JP3215599B2 - Heat treatment substrate holder, heat treatment method and heat treatment apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment substrate holder used in various heat treatment steps for manufacturing semiconductors, a heat treatment method and a heat treatment apparatus using the holder, and more particularly to a heat treatment method for a semiconductor wafer. The present invention relates to a substrate holder for heat treatment which reduces stress concentration, prevents the occurrence of slip due to the weight of a semiconductor wafer, and can freely adjust the height, a heat treatment method and a heat treatment apparatus using the holder.

[0002]

2. Description of the Related Art Conventionally, a bell jar type vertical heat treatment apparatus has been used in a process of performing heat treatment such as diffusion, oxide film formation, annealing, hydrogen treatment, and Ar treatment on a semiconductor wafer to manufacture a semiconductor body. Have been.

When a semiconductor wafer is heat-treated by such a vertical heat treatment apparatus, a substrate holder for heat treatment for holding these semiconductor wafers horizontally is used in order to process a large number of semiconductor wafers simultaneously. . This substrate holder for heat treatment has a plurality of columns made of a heat-resistant material such as quartz, and at regular intervals, a large number of slits perpendicular to the length direction are formed, and both ends of these columns are formed with slits inward. The semiconductor wafer is held by an end plate so as to face, and the semiconductor wafer is held in parallel at the slit.

In such a heat-treating substrate holder, at least two of the columns adjacent to each other must be spaced apart from each other by a distance equal to or larger than the diameter of the wafer in order to insert and remove the semiconductor wafer. The unevenness of the intervals causes unevenness in the stress applied to the edge of the semiconductor wafer. Than such stress,
With the recent increase in the size of semiconductor wafers and the increase in the temperature of processing, the cause and deformation of slip have been caused, and a solution to this problem has been desired.

In order to avoid this problem, the columns are arranged at equal intervals irrespective of the diameter of the semiconductor wafer, and one of them is detachable, and when the semiconductor wafer is inserted, the columns are removed and the columns are removed therefrom. There has also been proposed a heat treatment substrate holder in which a semiconductor wafer is inserted and engaged with a slit, the semiconductor wafer is mounted and then removed to assemble a column. However, in such a substrate holder for heat treatment, when mounting the column which has been removed by housing the semiconductor wafer, the end portion of the semiconductor wafer already held by being engaged with the slit of another column is mounted. Must be engaged with the slits of the support posts, and there is a problem that workability is extremely deteriorated.

Further, the heat-treating substrate holder is made of an expensive material such as quartz. However, the conventional heat-treating substrate holder cannot be repaired. There is also a problem that the processing cost of the semiconductor wafer increases.

Further, since the conventional heat treatment substrate holder is designed in accordance with the height of the vertical heat treatment furnace to be used, there is also a problem that it cannot be diverted to another heat treatment furnace. Was.

Further, in such a conventional heat treatment apparatus using a wafer holder, although a large number of semiconductor wafers can be heat-treated at the same time, the temperature rise and fall of the heat treatment apparatus must be repeated for each heat treatment operation. Therefore, there was a problem that productivity was poor and heat utilization efficiency was not good.

[0009]

As described above, in the conventional heat-treating substrate holder, the weight of the wafer is concentrated only at a specific portion of the peripheral portion of the wafer. There is a problem that this may cause deformation. In addition, there is a problem that workability is extremely poor when one of the columns is detachable.

In addition, the conventional heat-treating substrate holder cannot be repaired, and if any part of the substrate holder is damaged, it becomes impossible to use the entire holder and the processing cost is increased.

Furthermore, the conventional heat-treating substrate holder has a problem that it cannot be diverted to another heat-treating furnace because its height is designed according to the height of the vertical heat-treating furnace to be used. Was.

Further, since the conventional vertical heat treatment apparatus is a batch process, there is a problem that productivity is low and heat utilization efficiency is low.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and its main object is to uniformly apply a stress to an edge of a substrate causing slip or deformation without impairing workability. It is an object of the present invention to provide a heat-treating substrate holder that can be added. Another object of the present invention is to provide a heat treatment substrate holder capable of repairing only a damaged portion.

Still another object of the present invention is to provide a heat-treating substrate holder which can be adjusted in height and can be diverted to other vertical heat-treating furnaces.

