely absorbed by the evaporator so that the coolant temperature declines, the cooling generating device 700
Make after the cooling medium cooling, cooling medium enters the first passage 310 through first valve 351, the cooling is situated between
Matter circulates in the first passage 310 and the second channel 320, absorbs the heat of the Laser emission main body 100, with
Afterwards, it is again introduced into the cooling generating device 700 through second valve 352 so that the temperature reduction of the cooling medium, with
This realizes the circulation and heat exchange of cooling medium, further increases cooling effectiveness.
In order to further improve the cooling effectiveness of the cooling duct 300, as shown in Fig. 1, Fig. 3, Fig. 5 and Fig. 6, the present invention
Laser soldering device 10 also include cooling circuit 330, the cooling circuit 330 is connected with the cooling duct 300, and described
Cooling circuit 330 is located on the emission cavity 110, for example, the first passage 310, the cooling circuit 330 and described second
Passage 320 is sequentially communicated, so, and the cooling medium after being cooled down through the cooling generating device 700 passes through the first passage
310, into after the cooling circuit 330, fully contacted with the Laser emission main body 100 in cooling circuit 330, the cooling
Medium adds the contact area with the Laser emission main body 100, fully carries out hot friendship with the Laser emission main body 100
Change, improve cooling effectiveness；For example, the cooling circuit 330 is coaxially disposed with the emission cavity 110, and the cooling circuit 330
Diameter is more than the emission cavity 110, so that the cooling circuit 330 can fully be coated on the outside of emission cavity 110,
The heat of the emission cavity 110 is allowd to be delivered evenly to the cooling circuit 330.
In order to further improve the cooling effectiveness of the cooling duct 300, for example, as shown in figure 5, the cooling duct
300 are provided with multiple Us 340, and the two ends of the U 340 are connected with the cooling duct 300, for example, described
One passage 310, the cooling circuit 330 are respectively arranged with multiple Us 340 with the second channel 320, and described first leads to
The cooling medium in road 310, the cooling circuit 330 and the second channel 320 distinguishes can be through the U 340 one
End flows into the U 340, and the other end through the U 340 separately flows into the first passage 310, institute again
State cooling circuit 330 and the second channel 320, can so extend the active strokes of cooling medium, increase cooling medium with
The contact area of the Laser emission main body 100, so as to further improve the cooling effectiveness of the cooling duct 300.
It should be understood that the diameter of the U 340 is unsuitable excessive, the diameter of the U 340 is excessive then
So that the boring fraction of Laser emission main body 100 increase so that the structure of the Laser emission main body 100 becomes
It is unstable, and the diameter of the U 340 is too small, is unfavorable for circulation of the cooling medium in U 340, easily makes
Into blocking, cooling effectiveness is reduced, the diameter ratio of the diameter of the U 340 and the cooling duct 300 is 1：8, this
Sample, the diameter of the U 340 can avoid impacting the mechanism of the Laser emission main body 100, on the other hand,
The cooling medium can be allowd swimmingly to be circulated in the U 340, cooling effectiveness is improved.
It is noted that after being cooled down due to cooling medium through the cooling generating device 700, temperature can significantly drop
It is low, but the too low cooling medium of temperature impacts the operating efficiency to the generating laser 120, it is therefore desirable to control institute
State the operating power of cooling generating device 700, to adjust the chilling temperature of cooling medium, but frequently adjust it is described cooling fill
Put 700 operating power, it is possible to cause the cooling generating device 700 service life decline or operating efficiency reduction, be
Avoid impacting the service life of the cooling generating device 700, for example, present invention additionally comprises cylinder (not shown),
The coolant valve 350 is connected with cylinder, and the opening and closing of the coolant valve 350 are controlled by the cylinder, to realize
Cooling medium the velocity of liquid assets of the cooling duct 300 control, so as to reduce the frequency for adjusting the cooling generating device 700
Rate, extends the service life of the cooling generating device 700, on the other hand, by controlling cooling medium in the cooling duct
300 velocity of liquid assets, it is achieved thereby that the control to the temperature of cooling medium in the cooling duct 300, it is to avoid temperature mistake
The decline of the low operating efficiency for causing the generating laser 120；And for example, it is described present invention additionally comprises magnetic valve (not shown)
Coolant valve 350 is connected with the magnetic valve, for example, when the temperature of the Laser emission main body 100 is less than predetermined threshold value, institute
State electromagnetic valve work so that the coolant valve 350 is closed so that cooling medium stops circulation, it is to avoid the cooling duct 300
Interior coolant temperature is too low, and the generating laser 120 is impacted, when the temperature of the Laser emission main body 100
During higher than predetermined threshold value, coolant valve 350 is opened described in the solenoid-driven so that cooling medium is circulated, and institute is reduced with this
State the temperature of the cooling medium in cooling duct 300 so that the heat of the Laser emission main body 100 can be with Quick diffusing.
In order that the generating laser 120 is more firm so that welding precision is higher, such as Fig. 1, Fig. 3 and Fig. 5
Shown, laser soldering device 10 of the invention also includes support base 116, and the support base 116 is fixedly installed on the emission cavity
In 110, and be fixedly connected with the generating laser 120, for example, the first end of the support base 116 be fixedly connected on it is described
One end of emission cavity 110, the second end of the support base 116 is fixedly connected with the generating laser 120, passes through the support
The fixation of seat 116 so that the generating laser 120 is more firm, it is to avoid when the Laser emission main body 100 is in motion,
Rock so as to be prevented effectively from the generation of generating laser 120 and cause laser offset.
For example, as shown in figure 1, the second end of the support base 116 is provided with U-shaped portion 116a, the generating laser 120
It is fixed in the U-shaped portion 116a；And for example, as shown in figure 3, the second end of the support base 116 is provided with V-shape portion 116b, institute
Generating laser 120 is stated to be fixed in the V-shape portion 116b；And for example, as shown in Figures 5 to 7, the second of the support base 116
End is provided with recess 116c, and the generating laser 120 is fixed in the recess 116c, passes through the of the support base 116
The U-shaped portion 116a or V-shape portion 116b or recess 116c at two ends fix the bottom and both sides of the generating laser 120 so that institute
State generating laser 120 more firm, be prevented effectively from the generating laser 120 in the Laser emission main body 100 in motion
When produce rock and cause laser offset, welding precision is improved with this.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of laser soldering device, it is characterised in that including：
An emission cavity is opened up in Laser emission main body, the Laser emission main body, the emission cavity has an opening, the opening
Be provided with rake, the diameter of the rake is gradually reduced from inside to outside, the inwall of the rake and the emission cavity it
Between angle be 32 °, the rake periphery is provided with insulating collar, and the insulating collar is copper insulating collar, the rake
It is made up of copper-titanium alloy；
Generating laser, is arranged at one end away from the opening in the emission cavity, and the generating laser is described in
Opening；
Focalizer, is arranged in the emission cavity close to one end of the opening, and the focalizer and the generating laser
It is located along the same line with the geometric center of the opening；The focalizer also includes two speculums, and the speculum is set
In one end in the emission cavity close to the opening, the distance between two speculums along the emission cavity axially by
Interior to outer to be gradually reduced, the speculum fits in the rake, and the inclination angle of the speculum is identical with the rake；
Radiating piece, is connected with the Laser emission main body, and the radiating piece is heat dissipating ring, and the heat dissipating ring winding is simultaneously connected to institute
Laser emission body outer surface is stated, the heat dissipating ring is heat dissipation metal ring, the inner surface of the heat dissipating ring and the Laser emission
The outer surface of main body is abutted, and the heat dissipating ring is provided with multiple tracks radiating groove, circumferencial direction of the radiating groove along the heat dissipating ring
The different setting of spacing being arranged between the outer surface of the heat dissipating ring, radiating groove described in multiple tracks, and the width of the radiating groove
Different to set, the heat dissipating ring rotates the outer surface for being arranged at the Laser emission main body, and the Laser emission main body is provided with
The annular guide part set along the circumference of the Laser emission main body, the guide part is provided with T-shaped portion, and the heat dissipating ring is set
Groove is equipped with, the groove is provided with recessed conjunction portion, and the recessed conjunction portion of the groove is fastened on the T-shaped portion of the guide part, and described
Groove can be slided along the guide part, and the Laser emission main body is connected with multiple temperature inductors；
Cooling duct, the cooling duct is through the Laser emission body interior, and the cooling duct is provided with cooling
Valve, the cooling duct includes first passage and second channel, and the first passage connects with the second channel, and described the
In an angle, circulation is provided with cooling and is situated between in the first passage and the second channel for one passage and the second channel shape
Matter, the cooling medium is cooling fluid, and the cooling fluid is cooling liquid, and the cooling liquid is liquid nitrogen, described first
Passage is respectively arranged with the first valve and the second valve with the second channel；
Support base, is fixedly installed in the emission cavity, and is fixedly connected with the generating laser；
Wherein, the Laser emission main body is additionally provided with secondary light source, and the light of the secondary light source transmitting is sent out with the laser
The light ray parallel of emitter transmitting, the secondary light source includes infrared light supply and LED.
