CN105186267A - Laser radiator - Google Patents
Laser radiator Download PDFInfo
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- CN105186267A CN105186267A CN201510702603.0A CN201510702603A CN105186267A CN 105186267 A CN105186267 A CN 105186267A CN 201510702603 A CN201510702603 A CN 201510702603A CN 105186267 A CN105186267 A CN 105186267A
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- insulation board
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Abstract
The invention relates to a laser radiator comprising a plurality of laser modules, a heat insulation plate, and a cooling mechanism, wherein a plurality of separators are arranged on the heat insulation plate at intervals; the plurality of laser modules are arranged among the separators; the cooling mechanism is connected with the heat insulation plate and comprises a plurality of cooling plates; cooling capillary tubes are arranged in the cooling plates. According to the laser radiator, the plurality of laser modules are separated by the heat insulation plate, so that heat of the plurality of laser modules can not be concentrated, simultaneously after the heat is absorbed by the heat insulation plate, the heat is radiated by the cooling mechanism, so that the heat of the laser modules can be effectively radiated, and the service life of the laser modules is greatly prolonged.
Description
Technical field
The present invention relates to laser technology field, particularly relate to laser radiator.
Background technology
Along with the development of laser technology, more and more ripe laser technology is applied in each technical field, such as, laser marking, laser printing, laser cutting and laser ranging etc., laser has the feature of the high and concentration of energy of high directivity, brightness, therefore, LASER Light Source often produces a large amount of heats at work, as not in time heat distributed, the operating efficiency of LASER Light Source and related work components and parts will be affected, even will probably cause burning of LASER Light Source and related work components and parts.
Summary of the invention
Based on this, be necessary to lack good radiator structure for existing laser module, cause operationally producing a large amount of heats, and then affect the defect in useful life of laser module, a kind of laser radiator is provided, the amount of heat that effective absorbing laser module produces at work, and heat is distributed, substantially increase the useful life of laser module.
A kind of laser radiator, comprising:
Laser module;
Thermal insulation board, described thermal insulation board is provided with separator, and multiple described separator is disposed on described thermal insulation board, and multiple described laser module is arranged between separator respectively;
Cooling body, described cooling body is connected with described thermal insulation board;
Described cooling body comprises multiple coldplate, is provided with cooling capillary in described coldplate.
In one embodiment, cooling fluid is provided with in described cooling capillary.
In one embodiment, described cooling fluid is water.
In one embodiment, described cooling capillary diameter is set to 2mm ~ 6mm.
In one embodiment, described cooling capillary diameter is set to 3mm ~ 5mm.
In one embodiment, described cooling capillary diameter is set to 4mm.
Above-mentioned laser radiator, be separated by between multiple laser module by thermal insulation board, heat between multiple laser module cannot be concentrated, simultaneously, thermal insulation board is by after heat absorption, by cooling body, heat is distributed, the heat of laser module effectively can be distributed, substantially increase the useful life of laser module.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the laser radiator of one embodiment of the invention;
Fig. 2 is the cross-sectional view of the laser radiator of another embodiment of the present invention;
Fig. 3 is the cross-sectional view of the laser radiator of another embodiment of the present invention;
Fig. 4 is the cross-sectional view of the laser radiator of one embodiment of the invention;
Fig. 5 is the cross-sectional view of the laser radiator of another embodiment of the present invention;
Fig. 6 is the cross-sectional view of the laser radiator of another embodiment of the present invention;
Fig. 7 is the cross-sectional view in a direction of the laser radiator of another embodiment of the present invention;
Fig. 8 is the cross-sectional view of the laser radiator of another embodiment of the present invention;
Fig. 9 is the cross-sectional view of the laser radiator of another embodiment of the present invention;
Figure 10 is the structural representation of the thermal insulation board of the laser radiator of another embodiment of the present invention.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to execution mode described herein.On the contrary, provide the object of these execution modes be make to disclosure of the present invention understand more thorough comprehensively.
It should be noted that, when element is called as " being arranged at " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete execution mode, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Such as, a kind of laser radiator, it comprises: laser module; Thermal insulation board, described thermal insulation board is provided with separator, and multiple described separator is disposed on described thermal insulation board, and multiple described laser module is arranged between separator respectively; Cooling body, described cooling body is connected with described thermal insulation board; Described cooling body comprises multiple coldplate, is provided with cooling capillary in described coldplate.
