CN105181157B - A kind of thermometric wafer micromatic setting - Google Patents
A kind of thermometric wafer micromatic setting Download PDFInfo
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- CN105181157B CN105181157B CN201410281209.XA CN201410281209A CN105181157B CN 105181157 B CN105181157 B CN 105181157B CN 201410281209 A CN201410281209 A CN 201410281209A CN 105181157 B CN105181157 B CN 105181157B
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- China
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- pin needle
- line slideway
- lifting support
- pallet
- needle lifting
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Abstract
The present invention relates to semiconductor crystal wafer detection field, it is specifically a kind of to realize the thermometric wafer micromatic setting of fine position between thermometric wafer and card in the detection of semiconductor hot plate temperature homogeneity, including PIN needle, PIN needle lifting support, line slideway bearing, micrometer and pallet, wherein line slideway bearing is installed on pallet, PIN needle lifting support is liftably installed on the line slideway bearing, the middle part of the PIN needle lifting support is provided with groove, PIN needle is arranged in the groove of the PIN needle lifting support, the groove is inserted in the line slideway bearing, micrometer is installed on the downside of pallet, the measurement round bar free end of the micrometer is inserted in the line slideway bearing and offseted with the groove floor of the PIN needle lifting support, so it is the height of adjustable PIN needle by the micrometer.The present invention is simple in construction, and testing efficiency is high, can quantify test index.
Description
Technical field
It is specifically a kind of in the detection of semiconductor hot plate temperature homogeneity the present invention relates to semiconductor crystal wafer detection field
In can realize the thermometric wafer micromatic setting of fine position between thermometric wafer and card.
Background technology
At present in semiconductor crystal wafer production process, for the requirement more and more higher of hot plate card temperature homogeneity, normally
Production assembling after disk body carry out hot plate card temperature homogeneity test when, due to some foozles with assembling miss
Difference, test result is tended not to reach expected card temperature homogeneity index request, if it is possible to which disk body not up to standard is entered
The appropriate adjustment of row is allowed to meet use requirement, is possible to greatly save equipment cost, prevents from causing waste product because performance is not up to standard,
Also it is beneficial to the temperature homogeneity index request that card is further improved on the basis of existing simultaneously, with the increasingly complicated essence that faces the future
Close technological requirement.
The content of the invention
It is an object of the invention to provide a kind of thermometric wafer micromatic setting, in the detection of semiconductor hot plate temperature homogeneity
Position minor alteration between wafer and card can be realized, then hot plate is adjusted according to test wafer actual surface profiling temperatures
It is allowed to meet and requires.
The purpose of the present invention is achieved through the following technical solutions：
A kind of thermometric wafer micromatic setting, including PIN needle, PIN needle lifting support, line slideway bearing, micrometer and support
Disk, wherein line slideway bearing is installed on pallet, and PIN needle lifting support is liftably installed on the line slideway bearing
On, the middle part of the PIN needle lifting support is provided with groove, and PIN needle is arranged in the groove of the PIN needle lifting support, described
Groove is inserted in the line slideway bearing, micrometer is provided with the downside of pallet, the measurement round bar of the micrometer is certainly
Stretched into the line slideway bearing by end and offseted with the groove floor of the PIN needle lifting support.
The both sides of the PIN needle lifting support are respectively equipped with side plate, and the side plate is arranged at outside the line slideway bearing,
And be connected by line slideway with the line slideway bearing.
The track portion of the line slideway is installed on line slideway bearing, and the Slipper of line slideway is arranged on
On the side plate of PIN needle lifting support.
The free end of the PIN needle is extend out to outside the PIN needle lifting support.
The pallet passes through pallet bearing support.
Advantages of the present invention is with good effect：
1st, the micromatic setting applied to temperature of heat plate uniformity test that the present invention is designed is simple in construction, easy to operate, energy
Enough greatly improve the testing efficiency of temperature of heat plate uniformity test.
2nd, during the present invention can be directly used for hot plate uniformity test, directly sentenced in testing according to mike
Whether the height of fault wall face Ceramic Balls is reasonable, and the highly desired adjustment amount of different Ceramic Balls in card.