Still another object of the present invention is to provide a heat treatment method and a heat treatment apparatus capable of continuously heat treating a substrate.

[0016]

An object of the present invention is to provide an annular substrate mounting portion having an inner peripheral edge having a smaller diameter than the outer diameter of a substrate to be mounted, and a back surface in an area outside the substrate to be mounted. This is achieved by a heat treatment substrate holder comprising a plurality of boat units each having a support portion provided on the side. The substrate holder for heat treatment is used by mounting substrates to be heat-treated on the substrate mounting portions of a plurality of boat units, and stacking a plurality of boat units concentrically on another boat unit. You.

A reference example of the substrate holder for heat treatment of the present invention.
In the first type, the substrate to be heat-treated is supported concentrically on the outer peripheral edge of the boat unit by an annular support portion, and each boat unit is concentrically stacked on another boat unit. . Therefore, in this type of substrate holder for heat treatment, the annular substrate mounting portion of the boat unit has an outer peripheral edge whose diameter is larger than the outer diameter of the substrate to be mounted, and this portion supports other boat units. The part is put on.

In the first type of heat treatment substrate holder, a plurality of boat units are further provided with through holes, and locking pins made of a heat resistant material such as a heat resistant alloy are inserted through the through holes and fixed. And a type in which a concave portion on which the support portion of another boat unit can be fitted is formed on the support portion, and the concave portion is stacked and fixed so that the support portion of the other boat unit is fitted in this concave portion. Can be In the former case using the locking pin, the through hole is formed in an empty area caused by the orientation flat when the wafer is concentrically mounted, thereby avoiding a decrease in strength due to the formation of the through hole. In this type of boat unit, a semiconductor wafer is placed, and its supporting portion is placed on the supporting portion of another boat unit, and after stacking a required number of pieces, a lock made of a heat-resistant material such as a heat-resistant alloy is inserted into the through hole. Each boat unit is fixed by inserting a pin, and is charged into the heat treatment furnace.
In the latter type, in which another supporting portion is fitted into the concave portion, an engaging boss is projected from the lower surface of the supporting portion, and a concave portion in which the engaging boss is fitted is formed thereon, or the supporting portion is formed. A concave portion large enough to fit the entire support portion is formed thereon, and the engaging boss or the entire support portion is fitted into the concave portion for use.

In the first type of heat treatment substrate holder of the present invention, the substrate to be heat treated is held by the heat treatment substrate holder at a portion inside the outer peripheral edge. In this type, an auxiliary ring with a smaller diameter than the substrate is placed on the substrate mounting part of the boat unit and the substrate is mounted on this auxiliary ring. There is a type with a small diameter.

Although the inner diameter of the former auxiliary ring is not particularly limited, it is desirable that the inner ring has the same shape as the inner peripheral edge of the substrate mounting portion in consideration of workability.

In the latter case, since the diameter of the substrate mounting portion is smaller than that of the substrate, a plurality of arms are radially provided at equal intervals on the outer periphery of the substrate mounting portion in order to stack the substrates. A support is provided on the lower surface of the tip of the arm. In this case, as means for fixing the stacked boat units,
As described above, the supporting portion is projected on the back surface, or the engaging boss is projected on the supporting portion on the back surface, and the upper surface thereof is formed with a concave portion capable of fitting them, or the tip of the arm portion is used for holding. Any of the plurality of columns having the grooves formed therein and held by a holding unit erected on a base can be used.

The relative radius of the auxiliary ring or the annular substrate mounting portion of the first type to the substrate has a great influence on stress and deformation.

That is, when the outer diameter of the auxiliary ring or the like coincides with the outer diameter of the substrate, the deflection and distortion are maximized at the center of the semiconductor wafer. If the radius of the auxiliary ring or the like becomes too small, the maximum deformation occurs around the substrate and the maximum stress occurs at the support point. Therefore, it is desirable to use an optimal dimension appropriately according to the situation. The radius of the auxiliary ring or the like that minimizes stress and deformation of the entire substrate is 0.7 times the substrate radius. In this case, the maximum stress in the substrate is 1/4 and the maximum deflection in the substrate surface is 4% as compared with the conventional method of supporting the outer peripheral edge. Further, in consideration of the requirements of the substrate heat treatment process, the radius of the auxiliary ring or the like is 0.6 to the substrate radius.
Desirably 0.8 times. When only stress and deformation are considered, the radius of the auxiliary ring is 0.65 of the substrate radius.
Desirably, it is 0.75 times.

