CN105163490A - Multifunctional component - Google Patents
Multifunctional component Download PDFInfo
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- CN105163490A CN105163490A CN201510505005.4A CN201510505005A CN105163490A CN 105163490 A CN105163490 A CN 105163490A CN 201510505005 A CN201510505005 A CN 201510505005A CN 105163490 A CN105163490 A CN 105163490A
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- conductive coil
- capacitor
- laminated body
- parts
- chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a multifunctional component. The multifunctional component comprises a conductive coil, and at least one of a first lamination capacitor, a chip resistor and magnetic beads, wherein the conductive coil, the first lamination capacitor, the chip resistor and the magnetic beads are in mutual electrical insulation; the first lamination capacitor is positioned in the inner side and/or the outer side of the conductive coil; the chip resistor is positioned in the top surface and/or bottom surface of the conductive coil; and the magnetic beads are positioned in the top surface and/or bottom surface of the conductive coil. The multifunctional component realizes functions of multiple kinds of electronic components on one patch device simultaneously, so that the layout space of a PCB (printed circuit board) is reduced, and the PCB routing is shortened and the material is reduced as well.
Description
Technical field
The embodiment of the present invention relates to electronic devices and components field, particularly relates to a kind of multi-functional components and parts.
Background technology
Along with the progress of science and technology, the continuous lifting that the development in epoch and people require for miniaturization of electronic products, small-sized patch electronics components and parts present diversified development trend.
Such as, but current Chip-R, patch capacitor, chip inductor and paster magnetic bead are all discrete devices, can only realize single function separately, and Chip-R can only realize the function of resistance, and patch capacitor can only realize the function of electric capacity.In actual applications, resistance, electric capacity, inductance and magnetic bead are all conventional electronic components, often thickly dottedly on one piece of PCB (PrintedCircuitBoard, the printed circuit board) plate put hundreds and thousands of such gadgets.When carrying out functional circuit design, can take a large amount of pcb board spaces, and layout is not compact, cabling is complicated, and cost is high.
Summary of the invention
The invention provides a kind of multi-functional components and parts, to realize realizing multiple electronic component function at a surface-mounted device simultaneously, reduce pcb board arrangement space, shorten PCB cabling and reduce the effect of material.
Embodiments provide a kind of multi-functional components and parts, comprising:
Conductive coil;
And at least one in first laminated body, capacitor, Chip-R and magnetic bead;
Wherein, described conductive coil, the first laminated body, capacitor, Chip-R and magnetic bead are electrically insulated mutually;
Described first laminated body, capacitor is positioned at inside described conductive coil and/or outside;
Described Chip-R is positioned at described conductive coil end face and/or bottom surface;
Described magnetic bead is positioned at described conductive coil end face and/or bottom surface.
At least one by embedding in the components and parts of conductive coil realizing inductive function in the first laminated body, capacitor, Chip-R and magnetic bead of the present invention, thus achieve the function that components and parts have multiple electronic component, reduce pcb board arrangement space, shorten PCB cabling, decrease material, reduce cost.
Accompanying drawing explanation
The schematic top plan view of a kind of multi-functional components and parts that Fig. 1 a provides for the embodiment of the present invention;
The schematic top plan view of another multi-functional components and parts that Fig. 1 b provides for the embodiment of the present invention;
The schematic top plan view of another multi-functional components and parts that Fig. 1 c provides for the embodiment of the present invention;
The schematic cross-section of another multi-functional components and parts that Fig. 1 d provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 1 e provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 1 f provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 1 g provides for the embodiment of the present invention one
The schematic cross-section of another multi-functional components and parts that Fig. 1 h provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 1 i provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 2 a provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 2 b provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 2 c provides for the embodiment of the present invention one;
The schematic cross-section of another multi-functional components and parts that Fig. 2 d provides for the embodiment of the present invention one;
The schematic top plan view of a kind of multi-functional components and parts that Fig. 3 a provides for the embodiment of the present invention two;
The schematic cross-section of another multi-functional components and parts that Fig. 3 b provides for the embodiment of the present invention two;
Fig. 3 c is another schematic cross-section of Chip-R in Fig. 3 b;
The schematic cross-section of another multi-functional components and parts that Fig. 3 d provides for the embodiment of the present invention two;
The bottom view of a kind of multi-functional components and parts that Fig. 3 e provides for the embodiment of the present invention two.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, illustrate only part related to the present invention in accompanying drawing but not entire infrastructure.