Described laser module is used for Emission Lasers, such as, described laser module Emission Lasers carries out mark, such as, described laser module Emission Lasers is found range, such as, described laser module Emission Lasers is used for cutting, it should be understood that, laser module can be applicable to different scene, and should not be limited to above-mentioned arbitrary enforcement scene, and laser radiator of the present invention can be arranged according to the difformity of laser module and size, embodiment only carries out expansion elaboration as one or more preferred embodiment of the present invention below, only be not applied on the laser module of this type to limit the present invention.
Such as, as shown in Figure 1, it is the laser radiator 10 of a preferred embodiment of the present invention, comprise: laser module 100, thermal insulation board 200, cooling body 300 and heat-conducting mechanism 400, described thermal insulation board 200 is provided with separator, multiple described separator is disposed on described thermal insulation board 200, and multiple described laser module 100 is arranged between separator respectively; Described cooling body 300 is connected with described thermal insulation board 200; Described heat-conducting mechanism 400 is connected with described thermal insulation board 200; And for example, described cooling body 300 comprises cooling cylinder 310, and described cooling cylinder 310 has barrel 311, and described thermal insulation board 200 is connected to described barrel 311.
Such as, referring again to Fig. 1, described cooling cylinder 310 is square, described barrel 311 is four orthogonal inwalls, described thermal insulation board 200 is four, four described thermal insulation boards 200 are connected to four logical inwalls of described cooling, i.e. four described thermal insulation board 200 vertical settings mutually, multiple laser module 100 is arranged between separator respectively, by described separator, multiple laser module 100 is separated respectively, heat between multiple described laser module 100 cannot be concentrated, be conducive to distributing of heat, and be separately positioned on different thermal insulation board 200 by organizing described laser module 100 more, the heat of described laser module 100 can be spread further, the heat of multiple described laser module 100 is disperseed further.
Such as, described cooling cylinder 310 is polygon, described polygonal cooling cylinder 310 has multiple inwall, multiple thermal insulation board 200 correspondence is arranged on multiple described inwall, like this, the described laser module 100 on multiple thermal insulation board 200 can be made further to be disperseed, such as, described cooling cylinder 310 is hexagon, and such as, described cooling cylinder 310 is octagon.
In order to make the uniform heat distribution of multiple described laser module 100, be conducive to the heat that described cooling cylinder 310 can absorb described laser module 100 equably, such as, as shown in Figure 2, described cooling cylinder 310 is circular, and such as, described thermal insulation board 200 is arc, described thermal insulation board 200 and described cooling cylinder 310 form fit of arc, described thermal insulation board 200 is connected on the round tube wall 311 of described cooling cylinder 310.
More even in order to make heat distribute, such as, described thermal insulation board 200 is provided with multiple thermal vias, described thermal vias is evenly distributed on described thermal insulation board 200, the air circulation on thermal insulation board 200 can be accelerated like this, heat on described thermal insulation board 200 can be distributed rapidly, and it is more even that heat is distributed.
Such as, the different setting of spacing between multiple described separator, the spacing namely between multiple described separator is unequal, and like this, different spacing can place the laser module 100 of different specifications, size, to meet the different needs.Or, more even in order to make the heat of the laser module 100 on described thermal insulation board 200 distribute, as depicted in figs. 1 and 2, spacing between multiple described separator is equal, the spacing being arranged at the multiple described laser module 100 between multiple separator is like this equal, the heat distributed of multiple described laser module 100 can be absorbed by described thermal insulation board 200 uniformly, avoid the heat of described laser module 100 too concentrated.
In one embodiment, described separator is isolation bar, such as, described isolation bar and the one-body molded setting of described thermal insulation board 200, multiple laser module 100 can effectively be isolated by described isolation bar, avoids heat too concentrated, such as, described isolation bar is provided with arc-shaped surface.
In a further embodiment, as shown in Figures 1 to 6, described separator is division board 210, such as, described division board 210 is vertically arranged on described thermal insulation board 200, such as, described division board 210 and the one-body molded setting of described thermal insulation board 200, such as, as shown in Figures 4 to 6, the both sides of described laser module 100 are connected to two adjacent described thermal insulation boards 200, like this, described laser module 100 is not connected with thermal insulation board 200 by means of only bottom, make heat can be delivered to thermal insulation board 200 by the bottom of described laser module 100, by both sides, heat can also be passed to division board 210, and heat can be passed to rapidly thermal insulation board 200 by described division board 210, the radiating efficiency of described laser module 100 is improved further with this.
