CN105206903A - Folding type half-mode substrate integrated waveguide broadband band-pass filter - Google Patents
Folding type half-mode substrate integrated waveguide broadband band-pass filter Download PDFInfo
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- CN105206903A CN105206903A CN201510560244.XA CN201510560244A CN105206903A CN 105206903 A CN105206903 A CN 105206903A CN 201510560244 A CN201510560244 A CN 201510560244A CN 105206903 A CN105206903 A CN 105206903A
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Abstract
The invention provides a folding type half-mode substrate integrated waveguide broadband band-pass filter, relates to a filter, particularly relates to the folding type half-mode substrate integrated waveguide broadband band-pass filter, and aims at solving problems that common substrate integrated waveguide band-pass filters are high in working frequency and narrow in bandwidth. The folding type half-mode substrate integrated waveguide broadband band-pass filter comprises a dielectric substrate, an upper metal layer, a lower metal layer, a front surface first microstrip line, a front surface second microstrip line, a back surface first microstrip line, two front surface first metal embedding blocks, two front surface second metal embedding blocks, two front surface third metal embedding blocks, two back surface first metal embedding blocks, two back surface second metal embedding blocks and two back surface third metal embedding blocks. The upper metal layer and the lower metal layer are respectively printed on the front surface and the back surface of the dielectric substrate. The dielectric substrate is composed of a rectangular plate and a semicircular plate. The right end of the rectangular plate and the vertical side of the semicircular plate are connected as a whole. The front surface first microstrip line is rectangular. The folding type half-mode substrate integrated waveguide broadband band-pass filter is used for the field of wireless communication.
Description
Technical field
The present invention relates to a kind of filter, be specifically related to a kind of folded form half module substrate integrated wave guide broadband band-pass filter, belong to wireless communication field.
Background technology
Medium integrated waveguide is that a kind of realization on dielectric substrate is similar to the guided wave structure formed of metal rectangular waveguide characteristic, because this structure has Low emissivity, filter with low insertion loss, miniaturization, is easy to the advantage such as integrated, become the focus of research, be also widely used in the design of filter.By means of printed circuit technology, the low cost batch production based on the filter of medium integrated waveguide is called possibility.But the operating frequency of common substrate integration wave-guide band pass filter is very high, and bandwidth is narrower, which has limited its range of application.
Summary of the invention
The present invention is that to solve the operating frequency of common substrate integration wave-guide band pass filter high, the problem of narrow bandwidth, and then proposes folded form half module substrate integrated wave guide broadband band-pass filter.
The present invention be solve the problem adopt technical scheme be: the present invention includes medium substrate, upper metal level, lower metal layer, front first microstrip line, front second microstrip line, the back side first microstrip line, two front first metal insert, two front second metal insert, two front the 3rd metal insert, two back side first metal insert, two back side second metal insert and two back side the 3rd metal insert, upper metal level and lower metal layer are printed on the front and back of medium substrate respectively, medium substrate is made up of rectangular slab and semicircular plate, the right-hand member of rectangular slab and the vertical edge of semicircular plate link into an integrated entity, front first microstrip line is rectangle, front first microstrip line is printed on the middle part of metal level outer surface right-hand member, and the minor face of front first microstrip line right-hand member overlaps with the minor face of upper metal level right-hand member, front second microstrip line is printed on the left end of metal level outer surface, the back side first microstrip line is rectangle, the back side first microstrip line is printed on the middle part of lower metal layer outer surface right-hand member, upper metal level outer surface is laid with multiple first metallization via hole along two long limits of front first microstrip line and left end minor face, front first microstrip line on upper metal level outer surface and be provided with two between the microstrip line of front second and ranked second metallization via hole, each first metallization via hole and each second metallization via hole are all from top to bottom successively through upper metal level, medium substrate, lower metal layer, the both sides of the edge in medium substrate front setting-in front first metal insert successively from left to right, front second metal insert, front the 3rd metal insert, the both sides of the edge at the medium substrate back side setting-in back side first metal insert successively from left to right, the back side second metal insert, the back side the 3rd metal insert.
