CN105183246A - Capacitive touch control panel - Google Patents

Capacitive touch control panel Download PDF

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Publication number
CN105183246A
CN105183246A CN201410260555.XA CN201410260555A CN105183246A CN 105183246 A CN105183246 A CN 105183246A CN 201410260555 A CN201410260555 A CN 201410260555A CN 105183246 A CN105183246 A CN 105183246A
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nano
silver thread
conductive layer
substrate
cabling
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CN201410260555.XA
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CN105183246B (en
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高国峯
袁琼
李绍�
叶坤雄
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TPK Touch Solutions Xiamen Inc
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TPK Touch Solutions Xiamen Inc
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Abstract

The invention relates to the technical field of touch control and especially relates to a capacitive touch control panel. The capacitive touch control panel comprises a baseplate, a first nanometer silver line conducting layer and a second nanometer silver line conducting layer, wherein the second nanometer silver line conducting layer is formed on one of surfaces of the baseplate, the first nanometer silver line conducting layer comprises a plurality of first conducting electrodes and a plurality of first alignment lines, and the second nanometer silver line conducting layer comprises a plurality of second conducting electrodes, a plurality of second alignment lines, a plurality of connecting lines and a connecting area. The capacitive touch control panel also comprises a plurality of through holes, wherein the first alignment lines are electrically connected with the connecting lines through the through holes.

Description

Capacitance type touch-control panel
[technical field]
The present invention relates to technical field of touch control, particularly a kind of capacitance type touch-control panel.
[background technology]
Touch control device is subject to the favor of telecommunications industry gradually because of advantages such as its convenient operation, imaging are effective, function diversification, and is widely used on the products such as information system equipment, home appliance, communication apparatus, personal portable.
With touch-screen in recent years in the rapid emergence of communications industry, flourish particularly in mobile communication industry, touch-screen becomes the first-selected product of imaging display apparatus now at one stroke.Touch-screen mainly resistive touch screen and the capacitive touch screen that utilization rate is the highest, but user is for controllability, the consideration of ease for use and appearance, and capacitive touch screen mostly can be selected as its best preferred unit.
At traditional intelligence mobile phone, as in the capacitive touch screen of iphone etc., the material of touch control electrode is generally tin indium oxide (referred to as ITO).The transmittance of ITO is very high, and electric conductivity is better.But ITO is expensive, ITO is more crisp, pliability is poor, easily rupture time bending and cause dysfunction, even if be destroyed bending being also very easy to running into less physical stress, ITO conductance is generally greater than 70 ohm/sheet resistance, along with the progressively increase of touch-screen size, when being particularly applied to the panel of more than 15 cun, the defect of ITO is more and more outstanding, wherein the most obvious defect is exactly that the surface resistance of ITO is excessive, ITO cannot meet the requirement of current touch-control product for resistivity, the electric conductivity that large scale touch-screen is good and enough sensitivity cannot be ensured, also the development trend of the continuous low priceization of electronic product cannot be applicable to.
In addition, in manufacture method, ITO originally needs vacuum chamber, higher depositing temperature and/or high annealing temperature to obtain high conductance, causes the integral manufacturing cost of ITO very expensive.In processing procedure, ITO generally adopts sputter and gold-tinted light blockage coating, exposure, development, etching, stripping, numerous and diverse operation such as high-temperature baking, the high and length consuming time of cost.
Refer to Fig. 1 and Fig. 2, in traditional contact panel 110, the upper surface and lower surface of a substrate 1101 are formed first conductive layer 1103 and second conductive layer 1105 of ITO respectively, or on two substrates, form the first conductive layer 1103 and the second conductive layer 1105 respectively, then be connected on a FPC1107 by the first conductive layer 1103 by ITO cabling or metallic conduction cabling 1109 conducting, the second conductive layer 1105 is connected on the 2nd FPC1108 by ITO cabling or metallic conduction cabling 1109 conducting.The contact panel 110 of this structure needs through twice sputter, gold-tinted, and pressure programming and expend two FPC1107 and 1108, consumption cost consuming time.
[summary of the invention]
Complicated for overcoming processing procedure existing in existing ITO contact panel processing procedure, the technical matters that cost is higher, the invention provides a kind of production cost low, the simple capacitance type touch-control panel of processing procedure.
The technical scheme of technical solution problem of the present invention is to provide a kind of capacitance type touch-control panel, comprise a substrate, first nano-silver thread conductive layer and the second nano-silver thread conductive layer, second nano-silver thread conductive layer form in substrate wherein one on the surface, first nano-silver thread conductive layer comprises plural first conductive electrode and plural first cabling, second nano-silver thread conductive layer comprises plural second conductive electrode, plural second cabling, complex connecting line and join domain, described capacitance type touch-control panel also comprises plural through hole, and the first cabling and connecting line are electrically connected by through hole.
Preferably, the diameter of described through hole is Φ 20um to 1mm.
Preferably, the diameter of described through hole is Φ 200um to 600um.
Preferably, conductive material is provided with in described through hole.
Preferably, the width of the first cabling and the second cabling is 5um-35um, and the line-spacing of adjacent first cabling or adjacent second cabling is 5um-35um.
Preferably, telecommunications signal is drawn respectively by the first cabling by the first described conductive electrode two ends, and telecommunications signal is drawn respectively by the second cabling by the second described conductive electrode two ends.
Preferably, the first nano-silver thread conductive layer and the second nano-silver thread conductive layer are arranged on two surfaces of described substrate respectively, and through hole runs through substrate.