Embodiment one
Embodiments provide a kind of multi-functional components and parts, comprising: conductive coil, and at least one in the first laminated body, capacitor, Chip-R and magnetic bead; Wherein, described conductive coil, the first laminated body, capacitor, Chip-R and magnetic bead are electrically insulated mutually; Described first laminated body, capacitor is positioned at inside described conductive coil and/or outside; Described Chip-R is positioned at described conductive coil end face and/or bottom surface; Described magnetic bead is positioned at described conductive coil end face and/or bottom surface.Multi-functional components and parts provided by the present invention have multiple implementation, introduce the multi-functional components and parts described in the embodiment of the present invention in detail below in conjunction with accompanying drawing.
See Fig. 1 a-Fig. 1 i, the multi-functional components and parts that the present embodiment provides comprise any one in conductive coil and the first laminated body, capacitor, Chip-R and magnetic bead.The schematic top plan view of a kind of multi-functional components and parts that Fig. 1 a provides for the embodiment of the present invention, as shown in Figure 1a, described multi-functional components and parts comprise: conductive coil 11 and the first laminated body, capacitor 12; Wherein, conductive coil 11 and the first laminated body, capacitor 12 are electrically insulated mutually, and described first laminated body, capacitor 12 is positioned at the outside of described conductive coil 11.It should be noted that Fig. 1 a exemplary the outside that described first laminated body, capacitor 12 is positioned at described conductive coil 11 is set, restriction not to the embodiment of the present invention, in other embodiments, described first laminated body, capacitor 12 can also be positioned at the inner side of described conductive coil 11, as shown in Figure 1 b, as long as ensure that described conductive coil 11 and the first laminated body, capacitor 12 are electrically insulated mutually.Concrete can arrange insulating material, to ensure to be electrically insulated each other between described conductive coil 11 and the first laminated body, capacitor 12.Further, as described in Fig. 1 c, described multi-functional components and parts can also comprise 2 the first laminated body, capacitors 121 and 122, are arranged at the inner side and outer side of described conductive coil 11 respectively.The multi-functional components and parts that Fig. 1 a-Fig. 1 c provides comprise two kinds of electronic components, and be inductance and electric capacity respectively, wherein conductive coil 11 realizes the function of inductance, and the first laminated body, capacitor 12 realizes the function of electric capacity.When needing to realize the circuit of certain function on pcb board, can by connecting up on pcb board, corresponding connection conductive coil 11 and the first laminated body, capacitor 12 can realize the two parallel connection or series connection, compared to the space at least needing 2 surface mount elements taken on pcb board in prior art, the multi-functional components and parts that the present embodiment provides only need take the space of a surface mount elements, and the wiring on pcb board also can be shortened accordingly.
The schematic cross-section of another multi-functional components and parts that Fig. 1 d provides for the embodiment of the present invention one, as shown in Figure 1 d, described multi-functional components and parts comprise: conductive coil 11 and Chip-R 13, wherein said conductive coil 11 and Chip-R 13 are electrically insulated mutually, and described Chip-R 13 is positioned at described conductive coil 11 bottom surface.It should be noted that, as exemplary in Fig. 1 d by as described in Chip-R 13 be arranged on as described in the bottom surface of conductive coil 11, and the restriction not to the present embodiment, described in other way of example, Chip-R 13 can also be positioned at the end face of described conductive coil 11, as shown in fig. le, as long as ensure that described conductive coil 11 and Chip-R 13 are electrically insulated mutually.Further, as shown in Figure 1 f, described multi-functional components and parts can also comprise 2 Chip-Rs 131 and 132, are arranged at end face and the bottom surface of described conductive coil 11 respectively.The multi-functional components and parts that Fig. 1 d-Fig. 1 f provides comprise two kinds of electronic components, and be inductance and resistance respectively, wherein conductive coil 11 realizes the function of inductance, and Chip-R 13 realizes the function of resistance.When needing to realize the circuit of certain function on pcb board, can by connecting up on pcb board, corresponding connection conductive coil 11 and Chip-R 13 can realize the two parallel connection or series connection, compared to the space at least needing 2 surface mount elements taken on pcb board in prior art, the multi-functional components and parts that the present embodiment provides only need take the space of a surface mount elements, and the wiring on pcb board also can be shortened accordingly.