A second type of the substrate holder of the present invention comprises an annular substrate mounting portion, a cylindrical edge provided on the outer periphery thereof, and an edge protruding from the back surface of the substrate mounting portion. Having a support portion of a size that can be fitted, and in a state in which the support portion of another substrate holder is fitted to the upper edge of one substrate holder and a plurality of the holders are stacked, a flat or fork-like A notch into which these support portions can be inserted is formed at the upper edge so that the support portions can be inserted horizontally.

The second type of heat-treating substrate holder takes advantage of this feature by supporting the bottom of the heat-treating substrate holder with a first supporting portion that can be inserted into the cutout. The upper edge portion of another substrate holder for heat treatment supported by the second support portion is brought into contact with the bottom portion of the substrate holder in such a manner that the first support portion is flanked by the cutout portion, and the whole is subjected to the second process. The boat unit is supported by the support unit, and then the first support unit is retracted and lowered, and another boat unit is mounted. Thereafter, the same operation as described above is repeated, so that this boat unit is opened and closed in a cylindrical reaction. It can be inserted from the bottom of the chamber in order and removed from the top. Further, the substrates extruded in order from the cylindrical reaction chamber can be carried out by inserting the holding portions of the holding means into the cutouts provided in each boat unit and lifting them up.

In any of these types, quartz having excellent heat resistance is suitable as a material for the boat unit.

The heat treatment method of the present invention utilizes the characteristics of the heat treatment substrate holder of the present invention having a simple boat unit stacking structure, and a plurality of members to be heat treated housed in the boat unit are vertically arranged. From the lower part of the open and closed high-temperature cylindrical reaction chamber, the bottom of the boat unit inserted first is inserted in order so as to be pushed up by the upper edge of the boat unit to be inserted next, and the heat treatment of the substrate to be heat-treated is performed. Then, after the heat treatment is completed, the boat units extruded from the upper part of the reaction chamber are sequentially taken out.

When a second type of substrate holder for heat treatment is used in this method, the retreating / retracting member has a flat or fork-like holding portion which can be horizontally inserted into a cutout at the upper edge of the boat unit. A holding means capable of moving up and down is used.

The heat treatment apparatus of the present invention also utilizes the characteristics of the stacked structure of the substrate holder for heat treatment of the present invention.
A vertically arranged cylindrical reaction chamber which is vertically open and closed, a heating device for heating the reaction chamber, and an upper operation chamber partitioned from the outside air arranged above and below the reaction chamber so as to surround the opening of the reaction chamber And a lower operation chamber, and a boat unit that accommodates semiconductor wafers from the lower part of the reaction chamber in the lower operation chamber so that the bottom of the previously inserted boat unit is pushed up by the edge of the next inserted boat unit. A boat unit lifting device for sequentially inserting the boat unit, a lower transportation device for transporting the boat unit to the lifting device, and an upper transportation device for discharging the boat unit extruded from the upper part of the reaction chamber. I have.

[0030]

In the first type of substrate holder for heat treatment, which is a reference example, the substrates are concentrically mounted on a required number of boat units, and when the through holes are formed, the respective boat units are concentric. Further, they are stacked so that the through-holes coincide with each other, and a locking pin is inserted into the through-hole, or a support portion or the like is fitted and fixed in the recess, and then the furnace is charged into the heat treatment furnace.

At this time, the support of each boat unit is
It is placed outside the substrate on the substrate mounting part of the boat unit that is the lower stage. In the first type of heat treatment substrate holder, the substrate is supported all around, so that the load on the substrate is evenly distributed and no stress concentration occurs.

In the first type of substrate holder for heat treatment,
The substrate is placed on the substrate platform via the auxiliary ring or directly. In this type, the weight of the substrate is evenly distributed in the circumferential direction of the substrate and is also distributed in the radial direction of the substrate, so that stress concentration can be more effectively avoided.

