CN105188279A - Manufacturing method of segmented golden finger - Google Patents
Manufacturing method of segmented golden finger Download PDFInfo
- Publication number
- CN105188279A CN105188279A CN201510691167.1A CN201510691167A CN105188279A CN 105188279 A CN105188279 A CN 105188279A CN 201510691167 A CN201510691167 A CN 201510691167A CN 105188279 A CN105188279 A CN 105188279A
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- gold
- golden finger
- plated
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- fabricate block
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a manufacturing method of a segmented golden finger, which comprises the following steps: covering regions of a golden finger, except for a prefabricated segmented region and a to-be-gold-plated region, by adopting a first protection structure; gold-plating the prefabricated segmented region and the to-be-gold-plated region of the golden finger to form a gold-plated layer; and removing the gold-plated layer on the prefabricated segmented region. By adopting the first protection structure for covering the regions of the golden finger, except for the prefabricated segmented region and the to-be-gold-plated region, when the to-be-gold-plated region of the golden finger is gold-plated, the prefabricated segmented region can also be gold-plated, and then the gold-plated layer on the prefabricated segmented region is removed, so that in a gold-plating process, the prefabricated segmented region does not need to be covered by adopting the protection structure so as to avoid the phenomenon of gold infiltration caused by adopting the protection structure in the prior art to cover the prefabricated segmented region of the golden finger to directly obtain the segmented golden finger, and further avoid the condition of unstable performance of the golden finger caused by the phenomenon of gold infiltration.
Description
Technical field
The present invention relates to a kind of manufacture method of golden finger, particularly relate to a kind of manufacture method of segmentation golden finger.
Background technology
Position near edges of boards on printed circuit board (PCB) is in a row furnished with many rectangular metal contact pieces, and metal contact piece is gold-plated formation on the copper face of printed circuit board (PCB).These metal contact pieces are parts of printed circuit board (PCB), because of its surface gold-plating and the similar finger of shape, therefore are called as golden finger.Golden finger is used for the connection between printed circuit board (PCB), can connecting circuit and signal transmission.The Gold plated Layer on golden finger surface can improve the resistance to plug at this position, conductivity and non-oxidizability.Golden finger is generally divided into isometric golden finger, grading connecting finger and segmentation golden finger, the feature of segmentation golden finger is, the golden finger network that each root is complete is made up of the golden finger of two sections of different length, namely golden finger is designed to the segmentation structure with segment identifier, the effective time difference is formed like this in signals transmission, be convenient to the transmission of high-frequency signal, and charged hot-plugging technology can be realized, have very large facility to follow-up upgrade maintenance.
The traditional Making programme of PCB segmentation golden finger is: carry out press mold, exposure to the base material of PCB, developing and being etched with forms all figures, wherein golden finger part is made as complete unsegmented golden finger, and produces gold plated lead; At gold plated lead place and golden finger fabricate block district print plating resist bronze ink or paste plating resist gold dry film, exposing needs to carry out gold-plated region and carries out gold-plated; Plating resist bronze ink or plating resist gold dry film is removed after gold-plated; The mode of etching is adopted to be etched away by gold plated lead.Because fabricate block district during plating can not be gold-plated by plating resist bronze ink or the dry film protection of subsides plating resist gold, after removing plating resist bronze ink or plating resist gold dry film, namely segment identifier is formed, thus formation segmentation golden finger.
But, in the manufacture method of above prior art, need at fabricate block district print plating resist bronze ink or paste plating resist gold dry film, and rely on plating resist bronze ink or plating resist gold dry film stop fabricate block district gold-plated, and due to the fabricate block district of segmentation golden finger less, the copper face in plating resist bronze ink or subsides plating resist gold dry film and fabricate block district often cannot in conjunction with firm, easily there is falling the phenomenon of plating resist ink or plating resist gold dry film, fabricate block district is made to plate the thin and Gold plated Layer of uneven thickness, and then generation Gold plated Layer is permeated to described copper face, when causing plating segment identifier produce in various degree ooze golden situation.Simultaneously owing to oozing the inconsistent of golden degree, cause and remove fabricate block district when assisting gold plated lead, the problem of oozing gold cannot be solved completely, thus affect the stability of golden finger performance.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is that the manufacture method of the segmentation golden finger overcoming prior art occurs oozing tight phenomenon, and then causes the technological deficiency of segmentation golden finger unstable properties.
To achieve these goals, the embodiment of the present invention provides a kind of manufacture method of segmentation golden finger, comprises the steps:
Adopt the first operator guards cover golden finger except fabricate block district and treat except gold-plated region region;
To the fabricate block district of golden finger and treat that gold-plated process is carried out in gold-plated region, form Gold plated Layer;
Remove the Gold plated Layer be positioned in fabricate block district.
Preferably, employing first operator guards cover golden finger except fabricate block district and treat the region except gold-plated region step before, also comprise the steps:
Form the first auxiliary gold plated lead in the fabricate block district being positioned at golden finger, the described first auxiliary gold plated lead treats gold-plated region for what connect the both sides in fabricate block district;
Form the second auxiliary gold plated lead outside gold-plated region in the fabricate block district and treating being positioned at golden finger, the described second auxiliary gold plated lead is used for golden finger to treat that gold-plated region is connected with energising place.
Preferably, the width of the described first auxiliary gold plated lead is identical with described fabricate block sector width.
Preferably, after the step removing the Gold plated Layer be positioned in fabricate block district, also comprise:
Remove the first operator guards;
The second operator guards is adopted to cover the region except the first auxiliary gold plated lead and the second auxiliary gold plated lead region of golden finger;
Remove the first auxiliary gold plated lead and the second auxiliary gold plated lead.
Preferably, described removal is arranged in the step of the Gold plated Layer in fabricate block district, and the mode removing the first auxiliary gold plated lead and the second auxiliary gold plated lead is the mode adopting UV laser cutting.
Preferably, 5-10um place below described UV laser cutting to Gold plated Layer stops cutting.
Preferably, described removal first is assisted in the step of gold plated lead and the second auxiliary gold plated lead, adopts the mode of alkali etching.
Preferably, described first operator guards is plating resist gold dry film or described first operator guards is plating resist bronze ink.
Preferably, described second operator guards is plating resist gold dry film or described second operator guards is plating resist bronze ink.
The manufacture method tool of the segmentation golden finger that the embodiment of the present invention provides has the following advantages:
1. the manufacture method of segmentation golden finger provided by the invention, adopt the first operator guards cover golden finger except fabricate block district and treat except gold-plated region region, this make to golden finger when gold-plated region is carried out gold-plated, fabricate block district also can be gold-plated, then the Gold plated Layer be positioned in fabricate block district is removed, like this in gold-plated process, do not need to adopt operator guards to cover the fabricate block district of golden finger, avoid in prior art and ooze golden phenomenon when adopting operator guards cover golden finger fabricate block district and directly obtain segmentation golden finger, thus situation about avoiding because oozing the golden finger unstable properties that golden phenomenon causes occurs.
2. the manufacture method of segmentation golden finger provided by the invention, the width of the described first auxiliary gold plated lead is identical with described fabricate block sector width, to ensure when gold-plated, the Gold plated Layer width in fabricate block district is consistent with the width in fabricate block district, is convenient to Gold plated Layer that is smoothly follow-up and that accurately remove in fabricate block district.
3. the manufacture method of segmentation golden finger provided by the invention, described UV laser cutting is due to high-octane lasing light emitter and accurately control laser beam and effectively can improve process velocity and obtain accurate processing result, when adopting the mode of UV laser cutting to remove the Gold plated Layer be positioned in fabricate block district, due to the consistency of plated thickness and the consistency of UV laser cutting, and then ensure that the consistency of the rear product of cutting.
4. the manufacture method of segmentation golden finger provided by the invention, described UV laser cutting stops cutting to Gold plated Layer less than 6 5-10um place, to ensure that, under the error of UV laser cutting machine self, Gold plated Layer 6 is cut away completely.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the specific embodiment of the invention, below according to a particular embodiment of the invention and by reference to the accompanying drawings, invention is described in further detail.
Fig. 1 is the flow chart of the manufacture method of embodiment of the present invention segmentation golden finger.
The schematic diagram of the golden finger formed in the manufacture method of Fig. 2 for the golden finger of segmentation shown in Fig. 1, the first auxiliary gold plated lead and the second auxiliary gold plated lead.
Adopt in the manufacture method of Fig. 3 for the golden finger of segmentation shown in Fig. 1 first operator guards cover golden finger except fabricate block district and the schematic diagram treating the region except gold-plated region.
The schematic diagram of the Gold plated Layer be positioned in fabricate block district is removed in the manufacture method that Fig. 4 is the golden finger of segmentation shown in Fig. 1.
Gold plated Layer in the manufacture method that Fig. 5 is the golden finger of segmentation shown in Fig. 4 in fabricate block district removes the longitudinal section of rear described fabricate block district along V-V cutting.
The second operator guards is adopted to cover the schematic diagram in the region except the first auxiliary gold plated lead and the second auxiliary gold plated lead region of golden finger in the manufacture method of Fig. 6 for the golden finger of segmentation shown in Fig. 1.
The schematic diagram of the segmentation golden finger formed after the manufacture method neutral and alkali etching that Fig. 7 is the golden finger of segmentation shown in Fig. 1.
In figure, each description of reference numerals is as follows.
1-fabricate block district; 2-treats gold-plated region; 3-first assists gold plated lead;
4-second assists gold plated lead; 5-first operator guards; 6-Gold plated Layer; 7-second operator guards.
Embodiment
Be clearly and completely described technical scheme of the present invention below in conjunction with accompanying drawing, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In describing the invention, it should be noted that, term " on ", D score, " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance.
In addition, if below in the described different execution mode of the present invention involved technical characteristic do not form conflict each other and just can be combined with each other.
Embodiment 1
As shown in Figure 1, the flow chart of the manufacture method of a kind of segmentation golden finger provided for the present embodiment, it mainly comprises the steps:
S1: adopt the first operator guards 5 cover golden finger (not shown) except fabricate block district 1 and treat except gold-plated region 2 region, as shown in Figure 3;
S2: to the fabricate block district 1 of golden finger and treat that gold-plated process is carried out in gold-plated region 2, forms Gold plated Layer 6;
S3: remove the Gold plated Layer 6 be positioned in fabricate block district 1, as shown in Figure 4 and Figure 5.
The manufacture method of above-mentioned segmentation golden finger, adopt the first operator guards 5 cover golden finger except fabricate block district 1 and treat except gold-plated region 2 region, this make to golden finger when gold-plated region is carried out gold-plated, fabricate block district also can be plated gold-plated, then the Gold plated Layer be positioned in fabricate block district is removed, like this in gold-plated process, do not need to adopt operator guards to cover the fabricate block district of golden finger, avoid in prior art and ooze golden phenomenon when adopting operator guards cover golden finger fabricate block district and directly obtain segmentation golden finger, thus situation about avoiding because oozing the golden finger unstable properties that golden phenomenon causes occurs.
As preferred embodiment; in S1 step; the first operator guards 5 adopted is plating resist gold dry film; described plating resist gold dry film be covered in golden finger except fabricate block district 1 and on treating except gold-plated region 2 region; to ensure after S2 step, except fabricate block district 1 and treat that the region except gold-plated region 2 can not be coated with Gold plated Layer 6.
As preferred embodiment; in S1 step; the first operator guards 5 adopted can also be plating resist bronze ink; described plating resist bronze ink be printed on golden finger except fabricate block district 1 and on treating except gold-plated region 2 region; as shown in Figure 3; to ensure after S2 step, except fabricate block district 1 and treat that the region except gold-plated region 2 can not be coated with Gold plated Layer 6.
As preferred embodiment, in S2 step, to the fabricate block district 1 of golden finger and treat that the mode that gold-plated process is carried out in gold-plated region 2 is the mode of alloy plating, in the present embodiment, adopt the mode of plating nickel gold.
It should be noted that, before S1 step, also comprise following S0 step, S0 step comprises:
S01: form the first auxiliary gold plated lead 3 in the fabricate block district 1 of golden finger, the described first auxiliary gold plated lead 3 treats gold-plated region 2 for what connect the both sides in fabricate block district 1, as shown in Figure 2;
S02: in the fabricate block district 1 of golden finger and treat that gold-plated region 2 is outer and form the second auxiliary gold plated lead 4, the described second auxiliary gold plated lead 4 for golden finger treated that gold-plated region 2 is connected with energising place (not shown), as shown in Figure 2.
It should be noted that, S01 step and S02 step only represent the step comprised in S0 step, do not have the contact of tandem between each step, therefore the order of S01 step and S02 step can exchange mutually.
Described second auxiliary gold plated lead 4 is drawn from described prefabricated golden finger end, and extend to energising place according to predetermined circuit, by being energized to the auxiliary gold plated lead 4 of second outside the auxiliary gold plated lead 3 of first in fabricate block district 1 and fabricate block district 1, and then to the fabricate block district 1 of described golden finger and treat that gold-plated process is carried out in gold-plated region 2.
As preferred embodiment, the width of the in described fabricate block district 1 first auxiliary gold plated lead 3 is identical with described fabricate block district 1 width, as shown in Figure 2.During to ensure gold-plated, Gold plated Layer 6 width in fabricate block district 1 is consistent with the width in fabricate block district 1, is convenient to Gold plated Layer that is smoothly follow-up and that accurately remove in fabricate block district.
As preferred embodiment, after S3 step, also comprise:
S4: remove the first operator guards 5;
S5: adopt the second operator guards 7 to cover the region except the first auxiliary gold plated lead 3 and the second auxiliary gold plated lead 4 region of golden finger, as shown in Figure 6;
S6: remove the first auxiliary gold plated lead 3 and the second auxiliary gold plated lead 4, form segmentation golden finger, as shown in Figure 7.
As preferred embodiment, in S3 step, the mode of UV laser cutting is adopted to remove the Gold plated Layer 6 be positioned in fabricate block district 1.Described UV laser cutting is due to high-octane lasing light emitter and accurately control laser beam and effectively can improve process velocity and obtain accurate processing result.When adopting the mode of UV laser cutting to remove the Gold plated Layer 6 be positioned in fabricate block district 1, due to the consistency of Gold plated Layer 6 thickness and the consistency of UV laser cutting, and then ensure that the consistency of the rear product of cutting.
As preferred embodiment, as shown in Figure 5, described UV laser cutting stops cutting to Gold plated Layer less than 6 5-10um place.To ensure that, under the error of UV laser cutting machine self, Gold plated Layer 6 is cut away completely.
As preferred embodiment; in S5 step; described second operator guards 7 is plating resist gold dry film; described plating resist gold dry film is covered on the region except the first auxiliary gold plated lead 3 and the second auxiliary gold plated lead 4 of golden finger; to ensure in S6 step, the first auxiliary gold plated lead 3 and the second auxiliary gold plated lead 4 is only had to be etched.As the execution mode of distortion, the second operator guards 7 also can be plating resist bronze ink, but, when needing the region covered to there is hole, then do not select plating resist bronze ink.
As preferred embodiment, in S6 step, adopt the mode of alkali etching, assist gold plated lead 3 and the second auxiliary gold plated lead 4 to etch removal first completely.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For the ordinary person of technical field of the present invention, without departing from the inventive concept of the premise, some simple deductions or replacement can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1. a manufacture method for segmentation golden finger, is characterized in that, comprises the steps:
Adopt the first operator guards (5) cover golden finger except fabricate block district (1) and treat except gold-plated region (2) region;
To the fabricate block district (1) of golden finger and treat that gold-plated process is carried out in gold-plated region (2), form Gold plated Layer (6);
Removal is positioned at the Gold plated Layer (6) in fabricate block district (1).
2. the manufacture method of segmentation golden finger according to claim 1; it is characterized in that: employing first operator guards (5) cover golden finger except fabricate block district (1) and treat the region except gold-plated region (2) step before, also comprise the steps:
In the fabricate block district (1) of golden finger, form the first auxiliary gold plated lead (3), the described first auxiliary gold plated lead (3) treats gold-plated region (2) for what connect the both sides in fabricate block district (1);
In the fabricate block district (1) of golden finger and treat that gold-plated region (2) forms the second auxiliary gold plated lead (4) outward, by golden finger, the described second auxiliary gold plated lead (4) is for treating that gold-plated region (2) is connected with energising place.
3. the manufacture method of segmentation golden finger according to claim 2, is characterized in that: the width of the described first auxiliary gold plated lead (3) is identical with described fabricate block district (1) width.
4. the manufacture method of segmentation golden finger according to claim 2, is characterized in that: after removal is positioned at the step of the Gold plated Layer (6) in fabricate block district (1), also comprise:
Remove the first operator guards (5);
The second operator guards (7) is adopted to cover the region except the first auxiliary gold plated lead (3) and the second auxiliary gold plated lead (4) region of golden finger;
Remove the first auxiliary gold plated lead (3) and the second auxiliary gold plated lead (4).
5. the manufacture method of the segmentation golden finger according to any one of claim 1-4, is characterized in that: described removal is arranged in the step of the Gold plated Layer (6) in fabricate block district (1), adopts the mode of UV laser cutting.
6. the manufacture method of segmentation golden finger according to claim 5, is characterized in that: described UV laser cutting stops cutting to the following 5-10um place of Gold plated Layer (6).
7. according to the manufacture method of the segmentation golden finger described in claim 4 or 6, it is characterized in that: described removal first is assisted in the step of gold plated lead (3) and the second auxiliary gold plated lead (4), the mode removing the first auxiliary gold plated lead (3) and the second auxiliary gold plated lead (4) is the mode adopting alkali etching.
8. the manufacture method of the segmentation golden finger according to any one of claim 1-4, is characterized in that: described first operator guards (5) for plating resist gold dry film or described first operator guards (5) be plating resist bronze ink.
9. the manufacture method of segmentation golden finger according to claim 4, is characterized in that: described second operator guards (7) is plating resist gold dry film, or described second operator guards is plating resist bronze ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510691167.1A CN105188279B (en) | 2015-10-22 | 2015-10-22 | The production method for being segmented golden finger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510691167.1A CN105188279B (en) | 2015-10-22 | 2015-10-22 | The production method for being segmented golden finger |
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| CN105188279A true CN105188279A (en) | 2015-12-23 |
| CN105188279B CN105188279B (en) | 2018-09-04 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587941A (en) * | 2017-09-28 | 2019-04-05 | 健鼎（无锡）电子有限公司 | The method for forming golden finger structure |
| CN109673102A (en) * | 2018-12-19 | 2019-04-23 | 惠科股份有限公司 | Printed wiring board and its display panel |
| TWI658759B (en) * | 2017-09-25 | 2019-05-01 | Tripod Technology Corporation | Method of manufacturing gold finger structure |
| WO2024103575A1 (en) * | 2022-11-17 | 2024-05-23 | 上海美维电子有限公司 | Method for manufacturing graded gold finger |
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| CN102510682A (en) * | 2011-12-21 | 2012-06-20 | 博罗县精汇电子科技有限公司 | Method for producing plug-in gold-plated long-and-short fingers by adopting leap-frog re-etching method |
| CN103108500A (en) * | 2011-11-10 | 2013-05-15 | 珠海方正科技多层电路板有限公司 | Method for manufacturing sectional gold finger |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
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2015
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103108500A (en) * | 2011-11-10 | 2013-05-15 | 珠海方正科技多层电路板有限公司 | Method for manufacturing sectional gold finger |
| CN102510682A (en) * | 2011-12-21 | 2012-06-20 | 博罗县精汇电子科技有限公司 | Method for producing plug-in gold-plated long-and-short fingers by adopting leap-frog re-etching method |
| CN103237421A (en) * | 2013-04-26 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) segmentation golden finger preparation method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI658759B (en) * | 2017-09-25 | 2019-05-01 | Tripod Technology Corporation | Method of manufacturing gold finger structure |
| CN109587941A (en) * | 2017-09-28 | 2019-04-05 | 健鼎（无锡）电子有限公司 | The method for forming golden finger structure |
| CN109673102A (en) * | 2018-12-19 | 2019-04-23 | 惠科股份有限公司 | Printed wiring board and its display panel |
| WO2024103575A1 (en) * | 2022-11-17 | 2024-05-23 | 上海美维电子有限公司 | Method for manufacturing graded gold finger |
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| CN105188279B (en) | 2018-09-04 |
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Effective date of registration: 20220617 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. |
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