Preferably, comprise a cover plate further, comprise first surface and second surface, first surface is touch operation surface, and the first nano-silver thread conductive layer forms on the second surface of cover plate, and through hole runs through described substrate.
Preferably, comprise a second substrate further, the first nano-silver thread conductive layer forms on second substrate, and through hole runs through substrate and/or second substrate.
Preferably, the first described nano-silver thread conductive layer and the second described nano-silver thread conductive layer both sides can arrange adhesion promoting layer, levelling blanket, one or more layers among optical match layer, described adhesion promoting layer, levelling blanket, optical match layer can be arranged on homonymy or the not homonymy of the first described nano-silver thread conductive layer and the second described nano-silver thread conductive layer, described adhesion promoting layer, levelling blanket, the position between optical match layer three is interchangeable.
Compared with prior art, capacitance type touch-control panel of the present invention adopts nano-silver thread conductive layer to make the first nano-silver thread conductive layer and the second nano-silver thread conductive layer.First, it is low that nanometer silver wire material itself has resistance, and light transmission rate is more than 85%, and sheet resistance is in the superiority of 12-120ohm/sq, make the first nano-silver thread conductive layer and the second nano-silver thread conductive layer have good electric conductivity, the touch-control of capacitance type touch-control panel is highly sensitive.The good resistance of light transmission because of nano-silver thread is low, covers without the need to using shielding layer if use nano-silver thread to do cabling, thus realizes the design of capacitance type touch-control panel Rimless, and Rimless capacitance type touch-control panel makes user visually openr, and adding users is experienced.
Secondly, the present invention, in this capacitance type touch-control panel layer structure, increases adhesion promoting layer, levelling blanket and optical match layer, and adhesion promoting layer solves the series of problems that nanometer silver wire material causes because of the expansion of flexible base plate or contraction.Increase levelling blanket and carry out certain PROCESS FOR TREATMENT, making the overlap joint between nano-silver thread become good, thus conductance is effectively ensured, and the surface smoothness of capacitance type touch-control panel is greatly improved.The adjustment to capacitance type touch-control panel mist degree is realized by optical match layer, and flexible and changeable for the status requirement of optical match layer, realize the reduction to capacitance type touch-control panel mist degree flexibly and effectively.
Again, capacitance type touch-control panel cabling of the present invention adopts nanometer silver wire material and adopts the design of bilateral cabling to strengthen signal transmission, one side open circuit preventing capacitance type touch-control panel cabling from may occur in signals transmission causes signal cannot be transferred to situation on touch-control IC, improves the touch-control sensitivity of capacitance type touch-control panel.Nano Silver cabling and electrode one-body molded, without overlap joint bad, the problem that overlap resistance is higher.
In addition, capacitance type touch-control panel of the present invention adopts cabling via design, relative to conventional I TO and metal sputtering processing procedure, first substrate planarization is required it is not very high in the conductive layer of nano-silver thread and cabling coating process, etching can not be caused unclean, residual, the problems such as crackle, simultaneously due to the size effect of its Nano grade, make it have excellent light transmission and flexible resistance, therefore can be used as and preferably substitute ITO as touch control electrode and cabling material.
In capacitance type touch-control panel method for making of the present invention, adopt nano-silver thread as cabling material, the first conductive electrode and cabling thereof can complete in processing procedure, second conductive electrode and cabling thereof also can complete in processing procedure, simplify technique, consuming time few, cost is low.The cabling of capacitance type touch-control panel adopts via design, only needs use flexible PCB, one step press (bonding) processing procedure, further simplify capacitance type touch-control panel 0 Making programme, consuming time short, saves material, reduces costs.
[accompanying drawing explanation]
Fig. 1 is the cutting structural representation of prior art contact panel, and it comprises the first conductive layer and the second conductive layer.
Fig. 2 is the conductive pattern planar structure schematic diagram of prior art contact panel.
Fig. 3 is the cross section structure schematic diagram of nano-silver thread film of the present invention.
Fig. 4 is the floor map of nano-silver thread film of the present invention.
Fig. 5 is first embodiment of the invention contact panel cutting structural representation.
Fig. 6 is the planar structure schematic diagram of the first nano-silver thread conductive layer of contact panel shown in Fig. 5.
Fig. 7 is the planar structure schematic diagram of the second nano-silver thread conductive layer of contact panel shown in Fig. 5.
Fig. 8 is the floor map of the Rimless design of first embodiment of the invention contact panel.
Second nano-silver thread conductive layer of Fig. 9 second embodiment of the invention contact panel and the planar structure schematic diagram of corresponding cabling.
Figure 10 is the cutting structural representation of contact panel of the present invention 3rd embodiment, increases by an adhesion promoting layer at first substrate and between the first nano-silver thread conductive layer and the second nano-silver thread conductive layer.
Figure 11 is the cutting structural representation of contact panel of the present invention 4th embodiment, and the first nano-silver thread conductive layer and the second nano-silver thread conductive layer increase by a levelling blanket.
Figure 12 is the detonation configuration figure of contact panel of the present invention 5th embodiment, increases by an optical match layer at first substrate and between the first nano-silver thread conductive layer and the second nano-silver thread conductive layer.
Figure 13 is the method for making process flow diagram of sixth embodiment of the invention contact panel.
Figure 14 is seventh embodiment of the invention contact panel cutting structural representation.
Figure 15 is eighth embodiment of the invention contact panel cutting structural representation.