3rd, by using the present invention, the height adjusted can be needed to have a quantizating index, Neng Gougeng card Ceramic Balls
It is accurately controlled the hot plate card temperature homogeneity after adjustment.
Brief description of the drawings
Fig. 1 is structural perspective of the invention,
Fig. 2 is sectional view of the invention in Fig. 1,
Fig. 3 is PIN needle lifting support structural representation in Fig. 1,
Fig. 4 is use state schematic diagram of the invention in Fig. 1,
Fig. 5 is enlarged drawing at I in Fig. 4.
Wherein, 1 is PIN needle, and 2 be PIN needle lifting support, and 3 be line slideway, and 4 be line slideway bearing, and 5 be micrometer,
6 be pallet, and 7 be pallet bearing, and 8 be groove, and 9 be side plate, and 10 be hot plate.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
As shown in Fig. 1~2, the present invention include PIN needle 1, PIN needle lifting support 2, line slideway 3, line slideway bearing 4,
Micrometer 5, pallet 6 and pallet bearing 7, wherein pallet 6 are supported by three pallet bearings 7, and line slideway bearing 4 passes through bolt
It is installed on the pallet 6, the middle part of line slideway bearing 4 is provided with through hole.
As shown in figure 3, PIN needle lifting support 2 is the U shape structure for removing base, in PIN needle lifting support 2
Portion is provided with a groove 8, and both sides are respectively equipped with side plate 9, and PIN needle 1 is arranged in the groove 8, and PIN needle 1 and measurement are brilliant
The free end that circle offsets is extend out to outside the PIN needle lifting support 2.The groove 8 of PIN needle lifting support 2 is inserted into line slideway
In the through hole of bearing 4, the side plate 9 of the both sides of PIN needle lifting support 2 is arranged at when the groove 8 is inserted into line slideway bearing 4
Outside the line slideway bearing 4, and provided with straight between the side plate 9 of the lateral wall of line slideway bearing 4 and PIN needle lifting support
Line guide rail 3, the track portion of wherein line slideway 3 is installed on line slideway bearing 4, and the Slipper of line slideway 3 is installed
On the side plate 9 of PIN needle lifting support.
Micrometer 5 is installed in the downside surface of pallet 6, micrometer 5 described in the present embodiment is digital display micrometer gauge,
The measurement round bar free end of the micrometer 5 is stretched into the line slideway bearing 4, when device works, the measurement of micrometer 5
Round bar free end and the bottom surface of groove 8 of PIN needle lifting support 2 offset, and push away the measurement round bar of micrometer by adjusting micrometer 5
Dynamic PIN needle lifting support 2 is moved up and down, and the linear motion up and down of PIN needle lifting support 2 is ensured by line slideway 3, so just
Realize by adjusting micrometer 5 to adjust the height for the PIN needle being arranged on PIN needle lifting support 2.
The present embodiment is evenly equipped with three PIN needles 1 on pallet 6, and the up and down motion of each PIN needle is separate
, it can so be effectively ensured during thermometric and different tune are done in different directions to the relative card height of thermometric wafer
Whole, the particular number of the PIN needle 1 can be set according to actual needs.
The present invention operation principle be：
As shown in Figures 4 and 5, the present invention is arranged at the lower section of hot plate 10 in test, provided with confession on the disk body of hot plate 10
The through hole that the PIN needle 1 is passed through.In hot plate uniformity test, when the thermometric wafer being placed in hot plate card is in certain bar
We can learn temperature homogeneity index after stabilization under part, and when temperature homogeneity index is unqualified, we can pass through thousand
Divide the height of the adjustment of chi 5 PIN needle 1, so as to realize the accurate adjustment to thermometric wafer relative to hot plate card difference in height, adjusting
The temperature homogeneity index that thermometric wafer is detected in journey can also change therewith, and the actual table of thermometric wafer is tested by temperature measuring equipment
Face Temperature Distribution, just can determine that whether rationally and the adjustment amount size that needs of Ceramic Balls the height of Ceramic Balls in card, works as adjustment
When meeting expectation index to temperature homogeneity, the height adjustment amount of different PIN needles can also be recorded, realize needs to card Ceramic Balls
The height to be adjusted has a quantizating index, can more precise control adjustment after hot plate card temperature homogeneity.