Further , the second type has a cutout portion into which a flat or fork-shaped support portion of the support means can be inserted when a plurality of the support members are stacked on the upper edge portion. A heat treatment apparatus capable of performing a continuous heat treatment can be configured.

That is, in the second type, when the first boat unit is supported by the first support means, the second boat unit is held by the second support means and the upper edge of the second boat unit is held. The first and second boat units are supported by making contact with the bottom of the first boat unit so as to fend off the support portion of the first support means with the notch, and then the support portion of the first support means is retracted. By lowering and mounting the third boat unit and repeating the same operation, a plurality of boat units can be stacked one after another.
Further, by using the cutout portion of the boat unit, the support portion of the similar support means is inserted into the cutout portion of the next uppermost boat unit of the stacked boat units, and the uppermost boat unit is lifted. The boat units can be transferred sequentially from the top.

The heat treatment method and heat treatment apparatus of the present invention utilize the characteristics of the heat treatment substrate holder of the present invention having a simple stacked structure.

In the heat treatment method and the heat treatment apparatus according to the present invention, a plurality of boat units accommodating the specific heat treatment substrates are inserted from the bottom of a vertically arranged high-temperature cylindrical reaction chamber which is open up and down first. Are inserted in order so that the bottom of the boat unit is pushed up by the upper edge of the boat unit to be inserted next. The stacked boat units are supported by supporting the lowermost boat unit with a support means, which is supported by the upper edge of a new boat unit abutting the bottom of the previously inserted boat unit. This is performed by a method that does not interfere with the pushing up, for example, the method described for the third type of substrate holder for heat treatment described above.

Then, the stacked boat units are heat-treated in the process of passing through the reaction chamber, are sequentially extruded from the upper part of the reaction chamber, and are taken out to the outside by the upper transfer device which has been on standby.

[0038]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing a boat unit of a reference example , and FIG. 2 is a front view showing an assembled state thereof.

In FIG. 1, the boat unit 1 has an annular shape as a whole, and its outer peripheral edge 1a has a larger diameter than the outer diameter of a wafer 2 (indicated by a chain line) to be mounted, and its inner peripheral edge 1b has a 2 is smaller than the outer diameter. Also,
A through hole 3 is formed near the outer peripheral edge 1a.
Is mounted such that the through hole 3 is located at the center of the orientation flat 2a.

On the lower surface of the boat unit 1, support legs 4 are provided at equal intervals along the outer peripheral edge 1a. The outer diameter of the boat unit 1 and the thickness of the support legs 4 are determined when the wafer 2 is concentrically mounted and another boat unit 1 is stacked concentrically thereon so that the positions of the through holes 3 coincide with each other. The support legs 4 of the upper boat unit 1 are set so as to surround the wafers of the lower boat unit 1 and to be located outside the wafers.

FIG. 2 shows that the wafers 2 are placed and stacked on each of the eight boat units 1 in this manner.
A state is shown in which each boat unit 1 is fixed by inserting the locking pin 5 into the through hole 3. The substrate holder for heat treatment assembled in this manner is charged into a vertical heat treatment furnace or the like and subjected to heat treatment.

FIG. 3 is a perspective view showing another boat unit, and FIG. 4 is an enlarged sectional view showing a support leg portion in an assembled state.

In this boat unit , instead of fixing means by the through holes 3 and the locking pins 5 in FIGS. The structure is the same as that of the boat unit 1 shown in FIGS. 1 and 2 except that a recess 6 having a size to which the engaging boss 4a can be fitted is formed.

In this boat unit , as shown in FIG.
Are mounted, and a plurality of the boat units 1 are used in such a manner that the engaging bosses 4a of the other boat units 1 are engaged with the concave portions 6 of the boat unit 1. The displacement after stacking is prevented because the engaging boss 4a is fitted in the concave portion 6.

Also, in the boat unit shown in FIGS. 3 and 4, an engaging boss 4a is projected from the lower surface of the support leg 4, and the engaging boss 4a is fitted into the concave portion 6, as shown in FIG. To
Instead of providing the engaging boss 4a, a concave portion 6 into which the support leg 4 fits may be formed on the upper surface, and the support leg 4 of another boat unit may be fitted into the concave portion 6 and fixed.