The invention has the beneficial effects as follows: simulation result shows, designed filter working band covers 1.81 ~ 3.11GHz, and relative bandwidth reaches 52.85%.This filter is printed form structure, have section low, lightweight, be easy to integrated, the feature of broader bandwidth, can extensive use in a communications system.
Accompanying drawing explanation
Fig. 1 is Facad structure schematic diagram of the present invention, and Fig. 2 is structure schematic diagram of the present invention, and Fig. 3 is side sectional view of the present invention, and Fig. 4 is S parameter simulation result curve chart of the present invention.
Embodiment
Embodiment one: composition graphs 1 to Fig. 3 says each present embodiment, described in present embodiment, folded form half module substrate integrated wave guide broadband band-pass filter comprises medium substrate 1, upper metal level 2, lower metal layer 3, front first microstrip line 4, front second microstrip line 5, the back side first microstrip line 6, two front first metal insert 7, two front second metal insert 8, two front the 3rd metal insert 9, two back side first metal insert 10, two back side second metal insert 11 and two back side the 3rd metal insert 12, upper metal level 2 and lower metal layer 3 are printed on the front and back of medium substrate 1 respectively, medium substrate 1 is made up of rectangular slab 1-1 and semicircular plate 1-2, the right-hand member of rectangular slab 1-1 and the vertical edge of semicircular plate 1-2 link into an integrated entity, front first microstrip line 4 is rectangle, front first microstrip line 4 is printed on the middle part of metal level 2 outer surface right-hand member, and the minor face of front first microstrip line 4 right-hand member overlaps with the minor face of upper metal level 2 right-hand member, front second microstrip line 5 is printed on the left end of metal level 2 outer surface, the back side first microstrip line 6 is rectangle, the back side first microstrip line 6 is printed on the middle part of lower metal layer 3 outer surface right-hand member, upper metal level 2 outer surface is laid with multiple first metallization via hole 13 along two long limits of front first microstrip line 4 and left end minor face, front first microstrip line 4 on upper metal level 2 outer surface and be provided with two between front second microstrip line 5 and ranked second the via hole 14 that metallizes, each first metallization via hole 13 and each second metallization via hole 14 are all from top to bottom successively through upper metal level 2, medium substrate 1, lower metal layer 3, the both sides of the edge in medium substrate 1 front setting-in front first metal insert 7 successively from left to right, front second metal insert 8, front the 3rd metal insert 9, the both sides of the edge at medium substrate 1 back side setting-in back side first metal insert 10 successively from left to right, the back side second metal insert 11, the back side the 3rd metal insert 14.
Embodiment two: composition graphs 1 to Fig. 3 illustrates present embodiment; described in present embodiment, the thickness of the medium substrate 1 of folded form half module substrate integrated wave guide broadband band-pass filter is 4.8mm; relative dielectric constant is 4.2 ~ 4.5; the thickness of upper metal level 2 and lower metal layer 3 is 0.02 ~ 0.04mm; the length of rectangular slab 1-1 is 92.5mm; the width of rectangular slab 1-1 is 46mm, and the diameter of semicircular plate 1-2 is 46mm.
The technique effect of present embodiment is: so arrange, and filter can be made under the condition meeting required electric parameter index to have less size.Other composition and annexation identical with embodiment one.
Embodiment three: composition graphs 1 to Fig. 3 illustrates present embodiment, the length of front first microstrip line 4 of folded form half module substrate integrated wave guide broadband band-pass filter described in present embodiment is 59mm, the width of front first microstrip line 4 is 10mm, front second microstrip line 5 is made up of trapezoidal and rectangle, the long W1 of described rectangle is 21.7mm, the wide L1 of described rectangle is 10mm, the long W2 of described trapezoidal upper base is 16mm, described trapezoidal length of going to the bottom is for 21.7mm, described trapezoidal high L2 is 5mm, the length of the back side first microstrip line 6 is 59mm, the width of the back side first microstrip line 6 is 10mm.
The technique effect of present embodiment is: so arrange, and filter can be made to obtain good impedance matching property, make it | S
11| parameter value reduces.Other composition and annexation identical with embodiment one.
