CN105190868A - Hollow sealing sheet and method for producing hollow package - Google Patents

Hollow sealing sheet and method for producing hollow package Download PDF

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Publication number
CN105190868A
CN105190868A CN201480023192.6A CN201480023192A CN105190868A CN 105190868 A CN105190868 A CN 105190868A CN 201480023192 A CN201480023192 A CN 201480023192A CN 105190868 A CN105190868 A CN 105190868A
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China
Prior art keywords
hollow
sealing sheet
resin
hollow sealing
composition
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CN201480023192.6A
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Chinese (zh)
Inventor
石井淳
丰田英志
千岁裕之
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN105190868A publication Critical patent/CN105190868A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Provided are: a hollow sealing sheet that can produce a highly reliable hollow package; and a method for producing a hollow package. The hollow sealing sheet is for hollow-sealing an electronic component, contains resin, and has controlled resin ingress properties into the hollow section at 40-100 DEG C inclusive. The resin fills a molding die having a slit having a width of 20 [mu]m, and the amount of resin ingress into the slit when the resin is compressed for 10 minutes at a temperature of 150 DEG C and a pressure of 10 kg/cm2 is preferably no greater than 3 mm.

Description

The manufacture method of hollow sealing sheet and hollow package body
Technical field
The present invention relates to the manufacture method of hollow sealing sheet and hollow package body.
Background technology
In the making of the packaging body of the electronic units such as semiconductor, adopt following steps typically: sealed by one or more electronic component-use sealing resins being fixed on substrate, temporary fixed material etc., and sealer is cut into the packaging body of electronic unit unit as required.As this sealing resin, the flap seal resin that operability is good can be used.In addition, as increase quantity of filler present to improve the method for hollow sealing piece performance, propose by the mixing technology (patent documentation 1) filler is coupled in sheet for sealing.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2013-7028 publication
Summary of the invention
The problem that invention will solve
In recent years, SAW (SurfaceAcousticWave) filter, CMOS (ComplementaryMetalOxideSemiconductor) transducer, acceleration transducer etc. are called as the exploitation of the small electronic parts of MEMS and semiconductor package body one and coexist and develop.These electronic units have the hollow structure for guaranteeing surface elasticity wave propagation, the maintenance of optical system, the mobility of movable link etc. separately usually.When sealing, must maintain hollow structure with the connection reliability guaranteeing the Reliability of Microprocessor of movable link, element while seal.Also require that diaphragm seal adapts to have the needs of the hollow sealing body of this hollow structure.
The object of the present invention is to provide and a kind ofly can make the hollow sealing sheet of the hollow package body of high reliability and the manufacture method of hollow package body.
For the method for dealing with problems
Present inventor has performed further investigation, found that by adopting following formation can solve above-mentioned problem, thus complete the present invention.
That is, the present invention is a kind of hollow sealing sheet for carrying out hollow sealing to electronic unit,
Described hollow sealing sheet contains resin,
And more than 40 DEG C and the resin entering to hollow bulb of less than 100 DEG C are controlled.
About this hollow sealing sheet, due to more than 40 DEG C and the resin entering to hollow bulb of less than 100 DEG C controlled, therefore when hollow sealing, the resin to hollow bulb enters and is inhibited, and can make the hollow sealing body of high reliability.
About this hollow sealing sheet, have wide 20 μm slit shaping dies in fill described resin, at pressure 10kg/cm 2, temperature 150 DEG C condition under to described resin pressurize 10 minutes time, the resin inlet to described slit is preferably below 3mm.Thus, the resin entering that the heating to regulation slit adds pressure is inhibited, and therefore can make the hollow package body with higher reliability.It should be noted that, the mensuration of resin inlet is based on the record of embodiment.
About at this hollow sealing sheet, for slit width by relative to wide more than 1 μm and the drawing of the resin inlet of the slit of less than 100 μm time, preferably there is minimum in this drawing.Although this minimizing mechanism is still uncertain for existing, estimate as follows.Such as, if when hollow sealing sheet contains the particulate of the expansion such as inorganic filler, elastomer particle imparting property, then play dilatancy effect in slit neighboring area, resin is inhibited to entering of slit.If slit width is greatly more abundant than diameter of particle, then the effect of dilatancy and so on is more weak, and resin and particulate together easily enter slit, and it is large that resin enters quantitative change.Along with slit width reduces, dilatancy effect grow, resin inlet also reduces, and reaches minimum in certain some place's resin inlet.And if slit width is below certain certain value, such particulate is inhibited to entering of slit, and only resinous principle enters into slit.When being only resin, because dilatancy effect dies down, therefore to enter quantitative change large for resin.When the power of load on hollow diaphragm seal is constant, slit width is less, then resin is pressed against slit, and result resin inlet becomes larger.Said, can think to there is minimum in resin inlet is relative to the drawing of slit width.In addition, utilize this phenomenon, the composition that can design hollow sealing sheet coordinates to make the dilatancy effect for the clearance gap of hollow bulb maximize, and more effectively can limit resin entering thus making the hollow package body of high reliability to hollow bulb.
In sealing sheet, described minimum is preferably below 2mm.Thus, resin entering can be suppressed more to heavens, the reliability of hollow package body can be improved further.
The present invention is a kind of manufacture method of hollow package body, and it comprises:
Lamination process, maintains hollow bulb, while be layered on this electronic unit by this hollow sealing sheet in the mode covering one or more electronic unit; And
Seal formation process, makes described hollow sealing sheet solidify, and forms seal.