The schematic cross-section of another multi-functional components and parts that Fig. 1 g provides for the embodiment of the present invention one, as shown in Figure 1 g, described multi-functional components and parts comprise: conductive coil 11 and magnetic bead 14, described conductive coil 11 and described magnetic bead 14 are electrically insulated mutually, and described magnetic bead 14 is positioned at described conductive coil 11 bottom surface.It should be noted that, as exemplary in Fig. 1 g by as described in magnetic bead 14 be arranged on as described in conductive coil 11 bottom surface, and the restriction not to the present embodiment, in other embodiments, described magnetic bead 14 can also be positioned at the end face of described conductive coil 11, as shown in figure 1h, as long as ensure that described conductive coil 11 and described magnetic bead 14 are electrically insulated mutually.Further, as shown in figure 1i, described multi-functional components and parts can also comprise 2 magnetic beads 141 and 142, are arranged at end face and the bottom surface of described conductive coil 11 respectively.The multi-functional components and parts that Fig. 1 g-Fig. 1 i provides comprise two kinds of electronic components, and be inductance and magnetic bead respectively, wherein conductive coil 11 realizes the function of inductance, and magnetic bead 14 realizes the function of magnetic bead.When needing to realize the circuit of certain function on pcb board, can by connecting up on pcb board, corresponding connection conductive coil 11 and magnetic bead 14 can realize the two parallel connection or series connection, compared to the space at least needing 2 surface mount elements taken on pcb board in prior art, the multi-functional components and parts that the present embodiment provides only need take the space of a surface mount elements, and the wiring on pcb board also can be shortened accordingly.
It should be noted that multi-functional components and parts that above-described embodiment provides are for comprising conductive coil, and the situation of in the first laminated body, capacitor, Chip-R and magnetic bead.On the basis of above-described embodiment, preferably, described multi-functional components and parts comprise conductive coil, can also comprise any two or three in the first laminated body, capacitor, Chip-R and magnetic bead.The schematic cross-section of another multi-functional components and parts that Fig. 2 a provides for the embodiment of the present invention one, as shown in Figure 2 a, described multi-functional components and parts comprise: conductive coil 11, first laminated body, capacitor 12 and Chip-R 13, wherein said first laminated body, capacitor 12 is positioned at outside and/or inner side (exemplary Fig. 2 a is arranged on outside) of described conductive coil 11, and described Chip-R 13 is positioned at bottom surface and/or the end face (exemplary Fig. 2 a is arranged on bottom surface) of described conductive coil 11.
The schematic cross-section of another multi-functional components and parts that Fig. 2 b provides for the embodiment of the present invention one, as shown in Figure 2 b, described multi-functional components and parts comprise: conductive coil 11, first laminated body, capacitor 12 and magnetic bead 14, wherein said first laminated body, capacitor 12 is positioned at outside and/or inner side (exemplary Fig. 2 b is arranged on outside) of described conductive coil 11, and described magnetic bead 14 is positioned at bottom surface and/or the end face (exemplary Fig. 2 b is arranged on bottom surface) of described conductive coil 11.
The schematic cross-section of another multi-functional components and parts that Fig. 2 c provides for the embodiment of the present invention one, as shown in Figure 2 c, described multi-functional components and parts comprise: conductive coil 11, Chip-R 13 and magnetic bead 14, wherein said Chip-R 13 is positioned at end face and/or bottom surface (exemplary Fig. 2 c is arranged at end face) of described conductive coil 11, and described magnetic bead 14 is positioned at bottom surface and/or the end face (exemplary Fig. 2 c is arranged at bottom surface) of described conductive coil 11.
It should be noted that, the shape of described Chip-R and described magnetic bead can be square can also be circular or other shapes, and the shape of the embodiment of the present invention to Chip-R and magnetic bead is not restricted.Described Chip-R and described magnetic bead area occupied can cover end face and the bottom surface of described conductive coil completely, and also can be less than end face and the bottom surface of described conductive coil, this is not restricted for the embodiment of the present invention.
Compared to the space at least needing 3 surface mount elements taken on pcb board in prior art, the multi-functional components and parts that Fig. 2 a-Fig. 2 c provides only need take the space of a surface mount elements, and the wiring on pcb board also can be shortened accordingly.