Such as, described division board 210 and described thermal insulation board 200 one forging molding, such as, described division board 210 is metal material with described thermal insulation board 200, and such as, described division board 210 is alloy material with described thermal insulation board 200, such as, described alloy material is copper alloy, and such as, described division board 210 and described thermal insulation board 200 comprise each component of following mass parts:
Copper 60 parts ~ 75 parts, 4 parts ~ 4.5 parts, aluminium, silver 2.5 parts ~ 4.5 parts, titanium 0.6 part ~ 0.8 part, 4 parts ~ 4.5 parts, magnesium, iron 1 part ~ 1.5 parts, 1 part ~ 1.2 parts, nickel, 0.2 part ~ 0.4 part, manganese, Graphene 0.5 part ~ 2 parts, chromium 0.7 part ~ 0.8 part, vanadium 0.6 part ~ 0.8 part and silicon 1.2 parts ~ 15 parts.
Preferably, described division board 210 and described thermal insulation board 200 comprise each component of following mass parts:
Copper 72 parts, 4.3 parts, aluminium, silver 3.5 parts, titanium 0.7 part, 4 parts, magnesium, iron 1.2 parts, 1.1 parts, nickel, 0.3 part, manganese, Graphene 1.6 parts, chromium 0.75 part, vanadium 0.75 part and silicon 1.3 parts.
The alloy synthesized by above-mentioned component, there is good heat absorption and heat conductivility, wherein, the thermal conductivity of copper is 500 ~ 600W/ (m* DEG C), the thermal conductivity of aluminium is 200 ~ 300W/ (m* DEG C), using these two kinds of metals as the alloy of primary raw material, there is stronger heat conductivility, and the heat conductivility of the thermal conductivity 600 ~ 750W/ (m* DEG C) of silver, the Yin Gengjia in alloy alloy effectively.
It should be understood that, the thickness of described division board 210 should not be too thick, too thick, the speed of heat conduction to thermal insulation board 200 cannot be reduced, if and thickness is too thin, then easily make laser module 100 spacing of described division board 210 both sides too near, be unfavorable for that heat distributes, and easily make the heat of the laser module 100 of division board 210 both sides influence each other, heat can be absorbed rapidly to make division board 210 1 aspect, reduce the interaction of the heat of the laser module 100 of division board 210 both sides on the other hand, such as, described division board 210 thickness is set to 8mm ~ 12mm, preferably, described division board 210 thickness is set to 9mm ~ 10mm, preferably, described division board 210 thickness is set to 9.5mm, like this, the heat transfer efficiency of division board 210 is improved, thermal insulation board 200 can be passed to rapidly by after the heat absorption of laser module 100, on the other hand, the spacing avoiding two adjacent laser modules 100 is too near, heat is between the two influenced each other, cause local temperature too high, thus affect the useful life of laser module 100.
In order to improve radiating effect, as shown in Figures 3 to 6, described cooling body 300 also comprises multiple coldplate 320, described coldplate 320 is connected with described thermal insulation board 200, multiple described coldplate 320 connects inner formation cooling chamber 330, such as, described multiple coldplate 320 is in turn connected to form cooling cylinder 310, such as, multiple described coldplate 320 connects inner formation cooling chamber 330, such as, the one-body molded connection of multiple described coldplates 320, form the inner cooling cylinder 310 with cooling chamber 330, such as, described cooling chamber 330 shape and described cooling cylinder 310 form fit, such as, described cooling cylinder 310 is square, then described cooling chamber 330 is Q-RING, described cooling chamber 330 is arranged around described cooling cylinder 310, such as, refer to Fig. 3, described cooling cylinder 310 is circular, then described cooling chamber 330 is circular rings, described cooling chamber 330 is arranged around described cooling cylinder 310.Described coldplate 320 is by after the heat absorption of described thermal insulation board 200, and heat absorption is distributed rapidly by described cooling chamber 330, and the heat of described laser module 100 can be distributed rapidly.