In manufacture method of the present invention, due to this hollow sealing sheet that the resin entering employed to hollow bulb is inhibited, therefore can manufacture and guarantee hollow bulb well and the hollow package body on the whole with high reliability.
Accompanying drawing explanation
Fig. 1 is the profile of the hollow sealing sheet schematically showing an embodiment of the invention.
Fig. 2 A is the profile of an operation of the manufacture method of the hollow package body schematically showing an embodiment of the invention.
Fig. 2 B is the profile of an operation of the manufacture method of the hollow package body schematically showing an embodiment of the invention.
Fig. 2 C is the profile of an operation of the manufacture method of the hollow package body schematically showing an embodiment of the invention.
Fig. 3 is that the SEM of the cut surface of the hollow sealing sheet of embodiments of the invention observes image.
Fig. 4 A is the constructed profile of the shaping dies of resin inlet for measuring from the slit to shaping dies.
Fig. 4 B is the plane graph of the bed die of shaping dies.
Fig. 4 C is the mensuration constructed profile sequentially of the resin inlet for measuring the slit to shaping dies.
Embodiment
" the 1st execution mode "
[hollow sealing sheet]
Be described with reference to the hollow sealing sheet of Fig. 1 to present embodiment.Fig. 1 is the profile of the hollow sealing sheet schematically showing an embodiment of the invention.Hollow sealing sheet 11 provides with the representative state be laminated on the supporting mass 11a such as PETG (PET) film.It should be noted that, in order to easily carry out the stripping of hollow sealing sheet 11, demoulding process can be implemented to supporting mass 11a.
About hollow sealing sheet more than 11,40 DEG C and the resin entering to hollow bulb 14 (with reference to Fig. 2 A) of less than 100 DEG C controlled.Therefore, in the hollow package body 18 (with reference to Fig. 2 C) that in use empty diaphragm seal 11 obtains, hollow bulb 14 can be guaranteed, Reliability of Microprocessor and the connection reliability of electronic unit can be obtained with high level.
Have wide 20 μm slit shaping dies in fill resin for the formation of hollow sealing sheet 11, at pressure 10kg/cm 2, temperature 150 DEG C condition under to described resin pressurize 10 minutes time, the resin inlet to described slit is preferably below 3mm, is more preferably below 2mm.Be above-mentioned scope by the resin entering making heating add pressure, the hollow package body with higher reliability can be made.
About hollow sealing sheet 11, for slit width by relative to wide more than 1 μm and the resin inlet of the slit of less than 100 μm drawing time, preferably there is minimum in this drawing.Thereby, it is possible to carry out, for making the composition to the minimized hollow sealing sheet of resin inlet of hollow bulb design, the hollow package body of higher reliability can being manufactured.
In sealing sheet, described minimum is preferably below 2mm, is more preferably below 1mm.Thus, resin entering can be suppressed more to heavens, the reliability of hollow package body can be improved further.
By hollow sealing sheet at 150 DEG C hot curing after 1 hour, coefficient of linear expansion at 20 DEG C is preferably below 15ppm/K, is more preferably below 10ppm/K.Thus, the warpage of hollow package body can be suppressed well.The assay method of coefficient of linear expansion is as described below.Hollow sealing sheet before the solidification of wide 4.9mm, long 25mm, thick 0.2mm is solidified 1 hour at 150 DEG C.Resin sheet after solidification is arranged on TMA8310 (Rigaku Inc.), measures coefficient of linear expansion with the condition of tensile load 4.9mN, programming rate 10 DEG C/min.
As long as the resin combination forming hollow sealing sheet suitably can be given above-mentioned characteristic, can be used in the resin seal of the electronic units such as semiconductor chip, be just not particularly limited.Wherein, the limiting material preferably containing the resin flows that can limit near hollow bulb.As this limiting material, the particulate of the expansion such as high-viscosity material, the inorganic filler imparting property such as elastomer, high-viscosity epoxy resin, high viscosity phenolic resins suitably can be used.
As the viscosity of high-viscosity material, as long as consider the limited degree, workability etc. of resin flows and suitably set, preferably at 80 DEG C, be more than 2000Pas and below 30000Pas, be more preferably more than 5000Pas and below 25000Pas.It should be noted that, viscosity can use the determination of viscoelasticity device ARES of TAINSTRUMENT Inc., and is measured by parallel plate method.More specifically, can by 100 μm, swivel plate diameter 20mm, rotary speed 10s in gap -1condition under, in the scope of 50 DEG C to 200 DEG C, measure viscosity, read the viscosity at 80 DEG C of now gained and obtain.
As concrete composition, can to enumerate containing following A composition to the composition epoxy resin of E composition as preferred component.
A composition: epoxy resin
B component: phenolic resins
C composition: elastomer
D composition: inorganic filler
E composition: curing accelerator
(A composition)
About the epoxy resin (A composition) as heat-curing resin, it is not particularly limited.Such as, the various epoxy resin such as triphenylmethane type epoxy resin, cresol novalac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene-type epoxy resin, phenol novolac type epoxy resin, phenoxy resin can be used.These epoxy resin can be used alone, and also two or more kinds may be used.