FIG. 6 shows an embodiment of the present invention .
In this embodiment, as shown in the figure, an annular auxiliary ring 7 is placed on the substrate platform, Ru configured Tei to placing the semiconductor wafer 2 thereon. The auxiliary ring 7 has an outer diameter larger than the inner diameter of the substrate mounting portion of the boat unit 1 and smaller than the inscribed circle of the support leg 4. In the heat treatment substrate holder of this embodiment, by setting the outer diameter and the inner diameter of the auxiliary ring 7 to appropriate values, the stress distribution in the plane of the semiconductor wafer 2 can be averaged, and the overall deflection and stress Can be reduced.

In this embodiment, since the auxiliary ring 7 is merely mounted on the substrate mounting portion of the boat unit 1, it can be applied to any of the types shown in FIGS. .

FIG. 7 shows an embodiment in which the substrate mounting portion of the boat unit 1 itself has the function of the auxiliary ring of FIG. In this embodiment, the arm portions 8 are projected radially at regular intervals from the outer periphery of the substrate mounting portion, and the support legs 4
And an engaging boss 4a protrudes from the lower surface thereof.
A recess 6 is formed in the substrate mounting portion to which the engaging boss 4a of another boat unit can be fitted, and when stacked, the engaging boss 4a of another boat unit is fitted and fixed in the recess 6 when stacked. I am trying to.

The substrate mounting portion of the boat unit 1 has a smaller diameter than the outer diameter of the wafer to be mounted. The inner and outer diameters of the substrate mounting portion are determined by considering the strength and the stress distribution in the plane of the semiconductor wafer. It is set to be averaged.

FIG. 8 shows an embodiment in which the arm 8 is fixed by the holding unit 10 in the embodiment shown in FIG. In this type, as shown in the figure, instead of the engaging boss 4a and the concave portion 6, the boat unit 1
A fixing portion 11 having a height higher than the substrate mounting portion also serving as a spacer when the components are stacked is provided. Separately, a positional relationship corresponding to the fixing portion 11 of the boat unit 1 is provided on a base (not shown). A holding unit 10 having a plurality of columns 13 having vertical grooves 12 for holding the fixing portions 11 is prepared, and the fixing portions 11 of the boat unit 1 on which the wafers are mounted are engaged with the columns 13 so that the horizontal unit is provided. The movement inside is restricted. Then, a predetermined number of other boat units 1 on which wafers are mounted are placed on the boat unit 1 while the fixing unit 11 is engaged with the groove 12 in order, so that the boat units 1 are stably stacked. In any of the embodiments shown in FIGS. 6 to 8, the relative radius of the auxiliary ring or the annular substrate mounting portion to the wafer greatly affects the stress and the deformation. The radius of the mounting portion is 0.6 to 0.1 of the wafer radius.
The range is 8 times, preferably 0.65 to 0.75 times.

FIG. 9 shows an example of a boat unit of the second type according to the present invention.

The boat unit 1 includes an annular substrate mounting portion 14, an edge 15 provided on the outer periphery thereof, and a substrate mounting portion 1.
4 has an engaging portion 16 of a size that can be fitted into an edge picture projected on the back surface. A cutout portion 17 into which a flat or fork-shaped holding means can be inserted when stacked is formed in the upper edge portion of the boat unit 1.

FIG. 10 schematically shows a heat treatment apparatus using the boat unit of FIG.

The heat treatment apparatus 18 has a vertically arranged cylindrical reaction chamber 19 which is vertically arranged. The reaction chamber 19 is made of a material having excellent heat resistance such as quartz and generating no volatile components at high temperatures. A heating element 20 is arranged around the reaction chamber 19, and the outer periphery of the heating element 20 is covered with a heat insulating material 21.

The operation chamber 2 having an airtight structure is provided above and below the reaction chamber 19.
2, 23 are arranged. A gas introduction pipe 24 and an exhaust pipe 25 are connected to the operation chambers 22 and 23.
23 can be replaced with an inert gas such as nitrogen gas or helium gas or a gas having a predetermined oxygen concentration.

