CN105164310B - Device for processing two or more substrates in batch processing - Google Patents
Device for processing two or more substrates in batch processing Download PDFInfo
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- CN105164310B CN105164310B CN201480024683.2A CN201480024683A CN105164310B CN 105164310 B CN105164310 B CN 105164310B CN 201480024683 A CN201480024683 A CN 201480024683A CN 105164310 B CN105164310 B CN 105164310B
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- substrate
- substrate holder
- reaction chamber
- loaded
- actuator
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45546—Atomic layer deposition [ALD] characterized by the apparatus specially adapted for a substrate stack in the ALD reactor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Abstract
The present invention relates to one kind for by causing that at least a portion on substrate (10) surface is processed the device of two or more substrates (10) by least alternating surface reactions of the first and second precursors in batch processing.The device includes：Multiple substrate holders (6), for supporting the substrate (10)；And reaction chamber (3), the reaction chamber include reaction compartment (30).The reaction chamber (3) is arranged in processing stage deposition materials on the surface of the substrate (10) in reaction compartment (30).Substrate holder (6) is installed or is arranged to be arranged on reaction chamber (3) inside, for being processed in processing stage in the internal substrate (10) of reaction chamber (3).In substrate (10) is loaded to the loading stage on substrate holder (6) by loading attachment (9), at least some substrate holders (6) are arranged to move relative to each other.
Description
Technical field
The present invention relates to a kind of device for processing two or more substrates in batch processing, more particularly to one
Plant the device as described in the preamble in independent claims 1.
Background technology
The present invention relates to a kind of for by causing that at least a portion of substrate surface is subject to two or more precursor materials
Alternating surface reactions and process the device of substrate.More particularly, it is used for according to ald (ALD the present invention relates to one kind
Principle process the device of substrate.In this application, term ALD means the atom layer epitaxy orientation for realizing ALD principles
The method of growth (ALE) title similar with other.Apparatus for atomic layer deposition generally includes vacuum chamber, and substrate is in the vacuum chamber
Inter-process.Single processing chamber housing can also be arranged in inside vacuum chamber, and so, substrate loads in reaction chamber and anti-
Answer treatment in chamber.The loading of substrate can be carried out manually, or be carried out by loading attachment (such as loading robot).It is logical
Often, substrate is fitted into ALD devices and will be carried out in the air of home air, room atmosphere or clean room.The present invention is related to
And in loading a substrate into the substrate holder for supporting the substrate.
WO2009/144371 discloses a kind of device, wherein, what material was deposited in reaction chamber a collection of is arranged vertically base
On the surface of plate.In the publication, a collection of vertically arranged substrate includes abreast being arranged in movable substrate holder
One group of chip.Substrate holder is attached at movable reaction chamber and covers, and the size of reaction chamber is especially optimized to for this batch
It is arranged vertically the size or the size for carrying the substrate holder of the substrate of substrate.WO2009/144371 is also disclosed
Spacing between the substrates is smaller, the efficiency for improving reaction compartment, but also sufficiently large, so that precursor stream can enter
Enter between substrate.The document does not disclose how substrate loads in batch, but due to smaller between the substrate of the batch
Spacing, therefore increased the requirement of loading stage.
The common mode for building batch reactor is come for substrate, as in WO2009/144371 using fixed shelf
Used in open.A problem related to above-mentioned prior-art devices is that loading attachment (is held the end of such as robots arm
Row device) must be very small, because entrance is limited.In order to substrate is loaded to substrate holder, it is desirable to have for causing to load
Device enters between shelf and the space by substrate arranged at this.Substrate is heavier, it is necessary to which more spaces are used for by loading dress
Put substrate arranged on shelf.Meanwhile, cross-sectional area becomes much larger, and results in the need for more high flow capacity, it is therefore desirable to bigger
Pipeline and pump.Another way for building batch reactor is into causing distance between sequentially shelf more by shelf arrangement
It is long, but this causes other problems, for example, will have bigger precursor consumption, slower flushing and bigger flushing gas to consume,
Cause bigger ALD devices.When space change between the substrates is big, it is likely that produce some problems with film quality.With
Common mode is likely to generation problem providing the precursor of q.s.When the size of device becomes much larger, due to the height of equipment
Degree, also there is transportation problem.
The content of the invention
It is an object of the invention to provide a kind of device, to overcome or at least mitigating the shortcoming of prior art.The present invention
Purpose realize that the feature of the device is introduced in the independent claim by a kind of device.The preferred embodiments of the present invention
It is disclosed in the dependent claims.
The present invention based on provide a kind of thought for processing the device of substrate, so, substrate by loading attachment come
Load into the loading stage on substrate holder, at least some substrate holders are arranged to move relative to each other.This can
Lead to the substrate holder on it by the way that substrate holder is arranged so that into the substrate holder being loaded has
More spaces (compared with the space in processing stage between same substrate retainer) realize that so, loading attachment can
In loading stage by substrate arranged on substrate holder.In loading stage, when a substrate holder is loaded,
Other substrate holders are preferably in holding fix closer to each other, or when substrate holder has been loaded into, they are excellent
Choosing is that, in processing position, they are in the processing position in processing stage.Therefore, the apparatus according to the invention is used to pass through
So that at least a portion of substrate surface is subject at least alternating surface reactions of the first and second precursors and locates in batch processing
Two or more substrates are managed, the device includes：Multiple substrate holders, for supporting the substrate；And reaction chamber, this is anti-
Answering chamber includes reaction compartment, and the reaction chamber is arranged in processing stage on the surface of the substrate in reaction compartment
Deposition materials, substrate holder is installed or is arranged to be arranged on inside reaction chamber, for being processed anti-in processing stage
Answer the substrate of chamber interior.It is at least some in the loading stage that substrate loads to substrate holder by loading attachment
Substrate holder is arranged to move relative to each other.In one embodiment of the invention, substrate holder is arranged in frame substrate
In, for keeping including a collection of substrate of two or more substrates.In another embodiment of the invention, substrate holder arrangement
It is in heaps.
It is of the invention, for by causing that at least a portion of substrate surface is subject at least the first and second precursors
Alternating surface reactions and processed in batch processing two or more substrates device include it is multiple for supporting the substrate
Substrate holder.Device also includes reaction chamber, and the reaction chamber includes reaction compartment, and the reaction chamber is arranged at place
Deposition materials on the surface of the substrate in the reason stage in reaction compartment.Substrate holder is installed or is arranged to be arranged on reaction
Chamber interior, for processing the substrate inside reaction chamber in processing stage.Device also includes actuator, the actuator energy
Enough so that one or more substrate holders move relative to each other.Actuator enables to one or more substrate holders relative
Motion, so, in the loading stage that substrate loads to substrate holder by loading attachment, is loaded and on it
The substrate holder that there is another substrate holder in face is arranged in " loaded " position, in the " loaded " position, from the substrate being loaded
Retainer is more than the distance in processing stage between same substrate retainer to the distance of the substrate holder on it.
Therefore, device also include for cause substrate holder motion actuator, so, in loading stage, be loaded and
The substrate holder that it has another substrate holder above is arranged in " loaded " position, in the " loaded " position, from what is be loaded
Substrate holder to the distance of the substrate holder on it is more than in processing stage between same substrate retainer
Distance.In loading stage, the substrate holder in addition to the substrate holder being loaded be arranged to by actuator and/
Or raising device and move to holding fix, in the holding fix, substrate holder compared with processing position each other more
Close, they are in the processing position in processing stage.In loading stage, the substrate holder arrangement of substrate is already equipped with
Move to processing position into by actuator and/or raising device, so, it is continuous load substrate holder between away from
From identical with processing stage.In loading stage, the substrate holder being loaded passes through actuator and/or raising device
And move to " loaded " position.In loading stage, the substrate holder in addition to the substrate holder being loaded will keep
In place, the substrate holder being loaded moves to " loaded " position by actuator.Substrate holder can be for propping up
Hold substrate shelf and/or for by substrate supporting in a pair of support lugs between them.Preferably, frame substrate includes bottom
Plate and framework, the substrate holder are arranged to be connected with the framework.Preferably, actuator is included through bottom plate arrangement
Latch structure and/or the bar through reaction chamber arrangement.Device also includes lifting device, and the lifting device is arranged for loading
Frame substrate be increased in reaction chamber, so, reaction chamber be arranged to by by raising device come cause frame substrate move and
Close and open.Actuator is arranged to so, and in processing stage, the moving component of actuator is arranged in the outer of reaction chamber
Portion.Device can also include vacuum chamber.
The advantage of apparatus of the present invention is that loading attachment is arranged to when loading to one series-produced substrate in loading stage
There is sufficient space during amount, and distance in processing stage between continuous substrate is optimized to for so that material is deposited on base
On the surface of plate, the size of simultaneous reactions chamber can be remained without unwanted exceptional space.Another advantage of device is
Device can be manufactured into it is more compact, with cause device it is smaller.
Brief description of the drawings
The present invention is introduced by preferred embodiment in more detail below with reference to the accompanying drawings, in accompanying drawing：
Fig. 1 illustrates the apparatus according to the invention；
Fig. 2 a-2f illustrate one embodiment of the present of invention；
Fig. 3 a-3f illustrate another embodiment of the present invention；
Fig. 4 a and 4b illustrate the apparatus according to the invention；And
Fig. 5 a and 5b illustrate another view of the embodiment shown in Fig. 3 a-3f.
Specific embodiment
Fig. 1 illustrates the apparatus according to the invention, and the device includes ALD units 1, and the ALD units 1 have vacuum chamber 2, should
Vacuum chamber 2 is arranged to be substantially isolated with ambient atmosphere.Vacuum chamber 2 can be at least partially open and be closed, true for causing
The inner space of plenum chamber 2 isolates with ambient atmosphere.Substrate can be arranged or loaded to vacuum chamber 2, for according to ALD
Principle process.Herein, ambient atmosphere means normal room air, clean room air or is not suitable for
Offer prevents any air of sensitive substrate pollution or the inert atmosphere damaged.ALD units 1 also include at least one vacuum plant
(not shown), the vacuum plant is connected with the operation of vacuum chamber 2, for providing vacuum inside vacuum chamber 2.Vacuum holding
Putting can be vavuum pump or similar device.Vacuum plant can be arranged to provide about 0.1 millibar to 100 millibars of vacuum pressure
Power, typically about 4 millibars.In the time that substrate carries out that treatment and vacuum chamber 2 are closed, vacuum plant can be used for true
Plenum chamber 2 provides the vacuum pressure.It should be known that vacuum chamber 2 itself can form reaction chamber 3, substrate is in the reaction
Processed by precursor in chamber 3, or also may be selected, single reaction chamber 3 can be arranged in inside vacuum chamber 2, such as
Shown in figure.When single reaction chamber 3 is provided, substrate is processed inside reaction chamber 3, and precursor is also fed to the list
In only reaction chamber 3.
ALD units 1 also include precursor transmission system (not shown), for by gaseous precursors supply response chamber 3, anticipating
Think of is vacuum chamber 2 or the independent reaction chamber 3 inside the vacuum chamber 2, such as in this example, to perform atomic layer deposition
Product.Precursor transmission system includes one or more precursor sources (such as gas container or crucible) and for by precursor directed response
The pipe or conduit of chamber 3.In other words, with gaseous state supply response chamber 3, but in precursor storage tank, they can be precursor
Gas, liquid or solid.Precursor transmission system can also include discharger, for removing precursor or punching from reaction chamber 3
Gas washing body.
ALD units 1 include vacuum chamber 2, and the vacuum chamber 2 determines vacuum space 20.Vacuum chamber 2 is provided with gate valve
21, substrate 10 can be loaded to vacuum chamber 2 by the gate valve 21.Gate valve 21 can also be replaced by freight hatch etc..
ALD units 1 also include single reaction chamber 3, and the reaction chamber 3 is arranged in inside vacuum chamber 2, and reaction chamber 3 is determined
Reaction compartment 30 inside reaction chamber 3.ALD units 1 are also provided with frame substrate 5, and the frame substrate 5 keeps including several substrates
Device 6, substrate 10 is loaded on the substrate holder 6.Frame substrate 5 includes bottom plate 7, and frame substrate 5 is supported in the bottom plate 7.
Frame substrate 5 can also include frame framework 11, and the substrate holder 6 is arranged to be connected with the framework 11.Frame substrate 5 is also provided
There is raising device 8, the raising device 8 is arranged for raising frame substrate 5 inside reaction chamber 3 relative to frame substrate 5.Anti-
Answer in the open position of chamber 3, frame substrate 5 lies at least partially in the outside of the reaction chamber 3.Loading attachment is arranged to by loading arm
9 grades load substrate 10 and enter vacuum chamber 2 by gate valve 21 and load to the substrate holder 6 of frame substrate 5.Loading attachment leads to
It is often to load robot, there is robots arm 9 in the loading robot, for loading, unloading and processing substrate 10.In the implementation of Fig. 1
In example, load in a substantially horizontal direction to carry out.In the loading process of substrate 10, raising device 8 can cause frame substrate 5 by
Gradually move to followed by position, so, the loading motion of loading attachment and loading arm 9 can be every time always linear and basic
It is identical.Therefore, raising device 8 can cause the progressively linear upward motion of frame substrate 5, and loading attachment can be by identical
Substantially linear loads motion and loads to the overlap substrate holder 6 of frame substrate 5 substrate 10.This causes the loading of substrate 10
It is simple and efficient, and batch of two or more substrates 10 can be supplied to frame substrate 5, be moved without complicated loading.Cause
This, the device also includes raising device, and the raising device is arranged for so that the frame substrate 5 for loading is increased to reaction chamber 3
It is interior, so, reaction chamber 3 be arranged to by by raising device so that frame substrate 5 moves and closes and open.In Fig. 1, substrate
10 are loaded on the head substrate retainer 6 of frame substrate 5.Head substrate is all necessarily used in whole embodiments of the invention
Retainer 6 comes for bearing substrate 10, but head substrate retainer 6 can be in the case of not bearing substrate 10 as frame substrate
5 top surface equally works.When substrate 10 is loaded on head substrate retainer 6, other substrate holders can keep
In place, because not needing additional space come for loading.In such scheme, one or more actuators 42 are attached at very
On the wall of plenum chamber 2.Actuator 42 can also be attached in other correct positions.Actuator 42 for example can be grasped pneumatically or electrically
Make.
Fig. 2 a-2f illustrate ALD devices 1, but vacuum chamber 2 is saved, to simplify accompanying drawing.In these figures, substrate
Retainer 6 is stacked with, and the substrate holder can be the framework with opening, shelf etc., so that precursor gases energy
Enough it flow on the surface of substrate 10.In fig. 2 a, reaction chamber 3 is opened, and all empty substrate holders are each other on top.First
Substrate 10 is loaded to top retainer 6.The axle 41 of actuator 42 is exited.There are ways to combine actuator number and it
Arrangement.A kind of scheme is to use four actuators, on two opposite sides each two actuators.Fig. 2 b are illustrated first
Bottom plate 7 is moved upwards after substrate 6 is loaded to head substrate retainer 6, until head substrate retainer 6 is in actuator
The height of axle 41.Actuator shaft 41 is moved out, in shaft end is in the respective aperture/groove of substrate holder 6.Fig. 2 c are represented
Another substrate 10 is loaded to substrate holder 6.Bottom plate 7 causes the whole substrates in addition to head substrate retainer 6
Retainer is moved downward with it.Top retainer 6 is held in place by actuator shaft 41.Therefore, at this moment protected at top
There is free space between holder and remaining retainer such that it is able to load next substrate 10.Fig. 2 d illustrate bottom plate 7 to
Upper motion, until reaching top retainer from second retainer at top.Then, actuator shaft 41 is exited, and bottom plate 7 is further
The distance of another retainer is moved upwards.Fig. 2 e illustrate actuator shaft 41 and move out to the respective aperture/groove of retainer 6
It is interior.Then, bottom plate 7 is moved downward, so that the space between two top retainers 6 and remaining retainer 6 is opened, because
This can load next substrate 10.Fig. 2 f are illustrated when whole substrates 10 are all loaded and whole actuator shafts 41 are all exited,
Bottom plate 7 is moved upwards, until reaction chamber 3 is closed.
There is another method to load to substrate holder 6 substrate 10, as described below.In this embodiment, push up
Portion's substrate holder 6 has included substrate 10, therefore the substrate holder to be loaded has another substrate holder on it
6.The substrate holder 6 being loaded is arranged in " loaded " position, so, from it to the distance of the substrate holder 6 on it
It is bigger than distance in processing stage between the substrate holder 6.In this embodiment, loading attachment 9 is in whole dresses
Same position is all vertically kept in the load stage, therefore, in order that the substrate holder 6 that must be loaded reaches correct position
Put, it is meant that raising device 8 must cause that substrate holder 6 is ramped up.On the substrate holder 6 being loaded and it
Substrate holder 6 between space will be moved by allowing to carry out the substrate holder 6 of loading and/or by causing other bases
Plate retainer 6 is moved and arranged, in this special circumstances, the substrate holder 6 on it is most top side substrate holder,
The most top side substrate holder can not be moved further away from the substrate holder 6 being loaded in this example, therefore enter luggage
The substrate holder 6 of load must also be transported away from most top side substrate holder 6, other substrate holders 6 preferably below it
Move into mutually closer.Therefore, in loading stage, the cloth of substrate holder 6 in addition to the substrate holder 6 being loaded
It is set to and holding fix is moved to by actuator, in the holding fix, substrate holder 6 is more mutual than in processing position
Close, they are in the processing position in processing stage.In another embodiment of the invention, loading attachment 9 is arranged to
Certain height is moved to inside vacuum chamber 2 and/or reaction chamber 3, then moves downward such as about 10-20mm, or very
To about 200-300mm, to cause that substrate 10 is arranged on substrate holder 6, and loading attachment 9 is separated with substrate 10.Then,
Loading attachment 9 is moved out in the lower height from vacuum chamber 2 and/or reaction chamber 3, or in vacuum chamber 2 and/or instead
The moved upward inside of chamber 3 is answered, is then moved out.When two upper substrate retainers 6 have been loaded into and be arranged in treatment position
When putting (they are in the processing position in processing stage), the substrate holder 6 being loaded is preferably away from it
The substrate holder 6 in face, and other substrate holders 6 below it are arranged in holding fix, so, and with treatment position
Compared in the processing stage put, they are closer proximity to each other.Preferably, the substrate holder 6 being loaded is transported by actuator
It is dynamic, so, when two upper substrate retainers 6 are in processing position, the substrate holder 6 being loaded away from them, and
Substrate holder 6 below the substrate holder being loaded is arranged in holding fix, to cause in continuous substrate retainer 6
Between space it is smaller than space in processing stage between same substrate retainer 6.Therefore, in loading stage,
It is arranged to move to processing position by actuator through the substrate holder 6 equipped with substrate 10, to cause continuously loading
The distance between substrate holder 6 is identical with processing stage.Can also be in loading stage, except the substrate being loaded
Substrate holder 6 outside retainer 6 is held in place, and the substrate holder 6 being loaded moves to dress by actuator
Carry position.In loading stage, the substrate holder 6 being loaded moves to " loaded " position by actuator.So that described
The actuator of the motion of substrate holder 6 is preferably latch structure, and so, pin is arranged through reaction chamber 3 and/or vacuum chamber 2
Bottom, in the case of Fig. 3 for reaction chamber 3 bottom.The bottom of the reaction chamber 3 is preferably by the bottom of frame substrate 5
Portion's plate 7 is arranged, therefore latch structure is also disposed to through bottom plate 7.Other actuator constructions can also, for example bar is arranged to
Through chamber wall.Actuator can also be arranged so that moving component in the outside of reaction chamber 3.Therefore do not have on moving component
There are pollution or thin film deposition, therefore do not produce particle.
Fig. 3 a-3f illustrate the scheme that substrate holder 6 is supported in frame substrate 5 respectively.Substrate holder can be frame
Frame, shelf or similarity piece, with space among each other, so that precursor gases can flow through substrate surface.Fig. 3 a tables
Reaction chamber 2 in an open position is shown, all empty substrate holder 6 is supported by retainer pin 45 by frame 5.The
One substrate is loaded on top retainer.The axle 41 of actuator 42 is exited.There are ways to combine actuator number and it
Arrangement.A kind of scheme is to use four actuators, on two opposite sides each two actuators.Fig. 3 b illustrate bottom plate
7 motions upwards, until head substrate retainer 6 is in the height of actuator shaft 41.Actuator shaft 41 is moved out, until shaft end
Portion and retainer pin connection.The end effector 44 of loading attachment is return.Fig. 3 c illustrate bottom plate 7 and cause except head substrate
Whole substrate holders outside retainer 6 are moved downward with it.Top retainer 6 is kept just by actuator shaft 41
Position.Therefore, at this moment there is free space between top retainer 6 and next retainer 6 such that it is able to load next substrate
10.Fig. 3 d illustrate bottom plate 7 and move upwards, until top retainer 6 is placed on its pin.Then, actuator shaft 41 is exited,
Bottom plate 7 moves the distance of another retainer further up.Fig. 3 e illustrate actuator shaft 41 and move out, until shaft end
Portion is connected with retainer pin 45.Then, bottom plate 7 is moved downward, so as to open in two top retainers 6 and remaining holding
Space between device 6, therefore, it is possible to load next substrate.Fig. 3 f are illustrated and loaded and whole actuators in whole substrates 10
Final situation when axle 41 is all exited, and the motion upwards of bottom plate 7, until reaction chamber 3 is closed.