From guaranteeing that reactive viewpoint of the toughness after epoxy resin cure and epoxy resin is considered; preferred epoxide equivalent is 150 ~ 250, softening point or fusing point are be solid-state epoxy resin under the normal temperature of 50 ~ 130 DEG C; wherein; from the viewpoint of reliability, preferred triphenylmethane type epoxy resin, cresol novalac type epoxy resin, biphenyl type epoxy resin.
In addition, from the viewpoint of low stress, preferably there is the modified bisphenol A type epoxy resin of the flexibility such as acetal radical, polyoxyalkylenes skeleton, because the modified bisphenol A type epoxy resin with acetal radical is liquid and operability is good, therefore can use especially aptly.
If increase the weight average molecular weight of epoxy resin, viscosity also uprises, and namely epoxy resin itself can be used as above-mentioned limiting material and play a role.As weight average molecular weight, as long as the degree that can play a role as above-mentioned limiting material, be just not particularly limited, be preferably more than 150, be more preferably more than 300.
The content of epoxy resin (A composition) be preferably set to relative to composition epoxy resin be totally 1 ~ 10 % by weight scope.
(B component)
Phenolic resins (B component) as long as can be used as heat-curing resin and and there is the phenolic resins of curing reaction between epoxy resin (A composition), be just not particularly limited.Such as, phenol linear phenolic resin, phenol aralkyl resin, biphenyl aralkyl resin, dicyclopentadiene type phenol resin, cresol novalac resin, resol etc. can be used.These phenolic resins can be used alone, and also two or more kinds may be used.
As phenolic resins, consider from the reactive viewpoint with epoxy resin (A composition), preferably use the phenolic resins that hydroxyl equivalent is 70 ~ 250, softening point is 50 ~ 110 DEG C, wherein, high from the viewpoint of solidification reactivity, can be suitable for using phenol linear phenolic resin.In addition, from the viewpoint of reliability, the agent of low hygroscopicity phenolic resins that phenol aralkyl resin, biphenyl aralkyl resin are so suitably can also be used.
From the viewpoint of solidification reactivity, the mode that epoxy resin (A composition) preferably adds up to 0.7 ~ 1.5 equivalent according to the hydroxyl relative to epoxy radicals 1 equivalent in epoxy resin (A composition) in phenolic resins (B component) with the mixing ratio of phenolic resins (B component) coordinates, and is more preferably 0.9 ~ 1.2 equivalent.
If increase the weight average molecular weight of phenolic resins, then viscosity also uprises, and phenolic resins itself can be used as above-mentioned limiting material and plays a role.As weight average molecular weight, as long as the degree that can play a role as above-mentioned limiting material, be just not particularly limited, be preferably more than 150, be more preferably more than 300.
It should be noted that, in this manual, the assay method of weight average molecular weight can use following methods to measure.Sample is dissolved in THF with 0.1wt%, uses GPC (gel permeation chromatography) and measure weight average molecular weight by polystyrene conversion.Detailed condition determination is as described below.
The condition determination > of < weight average molecular weight
GPC device: eastern Cao's system, HLC-8120GPC
Post: eastern Cao's system, (GMHHR-H)+(GMHHR-H)+(G2000HHR)
Flow: 0.8mL/min
Concentration: 0.1wt%
Injection rate: 100 μ L
Column temperature: 40 DEG C
Eluent: THF
(C composition)
As the elastomer (C composition) that can use together with epoxy resin (A composition) and phenolic resins (B component), such as, various acrylic acid series copolymer, rubber constituent etc. can be used.From the viewpoint of thermal endurance, flexibility, the intensity of the dispersiveness that can improve in epoxy resin (A composition), gained hollow sealing sheet, preferably containing rubber constituent.As this rubber constituent, be preferably selected from least one in butadiene-based rubber, vinyl benzene rubber, acrylic rubber, silicone-based rubber.They can be used alone, and also two or more kinds may be used.By containing the elastomer as high-viscosity material, can suitably limit resin entering to hollow bulb.
In hollow sealing sheet 11, domain (the De メ イ Application) dispersion of preferred elastomer, and the maximum gauge of domain is less than 20 μm.Thus, elastomer can play function as the particulate of the resin flows effect (dilatancy effect) had near restriction hollow bulb, can more effectively suppress resin entering to hollow space.Elastomer can in set or aggegation partly, but from the viewpoint of the effect of dilatancy and so on, preferably dispersed on the whole.As long as be just not particularly limited although the upper limit of the maximum gauge of domain is less than 20 μm, be preferably less than 15 μm, be more preferably less than 10 μm.In addition, from the viewpoint of boundary physically and the imparting flexibility of miniaturization, the lower limit of the maximum gauge of domain is preferably more than 0.1 μm, is more preferably more than 0.3 μm.
The content of elastomer (C composition) be preferably composition epoxy resin overall 1.0 ~ 3.5 % by weight, be more preferably 1.5 ~ 3.0 % by weight.When the content of elastomer (C composition) is less than 1.0 % by weight, be difficult to the flexibility and the flexibility that obtain hollow sealing sheet 11, and then suppress the resin seal of hollow sealing sheet warpage also to become difficulty.On the contrary, if above-mentioned content is more than 3.5 % by weight, then the melt viscosity of hollow sealing sheet 11 uprises, and the imbedibility of electronic unit reduces, and can observe the intensity of the firming body of hollow sealing sheet 11 and the tendency of thermal endurance reduction.