In order to improve the heat absorption capacity of described cooling chamber 330 further, as shown in Figure 4, described cooling body 300 also comprises cooler 340, described cooler 340 is communicated with described cooling chamber 330, in described cooling chamber 330 by the heating of thermal insulation board 200 heat air can be lowered the temperature by cooler 340, make the interior air of described cooling chamber 330 can absorb more heats, heat absorption efficiency is higher.
Such as, referring again to Fig. 4, described cooling body 300 also comprises cooling water pipe 350, described cooler 340 is communicated with described cooling chamber 330 by cooling water pipe 350, such as, described cooling water pipe 350 comprises the first circulation pipe 351 and the second circulation pipe 352, described cooling chamber 330 has first-class port 331 and first-class port 332, described cooler 340 is communicated with the described first-class port 331 of described cooling chamber 330 by described first circulation pipe 351, and be communicated with described first-class port 332 by described second circulation pipe 352, like this, the air absorbing heat can enter cooler 340 by first-class port 331 and the first circulation pipe 351, under described cooler 340 acts on, heat is absorbed by described cooler 340 and is discharged, air through cooling enters in cooling chamber 330 by the second circulation pipe 352 and first-class port 332 again, the temperature of cooling chamber 330 is reduced, improve the heat absorption capacity of cooling chamber 330.
Such as, coolant is provided with in described cooling chamber 330, such as, described coolant is air, air is good heat transfer medium, easy acquisition, there is velocity of liquid assets fast, be easy to the feature transmitted, air can circulate rapidly in cooling chamber 330 and cooler 340, heat exchanger effectiveness is improved, in order to improve the endothermic effect of described cooling body 300 further, such as, described coolant is cooling fluid, such as, described cooling fluid is cooling water, the feature that glassware for drinking water has specific heat capacity large, and have cheap, be easy to the advantage obtained, when cooling water circulates in cooling chamber 330, effectively can take away the heat of coldplate 320, and heat is distributed by cooler 340, because specific heat capacity is large, cooling water fully can absorb the heat of coldplate 320, and temperature is unlikely to raise too much, there is good endothermic effect.Such as, described cooler 340 comprises water cooling box 360, described water cooling box 360 is communicated with described cooling chamber 330 by the cold pipe that goes, such as, be provided with multiple copper pipe in described water cooling box 360, described copper pipe is connected with the radiating fin 361 being arranged at described water cooling box 360 outside, and the heat of described cooling chamber 330 takes in water cooling box 360 by cooling water, after the copper pipe in described water cooling box 360 absorbs the heat of cooling water, heat is passed to radiating fin 361, heat distributes by radiating fin 361.
Such as, in order to improve the heat absorption efficiency of cooling chamber 330 inner cooling water, referring again to Fig. 4, metallic particles 333 is provided with in described cooling chamber 330, such as, described metallic particles 333 is shot copper, such as, described metallic particles 333 is aluminium copper grain, metallic particles 333 has good heat-conducting effect, fully can absorb the heat of coldplate 320, and metallic particles 333 adds the contact area with cooling water, in flow of cooling water process, metallic particles 333 fully can contact with cooling water in multiple angle, make heat fully can be passed to cooling water by metallic particles 333, improve thermal conversion efficiency.
In order to avoid metallic particles 333 flows out described cooling chamber 330 along with the flowing of cooling water, as shown in Figure 4, described first-class port 331 and the described first-class port 332 of described cooling chamber 330 are respectively arranged with filter screen 334, described filter screen 334 has filter opening, the diameter of described filter opening is less than the diameter of described metallic particles 333, it should be understood that, the diameter of described metallic particles 333 can not be excessive, if the diameter of metallic particles 333 is excessive, the quality of metallic particles 333 increases thereupon, then affect the mobility of described metallic particles 333, metallic particles 333 cannot fully be moved along with the flowing of cooling water, reduce the contact frequency of metallic particles 333 and cooling water, and the diameter of metallic particles 333 is also unsuitable too small, too small then metallic particles 333 easily runs off from cooling chamber 330, and run off in order to avoid the metallic particles 333 that diameter is too small, then the diameter of filter opening is then corresponding will reduce, the reduction of the diameter of filter opening then reduces the mobility of cooling water, in order to improve the flexibility ratio of metallic particles 333, and make the more flowability of cooling water, such as, described metallic particles 333 diameter is 3mm ~ 6mm, described filter opening diameter is 1.8mm ~ 3.5mm, preferably, described metallic particles 333 diameter is 5mm, and described filter opening diameter is 3mm, like this, metallic particles 333 has less volume and quality, and flexibility ratio is higher, can with flow of cooling water rapid movement, increase and the contact frequency of cooling water, on the other hand, the control of filter opening can abundant filtering metal particle 333, metallic particles 333 is avoided to run off, and have good in property, make cooling water have preferably mobility, thus heat can be taken away rapidly by cooling water.