The schematic cross-section of another multi-functional components and parts that Fig. 2 d provides for the embodiment of the present invention one, as shown in Figure 2 d, described multi-functional components and parts comprise: conductive coil 11, first laminated body, capacitor 12, Chip-R 13 and magnetic bead 14, wherein said first laminated body, capacitor 12 is positioned at outside and/or inner side (outside being arranged on described conductive coil 11 that Fig. 2 d is exemplary) of described conductive coil 11, described Chip-R 13 is positioned at end face and/or bottom surface (end face being arranged on described conductive coil 11 that Fig. 2 d is exemplary) of described conductive coil 11, described magnetic bead 14 is positioned at bottom surface and/or bottom surface (bottom surface being arranged on described conductive coil 11 that Fig. 2 d is exemplary) of described conductive coil 11.Mutually insulated between described conductive coil 11, first laminated body, capacitor 12, Chip-R 13 and magnetic bead 14, concrete can arrange insulating material each other at it, prevents short circuit.
Compared to the space at least needing 4 surface mount elements taken on pcb board in prior art, the multi-functional components and parts that Fig. 2 d provides only need take the space of a surface mount elements, and the wiring on pcb board also can be shortened accordingly.
It should be noted that the multi-functional components and parts that the embodiment of the present invention provides comprise at least one in the first laminated body, capacitor, Chip-R and magnetic bead, described first laminated body, capacitor is positioned at inside described conductive coil and/or outside; Described Chip-R is positioned at described conductive coil end face and/or bottom surface; Described magnetic bead is positioned at described conductive coil end face and/or bottom surface.When to comprise in described first laminated body, capacitor, Chip-R and magnetic bead multiple, it can combination in any, and described first laminated body, capacitor, Chip-R and magnetic bead can adjust by the carrying out corresponding according to combined situation to the position relationship of described conductive coil.
The embodiment of the present invention is by arranging at least one in the first laminated body, capacitor, Chip-R and magnetic bead in the relevant position of conductive coil, the space shared in pcb board with a surface mount elements independent in prior art is identical, but the multi-functional components and parts that the present embodiment provides are on the basis possessing inductive function, also possesses at least one function in electric capacity, resistance, magnetic bead simultaneously.In use, on pcb board, the circuit of certain function is realized if want, because described multi-functional components and parts have the function of multiple electronic component, therefore the quantity that the electronic component on pcb board is arranged can be reduced, because multiple electronic component integration is in components and parts, so when wiring connects on pcb board, save and decrease PCB arrangement space, and shorten PCB cabling, and save material.
Further, described conductive coil can also be able to be multilayer for individual layer, specifically can need personal settings according to application scenarios.
Described conductive coil winding can select close around, spaced winding or disorderly around etc., this is not restricted for the embodiment of the present invention.
On the basis of above-described embodiment, optionally, the inner side of the conductive coil of described multi-functional components and parts can also arrange magnetic core or iron core, thus can improve its inductance value.The shape of magnetic core or iron core can be the various shape such as I-shaped, cylindricality, hat, E shape, tank shape, and the shape of the present embodiment to magnetic core or iron core is not restricted.
On the basis of above-described embodiment, described multi-functional components and parts also comprise the housing be positioned at outside described conductive coil, and described first laminated body, capacitor is positioned at described housing.Described first laminated body, capacitor being arranged in described housing, directly utilizing spatial placement first laminated body, capacitor in housing, therefore without the need to increasing the volume of device.
Further, the material of described housing is plastics or epoxy resin.Described housing plays support and insulating effect to described multifunction device.
Optionally, described multi-functional components and parts also comprise and to be positioned at outside described conductive coil and the radome be mutually electrically insulated.The normal work of other circuit on the influence of magnetic field pcb board that described radome can avoid conductive coil operationally to produce.
When described multi-functional components and parts comprise at least one of the first laminated body, capacitor, Chip-R and magnetic bead, at least one of described first laminated body, capacitor, Chip-R and magnetic bead, all can by arranging cabling on PCB, carrying out connecting with the conductive coil of described multi-functional components and parts or in parallel, described first laminated body, capacitor, between Chip-R and magnetic bead, also can realize series connection between any two or parallel connection by arranging cabling on PCB.With when realizing the circuit of certain function in prior art, need to arrange independent inductance, electric capacity, Chip-R and magnetic bead and carry out connecting and/or parallel connection is compared, the multi-functional components and parts that the present embodiment provides can reduce length of arrangement wire.