Claims (5)
1. a kind of thermometric wafer micromatic setting, it is characterised in that：Including PIN needle (1), PIN needle lifting support (2), line slideway
Bearing (4), micrometer (5) and pallet (6), wherein line slideway bearing (4) are installed on pallet (6), PIN needle lifting support
(2) liftably it is installed on the line slideway bearing (4) by line slideway (3), the PIN needle lifting support (2)
Middle part is provided with groove (8), and PIN needle (1) is arranged in the groove (8) of the PIN needle lifting support (2), the line slideway branch
Through hole is provided with the middle part of seat (4), groove (8) outer wall is inserted in the through hole on the line slideway bearing (4), in pallet
(6) micrometer (5) is installed, the line slideway bearing (4) is stretched into the measurement round bar free end of the micrometer (5) on the downside of
In and offseted with groove (8) bottom surface of the PIN needle lifting support (2).
2. thermometric wafer micromatic setting according to claim 1, it is characterised in that：The two of the PIN needle lifting support (2)
Side is respectively equipped with side plate (9), and the side plate (9) is arranged at the line slideway bearing (4) outside, and by line slideway (3) with
The line slideway bearing (4) is connected.
3. thermometric wafer micromatic setting according to claim 2, it is characterised in that：The slide rail portion of the line slideway (3)
Divide and be installed on line slideway bearing (4), the Slipper of line slideway (3) is arranged on the side plate (9) of PIN needle lifting support
On.
4. thermometric wafer micromatic setting according to claim 1, it is characterised in that：The free end of the PIN needle (1) is stretched out
To the PIN needle lifting support (2) outside.
5. thermometric wafer micromatic setting according to claim 1, it is characterised in that：The pallet (6) passes through pallet bearing
(7) support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410281209.XA CN105181157B (en) | 2014-06-20 | 2014-06-20 | A kind of thermometric wafer micromatic setting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410281209.XA CN105181157B (en) | 2014-06-20 | 2014-06-20 | A kind of thermometric wafer micromatic setting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105181157A CN105181157A (en) | 2015-12-23 |
| CN105181157B true CN105181157B (en) | 2017-07-28 |
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ID=54903402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410281209.XA Active CN105181157B (en) | 2014-06-20 | 2014-06-20 | A kind of thermometric wafer micromatic setting |
Country Status (1)
| Country | Link |
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| CN (1) | CN105181157B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4300003B2 (en) * | 2002-08-07 | 2009-07-22 | 東京エレクトロン株式会社 | Mounting table driving apparatus and probe method |
| CN100517631C (en) * | 2006-09-22 | 2009-07-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for uplifting device and adjusting plane degree of lifting device |
| JP2008256650A (en) * | 2007-04-09 | 2008-10-23 | Yokogawa Electric Corp | Semiconductor test device |
| CN101259921B (en) * | 2008-04-14 | 2011-03-16 | 无锡市易控系统工程有限公司 | Full-automatic conveying device for wafer |
| US9121901B2 (en) * | 2009-02-12 | 2015-09-01 | Advantest Corporation | Semiconductor wafer test apparatus |
| JP5675239B2 (en) * | 2010-09-15 | 2015-02-25 | 東京エレクトロン株式会社 | Wafer inspection interface and wafer inspection apparatus |
| CN201945302U (en) * | 2010-12-30 | 2011-08-24 | 常州松晶电子有限公司 | Wafer angle testing location device |
| CN103633006B (en) * | 2013-12-11 | 2016-08-17 | 中国电子科技集团公司第二研究所 | Chip wafer jacking mechanism |
-
2014
- 2014-06-20 CN CN201410281209.XA patent/CN105181157B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105181157A (en) | 2015-12-23 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |