CN105177468B - A kind of Cu Ag amorphous alloy films and preparation method thereof - Google Patents
A kind of Cu Ag amorphous alloy films and preparation method thereof Download PDFInfo
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- CN105177468B CN105177468B CN201510528837.8A CN201510528837A CN105177468B CN 105177468 B CN105177468 B CN 105177468B CN 201510528837 A CN201510528837 A CN 201510528837A CN 105177468 B CN105177468 B CN 105177468B
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Abstract
The invention discloses a kind of Cu Ag amorphous alloy films and preparation method thereof, it is characterised in that the structural formula of amorphous alloy film is Cu68Ag32；The amorphous alloy film is obtained using Vacuum Coating method, and evaporation mode is simplest thermal resistance evaporation；In evaporation experimentation, Cu, Ag block is respectively implanted in two evaporation boats, 5 × 10 are evacuated down to‑4During Pa, start plated film, the evaporation current of Cu blocks and Ag blocks is adjusted to into 125A and 100A respectively, whole evaporation process prevents target temperature too high using water-cooling system.The Cu that the present invention is obtained68Ag32Amorphous alloy film non crystalline structure is apparent, and surface compact is smooth, and the method for the present invention is simple to operate, and cost is relatively low.
Description
Technical field
The invention belongs to amorphous alloy thin technology field of membrane materials, particularly relates to a kind of Cu-Ag amorphous alloy thins
Film and preparation method thereof.
Background technology
It is generally believed that the earliest research with regard to amorphous alloy film is deposit N i-S alloys, nineteen thirty can be traced back to.
And then, the amorphous alloy film that prepared by Kramer reported firsts evaporation deposition method.Nineteen fifty, A.Brenner electro-deposition
Method obtains Ni-P and Co-P amorphous alloy films.The amorphous alloy films such as Fe bases, Zr bases are used as hard surface abrasion resistance, corrosion resistant
Erosion layer has obtained wide application.
In recent ten years, with the continuous progress of technology of thin film material preparation and characterization method, glassy metal film grinds
Study carefully work gradually to increase.Research finds that amorphous alloy film not only has good glass forming ability, with block amorphous alloy
Compare, it has more excellent mechanics and magnetic property, shows good comprehensive physical and chemical property.Just because of non-
Peritectic alloy film has an above advantage, amorphous alloy film have been widely used for space flight and aviation, electronic component, machine components and
The fields such as petrochemical industry, in actual life, the application of amorphous alloy film has been even more than block amorphous alloy.Non-crystaline amorphous metal
Film has important potential using value, and the research to amorphous alloy film will drive amorphous alloy material and whole material
The development that material is learned.
Cu base noncrystal alloys are since being developed, because its relatively low cost and excellent mechanical property are subject to material
The concern in field, is considered as specifically being widely applied prospect.The Cu-Ag non-crystaline amorphous metals prepared using simplest reactive evaporation
Film, it is simple to operate, it is with low cost, with important Research Significance.
The content of the invention
The present invention use simplest thermal resistance evaporation coating method, there is provided a kind of novel C u-Ag amorphous alloy film and
Preparation method.
The present invention solves technical problem, adopts the following technical scheme that：
The Cu-Ag amorphous alloy films of the present invention, its feature is：Described Cu-Ag amorphous alloy films, its structural formula
For Cu68Ag32。
The concrete preparation process of above-mentioned Cu-Ti amorphous alloy films is as follows：
(1) Cu blocks and Ag blocks are cut, and Cu blocks and Ag blocks surface are polished, each 10min is cleaned successively with acetone and alcohol, is blown
It is dry stand-by；
(2) two evaporation boats are arranged on the evaporation source frame of thermal resistance evaporation coating system, and Cu blocks and Ag blocks is distinguished
It is placed in two evaporation boats, substrate is placed on substrate pallet, closes vacuum chamber and open cooling water；
(3) 5 × 10 are evacuated to-4Below Pa, then respectively by the evaporation current of Cu blocks and Ag blocks be adjusted to 125A and
100A, makes Cu and Ag while evaporating and being deposited on substrate, controls 1～4h of sedimentation time, obtains final product Cu68Ag32Amorphous alloy thin
Film.
The purity of raw material Cu blocks and Ag blocks is not less than 99.9wt.%.
By adjusting sedimentation time, Cu is controlled68Ag32The thickness of amorphous alloy film.
Above-mentioned Cu-Ag amorphous alloy films are prepared using thermal resistance evaporation coating system, and unit type used is：DZS-
500 type thermal resistance evaporation coating systems, middle tech, Chinese (Shenyang).
The non crystalline structure characteristic of above-mentioned Cu-Ag amorphous alloy films is using X-ray diffraction method (XRD) detection, device therefor
Model：X ' Pert Pro MPD X-ray diffractometers, PANalytical (Panalytical), Holland.
The surface topography and composition of above-mentioned Cu-Ag amorphous alloy films adopts field emission scanning electron microscope (FE-SEM)
And subsidiary energy disperse spectroscopy (EDS) detection, device therefor model：SU8020, FDAC, Japan.
The microstructure of above-mentioned Cu-Ag amorphous alloy films is using AFM detection, device therefor model：
Dimension, Brooker, Germany.
Beneficial effects of the present invention are embodied in：
The Cu-Ag amorphous alloy films of the present invention are prepared using the technology of simplest thermal resistance evaporation plated film, amorphous knot
Structure is apparent, and surface compact is smooth, and simple to operate, and cost is relatively low.
Description of the drawings
Fig. 1 is the XRD of alloy firm prepared by embodiment 1, tests the K using Cu targetsαRay；
Fig. 2 is the SEM surface topography maps of alloy firm prepared by embodiment 1；
Fig. 3 is the SEM end face shape figures of alloy firm prepared by embodiment 1；
Fig. 4 is the AFM microstructure schematic diagrames of alloy firm prepared by embodiment 1.
Specific embodiment
Embodiment 1：Cu68Ag32The preparation of amorphous alloy film
Step 1：By raw material Cu (99.9wt%), surface scale is removed in Ag (99.9wt%) polishings, and sequentially passes through
After acetone, alcohol are cleaned by ultrasonic each 10min, two evaporation boats being placed on the evaporation source frame of thermal resistance evaporation coating system
It is interior, substrate sheet glass is cleaned by ultrasonic after each 10min Jing acetone, alcohol, deionized water successively with silicon chip, is dried up and is placed in substrate bracket
On disk；
Step 2：Put air valve into, open cooling water, blast pipe is placed in outside window, open filming equipment general supply, open mechanical pump electricity
Source, opens side and takes out valve, open vacuum meter, and when vacuum is less than 10Pa, closing is other to take out valve, and opening slide valve opens molecular pump
Power supply, when vacuum is less than 5 × 10-4During Pa, thermal evaporation power supply is opened；Respectively the evaporation current of Cu blocks and Ag blocks is adjusted to
125A and 100A, makes the melt material plated film on evaporation boat, sedimentation time 70min；End to be coated revolves thermal evaporation sources electric current
Button is zeroed, and cools down evaporation boat, closes evaporation power supply.
Step 3：Its composition is detected by energy disperse spectroscopy to sample obtained by above-mentioned steps 2, it is known that the composition of gained sample is put down
It is Cu68Ag32；
Step 4：Its structure is detected by XRD to sample obtained by above-mentioned steps 2, as shown in figure 1, there is obvious crystal
Peak, wherein first steamed bun peak is glass substrate Interference Peaks, second peak is the obvious sharpening of sample peak (40 °～50 °), explanation
The sample of preparation is amorphous structure.
Step 5：Its surface topography is detected by SEM to the sample prepared by above-mentioned steps 2, as shown in Fig. 2 film surface
Smooth densification, no obvious crackle.
Step 6：Its thickness is detected by SEM to the sample prepared by above-mentioned steps 2, as shown in figure 3, the film thickness is about
For 141nm.