Atmosphere exchange chambers 26 and 27 are provided adjacent to the operation rooms 22 and 23, respectively. Lower atmosphere exchange room 25
Shutters 28 and 29 are provided between the control unit 21 and the lower operation room 21 and between the lower atmosphere exchange room 27 and the outside. By opening and closing the boat unit 1 and these shutters 28 and 29, the operation room 22 is maintained while maintaining the atmosphere. Can be brought in. Similarly, between the upper atmosphere exchange room 27 and the upper operation room 23,
The shutters 30, 3 are also provided between the upper atmosphere exchange chamber 24 and the outside.
The boat unit 1 can be carried out of the upper operation chamber 23 to the outside while maintaining the atmosphere by opening and closing these shutters 30 and 31.

In the lower operation room 22, a first support beam 32 and a second support beam 33 which can move forward and backward and move up and down, respectively, are arranged in a direction orthogonal to each other. A third support beam 34 having the same function is arranged in parallel with the beam 32. These support beams 31, 32, 33 are inserted into the operation rooms 22, 23 from the outside, but may be disposed in the operation rooms 22, 23. The tip of each of the support beams 21, 22, and 23 is a flat plate having a thickness and a width that can be accommodated in the notch 17 formed at the upper end of the boat unit, and the flat plates of the first and second support beams 31 and 32 are formed. The portion in the shape of is formed of a material having sufficient strength to support the weight of all the boat units 1 stacked and inserted into the reaction chamber 19.

Although not shown, in each of the atmosphere exchange chambers 26 and 27, there is provided a transfer device including a rotary fork which can be extended and contracted by a known three-node link mechanism.
The transfer device is disposed in the lower atmosphere exchange chamber 26, receives the boat unit 1 from the outside, passes it to the first support beam 32,
The transfer device is disposed in the upper atmosphere exchange chamber 27 and functions to receive the boat unit 1 from the third support beam 34 and carry it out to the outside.

Next, the operation of the embodiment shown in FIG. 10 will be described with reference to FIGS.

When the reaction chamber 19 and the operation chambers 22 and 23 reach a predetermined atmosphere and temperature, first, the shutter 29 of the lower atmosphere exchange chamber 26 is opened, and the three sections installed in the atmosphere exchange chamber 26 are opened. The link-type transfer device 35 extends outside and carries one of the first boat units 1 into the atmosphere exchange chamber 26 (FIG. 11). At this time, the boat unit 1 is positioned in advance so that the opposed notches 17 coincide with the transfer direction. When the boat unit 1 enters the atmosphere exchange chamber 26, the external shutter 29 is closed, the shutter 28 between the atmosphere exchange chamber 26 and the operation chamber 22 is opened, and the transfer device 35 moves the boat unit 1 directly below the reaction chamber 19. (FIG. 12). Then, the first support beam 32 advances and holds the bottom of the boat unit 1 and rises by the height of one boat unit (FIG. 13). Subsequently, the next boat unit 1 is similarly carried into the operation room 22 by the transfer device 35 (FIG. 1).
4) The second support beam 33 starts to extend perpendicularly to the plane of the drawing, and rises while holding the second boat unit 1 in the same manner, thereby moving the first support beam 32 to the second boat unit 1. Dodge the notch 17 and move the upper end to the first boat unit 1
To the bottom of After the weight of the first and second boat units 1 is securely received by the second support beam 33, the first support beam 32 retreats, descends to its original position, and enters a standby state (FIG. 15).

In this way, the first support beam 32 and the second
When the support beams 33 alternately push up the boat unit 1 from below and approach the heating zone of the reaction chamber 19, the temperature of the boat unit 1 gradually increases, and the semiconductor wafers accommodated in the boat unit are heat-treated, , The temperature gradually falls and is finally pushed out from the upper part of the reaction chamber 19. Then, the third support beam 34 moves forward, enters from the upper edge of the boat unit 1 next to the top boat unit 1 (FIG. 16), and rises to remove the top boat unit 1. It is lifted from the next boat unit 1 and transferred onto the upper transfer device 36 that has extended (FIG. 17).

Then, the upper transfer device 36 transfers the boat unit 1 to the outside (FIG. 18).

As described above, according to the heat treatment apparatus of the present invention, it is possible to continuously heat-treat the heat treatment target housed in the boat unit 1.

The operations shown in FIGS. 11 to 18 are one embodiment of the present invention, and these operations can be arbitrarily changed by a known sequential control method.

The transfer devices 35 and 36 may be of a belt conveyor type in place of such a type of expansion and contraction transfer.