Fig. 4 a and 4b illustrate the frame substrate 5 in the loading process of substrate to be implemented by the present invention that spring 47 is stayed open
Example.In this embodiment, the sidepiece of frame 5 is slightly tilted, so that substrate holder 6 can be vertically movable.When whole substrates all
When having been loaded into, reaction chamber 3 is closed by causing bottom plate 7 to move upwards.When the wedge 48 of frame reaches roller 46, compel
Close frame.For example when good heat conductive is needed between frame sidepiece and substrate holder, or when need frame sidepiece close/
During seal retainer pin opening, this scheme can be used.
Fig. 5 a and 5b illustrate the embodiment that substrate holder 6 is supported in frame 5 respectively, such as the institute in Fig. 3 a-3f earlier
Show.Therefore Fig. 5 a and 5b illustrate an implementation of the frame component that substrate holder 6 can be vertically movable relative to the wall of frame 5
Example, therefore produce the space needed for for loading substrate 10.When actuator shaft 41 is connected with pin 51, and during the reduction of bottom plate 7, promote
Dynamic device will cause that substrate holder 6.3 is held in place, while remaining frame is moved downward.So, in the substrate holder with
Space between the retainer 6.4 in face increases, while reducing to the space of retainer 6.2 above.Can by slit 50
Relative motion is carried out, the wall that bearing pin 55 can be relative to frame in the slit is moved.When bottom plate 7 is further moved downward,
Pad 49 will be reached at the pad of retainer 6.2 above, so as to stop the further motion of retainer 6.2.When bottom plate 7 after
Continuous when moving downward, the space between retainer 6.3 and 6.4 will continue to increase, while between retainer 6.2 and 6.1
Space starts to reduce.Pad 49 can realize in a multitude of different ways, a kind of portion for being to be added to pad substrate holder
Part, the part 53 in upper figure.
Fig. 5 a illustrate frame substrate 5 in processing position, loading completely.Arrangement of the substrate 10 in frame substrate 5 will
Arranged by making them be placed in horizontal level, so, the surface of each substrate is all in horizontal plane.Substrate 10 is preferably cloth
Put in continuous substrate holder 6, so, they form a collection of horizontally disposed substrate 10.When frame substrate 5 is mounted with completely
During substrate 10, raising device causes that frame substrate 5 is moved, to cause that frame substrate 5 is completely in inside reaction chamber 3.The cloth of frame substrate 5
It is set to when it is completely in 3 inside of reaction chamber and closes the reaction chamber 3.In this embodiment, the bottom plate 7 of frame substrate 5
The flange of the perforated wall of reaction chamber 3 is disposed against, for closing reaction compartment 30.Therefore, frame substrate 5 is (in the embodiment
In, bottom plate 7) it is arranged as being formed when reaction chamber 3 is closed at least a portion of reaction chamber 3.And, the cloth of reaction chamber 3
Be set to by by raising device so that frame substrate 5 moves and closes and open.Therefore, the present invention is capable of the loading of assembled substrate 10
With the closing of reaction chamber 3.
Therefore, according to the present invention, substrate can be loaded into the frame substrate 5 including multiple substrate holders 6, or they
Can be loaded on a pile substrate holder 6.In both embodiments, substrate holder 6 is all used to support the substrate, and base
Plate retainer 6 is arranged to move relative to each other.
It will be clear to a person skilled in the art that when technological progress, concept of the present invention can be implemented in many ways.This
Invention and its embodiment are not limited to examples detailed above, and can be to change within the scope of the claims.
Claims (16)
1. a kind of device, for by causing that at least a portion of substrate surface is subject to the alternating table of at least the first and second precursors
Face is reacted and two or more substrates is processed in batch processing, and the device includes：
Multiple substrate holders, for supporting the substrate；And
Reaction chamber, the reaction chamber includes reaction compartment, and the reaction chamber is arranged in processing stage empty in reaction
Between in substrate surface on deposition materials, substrate holder install or be arranged to be arranged on reaction chamber inside, for
The substrate inside reaction chamber is processed in processing stage, it is characterised in that：
In the loading stage that substrate loads to substrate holder by loading attachment, at least some substrate holder arrangements
Into can move relative to each other.
2. device according to claim 1, it is characterised in that：Substrate holder is arranged in frame substrate, for keeping wrapping
Include a collection of substrate of two or more substrates.
3. device according to claim 1, it is characterised in that：Substrate holder arrangement is in heaps.
4. device according to claim 1, it is characterised in that：Device also includes actuator, for causing substrate holder
Motion, so, in loading stage, is loaded and has on it the substrate holder of another substrate holder to be arranged in dress
Position is carried, in the " loaded " position, the distance from the substrate holder being loaded to the substrate holder on it is more than
Distance in processing stage between same substrate retainer.
5. device according to claim 1, it is characterised in that：In loading stage, except the substrate being loaded keeps
Substrate holder outside device is arranged to move to holding fix by actuator and/or raising device, in the holding fix
In, substrate holder is closer proximity to each other compared with processing position, and they are in the processing position in processing stage.
6. device according to claim 1, it is characterised in that：In loading stage, the substrate for being already equipped with substrate keeps
Device is arranged to move to processing position by actuator and/or raising device, so, it is continuous load substrate holder it
Between distance it is identical with processing stage.
7. device according to claim 1, it is characterised in that：In loading stage, the substrate holder being loaded leads to
Cross actuator and/or raising device and move to " loaded " position.
8. device according to claim 1, it is characterised in that：In loading stage, except the substrate being loaded keeps
Substrate holder outside device will be held in place, and the substrate holder being loaded moves to loading position by actuator
Put.
9. device according to claim 1, it is characterised in that：Substrate holder is the shelf for supporting substrates.
10. device according to claim 1, it is characterised in that：Substrate holder is a pair of support lugs, for by substrate
It is supported between this pair of support lug.
11. devices according to claim 1, it is characterised in that：Frame substrate includes bottom plate and framework, and the substrate keeps
Device is arranged to be connected with the framework.
12. device according to any one in claim 4-8, it is characterised in that：Actuator is included through bottom plate cloth
The latch structure put.
13. device according to any one in claim 4-8, it is characterised in that：Actuator is included through reaction chamber
The bar structure of arrangement.
14. devices according to claim 1, it is characterised in that：Device also includes lifting device, and the lifting device is arranged to
For the frame substrate of loading to be increased in reaction chamber, so, reaction chamber is arranged to by causing base by raising device
Grillage moves and closes and open.
15. device according to any one in claim 4-8, it is characterised in that：Actuator is arranged to so, in treatment
In stage, the moving component of actuator is arranged in the outside of reaction chamber.
16. devices according to claim 1, it is characterised in that：Device also includes vacuum chamber.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20135280A FI125222B (en) | 2013-03-22 | 2013-03-22 | Apparatus for handling two or more substrates in a batch process |
| FI20135280 | 2013-03-22 | ||
| PCT/FI2014/050151 WO2014147290A1 (en) | 2013-03-22 | 2014-02-28 | An apparatus for processing two or more substrates in a batch process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105164310A CN105164310A (en) | 2015-12-16 |
| CN105164310B true CN105164310B (en) | 2017-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480024683.2A Active CN105164310B (en) | 2013-03-22 | 2014-02-28 | Device for processing two or more substrates in batch processing |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10273579B2 (en) |
| CN (1) | CN105164310B (en) |
| DE (1) | DE112014001586B4 (en) |
| FI (1) | FI125222B (en) |
| WO (1) | WO2014147290A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10727374B2 (en) | 2015-09-04 | 2020-07-28 | Seoul Semiconductor Co., Ltd. | Transparent conductive structure and formation thereof |
| US10741724B2 (en) | 2015-10-02 | 2020-08-11 | Seoul Viosys Co., Ltd. | Light emitting diode devices with zinc oxide layer |
| US10981800B2 (en) | 2016-04-14 | 2021-04-20 | Seoul Semiconductor Co., Ltd. | Chamber enclosure and/or wafer holder for synthesis of zinc oxide |
| US10407315B2 (en) | 2016-04-14 | 2019-09-10 | Seoul Semiconductor Co., Ltd. | Method and/or system for synthesis of zinc oxide (ZnO) |
| WO2017180823A1 (en) * | 2016-04-14 | 2017-10-19 | Seoul Semiconductor Co., Ltd. | METHOD AND/OR SYSTEM FOR SYNTHESIS OF ZINC OXIDE (ZnO) |
| US10981801B2 (en) | 2016-04-14 | 2021-04-20 | Seoul Semiconductor Co., Ltd. | Fluid handling system for synthesis of zinc oxide |
| CN110234793B (en) * | 2017-02-08 | 2020-10-02 | 皮考逊公司 | Deposition or cleaning apparatus with movable structure and method of operation |
| US10755955B2 (en) * | 2018-02-12 | 2020-08-25 | Applied Materials, Inc. | Substrate transfer mechanism to reduce back-side substrate contact |
| FI130051B (en) * | 2019-04-25 | 2023-01-13 | Beneq Oy | Apparatus and method |
| US20220372621A1 (en) * | 2021-05-18 | 2022-11-24 | Mellanox Technologies, Ltd. | Cvd system with substrate carrier and associated mechanisms for moving substrate therethrough |
| FI130543B (en) * | 2021-08-13 | 2023-11-08 | Beneq Oy | An atomic layer deposition apparatus and method |
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| JP2555895B2 (en) * | 1989-12-14 | 1996-11-20 | 日本電気株式会社 | Semiconductor wafer heat treatment equipment |
| JP3215599B2 (en) | 1995-06-02 | 2001-10-09 | 東芝セラミックス株式会社 | Heat treatment substrate holder, heat treatment method and heat treatment apparatus |
| US20050188923A1 (en) | 1997-08-11 | 2005-09-01 | Cook Robert C. | Substrate carrier for parallel wafer processing reactor |
| JP2000311862A (en) * | 1999-04-28 | 2000-11-07 | Kokusai Electric Co Ltd | Substrate treating system |
| KR100613674B1 (en) * | 1999-05-14 | 2006-08-21 | 동경 엘렉트론 주식회사 | Method and apparatus for processing wafer |
| KR100802990B1 (en) * | 2003-11-20 | 2008-02-14 | 가부시키가이샤 히다치 고쿠사이 덴키 | Method for Manufacturing Semiconductor Device and Substrate Processing Apparatus |
| US8211235B2 (en) | 2005-03-04 | 2012-07-03 | Picosun Oy | Apparatuses and methods for deposition of material on surfaces |
| JP4719070B2 (en) * | 2006-04-27 | 2011-07-06 | 株式会社日立国際電気 | Semiconductor manufacturing apparatus, semiconductor manufacturing method, and boat |
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- 2014-02-28 CN CN201480024683.2A patent/CN105164310B/en active Active
- 2014-02-28 DE DE112014001586.5T patent/DE112014001586B4/en active Active
- 2014-02-28 US US14/777,613 patent/US10273579B2/en active Active
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| CN100541711C (en) * | 2006-03-14 | 2009-09-16 | 东京毅力科创株式会社 | Base-plate buffering device and method and processing unit |
| CN101438387A (en) * | 2006-06-26 | 2009-05-20 | 应用材料股份有限公司 | Batch processing platform for ALD and CVD |
| CN102046856A (en) * | 2008-05-27 | 2011-05-04 | 皮考逊公司 | Methods and apparatus for deposition reactors |
Also Published As
| Publication number | Publication date |
|---|---|
| FI125222B (en) | 2015-07-15 |
| DE112014001586B4 (en) | 2023-10-05 |
| CN105164310A (en) | 2015-12-16 |
| US20160281228A1 (en) | 2016-09-29 |
| US10273579B2 (en) | 2019-04-30 |
| DE112014001586T5 (en) | 2016-01-21 |
| WO2014147290A1 (en) | 2014-09-25 |
| FI20135280A (en) | 2014-09-23 |
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