In addition, elastomer (C composition) is preferably set to the scope of 0.5 ~ 1.5 relative to the weight rate (weight of the weight/A composition of C composition) of epoxy resin (A composition).Its reason is, when above-mentioned weight rate is less than 0.5, is difficult to the mobility controlling hollow sealing sheet 11, on the other hand, if more than 1.5, then and the tendency that the cementability can observing hollow sealing sheet 11 pairs of electronic units is deteriorated.
Above-mentioned elastomeric tensile modulus of elasticity Ee at 60 DEG C is preferably 5 × 10 relative to the ratio Ee/Et of the tensile modulus of elasticity Et of above-mentioned heat-curing resin -5above and 1 × 10 -2below, 1 × 10 is more preferably -4above and 5 × 10 -3below.Thus, during mixing in the manufacture process of hollow sealing sheet, from the shear stress useful effect of mixing component and heat-curing resin in elastomer, elastomeric microminiaturization can be promoted.It should be noted that, the assay method of above-mentioned tensile modulus of elasticity Ee and Et can carry out according to following steps.With cutting knife each of elastomer and heat-curing resin is cut out thick 200 μm, long 400mm, wide 10mm short strip shape, as working sample.Use solid determination of viscoelasticity device (RSAIII, RheometricScientific Inc.), under the condition of frequency 1Hz, programming rate 10 DEG C/min, measure the tensile modulus of elasticity of this working sample at-50 ~ 300 DEG C and loss elastic modulus.The value of the tensile modulus of elasticity at 60 DEG C when reading this mensuration, obtains target tensile modulus of elasticity Ee and Et.
(D composition)
Inanimate matter filler (D composition) is not particularly limited, known various filler can be used, such as, the powder of quartz glass, talcum, silicon dioxide (fused silica, crystallinity silicon dioxide etc.), aluminium oxide, aluminium nitride, silicon nitride, boron nitride can be enumerated.They can be used alone, and also two or more kinds may be used.By containing inorganic filler, can more effectively give the effect of the dilatancy near hollow bulb to hollow diaphragm seal.
Wherein, internal stress is reduced from the hotline expansion coefficient of the firming body by reducing composition epoxy resin, result can suppress the viewpoint of the warpage of the hollow sealing sheet 11 after electronic part encapsulation to be considered, preferred use SiO 2 powder, in SiO 2 powder, more preferably use fused silica powder.As fused silica powder, spheroidal fused SiO 2 powder, broken fused silica powder can be enumerated, and from the viewpoint of mobility, particularly preferably use spheroidal fused SiO 2 powder.Wherein, preferably use average grain diameter is the material of less than 54 μm scopes, more preferably uses the material of 0.1 ~ 30 μm of scope, particularly preferably uses the material of 0.5 ~ 20 μm of scope.
It should be noted that, for average grain diameter, can by using the sample of arbitrary extracting from female group, and using laser diffraction and scattering formula particle size distribution device to carry out measuring and deriving.
The content of inanimate matter filler (D composition) is preferably 70 ~ 90 overall volume % of composition epoxy resin (when silicon dioxide granule, because proportion is 2.2g/cm 3therefore be 81 ~ 94 % by weight), be more preferably 74 ~ 85 volume % (being 84 ~ 91 % by weight when silicon dioxide granule), more preferably 76 ~ 83 volume % (being 85 ~ 90 % by weight when silicon dioxide granule).When the content of inanimate matter filler (D composition) is less than 70 volume, the coefficient of linear expansion due to the firming body of composition epoxy resin becomes large, and the warpage therefore can observing hollow sealing sheet 11 becomes large tendency.On the other hand, if above-mentioned content is more than 90 volume %, then due to flexibility, the mobility variation of hollow sealing sheet 11, therefore can observe the tendency reduced with the cementability of electronic unit.
(E composition)
For curing accelerator (E composition), as long as promote the promoter of epoxy resin and phenolic resin curing, just be not particularly limited, and consider from curability and conservatory viewpoint, can be suitable for using organophosphor based compound, the imidazole compound such as triphenylphosphine, tetraphenylphosphoniphenolate tetraphenylborate.These curing accelerators can be used alone, and also can use with other curing accelerators.
The content of curing accelerator (E composition) is preferably 0.1 ~ 5 weight portion relative to total 100 weight portion of epoxy resin (A composition) and phenolic resins (B component).
(other compositions)
In addition, in composition epoxy resin, except A composition is to except E composition, flame retardant constituent can also be added.As fire retardant constituent, such as, the various metal hydroxidess such as aluminium hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, stannic hydroxide, Composite metal hydroxides can be used.
As the average grain diameter of metal hydroxides, guarantee suitable mobility from the viewpoint of during heating ring epoxy resin composition, average grain diameter is preferably 1 ~ 10 μm, more preferably 2 ~ 5 μm.When the average grain diameter of metal hydroxides is less than 1 μm, be difficult to be evenly dispersed in composition epoxy resin, and have the tendency of mobility when fully cannot obtain the heating of composition epoxy resin.In addition, if average grain diameter is more than 10 μm, then because the surface area of metal hydroxides (E composition) per unit addition diminishes, the tendency that flame retardant effect reduces therefore can be observed.
In addition, as flame retardant constituent, except above-mentioned metal hydroxides, phosphazene compound can also be used.As phosphazene compound, such as, SPR-100, SA-100, SP-100 (above ， Otsuka Chemical Co., Ltd), FP-100, FP-110 (more than, Fushimi Pharmaceutical Company, Limited) etc. can obtain as commercial goods.
