CN105176456A - Wafer thinning temporary binder and preparation method therefor - Google Patents
Wafer thinning temporary binder and preparation method therefor Download PDFInfo
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- CN105176456A CN105176456A CN201510532707.1A CN201510532707A CN105176456A CN 105176456 A CN105176456 A CN 105176456A CN 201510532707 A CN201510532707 A CN 201510532707A CN 105176456 A CN105176456 A CN 105176456A
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Abstract
The present invention relates to a wafer thinning temporary binder and a preparation method therefor. The binder comprises the following raw materials in parts by weight based on the total weight of raw materials: 40-70 parts of a solvent, 20-50 parts of a cycloolefin copolymer, 5-20 parts of tackifying resin, 0.01-0.5 part of an antioxidant, 0.01-0.5 part of a leveling agent and 0.01-2 parts of a coupling agent. The wafer thinning temporary binder prepared by the preparation method provided by the present invention has an excellent rheologic property, a relatively good bonding strength, good solvent resistance and heat resistance and low water absorption, can be heated to be unbonded, and is suitable for being used for temporary binding in the wafer thinning process.
Description
Technical field
The present invention relates to thinning temporary binders of a kind of wafer and preparation method thereof, belong to sizing agent field.
Background technology
A kind of by silicon perforation (TSV) connects, vertical stacking chipset of the same race and not of the same race becomes multi-chip module (MCM) the new encapsulation technology of one by the three dimensional integrated circuits (3DIC) of storehouse electron device, packaging cost can be reduced on a large scale, reduce package dimension, shorten between device and connect, reduce board area, thus be widely used in various mobile electronic device.Wafer thinning is one of guardian technique realizing 3DIC and Ultrathin packaging, is also the direction that large-scale integrated circuit develops over the next several years.Due to the frangible and easy warpage of thin wafer, carrying out in the course of processing of back to device wafers, needing to utilize tackiness agent to be fixed on base material, will be easy to peel off from base material after thin wafer back part processing.Wafer temporary binders is indispensable critical material in wafer thinning process as a kind of fine electronic chemical.The present invention contributes to improving the state of the art of China in fine electronic chemical and large-scale integrated circuit producing apparatus field, fills up the domestic blank in this field.
Summary of the invention
The object of this invention is to provide thinning temporary binders of a kind of wafer and preparation method thereof, temporary binders prepared by the present invention has excellent rheological property, preferably bonding strength, and solvent resistant and good heat resistance, water-intake rate is low, can add pyrolysis bonding.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: solvent 40 ~ 70 parts, cyclic olefine copolymer 20 ~ 50 parts, tackifying resin 5 ~ 20 parts, 0.01 ~ 0.5 part, oxidation inhibitor, flow agent 0.01 ~ 0.5 part, coupling agent 0.01 ~ 2 part.
Further, described solvent is the one in limonene, laurylene, myrcene, hexadecylene, tetrapropylene, perhydronaphthalene, solvent oil.
Further, described cyclic olefine copolymer is double-heptene-ethylene copolymer.
Cyclic olefine copolymer CycloOlefinCopolymers(COC) be thermoplasticity inert plastic, have extremely low activity group content, medium-resistance is excellent, and high temperature viscosity is low, and low temperature viscosity is high, and sticking power is good, and resistance toheat is given prominence to, and water-absorbent is low.
Further, described tackifying resin is one or both mixing in petroleum resin, hydrogenated petroleum resin, poly-α firpene, poly-beta pinene, Gum Rosin, terpine resin.
Tackifier have the function increasing sticking power and regulate high temperature viscosity simultaneously, for the manufacturability adjustment of product provides space.
Further, described oxidation inhibitor is 2,6 ditertiary butyl p cresol (BHT).
The use of oxidation inhibitor makes temporary binders suppress the carrying out of polymkeric substance oxidising process at production and storage process, stops polymkeric substance aging, extends the duration of service of temporary adhesive.
Further, described flow agent is the one in polyether modified siloxane, polyester modification siloxanes and alkyl modified siloxane.
The use of flow agent makes temporary binders form smooth, smooth, a uniform film in the process of spin coating with baking film forming.Make temporary binders to be good in the process of conjunction thickness at wafer even, tack coat tight between wafer and carrier wafer, thus ensure warpage and breakage to occur in the process that wafer is thinning.
Further, described coupling agent is the one in KH-550, KH-560, KH-570.
The invention has the beneficial effects as follows: the thinning temporary binders of wafer prepared by the present invention has excellent rheological property, preferably bonding strength, and solvent resistant and good heat resistance, water-intake rate is low, can add pyrolysis bonding.
The preparation method of the thinning temporary binders of a kind of wafer of the present invention, comprising:
In the percentage composition of raw material gross weight, 40 ~ 70 parts of solvents, 20 ~ 50 parts of cyclic olefine copolymers, 5 ~ 20 parts of tackifying resins, 0.01 ~ 0.5 part of oxidation inhibitor, 0.01 ~ 0.5 part of flow agent, 0.01 ~ 2 part of coupling agent, drop in reactor, 80 ~ 120 DEG C of reflux, completely namely stirring and dissolving obtains product.
Embodiment
Be described principle of the present invention and feature below, example, only for explaining the present invention, is not intended to limit scope of the present invention.
embodiment 1
Take laurylene (Japanese TCI) 70g, cycloolefin analog copolymer 5013 (German TOPAS) 30g, hydrogenated petroleum resin, softening temperature 115 DEG C (Japanese waste river) 8g, antioxidant BHT 0.08g, flow agent BYK-3330.08g, coupling agent KH-5501g, drops in reactor, 80 DEG C of reflux, stirring and dissolving is complete, obtains sample.
This sample is colourless transparent liquid, 25 DEG C of viscosity 2520mPas, 180 DEG C of viscosity 410000mPas, 220 DEG C of viscosity are 46000mPas, bonding strength 28Mpa, planeness ± 1.8% after 200 DEG C of baking 4min, can 220 DEG C separate bondings, gapless between after two strong conjunction bondings of wafer, acid and alkali-resistance solution, thermogravimetric analysis 5% weightless temperature is 285 DEG C.
embodiment 2
Take perhydronaphthalene (Japanese TCI) 60g, cycloolefin analog copolymer 6013 (German TOPAS) 30g, hydrogenated petroleum resin, softening temperature 135 DEG C (Japanese waste river) 10g, antioxidant BHT 0.06g, flow agent BYK-3330.06g, coupling agent KH-5600.8g, drops in reactor, 90 DEG C of reflux, stirring and dissolving is complete, gets product.
This sample is colourless transparent liquid, 25 DEG C of viscosity 1940mPas, 180 DEG C of viscosity 460000mPas, 220 DEG C of viscosity are 52000mPas, bonding strength 19Mpa, planeness ± 2.3% after 200 DEG C of baking 4min, can 220 DEG C separate bondings, gapless between after two strong conjunction bondings of wafer, acid and alkali-resistance solution, thermogravimetric analysis 5% weightless temperature is 297 DEG C.
embodiment 3
Take D20 solvent oil (U.S.'s shell) 50g, cycloolefin analog copolymer 6015 (Polyplastics) 38g, poly-α/β firpene F115, softening temperature 115 DEG C (U.S.'s skin Nova) 12g, antioxidant BHT 0.04g, flow agent BYK-3100.04g, coupling agent KH-5600.5g, drops in reactor, 100 DEG C of reflux, stirring and dissolving is complete, gets product.
This sample is light yellow transparent liquid, 25 DEG C of viscosity 3720mPas, 180 DEG C of viscosity 520000mPas, 220 DEG C of viscosity are 51000mPas, bonding strength 28Mpa, planeness ± 1.8% after 180 DEG C of baking 4min, can 220 DEG C separate bondings, gapless between after two strong conjunction bondings of wafer, acid and alkali-resistance solution, thermogravimetric analysis 5% weightless temperature is 308 DEG C.
embodiment 4
Take D40(U.S. shell) 40g, cycloolefin analog copolymer 6017 (Polyplastics) 44g, terpine resin 803L, softening temperature 150 DEG C (Japanese waste river) 15g, antioxidant BHT 0.02g, flow agent BYK-3100.02g, coupling agent KH-5500.2g, drops in reactor, 120 DEG C of reflux, stirring and dissolving is complete, gets product.
This sample is yellow transparent liquid, 25 DEG C of viscosity 2370mPas, 180 DEG C of viscosity 520000mPas, 220 DEG C of viscosity are 53000mPas, bonding strength 31Mpa, planeness ± 1.8% after 180 DEG C of baking 4min, can 220 DEG C separate bondings, gapless between after two strong conjunction bondings of wafer, acid and alkali-resistance solution, thermogravimetric analysis 5% weightless temperature is 327 DEG C.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. the thinning temporary binders of wafer, it is characterized in that, in the percentage composition of raw material gross weight, be made up of following raw material: solvent 40 ~ 70 parts, cyclic olefine copolymer 20 ~ 50 parts, tackifying resin 5 ~ 20 parts, 0.01 ~ 0.5 part, oxidation inhibitor, flow agent 0.01 ~ 0.5 part, coupling agent 0.01 ~ 2 part;
Described solvent is the one in limonene, laurylene, myrcene, hexadecylene, tetrapropylene, perhydronaphthalene, solvent oil; Described cyclic olefine copolymer is double-heptene-ethylene copolymer.
2. temporary binders according to claim 1, is characterized in that, described tackifying resin is one or both mixing in petroleum resin, hydrogenated petroleum resin, poly-α-pinene, poly-beta-pinene, Gum Rosin, terpine resin.
3. temporary binders according to claim 1, is characterized in that, described oxidation inhibitor is 2,6 ditertiary butyl p cresol (BHT).
4. temporary binders according to claim 1, is characterized in that, described flow agent is the one in polyether modified siloxane, polyester modification siloxanes or alkyl modified siloxane.
5. temporary binders according to claim 1, is characterized in that, described coupling agent is the one in KH-550, KH-560, KH-570.
6. temporary binders according to claim 1, it is characterized in that, preparation method comprises: in the percentage composition of raw material gross weight, by 40 ~ 70 parts of solvents, 20 ~ 50 parts of cyclic olefine copolymers, 5 ~ 20 parts of tackifying resins, 0.01 ~ 0.5 part of oxidation inhibitor, 0.01 ~ 0.5 part of flow agent, 0.01 ~ 2 part of coupling agent, drop in reactor, 80 ~ 120 DEG C of reflux, completely namely stirring and dissolving obtains product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510532707.1A CN105176456A (en) | 2015-08-27 | 2015-08-27 | Wafer thinning temporary binder and preparation method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510532707.1A CN105176456A (en) | 2015-08-27 | 2015-08-27 | Wafer thinning temporary binder and preparation method therefor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111909638A (en) * | 2020-08-12 | 2020-11-10 | 深圳先进电子材料国际创新研究院 | Temporary bonding adhesive material for preventing wafer from being damaged by ultraviolet laser |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101523566A (en) * | 2006-10-06 | 2009-09-02 | 布鲁尔科技公司 | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| CN102203917A (en) * | 2008-10-31 | 2011-09-28 | 布鲁尔科技公司 | Cyclic olefin compositions for temporary wafer bonding |
| CN102816545A (en) * | 2011-06-09 | 2012-12-12 | 第一毛织株式会社 | Adhesive composition and optical component using same |
-
2015
- 2015-08-27 CN CN201510532707.1A patent/CN105176456A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101523566A (en) * | 2006-10-06 | 2009-09-02 | 布鲁尔科技公司 | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| CN102203917A (en) * | 2008-10-31 | 2011-09-28 | 布鲁尔科技公司 | Cyclic olefin compositions for temporary wafer bonding |
| CN102816545A (en) * | 2011-06-09 | 2012-12-12 | 第一毛织株式会社 | Adhesive composition and optical component using same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111909638A (en) * | 2020-08-12 | 2020-11-10 | 深圳先进电子材料国际创新研究院 | Temporary bonding adhesive material for preventing wafer from being damaged by ultraviolet laser |
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Application publication date: 20151223 |
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