CN105177468A - Cu-Ag amorphous alloy film and preparation method thereof - Google Patents
Cu-Ag amorphous alloy film and preparation method thereof Download PDFInfo
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- CN105177468A CN105177468A CN201510528837.8A CN201510528837A CN105177468A CN 105177468 A CN105177468 A CN 105177468A CN 201510528837 A CN201510528837 A CN 201510528837A CN 105177468 A CN105177468 A CN 105177468A
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- 229910000808 amorphous metal alloy Inorganic materials 0.000 title claims abstract description 42
- 229910017770 Cu—Ag Inorganic materials 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 230000008020 evaporation Effects 0.000 claims abstract description 30
- 238000001704 evaporation Methods 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000007858 starting material Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract 1
- 238000002474 experimental method Methods 0.000 abstract 1
- 239000013077 target material Substances 0.000 abstract 1
- 238000001771 vacuum deposition Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 31
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910000796 S alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
The invention discloses Cu-Ag amorphous alloy film and a preparation method thereof. The Cu-Ag amorphous alloy film is characterized in that the structural formula of the amorphous alloy film is Cu68Ag32; the amorphous alloy film is obtained though a vacuum coating method, and the evaporation mode is the simplest resistive evaporation; in the evaporation experiment process, Cu blocks and Ag blocks are placed in two evaporation boats respectively, when the pressure reaches 5*10<-4> Pa through vacuumizing, coating is started, the evaporation current of the Cu blocks and the evaporation current of the Ag blocks are adjusted to 125 A and 100 A respectively, and a water cooling system is adopted in the whole evaporation process to prevent the temperature of a target material from being too high. The Cu68Ag32 amorphous alloy film obtained through the method is clear in amorphous structure and compact and flat in surface; the method is simple in operation and low in cost.
Description
Technical field
The invention belongs to amorphous alloy thin technology field of membrane materials, relate to a kind of Cu-Ag amorphous alloy film and preparation method thereof specifically.
Background technology
It is generally acknowledged, the research the earliest about amorphous alloy film is deposit N i-S alloy, can trace back to nineteen thirty.And then, the amorphous alloy film prepared of Kramer reported first evaporation deposition method.Nineteen fifty, A.Brenner Means of Electrodeposition obtains Ni-P and Co-P amorphous alloy film.The amorphous alloy films such as Fe base, Zr base have obtained comparatively widespread use as hard surface abrasion resistance, anti-corrosion layer.
In recent ten years, along with the continuous progress of technology of thin film material preparation and characterization method, the research work of metallic glass film increases gradually.Research finds, amorphous alloy film not only has good glass forming ability, and compared with block amorphous alloy, it has more excellent mechanics and magnetic property, shows good comprehensive physical and chemical property.Have above advantage just because of amorphous alloy film, amorphous alloy film has been widely used in space flight and aviation, electronic component, mechanical component and field of petrochemical industry, and in actual life, the application of amorphous alloy film has even exceeded block amorphous alloy.Amorphous alloy film has important potential using value, will drive the development of amorphous alloy material and whole materialogy to the research of amorphous alloy film.
Cu base noncrystal alloy is since being developed, because its lower cost and excellent mechanical property receive the concern of Material Field, is considered to concrete application prospect widely.Adopt Cu-Ag amorphous alloy film prepared by the simplest reactive evaporation, simple to operate, with low cost, there is important Research Significance.
Summary of the invention
The present invention uses the simplest thermal resistance evaporation plating method, provides a kind of novel C u-Ag amorphous alloy film and preparation method.
Technical solution problem of the present invention, adopts following technical scheme:
Cu-Ag amorphous alloy film of the present invention, its feature is: described Cu-Ag amorphous alloy film, and its structural formula is Cu
68ag
32.
The concrete preparation process of above-mentioned Cu-Ti amorphous alloy film is as follows:
(1) cut Cu block and Ag block, by Cu block and Ag block surface finish, clean each 10min successively with acetone and alcohol, dry up stand-by;
(2) two evaporation boats are arranged on the evaporation source frame of thermal resistance evaporation coating system, and Cu block and Ag block are placed in two evaporation boats respectively, substrate is placed on substrate pallet, close vacuum chamber and open water coolant;
(3) 5 × 10 are evacuated to
-4below Pa, is then adjusted to 125A and 100A by the evaporation current of Cu block and Ag block respectively, Cu and Ag is evaporated simultaneously and is deposited on substrate, controls depositing time 1 ~ 4h, obtains Cu
68ag
32amorphous alloy film.
The purity of starting material Cu block and Ag block is all not less than 99.9wt.%.
By adjustment depositing time, control Cu
68ag
32the thickness of amorphous alloy film.
Above-mentioned Cu-Ag amorphous alloy film adopts the preparation of thermal resistance evaporation coating system, and unit type used is: DZS-500 type thermal resistance evaporation coating system, middle tech, China (Shenyang).
The non-crystal structure characteristic of above-mentioned Cu-Ag amorphous alloy film adopts X-ray diffraction method (XRD) to detect, and equipment used model is: X ' PertProMPDX x ray diffractometer x, PANalytical (Panalytical), Holland.
The surface topography of above-mentioned Cu-Ag amorphous alloy film and composition adopt field emission scanning electron microscope (FE-SEM) and subsidiary energy spectrometer (EDS) to detect, and equipment used model is: SU8020, FDAC, Japan.
The microtexture of above-mentioned Cu-Ag amorphous alloy film adopts atomic force microscope to detect, and equipment used model is: Dimension, Brooker, Germany.
Beneficial effect of the present invention is embodied in:
Cu-Ag amorphous alloy film of the present invention adopts the technology of the simplest thermal resistance evaporation plated film to prepare, and non-crystal structure is distinct, and surface compact is smooth, and simple to operate, and cost is lower.
Accompanying drawing explanation
Fig. 1 is the XRD figure of alloy firm prepared by embodiment 1, and test uses the K of Cu target
αray;
Fig. 2 is the SEM surface topography map of alloy firm prepared by embodiment 1;
Fig. 3 is the SEM end face shape figure of alloy firm prepared by embodiment 1;
Fig. 4 is the AFM microtexture schematic diagram of alloy firm prepared by embodiment 1.
Embodiment
Embodiment 1:Cu
68ag
32the preparation of amorphous alloy film
Step 1: by starting material Cu (99.9wt%), surface scale is removed in Ag (99.9wt%) polishing, and successively after acetone, each 10min of alcohol ultrasonic cleaning, be placed in two evaporation boats being arranged on the evaporation source frame of thermal resistance evaporation coating system, by substrate sheet glass and silicon chip successively after acetone, alcohol, each 10min of deionized water ultrasonic cleaning, dry up and be placed on substrate pallet;
Step 2: close intake valve, open water coolant, vapor pipe is placed in outside window, open filming equipment general supply, start tool pumping source, opened side and takes out valve, open vacuumometer, when vacuum tightness is less than 10Pa, close side and take out valve, open slide valve, open molecular pump power source, when vacuum tightness is lower than 5 × 10
-4during Pa, open thermal evaporation power supply; Respectively the evaporation current of Cu block and Ag block is adjusted to 125A and 100A, makes the material melts plated film on evaporation boat, depositing time 70min; End to be coated makes thermal evaporation sources current knob make zero, and evaporation boat is cooled, and closes evaporation power supply.
Step 3: by energy spectrometer, its composition is detected, the composition average out to Cu of known gained sample to sample obtained by above-mentioned steps 2
68ag
32;
Step 4: by XRD, its structure is detected to sample obtained by above-mentioned steps 2, as shown in Figure 1, there is obvious crystal peak, wherein first steamed bun peak is glass substrate Interference Peaks, second peak is the obvious sharpening in sample peak (40 ° ~ 50 °), illustrates that the sample of preparation is amorphous structure.
Step 5: detect its surface topography by SEM to the sample prepared by above-mentioned steps 2, as shown in Figure 2, the smooth densification of film surface, does not have obvious crackle.
Step 6: detect its thickness by SEM to the sample prepared by above-mentioned steps 2, as shown in Figure 3, this film thickness is about 141nm.
Step 7: detect its microscopic appearance by AFM to the sample prepared by above-mentioned steps 2, as can see from Figure 4, film surface is made up of some microscopic particles, and in conjunction with good, and the particle degree of fluctuating reaches Nano grade.
Claims (4)
1. a Cu-Ag amorphous alloy film, is characterized in that: the structural formula of described Cu-Ag amorphous alloy film is Cu
68ag
32.
2. a preparation method for Cu-Ag amorphous alloy film according to claim 1, is characterized in that comprising the following steps:
(1) cut Cu block and Ag block, by Cu block and Ag block surface finish, clean each 10min successively with acetone and alcohol, dry up stand-by;
(2) two evaporation boats are arranged on the evaporation source frame of thermal resistance evaporation coating system, and Cu block and Ag block are placed in two evaporation boats respectively, substrate is placed on substrate pallet, close vacuum chamber and open water coolant;
(3) 5 × 10 are evacuated to
-4below Pa, is then adjusted to 125A and 100A by the evaporation current of Cu block and Ag block respectively, Cu and Ag is evaporated simultaneously and is deposited on substrate, controls depositing time 1 ~ 4h, obtains Cu
68ag
32amorphous alloy film.
3. Cu-Ag amorphous alloy thin membrane preparation method according to claim 2, is characterized in that: the purity of starting material Cu block and Ag block is all not less than 99.9wt.%.
4. Cu-Ag amorphous alloy thin membrane preparation method according to claim 2, is characterized in that: by adjustment depositing time, control Cu
68ag
32the thickness of amorphous alloy film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510528837.8A CN105177468B (en) | 2015-08-24 | 2015-08-24 | A kind of Cu Ag amorphous alloy films and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510528837.8A CN105177468B (en) | 2015-08-24 | 2015-08-24 | A kind of Cu Ag amorphous alloy films and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105177468A true CN105177468A (en) | 2015-12-23 |
| CN105177468B CN105177468B (en) | 2017-04-05 |
Family
ID=54899885
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510528837.8A Expired - Fee Related CN105177468B (en) | 2015-08-24 | 2015-08-24 | A kind of Cu Ag amorphous alloy films and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106244999A (en) * | 2016-08-30 | 2016-12-21 | 张为凤 | A kind of preparation method of bulk amorphous alloys |
| CN106835024A (en) * | 2017-01-06 | 2017-06-13 | 苏州晶鼎鑫光电科技有限公司 | A kind of method for preparing non-evaporable film getter |
| CN112028499A (en) * | 2020-08-21 | 2020-12-04 | 河南理工大学 | Amorphous transparent conductive composite film with CuAg alloy as buffer layer and capable of being prepared at room temperature, and preparation method and application thereof |
| CN112378329A (en) * | 2020-10-21 | 2021-02-19 | 中国科学院金属研究所 | Eddy current detection method for thickness of corrosion layer on inner wall of austenite pipe |
| CN112569804A (en) * | 2019-09-30 | 2021-03-30 | 成都易态科技有限公司 | Composite porous film |
| US11177447B2 (en) | 2017-08-17 | 2021-11-16 | Asustek Computer Inc. | Flexible display and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3427154A (en) * | 1964-09-11 | 1969-02-11 | Ibm | Amorphous alloys and process therefor |
| CN102943239A (en) * | 2012-11-20 | 2013-02-27 | 张振星 | Aluminum die-cast alloy surface corrosion-resistant silver-based amorphous film and preparation process thereof |
| CN104532190A (en) * | 2014-12-19 | 2015-04-22 | 合肥工业大学 | Preparation method of Zr-Cu metal glass film |
-
2015
- 2015-08-24 CN CN201510528837.8A patent/CN105177468B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3427154A (en) * | 1964-09-11 | 1969-02-11 | Ibm | Amorphous alloys and process therefor |
| CN102943239A (en) * | 2012-11-20 | 2013-02-27 | 张振星 | Aluminum die-cast alloy surface corrosion-resistant silver-based amorphous film and preparation process thereof |
| CN104532190A (en) * | 2014-12-19 | 2015-04-22 | 合肥工业大学 | Preparation method of Zr-Cu metal glass film |
Non-Patent Citations (1)
| Title |
|---|
| 高晓明等: "低温沉积Ag-Cu薄膜的耐原子氧和摩擦学性能", 《摩擦学学报》 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106244999A (en) * | 2016-08-30 | 2016-12-21 | 张为凤 | A kind of preparation method of bulk amorphous alloys |
| CN106244999B (en) * | 2016-08-30 | 2019-02-19 | 南通壹选工业设计有限公司 | A kind of preparation method of bulk amorphous alloys |
| CN106835024A (en) * | 2017-01-06 | 2017-06-13 | 苏州晶鼎鑫光电科技有限公司 | A kind of method for preparing non-evaporable film getter |
| CN106835024B (en) * | 2017-01-06 | 2019-07-12 | 苏州晶鼎鑫光电科技有限公司 | A method of preparing non-evaporable film getter |
| US11177447B2 (en) | 2017-08-17 | 2021-11-16 | Asustek Computer Inc. | Flexible display and manufacturing method thereof |
| CN112569804A (en) * | 2019-09-30 | 2021-03-30 | 成都易态科技有限公司 | Composite porous film |
| CN112028499A (en) * | 2020-08-21 | 2020-12-04 | 河南理工大学 | Amorphous transparent conductive composite film with CuAg alloy as buffer layer and capable of being prepared at room temperature, and preparation method and application thereof |
| CN112028499B (en) * | 2020-08-21 | 2023-01-24 | 河南理工大学 | Amorphous transparent conductive composite film with CuAg alloy as buffer layer and capable of being prepared at room temperature, and preparation method and application thereof |
| CN112378329A (en) * | 2020-10-21 | 2021-02-19 | 中国科学院金属研究所 | Eddy current detection method for thickness of corrosion layer on inner wall of austenite pipe |
| CN112378329B (en) * | 2020-10-21 | 2022-04-12 | 中国科学院金属研究所 | Eddy current detection method for thickness of corrosion layer on inner wall of austenite pipe |
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|---|---|
| CN105177468B (en) | 2017-04-05 |
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