Step 7：Its microscopic appearance is detected by AFM to the sample prepared by above-mentioned steps 2, it can be seen from figure 4 that thin
Film surface is made up of some microscopic particles, is well combined, and the particle degree of fluctuating reaches Nano grade.
Claims (3)
1. a kind of preparation method of Cu-Ag amorphous alloy films, the structural formula of the Cu-Ag amorphous alloy films is Cu68Ag32,
It is characterized in that comprising the following steps：
(1) Cu blocks and Ag blocks are cut, and Cu blocks and Ag blocks surface are polished, each 10min is cleaned successively with acetone and alcohol, is dried up and treat
With；
(2) two evaporation boats are arranged on the evaporation source frame of thermal resistance evaporation coating system, and Cu blocks and Ag blocks is respectively placed in
In two evaporation boats, substrate is placed on substrate pallet, closes vacuum chamber and open cooling water；
(3) 5 × 10 are evacuated to-4Then the evaporation current of Cu blocks and Ag blocks is adjusted to 125A and 100A, is made by below Pa respectively
Cu and Ag evaporates and is deposited on substrate simultaneously, controls 1～4h of sedimentation time, obtains final product Cu68Ag32Amorphous alloy film.
2. Cu-Ag amorphous alloy thins membrane preparation method according to claim 1, it is characterised in that：Raw material Cu blocks and Ag
The purity of block is not less than 99.9wt.%.
3. Cu-Ag amorphous alloy thins membrane preparation method according to claim 1, it is characterised in that：By adjusting during deposition
Between, control Cu68Ag32The thickness of amorphous alloy film.
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106244999B (en) * | 2016-08-30 | 2019-02-19 | 南通壹选工业设计有限公司 | A kind of preparation method of bulk amorphous alloys |
| CN106835024B (en) * | 2017-01-06 | 2019-07-12 | 苏州晶鼎鑫光电科技有限公司 | A method of preparing non-evaporable film getter |
| TWI626776B (en) | 2017-08-17 | 2018-06-11 | 華碩電腦股份有限公司 | Flexible display and manufacturing method thereof |
| CN112569804B (en) * | 2019-09-30 | 2022-08-09 | 成都易态科技有限公司 | Composite porous film |
| CN112028499B (en) * | 2020-08-21 | 2023-01-24 | 河南理工大学 | Amorphous transparent conductive composite film with CuAg alloy as buffer layer and capable of being prepared at room temperature, and preparation method and application thereof |
| CN112378329B (en) * | 2020-10-21 | 2022-04-12 | 中国科学院金属研究所 | Eddy current detection method for thickness of corrosion layer on inner wall of austenite pipe |
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| US3427154A (en) * | 1964-09-11 | 1969-02-11 | Ibm | Amorphous alloys and process therefor |
| CN102943239A (en) * | 2012-11-20 | 2013-02-27 | 张振星 | Aluminum die-cast alloy surface corrosion-resistant silver-based amorphous film and preparation process thereof |
| CN104532190A (en) * | 2014-12-19 | 2015-04-22 | 合肥工业大学 | Preparation method of Zr-Cu metal glass film |
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2015
- 2015-08-24 CN CN201510528837.8A patent/CN105177468B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3427154A (en) * | 1964-09-11 | 1969-02-11 | Ibm | Amorphous alloys and process therefor |
| CN102943239A (en) * | 2012-11-20 | 2013-02-27 | 张振星 | Aluminum die-cast alloy surface corrosion-resistant silver-based amorphous film and preparation process thereof |
| CN104532190A (en) * | 2014-12-19 | 2015-04-22 | 合肥工业大学 | Preparation method of Zr-Cu metal glass film |
Non-Patent Citations (1)
| Title |
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| 低温沉积Ag-Cu薄膜的耐原子氧和摩擦学性能;高晓明等;《摩擦学学报》;20130531;第33卷(第3期);第245-252页 * |
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