[embodiment]
In order to make object of the present invention, technical scheme and advantage are clearly understood, below in conjunction with accompanying drawing and embodiment, are further elaborated to the present invention.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 3 and Fig. 4, it is the cutting structural representation of nano-silver thread conductive film 800, it nano-silver thread conductive layer 805 comprising substrate 807 and be produced on substrate 807, nano-silver thread conductive layer 805 comprises the many nano-silver threads 801 be embedded in matrix 803, substrate 807 is generally transparent insulation material, and nano-silver thread arrangement wherein mutually overlaps and forms conductive network.The larger resistance of nano-silver thread 801 wire diameter is lower, the more long more easily overlap joint of line length forms conductive network, but nano-silver thread 801 surface area also increases simultaneously thereupon, the haze issues that surface reflection light diffusion causes is more obvious, therefore nano-silver thread 801 (silvernanowires, be called for short SNW) line length be 10-300 μm, preferred 20-100 μm, preferably its length 20-50 μm, the wire diameter of nano-silver thread 801 is less than 500nm or is less than 200nm, 100nm, preferably be less than 50nm, and its length breadth ratio ratio of wire diameter (line length with) is greater than 10, be preferably greater than 50, more preferably greater than 400.
Silver is silvery white metal under general state, and is opaque material, and electric conductivity is splendid.And when being nano-silver thread 801, nano-silver thread 801 has good transmittance and splendid electric conductivity, can be good at the touch control electrode applying to touch-screen.
Matrix 803 refers to that the solution containing nano-silver thread 801 is being arranged on substrate 807 through methods such as coatings, after heating, drying makes volatile material volatilize, stays the non-nano silver line material on substrate 807.Nano-silver thread 801 scatters or embeds wherein, forms conductive network, and part nano-silver thread 801 is outstanding from matrix 803 material.Nano-silver thread 801 relies on matrix 803 to form nano-silver thread conductive layer 805, and matrix 803 can protect nano-silver thread 801 not to be subject to the impact of the external environments such as burn into wearing and tearing.
The thickness of nano-silver thread conductive layer 805 is thicker, and its resistance more low electric conductivity is better, but transmittance increases along with thickness and reduces simultaneously, and therefore, the thickness of nano-silver thread conductive layer 805 is about 10nm-5 μm, and be preferably 20nm-1 μm, more excellent is 50nm-200nm.In certain embodiments, the refractive index of nano-silver thread conductive layer 805 is 1.3-2.5, and more excellent is 1.35-1.8.
Solution containing nano-silver thread 801 refers to, nano-silver thread 801 is dissolved in the aaerosol solution formed in specific solvent, and this solvent can be water, aqueous solution, organic solvent, inorganic solvent, solion, saline solns, supercritical fluid, oil or its potpourri etc.Also containing other adjuvant in this solvent, as spreading agent, surfactant, crosslinking chemical, wetting agent or thickening agent, but not as limit.
In addition, by selecting suitable host material to adjust the optical characteristics of nano-silver thread conductive layer 805, particularly haze issues is solved.Such as, matrix 803 can be adjusted to refractive index, component and certain thickness with expectation, can effectively reduce reflection loss, glare effects, mist degree.
Mist degree refers to the outward appearance of cloud because nano-silver thread 801 surface light diffusion in nano-silver thread conductive layer 805 causes or muddiness.The haze issues of screen can cause when outdoor scene light irradiates, and screen reflection light intensity is strong, and user can be made time serious not see screen.
The transmittance of nano-silver thread conductive layer 805 or sharpness can limiting by following parameter quantitative: transmittance and mist degree.Transmittance refers to the number percent of the incident light by medium transmission, and the transmittance of transparency conducting layer 805 is at least 85%, even can up to more than 90%.
Refer to Fig. 5, the capacitance type touch-control panel 10 of the first embodiment of the present invention comprises first substrate 101, the first nano-silver thread conductive layer 103, bonding coat 109, second nano-silver thread conductive layer 105 and second substrate 107, wherein second substrate 107 contacts with touching object, can be regarded as the cover plate often stated.Wherein, the upper surface of first substrate 101 lays the first nano-silver thread conductive layer 103, first substrate 101 lower surface lays the second nano-silver thread conductive layer 105 (in all embodiments, the position determiners such as upper and lower, left and right are only limitted to the relative position in given view, but not absolute position).
Described first substrate 101 can be rigid substrates, as glass, and tempered glass, sapphire glass.Also can for having flexual flexible base, board, described flexible base, board includes but not limited to PI (polyimide), PC (polycarbonate), polyethersulfone (PES), polymethylmethacrylate (PMMA), acryl, acrylic nitrile-butadiene-styrene (ABS), polyamide (PA), polybenzimidazoles polybutylene (PB), polybutylene terephthalate (PBT), polyester (PE), polyetheretherketone (PEEK), polyetherimide (PEI), polyetherimide, tygon (PE), polyethylene terephthalate (PET), polystyrene (PS), teflon (PTFE), polyurethane (PU), the combination in any of Polyvinylchloride (PVC) any one or they.
Wherein said first substrate 101 and second substrate 107 comprise the functional layer with anti-dazzle, sclerosis, anti-reflection or atomizing functions.Wherein, have functional layer that is anti-dazzle or atomizing functions, formed by the applying coating with anti-dazzle or atomizing functions, coating comprises metal oxide particle; The functional layer with sclerosis function is applied by the high-molecular coating with sclerosis function and is formed or directly hardened by chemistry or physical method; The functional layer with anti-reflection function is titania coating, magnesium fluoride coating or calcium fluoride coating.
In the present embodiment, first substrate 101 is preferably flexible parent metal.Because present stage more easily punches on flexible material.
First nano-silver thread conductive layer 103 and the second nano-silver thread conductive layer 105 adopt nano-silver thread 801 material to make.When first nano-silver thread conductive layer 103 and the second nano-silver thread conductive layer 105 are the nano-silver thread conductive layer 805 shown in Fig. 3, Fig. 4, nano-silver thread 801 embeds or is embedded in first substrate 101, and first substrate 101 can be substrate 807 material shown in Fig. 3, Fig. 4.
First substrate 101 its be generally square, this first substrate 101 is formed the through hole 171 on multiple two surface through, in through hole 171 filled conductive material or in through hole 171 formed the coat of metal, for connecting the cabling corresponding with it, this conductive material can be conductive silver paste, copper slurry or other conducting metals slurry.The diameter of this through hole 171 is Φ 20um to 1mm, preferred 200um-600um.
This second substrate 107 upper surface is touching object surface of contact, can be understood as the cover plate often stated.Its material is preferably rigid substrates, and decorative layer 111 material can be ink, photoresistance, the materials such as non-metallic sputter.The cabling of traditional capacitance type touch-control panel is metal opaque material, one deck decorative layer 111 need be printed opaque cabling is override, when using nano-silver thread cabling, because its light transmission is good, then cabling can not need to use decorative layer 111 to cover, and can realize at least both sides Rimless design.Bonding coat 109 is for being bonded as one by first substrate 101 and second substrate 107, bonding coat 109 is insulating material, and bonding coat 109 can select Optical transparent adhesive.
Refer to Fig. 6, this first nano-silver thread conductive layer 103 comprises the first conductive electrode 121 of multiple parallel equidistant arrangement in a first direction, and multiple first cabling 161.Wherein the first conductive electrode 121 of arranging with the plurality of spacing respectively of the plurality of first cabling 161 and above-mentioned multiple through hole 171 one_to_one corresponding, its one end is electrically connected with the first corresponding conductive electrode 121 respectively, and the other end extends to through hole 171 position corresponding with it.Wherein, the position of the plurality of first conductive electrode 121 correspondence is regarded as viewing area 133, because herein for user touches and the region of observation.Position residing for multiple first cabling 161 is outer peripheral areas 131 because herein can layout many cablings and affect visual effect, so this outer peripheral areas more than 131 is coating covers, do not allow user observe.This outer peripheral areas 131 is enclosed in the surrounding of this viewing area 133.
Refer to Fig. 7, the second nano-silver thread conductive layer 105 comprises the second conductive electrode 123 of multiple parallel equidistant arrangement in a second direction, multiple second cabling 165, multiple connecting line 162.Wherein the second conductive electrode 123 one_to_one corresponding of arranging with the plurality of spacing respectively of the plurality of second cabling 165, its one end is electrically connected with the second corresponding conductive electrode 123 respectively, the other end extends to join domain 135 place at this second nano-silver thread conductive layer 105 1 side, link (non-label) corresponding thereon respectively connects, for connection flexible PCB 137.Connecting line 162 one end connects multiple through holes 171 of above-mentioned correspondence, and the other end extends to join domain 135 place, equally for be connected flexible PCB 137.Second conductive electrode 123 is distributed in above-mentioned viewing area 133, and the second cabling 165 and connecting line 162 are distributed in outer peripheral areas 131.
In another distressed structure, the first nano-silver thread conductive layer 103 and the second nano-silver thread conductive layer 105 position can exchange.
Refer to Fig. 8, the material of this first cabling 161 and the second cabling 165 can be arbitrary conductive material, includes but not limited to opaque conductive material, as: gold, silver, copper, aluminium, nickel or zinc or its combine arbitrarily, certainly, the optimum nano-silver thread 801 for adopting as shown in Figure 3.When the material of the first cabling 161 and the second cabling 165 all adopts the transparent conductive materials such as nano-silver thread 801, the first cabling 161 can be realized as cabling and the second cabling 165 width is 5um-35um owing to adopting nano-silver thread conductive layer 805, first cabling 161 and the second cabling 165 spacing are 5um-35um, therefore the first cabling 161 and the second cabling 165 width and to walk distance between centers of tracks all smaller, first cabling 161 and the region shared by the second cabling 165 can be very little, outer peripheral areas 131 can be realized like this reduce, when capacitance type touch-control panel 10 area is constant, viewing area 133 area is increased, realize narrow frame design.Further, because nano-silver thread conductive layer 805 has light transmission, second substrate 107 the right and left can not do frame, and namely no decoration layer 111 covers, and realizes the design of capacitance type touch-control panel 10 Rimless.Up and down both sides are then covered in (as shown in Figure 8 shadow region) by the decorative layer 111 of second substrate 107 bottom, and decorative layer 111 can cover the through hole 171 that first cabling 161, second cabling 165 on upper and lower both sides, connecting line 162 and conducting connect the first cabling 161 and connecting line 162.The width of the first cabling 161 and the second cabling 165 is approximately 10um-35um, and line-spacing is 10um-35um, can be square also can be arc in the corner of the first cabling 161 and the second cabling 165, adopts the turning of arc can prevent the fracture gone between.
Compared with prior art, first the advantages such as, the first conductive electrode 121 of first embodiment of the invention capacitance type touch-control panel 10 and the second conductive electrode 123 adopt nano-silver thread conductive layer 805 to be made, and have price low, resistance is low, frivolous, and flexibility is good; Secondly, when nano-silver thread conductive layer 805 is as cabling material, low solid its of resistivity due to nano-silver thread conductive layer 805 material itself has better electric conductivity, make the touch-control of capacitance type touch-control panel 10 highly sensitive, again because of the light transmission that nano-silver thread conductive layer 805 is excellent, capacitance type touch-control panel 10 is made to be achieved Rimless design.Again, first conductive electrode 121, first cabling 161, second conductive electrode 123, second cabling 165 and connecting line 162 all adopt nano-silver thread conductive layer 805 material, realize only needing one-shot forming technique to complete, simplify manufacture craft, consuming time few, cost is low.And, first substrate 101 adopts via design, first cabling 161 is connected with connecting line 162 by through hole 171, and cause join domain 135, so only need use flexible PCB 137 and join domain 135 one step press (bonding) processing procedure to complete assembling, this design simplifies flow process, reduces cost.
Refer to Fig. 9, second embodiment of the invention capacitance type touch-control panel 20 is substantially identical with the structure of the capacitance type touch-control panel 10 of the first embodiment, difference is only: the second conductive electrode 223 adopts bilateral cabling to design, and the second conductive electrode 223 both sides comprise the second conductive electrode first limit cabling 265 and the second conductive electrode Second Edge cabling 267.One end and second conductive electrode 223 upper electrical of the second conductive electrode first limit cabling 265 connect, the other end is connected to join domain 235 place, second conductive electrode Second Edge cabling 267 one end is electrically connected with the second conductive electrode 223 bottom, and the other end is electrically connected with join domain 235.
Compared with prior art, second conductive electrode 223 adopts bilateral cabling to design, signal transmission can be strengthened, one side open circuit preventing capacitance type touch-control panel 20 cabling from may occur in signals transmission makes signal cannot be transferred to the situation of touch-control IC (not shown), improves the touch-control sensitivity of capacitance type touch-control panel 20.
In other distressed structures, first conductive electrode (not shown) also adopts above bilateral cabling design, the corresponding connecting line 262 of every bar cabling (not shown), cabling (not shown) is electrically connected by through hole 271 and connecting line 262.
Refer to Figure 10, the capacitance type touch-control panel 30 of third embodiment of the invention, first nano-silver thread conductive layer 303 and the second nano-silver thread conductive layer 305 are arranged at first substrate 301 upper and lower surface respectively, and first substrate 301 is having mercy on property flexible base, board, first substrate 301 due to be heated or temperature variation time produce deformation and allow the first nano-silver thread conductive layer 303 and the second nano-silver thread conductive layer 305 cannot be good comprehensively cover on first substrate 301, special meeting is at the first nano-silver thread conductive layer 303 and first substrate 301, and, one deck adhesion promoting layer 302 is applied between second nano-silver thread conductive layer 305 and first substrate 301, the coated area of adhesion promoting layer 302 is 100% of the first nano-silver thread conductive layer 303 or the second nano-silver thread conductive layer 305 surface area, or 80%-90%, minimumly be not less than 50%, herein coated area with the first nano-silver thread conductive layer 303 and the second nano-silver thread conductive layer 305 surface area for benchmark, namely when the first nano-silver thread conductive layer 303 and the second nano-silver thread conductive layer 305 are greater than, when being less than or equal to first substrate 301 surface area, coated area is 100% of the first nano-silver thread conductive layer 303 and the second nano-silver thread conductive layer 305 surface area, or 80%-90%, minimumly be not less than 50%.The expansion coefficient of described adhesion promoting layer 302 is less than the expansion coefficient of pliability first substrate 301.Due to the change often along with temperature in film forming manufacturing process; and when first substrate 301 is for having larger expansion coefficient during flexible base plate; significant volume change is often had in the process of heating, cooling; thus make pliability first substrate 301 produce warpage or the distortion of the second bending direction; and then cause exposure or the problem of poor focusing; the existence of described adhesion promoting layer 302, can be good at solving the problem.
Thus, capacitance type touch-control panel 30 rhythmo structure from top to bottom of the 3rd embodiment comprises second substrate 307, decorative layer 311 successively, bonding coat 309, the first nano-silver thread conductive layer 303, adhesion promoting layer 302, first substrate 301, adhesion promoting layer 302 and the second nano-silver thread conductive layer 305.
Overlap simply by virtue of intermolecular force between nano-silver thread 801, easily there is slippage deflecting under effect, provide adhesion promoting layer 302 make the first nano-silver thread conductive layer 303 and the adhesion between the second nano-silver thread conductive layer 305 and first substrate 301 good.Usual nano-silver thread conductive layer 805 is more firm with the attachment of base material, and the overlap joint between nano-silver thread 801 is then more good, thus provides good conductance.Generally speaking; film forming manufacturing process is when carrying out; often variation with temperature can be accompanied; and flexible base plate has larger expansion coefficient; significant volume change is often had in the middle of the process of cooling that heats up; during film forming manufacturing process; Chang Yinwei is adhered to the expansion of the flexible base plate on hard substrate or contraction and makes flexible base plate produce warpage or the distortion of the second bending direction; and then cause exposure or the burnt poly-problem such as bad, the series of problems caused because of the expansion of flexible base plate or contraction is solved by adhesion promoting layer.
Refer to Figure 11, first nano-silver thread conductive layer 403 of the capacitance type touch-control panel 40 of fourth embodiment of the invention and the second nano-silver thread conductive layer 405 arrange a levelling blanket 404 respectively, described levelling blanket 404 lays respectively at the first nano-silver thread conductive layer 403 upper surface and the second nano-silver thread conductive layer 405 lower surface, or preferred, the first nano-silver thread conductive layer 403 and the second nano-silver thread conductive layer 405 are partially submerged in levelling blanket 404 in a thickness direction.After first nano-silver thread conductive layer 403 and the second nano-silver thread conductive layer 405 are coated on first substrate about 401 two surfaces, nano-silver thread 801 can not tile equably and overlap more preferably, make poor flatness, simultaneously due to phenomenon that the harmful effect nano-silver thread 801 that laps one another between nano-silver thread 801 is upturned.By applying levelling blanket 404 on the first nano-silver thread conductive layer 403 and the second nano-silver thread conductive layer 405, and after certain PROCESS FOR TREATMENT, the overlap joint area between nano-silver thread 801 can be made to increase thus improve the conductance of nano-silver thread 801 and reach good surface smoothness.
Thus, capacitance type touch-control panel 40 rhythmo structure from top to bottom of the 4th embodiment comprises second substrate 407, decorative layer 411 successively, bonding coat 409, levelling blanket 404, the first nano-silver thread conductive layer 403, first substrate 401, the second nano-silver thread conductive layer 405 and levelling blanket 404.
The capacitance type touch-control panel 40 of the present embodiment can also comprise and above-mentionedly comprise adhesion promoting layer 302.Adhesion promoting layer 302 lay respectively at the first nano-silver thread conductive layer 403 wherein between a surface and first substrate 401, wherein between a surface and first substrate 401 of the second nano-silver thread conductive layer 405, levelling blanket lay respectively at the first nano-silver thread conductive layer 403, second nano-silver thread conductive layer 405 another on the surface.
After making conductive electrode with nano-silver thread conductive layer 805, nano-silver thread 801 is upturned and has an impact to capacitance type touch-control panel 40 surface smoothness, intermolecular force is only relied on to realize overlap joint between nano-silver thread 801, have overlap joint bad thus affect the problem of conductance, by providing levelling blanket 404 and carrying out certain PROCESS FOR TREATMENT, the overlap joint between nano-silver thread 801 is made to become good, thus conductance is effectively ensured, and the surface smoothness of capacitance type touch-control panel 40 is greatly improved.
Refer to Figure 12, the capacitance type touch-control panel 50 of fifth embodiment of the invention comprises optical match layer 506, and described optical match layer 506 is between first substrate 501 and the first nano-silver thread conductive layer 503, between first substrate 501 and the second nano-silver thread conductive layer 505.
Optical match layer 506 can be organism or inorganics, or organic and inorganic mixed coating.The optical film thickness of described optical match layer 506 is for being less than or equal to 1/4 wavelength odd-multiple.
The generation type of described optical match layer 506 can be physical deposition, chemogenic deposit, vacuum coating, printing, spraying, flexo, nano impression, serigraphy, scraper for coating, rotary coating, bar-shaped coating, cylinder is coated with, the coating of line rod, any one mode such as dip coated.
Need to overcome because the first nano-silver thread conductive layer 503, second nano-silver thread conductive layer 505 has haze issues, therefore after increasing optical match layer 506 in the present embodiment, the mist degree of described first nano-silver thread conductive layer 503, second nano-silver thread conductive layer 505 can be reduced to and be less than or equal to about 3%, is preferably less than or once with 1.5%.
Thus, capacitance type touch-control panel 50 rhythmo structure from top to bottom of the 5th embodiment comprises second substrate 507 successively, decorative layer 511, bonding coat 509, first nano-silver thread conductive layer 503, optical match layer 506, first substrate 501, optical match layer 506 and the second nano-silver thread conductive layer 505.
In another embodiment, optical layers matching layer 506 and the first nano-silver thread conductive layer 503, second nano-silver thread conductive layer 505 position can exchange.When optical match layer 506 is on the first nano-silver thread conductive layer 503, second nano-silver thread conductive layer 505 surface, can, as protective seam, prevent nano-silver thread 801 to be oxidized, corrosion etc. be directly exposed to outer series of problems simultaneously.
The adjustment to capacitance type touch-control panel 50 mist degree is realized by optical match layer 506, and flexible and changeable for the status requirement of optical match layer 506, realize the reduction of the mist degree to nano-silver thread conductive layer 805 flexibly and effectively.
In other distressed structure embodiments, first nano-silver thread conductive layer 503 and the second nano-silver thread conductive layer 505 both sides can arrange the adhesion promoting layer 302 of above-described embodiment, levelling blanket 404, one or more layers among optical match layer 506, adhesion promoting layer 302, levelling blanket 404, optical match layer 506 can be arranged on homonymy or the not homonymy of the first nano-silver thread conductive layer 503 and the second nano-silver thread conductive layer 505, adhesion promoting layer 302, levelling blanket 404, the position between optical match layer 506 three is interchangeable.
Refer to Figure 13, be the sixth embodiment of the present invention, the present embodiment is the manufacture method of capacitance type touch-control panel 10, and the method comprises the following steps:
S11: the first substrate 101 that a transparent insulation is provided.
S12: formed at described first substrate 101 upper surface and etch the first nano-silver thread conductive layer 103.This first nano-silver thread conductive layer 103 is done further patterned process, form the first conductive electrode 121 pattern and first cabling 161 of anticipation, first conductive electrode 121 pattern and the first cabling 161 are formed on same processing procedure, wet etching can be adopted, oxide etch, laser etches, and the patterning methods such as electric arc high-frequency induction etching form the first conductive electrode 121 pattern and the first cabling 161.
S13: formed on the lower surface of described first substrate 101 and etch the second nano-silver thread conductive layer 105.This second nano-silver thread conductive layer 105 is done further etch processes, form the second conductive electrode 123 pattern, second cabling of anticipation, join domain 135 and connecting line, make the second conductive electrode 123 pattern case, the second cabling 163, join domain 135 and connecting line 162 are formed on same processing procedure.Can adopt wet etching, oxide etch, the patterning methods such as laser etches, the etching of electric arc high-frequency induction make, and this step also comprises the join domain 135 making and be connected with flexible PCB 137.
S14: the through hole 171 running through first substrate 101 is set in the upper or lower edge margin of first substrate 101.Through hole 171 can adopt conventional hole forming method to make, such as of numerical control machining center or other machines.
S15: pour into conductive material or at through hole 171 inner ring metal cladding to through hole 171 li.
S16: pressing (Bonding) flexible PCB 137.Utilize ACF (full name: AnisotropicConductiveFilm, Chinese: anisotropic conductive film) that flexible PCB 137 and join domain 135 are carried out pressing, make touching signals be transferred to touch chip.
S17: the second substrate 107 that a transparent insulation is provided, second substrate 107 upper surface and human body touch-control medium contact.Second substrate 107 can for the cover plate often stated.
S18: described first substrate 101 is pasted together by bonding coat 109 with described second substrate 107.
Refer to Figure 14, the capacitance type touch-control panel 70 of the seventh embodiment of the present invention is substantially identical with capacitance type touch-control panel 10 structure, comprise first substrate 701, the first nano-silver thread conductive layer 703 is formed at first substrate 701 upper surface, bonding coat 709, second substrate 707, the second nano-silver thread conductive layer 705 is formed at the second basic 707 lower surfaces, shielding layer 711 is arranged between second substrate 707 and the second nano-silver thread conductive layer 705, wherein second substrate 707 upper surface contacts with touching object, can be regarded as the cover plate often stated.First nano-silver thread conductive layer 703 comprises the first conductive electrode and the first cabling (does not indicate in figure, see Fig. 6), second nano-silver thread conductive layer 705 comprises the second conductive electrode, the second cabling, connecting line and join domain (not indicating in figure, see Fig. 7).
First substrate 701 is formed with multiple through hole 771, the through first substrate 701 of through hole 771 and bonding coat 709.
In through hole 771 filled conductive material or in through hole 771 formed the coat of metal, this conductive material can be conductive silver paste, copper slurry or other conducting metals starch.The diameter of this through hole 771 is Φ 20um to 1mm, preferred 200um-600um.First cabling of the first nano-silver thread conductive layer 703 is electrically connected by the connecting line of through hole 771 and the second nano-silver thread conductive layer 705 and is extended to join domain, and a flexible PCB conducting can be connected the first nano-silver thread conductive layer 703 and the second nano-silver thread conductive layer 705 with join domain pressing.
Decorative layer 711 only can be arranged on second substrate about 107 both sides, realizes the design of capacitance type touch-control panel 70 the right and left Rimless.
Bonding coat 709, for first substrate 701 and second substrate 707 being bonded as one, has insulativity.Bonding coat 709 can select the Optical transparent adhesive of insulation.
In other distressed structures, the first nano-silver thread conductive layer 703 can be arranged on the lower surface of first substrate 701.
Refer to Figure 15, the capacitance type touch-control panel 90 of the eighth embodiment of the present invention comprises first substrate 901, the first nano-silver thread conductive layer 903, bonding coat 909, the second nano-silver thread conductive layer 905 and second substrate 907, through hole 971.The lower surface of first substrate 901 lays the first nano-silver thread conductive layer 903, and second substrate 907 upper surface lays the second nano-silver thread conductive layer 905.
The through first substrate 901 of through hole 971, second substrate 907, bonding coat 909.
When using this capacitance type touch-control panel, also can arrange a cover plate (not shown) at the upper surface of second substrate, protect the substrate of its underpart and conductive electrode, cover plate can select material identical or different with first substrate 901.In through hole 971 filled conductive material or in through hole 971 formed the coat of metal, for connecting the cabling corresponding with it, this conductive material can be conductive silver paste, copper slurry or other conducting metals starch.The diameter of this through hole 971 is Φ 20um to 1mm, preferred 200um-600um.First cabling of the first nano-silver thread conductive layer 903 is electrically connected by the connecting line of through hole 971 and the second nano-silver thread conductive layer 905 and is extended to join domain, and a flexible PCB conducting can be connected the first nano-silver thread conductive layer 903 and the second nano-silver thread conductive layer 905 with join domain pressing.
Bonding coat 909 is for being bonded as one by first substrate 901 and second substrate 907, bonding coat 909 can select the Optical transparent adhesive (OpticalClearAdhesive is called for short OCA glue) of insulation.
In other distressed structures, the first nano-silver thread conductive layer 903 is arranged at first substrate 901 lower surface, and the second nano-silver thread conductive layer 905 is arranged at first substrate 907 lower surface, and through hole runs through first substrate 901, bonding coat 909 and/or second substrate 907; Or the first nano-silver thread conductive layer 903 is arranged at first substrate 901 upper surface, the second nano-silver thread conductive layer 905 is arranged at first substrate 907 lower surface, and through hole runs through first substrate 901, bonding coat 909 and/or second substrate 907; Or the first nano-silver thread conductive layer 903 is arranged at first substrate 901 upper surface, the second nano-silver thread conductive layer 905 is arranged at first substrate 907 upper surface, and through hole runs through first substrate 901, bonding coat 909 and/or second substrate 907.
Compared with prior art, capacitance type touch-control panel 10 of the present invention adopts nano-silver thread conductive layer 805 to make the first nano-silver thread conductive layer 103 and the second nano-silver thread conductive layer 105.First, it is low that nano-silver thread 801 material itself has resistance, and light transmission rate is more than 85%, and sheet resistance is in the superiority of 12-120ohm/sq, make the first nano-silver thread conductive layer 103 and the second nano-silver thread conductive layer 105 have good electric conductivity, the touch-control of capacitance type touch-control panel 10 is highly sensitive.The good resistance of light transmission because of nano-silver thread 801 is low, if use nano-silver thread 801 to do cabling to cover without the need to using shielding layer 111, thus realizing the design of capacitance type touch-control panel 10 Rimless, Rimless capacitance type touch-control panel 10 makes user visually openr, and adding users is experienced.
Secondly, the present invention, in this capacitance type touch-control panel 10 layer structure, increases adhesion promoting layer 302, levelling blanket 404 and optical match layer 506, and adhesion promoting layer 302 solves the series of problems that nano-silver thread 801 material causes because of the expansion of flexible base plate or contraction.Increase levelling blanket 404 and carry out certain PROCESS FOR TREATMENT, making the overlap joint between nano-silver thread 801 become good, thus conductance is effectively ensured, and the surface smoothness of capacitance type touch-control panel 10 is greatly improved.The adjustment to capacitance type touch-control panel 10 mist degree is realized by optical match layer 506, and flexible and changeable for the status requirement of optical match layer 506, realize the reduction to capacitance type touch-control panel 10 mist degree flexibly and effectively.
Again, capacitance type touch-control panel 10 cabling of the present invention adopts nano-silver thread 801 material and adopts the design of bilateral cabling to strengthen signal transmission, one side open circuit preventing capacitance type touch-control panel 10 cabling from may occur in signals transmission causes signal cannot be transferred to situation on touch-control IC, improves the touch-control sensitivity of capacitance type touch-control panel 10.Nano Silver cabling and electrode one-body molded, without overlap joint bad, the problem that overlap resistance is higher.
In addition, capacitance type touch-control panel 10 of the present invention adopts cabling via design, relative to conventional I TO and metal sputtering processing procedure, first substrate 101 planarization is required it is not very high in the conductive layer of nano-silver thread 801 and cabling coating process, etching can not be caused unclean, residual, the problems such as crackle, simultaneously due to the size effect of its Nano grade, make it have excellent light transmission and flexible resistance, therefore can be used as and preferably substitute ITO as touch control electrode and cabling material.
In capacitance type touch-control panel method for making of the present invention, adopt nano-silver thread 801 as cabling material, first conductive electrode 121 and cabling thereof can complete in processing procedure, second conductive electrode 123 and cabling thereof also can complete in processing procedure, simplify technique, consuming time few, cost is low.The cabling of capacitance type touch-control panel 10 adopts via design, only needs use flexible PCB 137, one step press (bonding) processing procedure, further simplify capacitance type touch-control panel 10 Making programme, consuming time short, saves material, reduces costs.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within principle of the present invention, equivalent replacement and improvement etc. all should comprise within protection scope of the present invention.

Claims (10)

1. a capacitance type touch-control panel, comprise a substrate, first nano-silver thread conductive layer and the second nano-silver thread conductive layer, second nano-silver thread conductive layer form in substrate wherein one on the surface, it is characterized in that: the first nano-silver thread conductive layer comprises plural first conductive electrode and plural first cabling, second nano-silver thread conductive layer comprises plural second conductive electrode, plural second cabling, complex connecting line and join domain, described capacitance type touch-control panel also comprises plural through hole, and the first cabling and connecting line are electrically connected by through hole.
2. capacitance type touch-control panel as claimed in claim 1, is characterized in that: the diameter of described through hole is Φ 20um to 1mm.
3. capacitance type touch-control panel as claimed in claim 1, is characterized in that: the diameter of described through hole is Φ 200um to 600um.
4. capacitance type touch-control panel as claimed in claim 1, is characterized in that: be provided with conductive material in described through hole.
5. capacitance type touch-control panel as claimed in claim 1, it is characterized in that: the width of the first cabling and the second cabling is 5um-35um, the line-spacing of adjacent first cabling or adjacent second cabling is 5um-35um.
6. capacitance type touch-control panel as claimed in claim 1, it is characterized in that: telecommunications signal is drawn respectively by the first cabling by the first described conductive electrode two ends, telecommunications signal is drawn respectively by the second cabling by the second described conductive electrode two ends.
7. capacitance type touch-control panel as claimed in claim 1, is characterized in that: the first nano-silver thread conductive layer and the second nano-silver thread conductive layer are arranged on two surfaces of described substrate respectively, and through hole runs through substrate.
8. capacitance type touch-control panel as claimed in claim 1, it is characterized in that: comprise a cover plate further, comprise first surface and second surface, first surface is touch operation surface, first nano-silver thread conductive layer forms on the second surface of cover plate, and through hole runs through described substrate.
9. capacitance type touch-control panel as claimed in claim 1, it is characterized in that: comprise a second substrate further, the first nano-silver thread conductive layer forms on second substrate, and through hole runs through substrate and/or second substrate.
10. the capacitance type touch-control panel as described in any one of claim 1-9, it is characterized in that: the first described nano-silver thread conductive layer and the second described nano-silver thread conductive layer both sides can arrange adhesion promoting layer, levelling blanket, one or more layers among optical match layer, described adhesion promoting layer, levelling blanket, optical match layer can be arranged on homonymy or the not homonymy of the first described nano-silver thread conductive layer and the second described nano-silver thread conductive layer, described adhesion promoting layer, levelling blanket, the position between optical match layer three is interchangeable.
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