In order to improve endothermic effect further, such as, described cooling fluid is ethanol, ethanol has volatile characteristic, when ethanol is at described cooling chamber 330, easily volatilization of being heated, can absorb rapidly the heat of described coldplate 320, when ethanol stream leads to cooler 340, under the effect of cooler 340, release heat, ethanol cohesion is liquid, again circulates in cooling chamber 330, thus achieve the circulation of heat absorption and heat radiation, substantially increase the radiating efficiency of coldplate 320.
Such as, described coolant is liquid nitrogen, liquid nitrogen has extremely low temperature, there is extraordinary endothermic effect, when liquid nitrogen circulates in cooling chamber 330, the heat of cooling version can be absorbed as quick as thought, cooling version is made to have extraordinary endothermic effect, rapidly by the heat absorption of thermal insulation board 200, laser module 100 can be worked at a normal temperature, substantially increases the useful life of laser module 100.
In order to improve the cooling effect of cooling body 300 further, such as, described coolant is cold-producing medium, such as, described cold-producing medium is R417A, such as, as shown in Figure 5, described cooler 340 comprises compressor 341, choke valve 342 and condenser 343, one end of described compressor 341 is connected with condenser 343 one end, the other end of described condenser 343 is connected with one end of choke valve 342, the other end of described choke valve 342 is connected with one end of cooling chamber 330, the other end of described cooling chamber 330 is connected with the other end of compressor 341, in embody rule, compressor 341 works, be high temperature and high pressure gaseous refrigerant by refrigerant compression, cold-producing medium enters condenser 343 after compression, under the cooling effect of condenser 343, the gaseous refrigerant of HTHP is cooled to the liquid refrigerant of cryogenic high pressure, cryogenic high pressure liquid refrigerant is under choke valve 342 hypotensive effect, become low-temp low-pressure liquid refrigerant, after low-temp low-pressure liquid refrigerant enters cooling chamber 330, absorb the heat in cooling chamber 330, rapid volatilization, the temperature of cooling chamber 330 and coldplate 320 is reduced rapidly, thus the heat of thermal insulation board 200 is absorbed in a large number, after gaseous refrigerant after volatilization enters compressor 341, again compress, constantly circulate with this process, it is the operational environment of laser module 100 low temperature when laser module 100 works, extend the useful life of laser module 100.
In order to improve heat absorption and the capacity of heat transmission of described coldplate 320 further, please simultaneously see Fig. 6 and Fig. 7, cooling capillary 325 is provided with in described coldplate 320, such as, described cooling capillary 325 is communicated with described cooling chamber 330, like this, the contact area of cooling chamber 330 and coldplate 320 can be increased by described cooling capillary 325, the heat absorption efficiency of further raising cooling chamber 330, make the heat of described thermal insulation board 200 can be delivered to cooling chamber 330 efficiently by described coldplate 320, and distributed by cooling chamber 330.
Such as, cooling fluid is provided with in described cooling capillary 325, such as described cooling fluid is cooling water, such as, described cooling water is by being circulated to cooling capillary 325 in cooling chamber 330, cooling water can fully be contacted with coldplate 320, and cooling water fully can absorb the heat of coldplate 320, and in the cyclic process of cooling water, heat is taken away, and distribute.
It should be understood that, the diameter of described cooling capillary 325 is unsuitable excessive, the diameter of excessive cooling capillary 325 declines making the heat absorption capacity of coldplate 320, also described cooling fluid cannot be made fully to contact with described coldplate 320, and the diameter of described cooling capillary 325 is also unsuitable too small, the diameter of too small cooling capillary 325 will affect the circulation of cooling fluid, in order to increase the contact area of cooling fluid and coldplate 320, and improve the velocity of liquid assets of described cooling fluid in cooling capillary 325, such as, described cooling capillary 325 diameter is set to 2mm ~ 6mm, preferably, described cooling capillary 325 diameter is set to 3mm ~ 5mm, preferably, described cooling capillary 325 diameter is set to 4mm, such as, multiple cooling capillary 325 is provided with in described coldplate 320, the surface area of the cooling capillary 325 that described cooling capillary 325 to one diameters that multiple so such diameter is less are larger is larger, thus considerably increase the contact area of cooling fluid and described coldplate 320, improve the heat absorption capacity of cooling fluid, on the other hand, cooling fluid can be circulated swimmingly in described cooling capillary 325, improve heat exchanger effectiveness.Can contact more even with described coldplate 320 to make cooling fluid, such as, multiple described cooling capillary 325 is evenly arranged in described coldplate 320, such as, multiple described cooling capillary 325 is parallel to each other and be evenly arranged in described coldplate 320, such as, as shown in Figure 7, " U " shape that multiple described cooling capillary 325 connects successively in head and the tail is arranged, add the contact area of cooling fluid and coldplate 320 on the one hand, make each location contacts of cooling fluid and coldplate 320 more even, make cooling fluid can circulate with described cooling capillary 325 Inner eycle at described cooling chamber 330 on the other hand, further raising heat exchanger effectiveness.
In order to improve heat absorption and the heat-sinking capability of described coldplate 320 further, as shown in Figure 8 and Figure 9, described cooling body 300 comprises multiple coldplate 320, described coldplate 320 comprises the first cooling layer 321 connected successively, second cooling layer 322 and the 3rd cooling layer 323, described first cooling layer 321 is connected with described thermal insulation board 200, such as, described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323 one forging molding, such as, described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323 are set to the metal of unlike material respectively, such as, described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323 are respectively the materials synthesis of unlike material, such as, described first cooling layer 321 is set to heat conduction carbon fiber, described second cooling layer 322 is set to copper, described 3rd cooling layer 323 is set to aluminium.
In order to improve the heat transference efficiency between described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323, such as, silica gel is provided with between described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323.
It should be understood that, due to described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323 adopt different materials to make, therefore described first cooling layer 321, second cooling layer 322 and the 3rd cooling layer 323 have different thermal conductivitys, in order to make described first cooling layer 321, the heat trnasfer of the second cooling layer 322 and the 3rd cooling layer 323 is more even, efficiently, such as, described first cooling layer 321, the thickness of the second cooling layer 322 and the 3rd cooling layer 323 reduces successively, in above-mentioned embodiment, described first cooling layer 321 is heat conduction carbon fiber, the thermal conductivity of heat conduction carbon fiber is 600 ~ 900W/ (m* DEG C), described second cooling layer 322 is copper, the thermal conductivity of copper is 500 ~ 600W/ (m* DEG C), and the 3rd cooling layer 323 is aluminium, the thermal conductivity of aluminium is 200 ~ 300W/ (m* DEG C), such as, described first cooling layer 321 is connected with described thermal insulation board 200, described second cooling layer 322 is connected to the side away from described thermal insulation board 200 successively with described 3rd cooling layer 323, described 3rd cooling layer 323 is positioned at the outermost of coldplate 320, described first cooling layer 321 can absorb the heat of thermal insulation board 200 fast, and by heat conduction to described second cooling layer 322, second cooling layer 322 by heat conduction to the 3rd cooling layer 323, heat distributes by the 3rd cooling layer 323, due to described first cooling layer 321, the thermal conductivity of described second cooling layer 322 and described 3rd cooling layer 323 reduces gradually, therefore, improve to make heat transference efficiency, need the thickness reducing described second cooling layer 322 and described 3rd cooling layer 323, the external world can be delivered to by described second cooling layer 322 and described 3rd cooling layer 323 rapidly to make heat trnasfer, preferably, described first cooling layer 321, the Thickness Ratio of the second cooling layer 322 and the 3rd cooling layer 323 is 7:6:3, like this, both improve the endothermic effect of coldplate 320, make again the heat of coldplate 320 can be distributed to the external world rapidly.