Embodiment four: composition graphs 1 to Fig. 3 illustrates present embodiment; first metallization via hole 13 of folded form half module substrate integrated wave guide broadband band-pass filter described in present embodiment and the radius of the second metallization via hole 14 are 0.3mm; centre-to-centre spacing between adjacent two first metallization via holes 13 is 1mm, and the centre-to-centre spacing between adjacent two second metallization via holes 14 is 1mm.
The technique effect of present embodiment is: so arrange, and can reduce the leakage of the electromagnetic energy transmitted in filter, obtains higher | S
21| parameter.Other composition and annexation identical with embodiment one.
Embodiment five: composition graphs 1 to Fig. 3 illustrates present embodiment, the length of the first metal insert 10 of folded form half module substrate integrated wave guide broadband band-pass filter described in present embodiment is 8mm, the wide of first metal insert 10 is 2mm, the thickness of the first metal insert 10 is 1.8mm, the length of the second metal insert 11 is 10mm, the wide of second metal insert 11 is 2mm, the thickness of the second metal insert 11 is 1.8mm, the length of the 3rd metal insert 12 is 10mm, the wide of 3rd metal insert 12 is 2mm, the thickness of the 3rd metal insert 12 is 1.8mm, distance J1 between first metal insert 10 and the second adjoining metal insert 11 is 21mm, distance J2 between second metal insert 11 and the 3rd adjoining metal insert 12 is 22mm, distance J3 between 3rd metal insert 12 and medium substrate 1 right-hand member edge is 11mm.
The technique effect of present embodiment is: so arrange, and can obtain inductance and the capacitance of best filter equivalent electric circuit.Other composition and annexation identical with embodiment one.
Operation principle
The broadband bandpass characteristics of folded form half module substrate integrated wave guide broadband band-pass filter mainly by loading rectangular metal block to realize on half module substrate integrated wave guide, and it is similar that half module substrate integrated wave guide and traditional sucrose fill rectangular waveguide, has high pass characteristic; And load rectangular metal block there is low-pass characteristic, therefore, both combinations will produce bandpass characteristics.
Claims (5)
1. folded form half module substrate integrated wave guide broadband band-pass filter, it is characterized in that: described folded form half module substrate integrated wave guide broadband band-pass filter comprises medium substrate (1), upper metal level (2), lower metal layer (3), front first microstrip line (4), front second microstrip line (5), the back side first microstrip line (6), two fronts first metal insert (7), two fronts second metal insert (8), two fronts the 3rd metal insert (9), two back sides first metal insert (10), two back sides second metal insert (11) and two back sides the 3rd metal insert (12), upper metal level (2) and lower metal layer (3) are printed on the front and back of medium substrate (1) respectively, medium substrate (1) is made up of rectangular slab (1-1) and semicircular plate (1-2), the right-hand member of rectangular slab (1-1) and the vertical edge of semicircular plate (1-2) link into an integrated entity, front first microstrip line (4) is rectangle, front first microstrip line (4) is printed on the middle part of metal level (2) outer surface right-hand member, and the minor face of front first microstrip line (4) right-hand member overlaps with the minor face of upper metal level (2) right-hand member, front second microstrip line (5) is printed on the left end of metal level (2) outer surface, the back side first microstrip line (6) is rectangle, the back side first microstrip line (6) is printed on the middle part of lower metal layer (3) outer surface right-hand member, upper metal level (2) outer surface is laid with multiple first metallization via hole (13) along two long limits in front first microstrip line (4) and left end minor face, front first microstrip line (4) on upper metal level (2) outer surface and be provided with two between front second microstrip line (5) and ranked second the via hole (14) that metallizes, each first metallization via hole (13) and each second metallization via hole (14) are all from top to bottom successively through upper metal level (2), medium substrate (1), lower metal layer (3), the both sides of the edge in medium substrate (1) front setting-in front first metal insert (7) successively from left to right, front second metal insert (8), front the 3rd metal insert (9), the both sides of the edge at medium substrate (1) back side setting-in back side first metal insert (10) successively from left to right, the back side second metal insert (11), the back side the 3rd metal insert (14).