As shown in FIG. 19, the first support beam 32 is replaced with a pusher 32a which only moves up and down,
In the sequence shown in FIG. 14, the bottom of the boat unit 1 raised first may be pushed up by the upper edge of the boat unit 1 to be raised next in the sequence shown in FIG.

Further, it is also possible to form a slit in the wafer mounting portion of the boat unit 1 to reduce the contact area of the wafer or to form a slit at the edge to improve the flow of the atmosphere gas.

[0069]

According to the substrate holder for heat treatment of the present invention, the self-weight of the substrate is uniformly applied to the entire peripheral portion, thereby preventing the occurrence of slip due to stress concentration and the deformation of the wafer. Also,
Since a plurality of boat units are stacked and used, even if they are partially damaged, they can be easily replaced and the processing cost is easy, and the height can be changed, so that they can be diverted to a heat treatment apparatus. Furthermore, since the substrate holder for heat treatment of the present invention has a laminated structure, it can be continuously loaded into a heat treatment apparatus to perform continuous work, thereby increasing productivity and improving heat use efficiency. .

[Brief description of the drawings]

FIG. 1 is a perspective view showing a boat unit of a reference example .

FIG. 2 is a sectional view schematically showing a state where the boat unit of FIG. 1 is assembled.

FIG. 3 is a perspective view showing another boat unit.

FIG. 4 is a sectional view schematically showing a state in which the boat unit of FIG. 3 is assembled.

FIG. 5 is a sectional view schematically showing still another boat unit .

6 is a cross-sectional view schematically showing a main part of the actual施例of the present invention

FIG. 7 is a partial perspective view showing another embodiment of the present invention.

FIG. 8 is a partial perspective view showing still another embodiment of the present invention.

FIG. 9 is a sectional view schematically showing one embodiment of the present invention.

FIG. 10 is a partial sectional view schematically showing a heat treatment apparatus of the present invention.

FIG. 11 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 12 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 13 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 14 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 15 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 16 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 17 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 18 is a diagram schematically showing the operation of the embodiment in FIG. 10;

FIG. 19 is a partial perspective view illustrating a gel mechanism for pushing up a boat unit according to another embodiment of the heat treatment apparatus of the present invention.

20 (a) to (h) are diagrams showing the operation of the embodiment using the mechanism shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Boat unit, 1a ... Outer periphery, 1b ... Inner periphery, 2 ... Wafer, 2a ... Orientation flat, 3 ... Through-hole, 4 ... Support leg, 4a ... Engagement boss, 5
... locking pin, 6 ... concave part, 7 ... auxiliary ring, 8 ...
Arm part, 10 holding unit, 11 fixing part, 12
... vertical grooves, 13 ... columns, 14 ... substrate mounting part, 15
... edge, 16 ... engaging part, 17 ... notch, 18 ...
Heat treatment device, 19 reaction chamber, 20 heating element, 21
... heat insulating material, 22, 23 ... operation room, 24 ... gas introduction pipe, 25 ... exhaust pipe, 26, 27 ... atmosphere exchange chamber, 2
8, 29, 30, 31 ... shutter, 32, 33, 34
...... Support beam, 35 ... Transfer device

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Taku Haneda 378 Ogunimachi, Ogunimachi, Ogunimachi, Nishiokitama-gun, Yamagata Prefecture Inside the Oguni Plant, Toshiba Ceramics Co., Ltd. No. 378 Toshiba Ceramics Co., Ltd. in Oguni Factory (72) Inventor Tomohide Otsuka Nishiokitama-gun, Yamagata Prefecture Ogunimachi Ojimachi 378 Toshiba Ceramics Co., Ltd. 378, Ogunimachi, Ogunimachi Toshiba Ceramics Co., Ltd.Oguni Factory (72) Inventor: Atsuro Miyao 378, Ogunimachi, Ogunimachi, Ogunimachi, Nishigatagata, Yamagata Prefecture Toshiba Ceramics Co., Ltd. 378 Ogunimachi, Ogunimachi, Nishiokitama-gun, Yamagata Prefecture Toshiba Ceramics (72) Inventor Teihira 30 Soya, Hadano-shi, Kanagawa Prefecture Toshiba Ceramics Co., Ltd. (72) Inventor Katsuhiro Yamamoto 30-Soya, Hadano-shi, Kanagawa Toshiba Ceramics Co., Ltd. (56) References JP-A-6-310454 (JP, A) JP-A-6-45332 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/68 H01L 21 / 22 511 H01L 21/31 H01L 21/324