In order to improve the heat absorption capacity of described coldplate 320 further, such as, refer to Fig. 9, described second cooling layer 322 is provided with multiple cooling hollow bubble 324, such as, described cooling hollow bubble 324 is evenly distributed on described second cooling layer 322, such as, ethanol is provided with in described cooling hollow bubble 324, like this, make described second cooling layer 322 endothermic effect evenly, and there is stronger heat absorption capacity, such as, described cooling hollow bubble 324 has circular configuration or circular cross-section, such as, it is 0.8mm ~ 1.2mm that described cooling hollow steeps 324 diameters, preferably, it is 1mm that described cooling hollow steeps 324 diameters.In a further embodiment, described cooling hollow bubble 324 is polyhedron, and like this, Rubus Tosaefulins 324 can from the heat of the second cooling layer 322 described in each face uniform pickup.
In one embodiment, as shown in Fig. 1 and Figure 10, described heat-conducting mechanism 400 comprises fin 410, described fin 410 is connected with described thermal insulation board 200, such as, described fin 410 is semiconductor heat-dissipating sheet 410, when described semiconductor heat-dissipating sheet 410 is energized, the heat of described fin 410 transfers to hot junction by cold junction, such as, described semiconductor heat-dissipating sheet 410 comprises first end and the second end, described first end is connected with described thermal insulation board 200, described second end is connected with described first end, when described semiconductor heat-dissipating sheet 410 is energized, described first end is by the heat absorption of thermal insulation board 200, and be transferred to described second end, the temperature of described thermal insulation board 200 can be reduced rapidly, it is worth mentioning that, carrying out heat radiation by described semiconductor heat-dissipating sheet 410 to described thermal insulation board 200 is active heat removal, when thermal insulation board 200 temperature is not high, also the heat of first end can be forced to be passed to the second end by energising, make the temperature of thermal insulation board 200 lower, and without the need to just dispelling the heat when thermal insulation board 200 temperature is higher, radiating efficiency can be substantially increased like this.
In order to improve radiating efficiency further, such as, as shown in Figure 10, four described semiconductor heat-dissipating sheets 410 are set, thus improve the radiating efficiency of heat-conducting mechanism 400, such as, described thermal insulation board 200 is square, four described semiconductor heat-dissipating sheets 410 are arranged at four angles of square thermal insulation board 200, or four described semiconductor heat-dissipating sheets 410 are arranged at four limits of square thermal insulation board 200, like this, four described semiconductor heat-dissipating sheets 410 can absorb the heat of thermal insulation board 200 equably, the heat of thermal insulation board 200 is distributed more even, thus make multiple described laser module 100 to obtain effective temperature-reducing, increase the service life.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (6)
1. a laser radiator, is characterized in that, comprising:
Laser module;
Thermal insulation board, described thermal insulation board is provided with separator, and multiple described separator is disposed on described thermal insulation board, and multiple described laser module is arranged between separator respectively;
Cooling body, described cooling body is connected with described thermal insulation board;
Described cooling body comprises multiple coldplate, is provided with cooling capillary in described coldplate.
2. laser radiator according to claim 1, is characterized in that, is provided with cooling fluid in described cooling capillary.
3. laser radiator according to claim 2, is characterized in that, described cooling fluid is water.
4. laser radiator according to claim 1, is characterized in that, described cooling capillary diameter is set to 2mm ~ 6mm.
5. laser radiator according to claim 4, is characterized in that, described cooling capillary diameter is set to 3mm ~ 5mm.
6. laser radiator according to claim 5, is characterized in that, described cooling capillary diameter is set to 4mm.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106003499A (en) * | 2016-06-20 | 2016-10-12 | 安庆市鑫顺塑业有限公司 | Plastic film blowing cooling device |
| CN106091732A (en) * | 2016-06-20 | 2016-11-09 | 安庆市鑫顺塑业有限公司 | A kind of film chiller |
| CN108604770A (en) * | 2016-01-26 | 2018-09-28 | 富士胶片株式会社 | Laser device |
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| CN108604770A (en) * | 2016-01-26 | 2018-09-28 | 富士胶片株式会社 | Laser device |
| CN108604770B (en) * | 2016-01-26 | 2020-07-24 | 富士胶片株式会社 | Laser device |
| CN106003499A (en) * | 2016-06-20 | 2016-10-12 | 安庆市鑫顺塑业有限公司 | Plastic film blowing cooling device |
| CN106091732A (en) * | 2016-06-20 | 2016-11-09 | 安庆市鑫顺塑业有限公司 | A kind of film chiller |
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