From the viewpoint of playing flame retardant effect on a small quantity, the phosphazene compound that preferred formula (1) or formula (2) represent, the containing ratio of the P elements contained in these phosphazene compounds is preferably more than 12 % by weight.
[changing 1]
(in formula (1), n is the integer of 3 ~ 25, R 1and R 2identical or different, be the 1 valency organic group with the functional group be selected from alkoxyl, phenoxy group, amino, hydroxyl and pi-allyl.)
[changing 2]
(in formula (2), n and m is the integer of 3 ~ 25 independently of one another.R 3and R 5identical or different, be the 1 valency organic group with the functional group be selected from alkoxyl, phenoxy group, amino, hydroxyl and pi-allyl.R 4for having the divalent organic group of the functional group be selected from alkoxyl, phenoxy group, amino, hydroxyl and pi-allyl.)
In addition, generate from the viewpoint of stability and suppression space, preferably use the cyclic phosphines nitrile oligomer that formula (3) represents.
[changing 3]
(in formula (3), n is the integer of 3 ~ 25, R 6and R 7identical or different, be hydrogen, hydroxyl, alkyl, alkoxyl or glycidyl.)
Cyclic phosphines nitrile oligomer represented by above-mentioned formula (3), such as FP-100, FP-110 (above, Fushimi Pharmaceutical Company, Limited) etc. can obtain as commercial goods.
The content of phosphazene compound preferably comprise the organic principle of epoxy resin (A composition), phenolic resins (B component), elastomer (D composition), curing accelerator (E composition) and phosphazene compound (other compositions) contained in composition epoxy resin overall 10 ~ 30 % by weight.Namely, when the content of phosphazene compound be less than organic principle overall 10 % by weight time, the anti-flammability of hollow sealing sheet 11 reduces, and relative to adherend (such as, carried the substrate etc. of electronic unit) concavo-convex tracing ability reduce, the tendency producing space can be observed.If above-mentioned content exceed organic principle overall 30 % by weight, then the surface of hollow sealing sheet 11 easily produces viscosity, can observe the tendency being difficult to carry out reduce workability such as the aligned in position of adherend.
In addition, and with above-mentioned metal hydroxides and phosphazene compound, thus can obtain ensure that the flexibility needed for sheet sealing and the hollow sealing sheet 11 of excellent in flame retardance.By will both and use, sufficient flexibility when sufficient anti-flammability when only can be used metal hydroxides and only use phosphazene compound.
In above-mentioned fire retardant, from the viewpoint of the morphotropism of hollow sealing sheet during resin seal shaping, to electronic unit or the concavo-convex tracing ability of adherend and the adaptation of electronic unit or adherend, it is desirable to use organic system fire retardant, be suitable for especially using phosphine nitrile flame retardant.
It should be noted that, in composition epoxy resin, except above-mentioned each composition, can also suitably coordinate as required with carbon black is other additives such as pigment of representative.
(manufacture method of hollow sealing sheet)
Below the manufacture method of hollow diaphragm seal is described.The manufacture method of the hollow sealing sheet of present embodiment comprises: preparation contains the compounding procedure of elastomeric mixing thing and described mixing thing is configured as sheet and obtains the forming process of hollow sealing sheet.
(compounding procedure)
First, by composition epoxy resin is prepared in above-mentioned each composition mixing.As long as mixed method disperses the method mixed with making each uniform composition, be just not particularly limited.Then, by using kneader etc. directly will be mixing and prepare mixing thing containing elastomeric each gradation composition.Now, domain shape is separated into according to the elastomer of hollow sealing sheet and the mode that the maximum gauge of this domain is less than 20 μm is carried out mixing.
Specifically, use the known methods such as mixer to be mixed by each composition of above-mentioned A ~ E composition and other additives as required, then carry out melting mixing, prepare mixing thing thus.As the method for melting mixing, be not particularly limited, such as, the method etc. that known mixing rolls such as using mixing mill, adding pressure type kneader, extruder carries out melting mixing can be enumerated.As this kneader, such as, can be suitable for using following kneader: it possesses mixing screw rod, this mixing screw rod has helical-blade is less than other parts part of helical-blade from the overhang of helical axis from the overhang of helical axis in an axial part, or this mixing screw rod does not have helical-blade in axial one.In the little part of the overhang of helical-blade or do not have the part place of helical-blade produce low-shearing force and form low stirring, the compression ratio of mixing thing increases thus, can get rid of the air brought into, can suppress the generation of pore in the mixing thing of gained.
As compounding conditions, as long as temperature is more than the softening point of above-mentioned each composition, just be not particularly limited, be such as 30 ~ 150 DEG C, if consider the Thermocurable of epoxy resin, be then preferably 40 ~ 140 DEG C, more preferably 60 ~ 120 DEG C, time is such as 1 ~ 30 minute, is preferably 5 ~ 15 minutes.Thus, mixing thing can be prepared.
When mixing use kneader, mixing revolution r (rpm) is preferably more than 60 relative to the ratio r/t of mixing treating capacity t (kg/hr), is more preferably more than 70.If this is more than 60 than r/t, then can applies sufficient shear stress to containing elastomeric compounding raw materials, thus promote elastomeric microminiaturization efficiently.As above-mentioned mixing revolution r (rpm), be preferably 200 ~ 1000rpm, as mixing treating capacity t (kg/hr), be preferably 3 ~ 20kg/hr.
(forming process)
By extrusion molding, the mixing thing obtained is configured as sheet, hollow sealing sheet 11 can be obtained thus.Specifically, directly can carry out extrusion molding at high operating temperatures not cooling the mixing thing after melting mixing, thus form hollow sealing sheet 11.As this extrusion method, be not particularly limited, T mould extrusion molding, roller rolling process, the mixing method of roller, coetrusion, rolling-molding method etc. can be enumerated.As extrusion temperature, as long as be more than the softening point of above-mentioned each composition, be just not particularly limited, and if consider the Thermocurable of epoxy resin and formability, be then such as 40 ~ 150 DEG C, be preferably 50 ~ 140 DEG C, more preferably 70 ~ 120 DEG C.From the above mentioned, hollow sealing sheet 11 can be formed.
The thickness of hollow sealing sheet 11 is not particularly limited, but is preferably 100 ~ 2000 μm.If in above-mentioned scope, then can encapsulated electronic components well.In addition, by making resin sheet be slim, can caloric value be reduced, become and not easily produce cure shrinkage.Result can reduce packaging body amount of warpage, can obtain the hollow package body that reliability is higher.
The said hollow sealing sheet obtained can be laminated for desired thickness as required and use.That is, hollow sealing sheet can use with single layer structure, also can use as the duplexer of the sandwich construction being laminated for more than 2 layers.
[manufacture method of hollow package body]
Then, with reference to Fig. 2 A ~ 2C, the manufacture method of the hollow package body using the present embodiment of above-mentioned hollow sealing sheet is described.Fig. 2 A ~ 2C is respectively the profile of an operation of the manufacture method of the hollow package body schematically showing an embodiment of the invention.In the present embodiment, by hollow sealing sheet, hollow sealing is carried out to the electronic unit be equipped on substrate, make hollow package body.It should be noted that, in the present embodiment, use SAW filter as electronic unit, use printed circuit board as adherend, but also can use the key element beyond these.Such as, as electronic unit, electricity container, sensor device, light-emitting component can be made, there is the movable parts such as vibrating elements and need the element of hollow bulb, as adherend, can lead frame, tape carrier etc. be used.Use arbitrary key element, all can be realized the protection of height by the resin seal of electronic unit.
(SAW chip mounted board preparatory process)
In SAW chip mounted board preparatory process, prepare the printed circuit board 12 (with reference to Fig. 2 A) being equipped with multiple SAW chip 13.SAW chip 13 can make its singualtion by utilizing the piezoelectric crystalline of known method to the comb poles being formed with regulation to carry out cutting and be formed.SAW chip 13, to the lift-launch of printed circuit board 12, can use the known devices such as flip-chip bonding machine, chip engagement machine.SAW chip 13 is electrically connected by projected electrode 13a such as projections with printed circuit board 12.In addition, between SAW chip 13 and printed circuit board 12, maintain hollow bulb 14, thus the wave propagation of SAW chip upper surface elasticity can not be hindered.Distance between SAW chip 13 and printed circuit board 12 decides according to the explanation of each key element, is generally about 15 ~ 50 μm.
(sealing process)
In sealing process, in the mode covering SAW chip 13, hollow sealing sheet 11 is laminated in printed circuit board 12, and with above-mentioned hollow sealing sheet, resin seal (with reference to Fig. 2 B) is carried out to SAW chip 13.This hollow sealing sheet 11 plays a role as the protection of SAW chip 13 and subsidiary key element thereof the sealing resin from external environment influence.
In the present embodiment, adopting above-mentioned hollow sealing sheet 11, in the covering of SAW chip 13, imbedding SAW chip 13 by being only attached at printed circuit board 12 thus, and then the production efficiency of hollow package body can be improved.In this case, the known method such as hot pressing, lamination can be utilized to be layered on printed circuit board 12 by hollow sealing sheet 11.As hot pressing condition, temperature is such as 40 ~ 100 DEG C, and be preferably 50 ~ 90 DEG C, pressure is such as 0.1 ~ 10MPa, and be preferably 0.5 ~ 8MPa, the time is such as 0.3 ~ 10 minute, is preferably 0.5 ~ 5 minute.In addition, if consider hollow sealing sheet 11 pairs of SAW chip 13 and the adaptation of printed circuit board 12 and the raising of tracing ability, then preferably (such as, 0.1 ~ 5kPa) suppresses at reduced pressure conditions.
In hollow sealing sheet 11, due to the dispersion of elastomeric micro-structure territory, therefore inhibit resinous principle entering to hollow bulb 14, the Reliability of Microprocessor of SAW chip 14, connection reliability can be improved.
(seal formation process)
In seal formation process, hot curing process is carried out to above-mentioned hollow sealing sheet, form seal 15 (with reference to Fig. 2 B).For the condition of the hot curing process of hollow sealing sheet, as heating-up temperature, be preferably 100 DEG C to 200 DEG C, be more preferably 120 DEG C to 180 DEG C, as heating time, be preferably 10 minutes to 180 minutes, be more preferably between 30 minutes to 120 minutes, and can pressurize as required.When pressurizeing, preferably can adopt 0.1MPa to 10MPa, more preferably adopting 0.5MPa to 5MPa.
(cutting action)
Then, can the seal 15 comprising the key elements such as hollow sealing sheet 11, printed circuit board 12 and SAW chip 13 be cut (with reference to Fig. 2 C).Thus, the hollow package body 18 based on SAW chip 13 unit can be obtained.Cutting utilizes existing known cutting blade to carry out usually after fixing above-mentioned seal 15.