2. laser soldering device according to claim 1, it is characterised in that the first end of the support base is fixedly connected on
One end of the emission cavity, the second end of the support base is fixedly connected with the generating laser.
3. laser soldering device according to claim 2, it is characterised in that the second end of the support base is provided with U-shaped
Portion, the generating laser is fixed in the U-shaped portion.
4. laser soldering device according to claim 2, it is characterised in that the second end of the support base is provided with V-arrangement
Portion, the generating laser is fixed in the V-shape portion.
5. laser soldering device according to claim 2, it is characterised in that the second end of the support base is provided with recessed
Portion, the generating laser is fixed in the recess.
6. laser soldering device according to claim 1, it is characterised in that the inwall of the emission cavity is provided with reflection
Layer.
7. laser soldering device according to claim 6, it is characterised in that be provided with heat conduction on the outside of the reflecting layer
Layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510707746.0A CN105215548B (en) | 2015-10-26 | 2015-10-26 | Laser soldering device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510707746.0A CN105215548B (en) | 2015-10-26 | 2015-10-26 | Laser soldering device |
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| CN105215548A CN105215548A (en) | 2016-01-06 |
| CN105215548B true CN105215548B (en) | 2017-09-12 |
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| CN201510707746.0A Active CN105215548B (en) | 2015-10-26 | 2015-10-26 | Laser soldering device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116100213A (en) * | 2023-04-11 | 2023-05-12 | 四川科新机电股份有限公司 | Large stainless steel sheet welding anti-deformation device and method |
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| CN1234615A (en) * | 1997-12-11 | 1999-11-10 | 日本板硝子株式会社 | Optical module |
| CN202004312U (en) * | 2011-04-01 | 2011-10-05 | 广州安特激光技术有限公司 | Diode pumping ceramic cavity |
| CN202434875U (en) * | 2012-01-19 | 2012-09-12 | 吉林省永利激光科技有限公司 | Adjustable laser tube support applicable to different tube diameters |
| CN102798944A (en) * | 2012-07-27 | 2012-11-28 | 北京国科世纪激光技术有限公司 | Optical fiber coupling device of fiber laser |
| CN104159786A (en) * | 2012-03-12 | 2014-11-19 | 齐扎拉光系统有限责任公司 | Standard light source laser diode |
| CN205166178U (en) * | 2015-10-26 | 2016-04-20 | 惠州市杰普特电子技术有限公司 | Laser welding apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86202164U (en) * | 1986-04-14 | 1986-12-31 | 中国科学院高能物理研究所 | Focus and focus-out laser cavity |
| CN102769241A (en) * | 2012-07-13 | 2012-11-07 | 中国电子科技集团公司第十一研究所 | Cooling system for improving reliability of solid-state laser |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1234615A (en) * | 1997-12-11 | 1999-11-10 | 日本板硝子株式会社 | Optical module |
| CN202004312U (en) * | 2011-04-01 | 2011-10-05 | 广州安特激光技术有限公司 | Diode pumping ceramic cavity |
| CN202434875U (en) * | 2012-01-19 | 2012-09-12 | 吉林省永利激光科技有限公司 | Adjustable laser tube support applicable to different tube diameters |
| CN104159786A (en) * | 2012-03-12 | 2014-11-19 | 齐扎拉光系统有限责任公司 | Standard light source laser diode |
| CN102798944A (en) * | 2012-07-27 | 2012-11-28 | 北京国科世纪激光技术有限公司 | Optical fiber coupling device of fiber laser |
| CN205166178U (en) * | 2015-10-26 | 2016-04-20 | 惠州市杰普特电子技术有限公司 | Laser welding apparatus |
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| CN105215548A (en) | 2016-01-06 |
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