2. folded form half module substrate integrated wave guide broadband band-pass filter according to claim 1; it is characterized in that: the thickness of medium substrate (1) is 4.8mm; relative dielectric constant is that the thickness of metal level (2) and lower metal layer (3) on 4.2 ~ 4.5 is 0.02 ~ 0.04mm; the length of rectangular slab (1-1) is 92.5mm; the width of rectangular slab (1-1) is 46mm, and the diameter of semicircular plate (1-2) is 46mm.
3. folded form half module substrate integrated wave guide broadband band-pass filter according to claim 1, it is characterized in that: the length in front first microstrip line (4) is 59mm, the width in front first microstrip line (4) is 10mm, front second microstrip line (5) is made up of trapezoidal and rectangle, the length (W1) of described rectangle is 21.7mm, wide (L1) of described rectangle is 10mm, described trapezoidal upper base long (W2) is 16mm, described trapezoidal length of going to the bottom is for 21.7mm, described trapezoidal height (L2) is 5mm, the length at the back side first microstrip line (6) is 59mm, the width at the back side first microstrip line (6) is 10mm.
4. folded form half module substrate integrated wave guide broadband band-pass filter according to claim 1; it is characterized in that: the radius of the first metallization via hole (13) and the second metallization via hole (14) is 0.3mm; centre-to-centre spacing between adjacent two first metallization via hole (13) is 1mm, and the centre-to-centre spacing between adjacent two second metallization via hole (14) is 1mm.
5. folded form half module substrate integrated wave guide broadband band-pass filter according to claim 1, it is characterized in that: the length of the first metal insert (10) is 8mm, the wide of first metal insert (10) is 2mm, the thickness of the first metal insert (10) is 1.8mm, the length of the second metal insert (11) is 10mm, the wide of second metal insert (11) is 2mm, the thickness of the second metal insert (11) is 1.8mm, the length of the 3rd metal insert (12) is 10mm, the wide of 3rd metal insert (12) is 2mm, the thickness of the 3rd metal insert (12) is 1.8mm, distance (J1) between first metal insert (10) and adjoining the second metal insert (11) is 21mm, distance (J2) between second metal insert (11) and the 3rd adjoining metal insert (12) is 22mm, distance (J3) between 3rd metal insert (12) and medium substrate (1) right-hand member edge is 11mm.
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| CN201510560244.XA CN105206903B (en) | 2015-09-06 | 2015-09-06 | Folded form half module substrate integrated wave guide broadband band-pass filter |
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| CN201510560244.XA CN105206903B (en) | 2015-09-06 | 2015-09-06 | Folded form half module substrate integrated wave guide broadband band-pass filter |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2888662Y (en) * | 2006-01-26 | 2007-04-11 | 东南大学 | High-performance waveguide filter with integrated microwave/millimeter wave substrate |
| CN201156573Y (en) * | 2008-01-25 | 2008-11-26 | 南京理工大学 | Integrated wave-guide band filter based on foldable substrate |
| US20090066597A1 (en) * | 2007-09-07 | 2009-03-12 | Songnan Yang | Substrate Integrated Waveguide Antenna Array |
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2015
- 2015-09-06 CN CN201510560244.XA patent/CN105206903B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2888662Y (en) * | 2006-01-26 | 2007-04-11 | 东南大学 | High-performance waveguide filter with integrated microwave/millimeter wave substrate |
| US20090066597A1 (en) * | 2007-09-07 | 2009-03-12 | Songnan Yang | Substrate Integrated Waveguide Antenna Array |
| CN201156573Y (en) * | 2008-01-25 | 2008-11-26 | 南京理工大学 | Integrated wave-guide band filter based on foldable substrate |
Non-Patent Citations (3)
| Title |
|---|
| K. W. ECCLESTON: "Folded Substrate-Integrated Waveguide Out-of-Phase Power Divider", 《IEEE》 * |
| 王立娜: "基于基片集成波导技术的宽带带通滤波器的设计", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
| 陶翀: "半模基片集成波导带通滤波器的设计", 《电子元器件应用》 * |
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