(substrate installation procedure)
As required, can carry out forming wiring again and projection to hollow package body 18 obtained above and being installed on the substrate installation procedure of other substrate (not shown).Hollow package body 18, to the installation of substrate, can use the known devices such as flip-chip bonding machine, chip engagement machine.
" the 2nd execution mode "
In the 1st execution mode, use kneader etc. carry out mixing to each gradation composition and prepare mixing thing, and by this mixing thing extrusion molding, be formed as sheet.On the other hand, in the present embodiment, be coated with each component dissolves or be scattered in organic solvent etc. and the varnish obtained, being formed as sheet.In rubbing method, due to sheet film forming can be carried out under the state making elastomer be dissolved or dispersed in solvent etc., elastomeric domain size microminiaturization therefore can be made.
As the concrete making step using varnish, the conventionally above-mentioned A ~ E composition of suitable mixing and other additives as required, and make it be dissolved or dispersed in organic solvent equably, prepare varnish.Then, by be coated on by above-mentioned varnish on the supporting masses such as polyester and to make it dry, hollow sealing sheet 11 can be obtained.Then, as required, in order to protect the surface of hollow sealing sheet and the stripping films such as polyester film of can fitting.Stripping film is peeled off when sealing.
As above-mentioned organic solvent, be not particularly limited, known various organic solvent can be used, such as methylethylketone, acetone, cyclohexanone, dioxanes, diethyl ketone, toluene, ethyl acetate etc.They can be used alone, and also two or more kinds may be used.In addition, usually preferred with the solid component concentration of varnish be the mode of 30 ~ 95 % by weight scopes with an organic solvent.
The thickness that organic solvent is dried, is not particularly limited, but from the viewpoint of thickness evenness and residual solvents amount, is usually preferably set to 5 ~ 100 μm, is more preferably 20 ~ 70 μm.
Embodiment
Below, citing describes the preferred embodiments of the present invention in detail.Wherein, for the material recorded in the present embodiment, use level etc., as long as no the record of being particularly limited to property, then do not wish scope of the present invention to be only defined as these conditions.In addition, part represents weight portion.
[embodiment 1]
(making of hollow sealing sheet)
Mix following composition with blender, mixing revolution is set to 300rpm, mixing treating capacity is set to 5kg/hr, utilize twin screw compounder melting mixing 10 minutes at 110 DEG C, then extrude from T mould, make the hollow sealing sheet that thickness is 200 μm thus.
[embodiment 2]
Mixing treating capacity is set as 3.5kg/hr, makes hollow sealing sheet similarly to Example 1 in addition.
[embodiment 3]
Mixing revolution is set as 500rpm, makes hollow sealing sheet similarly to Example 1 in addition.
[embodiment 4]
Mixing revolution is set as 1000rpm, makes hollow sealing sheet similarly to Example 1 in addition.
[embodiment 5]
The composition identical with embodiment 1 is dissolved or dispersed in the 1:1 mixed solvent of methylethylketone and toluene with identical use level, makes the varnish that solid constituent is 40 % by weight.
Varnish is coated in the mode that the coating thickness after solvent seasoning is 50 μm in the PET film implementing demoulding process, then drying condition is set as 120 DEG C, 3 minutes, makes dried coating film, obtain the resin sheet that thickness is 50 μm.Use laminating machine that the resin sheet obtained is laminated to thickness and reach 200 μm, make the hollow sealing sheet that thickness is 200 μm.
[comparative example 1]
Mixing revolution is set as 100rpm, makes hollow sealing sheet similarly to Example 1 in addition.
[comparative example 2]
Mixing revolution is set as 50rpm, makes hollow sealing sheet similarly to Example 1 in addition.
(evaluation of hollow sealing sheet flexibility)
The sheet for sealing of embodiment and comparative example is cut into wide 60mm × long 60mm, holds the both ends (overlooking the limit of lower subtend) of hollow sealing sheet, 90-degree bent lentamente, and flexible according to following benchmark evaluation.Result is shown in table 1.
Zero: even if 90-degree bent does not also break.
△: produce slight crack during 90-degree bent.
×: break during 90-degree bent.
(observation in elastomer structure territory)
By the hot curing 1 hour after slowly cooling to room temperature at 150 DEG C of the hollow sealing sheet of making, cut off the solidfied material of gained with cutter.With Buehler automatic grinding device grinding and cutting face, and observe the cut surface after grinding by SEM (2000 times).The SEM of the cut surface of the hollow sealing sheet of embodiment 1 shown in Fig. 3 observes image.Observe in image at SEM, the region represented with black is elastomer structure territory.Then, this elastomer structure territory represented with black of Stochastic choice 50, measures their maximum gauge and averages, as the maximum gauge of domain.For other embodiment 2 ~ 5 and comparative example 1 ~ 2, carry out the mensuration of SEM observation and maximum gauge similarly.The result that maximum gauge measures is shown in table 1.
(mensuration with the resin inlet in the shaping dies of slit)
Use the shaping dies with slit shown in Fig. 4 A to Fig. 4 C, measure the resin inlet to slit.As shown in Figure 4 A, shaping dies 100 has the bed die 110 of the section U-shaped of standing portion by the outer peripheral portion at disk and discoid mold 120 is formed, and is provided with the blank part of slit S and collecting resin 200 between bed die 110 and mold 120.The input port O of working sample and resin 200 is provided with at the center of mold 120.As shown in Figure 4 B, above the standing portion of the bed die 110 when overlooking, be provided with multiple from above with prescribed depth incision groove 111.The penetraction depth of each groove 111 can obtain the value of the width of the slit S specified when being and combining with mold 120.