Claims (7)

(57) [Claims] 1. An annular substrate mounting portion having an outer peripheral edge larger than the outer diameter of a substrate to be mounted and an inner peripheral edge smaller than the outer diameter of the substrate to be mounted, and the substrate mounting portion A plurality of support portions protruding from the back surface of a region outside the substrate, and a concave portion formed at a position corresponding to the support portion on the upper surface of the substrate mounting portion and in which the support portion can be fitted. A plurality of annular boat units, and a plurality of annular auxiliary rings having an outer diameter larger than the inner diameter of the substrate mounting portion and smaller than the inscribed circle of the support portion; Each of the boat units is detachably configured by mounting a substrate on each of the boat units via the auxiliary ring and stacking the support portions of the respective boat units so as to fit into the recesses of the other boat units. Substrate holder. 2. An annular substrate mounting portion having an inner peripheral edge smaller in diameter than an outer diameter of a substrate to be mounted, and a plurality of arms projecting at equal intervals from an outer peripheral edge of a wafer of the substrate mounting portion. The boat unit comprises a plurality of annular boat units each having a support portion protruding from the rear surface of the tip of each of these arms and a concave portion formed on the upper surface of each support portion and into which the support portion can be fitted. Each boat unit is detachably constructed by stacking a substrate on each of the boat units and stacking the support portion on the back surface of the tip of the arm of each boat unit so as to fit into the recess on the top surface of the arm tip of the other boat unit. Substrate holder for heat treatment. 3. An annular substrate mounting portion having an inner peripheral edge smaller in diameter than an outer diameter of a substrate to be mounted, and a plurality of arms protruding at equal intervals from an outer peripheral edge of the wafer of the substrate mounting portion. A plurality of annular boat units each having a supporting portion protruding from the rear surface of the tip of the arm, a base, and an erect standing on the base in a positional relationship corresponding to the tip of the arm of the boat unit; And a support having a groove formed in the longitudinal direction for holding the arm, and a substrate is placed on each of the boat units, and the tip of the arm of each boat unit is set to the groove of the holding unit. A substrate holder for heat treatment, wherein each boat unit is configured to be detachable by being engaged with and stacked on a boat. 4. A plurality of substrates each having an annular substrate mounting portion, an edge provided on an outer periphery thereof, and a supporting portion projecting from the back surface of the substrate mounting portion and having a size capable of fitting to the edge. The boat unit is formed with a cutout on the upper edge thereof, into which a flat or fork-shaped support portion of the holding means can be inserted when a plurality of the boat units are stacked. Substrate holder for heat treatment. 5. The heat treatment substrate holder according to claim 4, wherein the bottom portion is a dropping bottom having a locking step portion that can be fitted to an upper portion of another boat unit. 6. A boat for inserting a plurality of boat units accommodating substrates to be heat-treated from the lower part of a vertically arranged high-temperature cylindrical reaction chamber which is vertically opened, and then inserts the bottom of the boat unit inserted first to the next. insert in the upper edge of the unit in order to push up so subjected to a heat treatment of the heat treatment board, a heat treatment method characterized by issuing preparative boat unit that has been extruded from the upper portion of the reaction chamber in order remaining after heat treatment . 7. A cylindrical reaction chamber vertically arranged vertically open, and the heating device, arranged to surround the opening portion of the front Symbol reaction chamber and below the front Symbol reaction chamber outside air to heat the reaction chamber then insert the boat unit and the upper operating chamber and a lower operating chamber which is partitioned, the bottom of the inserted boat units from the bottom of the front Symbol reaction chamber in the lower operating chamber boat unit previously accommodating the thermally treated substrate from unloading the boat unit push-up device, and a lower transfer device for placing the boat unit before Symbol pushed up device, a boat unit coming extruded from the upper portion of said reaction chamber to be inserted in order in edges pushed up so over the heat treatment instrumentation, characterized in that it comprises an upper transport device for
Place .