As the mensuration order of the resin inlet of reality, adopt following order: as shown in Figure 4 C, drop into resin 200 from input port O in mould in shaping dies 100 after, the rod 130 of pressurization is inserted at O place, input port, while heat shaping dies 100 entirety, while when pressurizeing with rod 130, which kind of degree to enter into slit S for benchmark according to resin 200 with and evaluate.Measure the distance L of the maximum point of arrival now from the inner peripheral end thereof of slit S to resin 200, it can be used as resin inlet.Condition determination is as follows, and result is shown in table 1.
< condition determination >
Heating-up temperature: 150 DEG C
Pressure: 10kg/cm 2
Pressing time: 10 minutes
Slit width: 1 μm, 5 μm, 10 μm, 20 μm, 50 μm
(evaluation to the resin entering of packaging body hollow bulb)
Make the SAW chip installation base plate SAW chip of the following specification being formed with aluminium comb poles being installed under following engaging condition glass substrate.
< SAW chip >
Chip size: 1.4 × 1.1mm (thick 150 μm)
Projection material: Au is high 30 μm
Number of lugs: 6 projections
Chip-count: 100 (10 × 10)
< engaging condition >
Device: SUNX (strain) is made
Engaging condition: 200 DEG C, 3N, 1sec (ultrasonic power output 2W)
Under heating pressurized conditions shown below, by vacuum pressing, each hollow sealing sheet is attached on the SAW chip installation base plate of gained.
< attaches condition >
Temperature: 60 DEG C
Pressure: 4MPa
Vacuum degree: 1.6kPa
Press time: 1 minute
After opening to atmospheric pressure, in air drier, under the condition of 150 DEG C, 1 hour, make the hot curing of hollow sealing sheet, obtain seal.Electron microscope (KEYENCE Inc., trade name " DigitalMicroscope ", 200 times) is used to measure the inlet of resin to the hollow bulb between SAW chip and glass substrate from glass substrate side.For resin inlet, before being sealed by hollow sealing sheet, use electron microscope confirm from glass substrate side and store the end position of SAW chip, reuse electron microscope after sealing to observe from glass substrate side, observation image relatively before and after sealing, measure the maximum arrival distance that resin enters hollow bulb from the end of the SAW chip confirmed before sealing, it can be used as resin inlet.Be the average evaluation of less than 20 μm by resin inlet being "○", is "×" by the average evaluation more than 20 μm.Result is shown in table 1.
As shown in Table 1, the flexibility of the hollow sealing sheet of embodiment 1 ~ 5 is good.On the other hand, in comparative example 1 ~ 2, produce slight crack, flexible poor.In addition we know, in embodiment 1 ~ 5, compared with comparative example 1 ~ 2, be inhibited to the resin inlet in die slit.In addition known, in the SAW chip packaging body of embodiment 1 ~ 5, the resinous principle of hollow sealing sheet is inhibited to entering in hollow bulb, can make the hollow package body of high-quality.In comparative example 1 ~ 2, to the resin inlet of hollow bulb all more than 20 μm.
Symbol description
11 hollow sealing sheets
11a supporting mass
13SAW chip
14 hollow bulbs
15 seals
18 hollow package bodies
100 shaping dies
110 bed dies
111 grooves
120 molds
130 rods
200 resins
L resin inlet
O input port
S slit

Claims (5)

1. a hollow sealing sheet, it is the hollow sealing sheet for carrying out hollow sealing to electronic unit,
Described hollow sealing sheet contains resin,
And more than 40 DEG C and the resin entering to hollow bulb of less than 100 DEG C are controlled.
2. hollow sealing sheet according to claim 1, wherein,
Have wide 20 μm slit shaping dies in fill described resin, at pressure 10kg/cm 2, temperature 150 DEG C condition under to described resin pressurize 10 minutes time, the resin inlet to described slit is below 3mm.
3. hollow sealing sheet according to claim 2, for slit width by relative to wide more than 1 μm and the resin inlet of the slit of less than 100 μm drawing time, there is minimum in this drawing.
4. hollow sealing sheet according to claim 3, described minimum is below 2mm.
5. a manufacture method for hollow package body, it comprises:
Lamination process, maintains hollow bulb, while be layered on this electronic unit by the hollow sealing sheet according to any one of Claims 1 to 4 in the mode covering one or more electronic unit; And
Seal formation process, makes described hollow sealing sheet solidify, and forms seal.
CN201480023192.6A 2013-04-26 2014-04-14 Hollow sealing sheet and method for producing hollow package Pending CN105190868A (en)

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JP2006032478A (en) * 2004-07-13 2006-02-02 Nippon Steel Chem Co Ltd Process for manufacturing semiconductor device
CN101307221A (en) * 2007-05-17 2008-11-19 日东电工株式会社 Thermosetting encapsulation adhesive sheet

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JP2006032478A (en) * 2004-07-13 2006-02-02 Nippon Steel Chem Co Ltd Process for manufacturing semiconductor device
CN101307221A (en) * 2007-05-17 2008-11-19 日东电工株式会社 Thermosetting encapsulation adhesive sheet

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Application publication date: 20151223