Embodiment two
The embodiment of the present invention is the optimization on above-described embodiment basis, the first laminated body, capacitor, Chip-R and the magnetic bead that there is provided in multi-functional components and parts provided by the invention have multiple implementation structure, the present embodiment is described in detail with regard to the concrete structure example of described first laminated body, capacitor, Chip-R, magnetic bead, but is not limitation of the present invention.
The schematic top plan view of a kind of multi-functional components and parts that Fig. 3 a provides for the embodiment of the present invention two, as shown in Figure 3 a, described multi-functional components and parts comprise conductive coil 31 and the first laminated body, capacitor 32, and wherein said first laminated body, capacitor 32 is positioned at inner side and/or outside (outside being arranged on described conductive coil that Fig. 3 is exemplary) of described conductive coil 31.Described conductive coil 31 and described first laminated body, capacitor 32 mutually insulated.Described first laminated body, capacitor 32 comprises multiple first inner electrode layer 321 and multiple the second inner electrode layer 322, and described first inner electrode layer 321 and the second inner electrode layer 322 replace insulation setting and part is overlapping; Described first laminated body, capacitor 32 also comprises the first welding electrode 323 and the second welding electrode 324, described first welding electrode 323 is electrically connected with described multiple first inner electrode layer 321, and described second welding electrode 324 is electrically connected with described multiple the second inner electrode layer 322.The two ends of the first welding electrode 323, second welding electrode 324 and described conductive coil 31 are placed on the relevant position of described pcb board, and are connected by wiring, to realize the circuit of certain function.
Further, on the basis of above-described embodiment, described multi-functional components and parts also comprise Chip-R, the schematic cross-section of another multi-functional components and parts that Fig. 3 b provides for the embodiment of the present invention two, as shown in Figure 3 b, described Chip-R 33 is positioned at end face and/or bottom surface (bottom surface being arranged on described conductive coil 31 that Fig. 3 is exemplary) of described conductive coil 31.Described Chip-R 33 comprises: medium substrate 331; Be positioned at the resistive layer 332 above described medium substrate 331; 3rd welding electrode 333 and the 4th welding electrode 334, described 3rd welding electrode 333 and the 4th welding electrode 334 are electrically connected with the two ends of described resistive layer 332 respectively.
On the basis of above-described embodiment, optionally, the second laminated body, capacitor 34 is provided with in the medium substrate 331 of described Chip-R; Fig. 3 c is another schematic cross-section of Chip-R in Fig. 3 b.As shown in Figure 3 c, Chip-R comprises medium substrate 331; Be positioned at the resistive layer 332 above described medium substrate 331, the second laminated body, capacitor 34 is provided with in described medium substrate 331, described second laminated body, capacitor 34 comprises: multiple 3rd inner electrode layer 341 and multiple 4th inner electrode layer 342, and described 3rd inner electrode layer 341 and multiple 4th inner electrode layer 342 replace insulation setting and part is overlapping; 5th welding electrode 343 and the 6th welding electrode 344, described 5th welding electrode 343 is electrically connected with described multiple 3rd inner electrode layer 341, and described 6th termination electrode 344 is electrically connected with described multiple 4th inner electrode layer 342.The present embodiment arranges the second laminated body, capacitor 34. in the medium substrate 331 of described Chip-R 33, can make full use of the space in device, and integrated more electronic component, realizes several functions.
Further, described multi-functional components and parts also comprise magnetic bead, the schematic cross-section of another multi-functional components and parts that Fig. 3 d provides for the embodiment of the present invention two, as shown in Figure 3 d, described magnetic bead 35 is positioned at end face and/or bottom surface (end face being arranged on described conductive coil 31 that Fig. 3 d is exemplary) of described conductive coil 31.Described magnetic bead 35 comprises: ferrite 351; Be positioned at the 7th welding electrode 352 and the 8th welding electrode 353 at described ferrite 351 two ends.
The bottom view of a kind of multi-functional components and parts that Fig. 3 e provides for the embodiment of the present invention two, described multi-functional components and parts comprise conductive coil, the first laminated body, capacitor, Chip-R and magnetic bead, see Fig. 3 e, on the bottom surface of described multi-functional components and parts, there are 4 pairs of pins, are respectively the two ends 311 and 312 of conductive coil; First welding electrode 323 and the second welding electrode 324 of the first laminated body, capacitor; 3rd welding electrode 333 of Chip-R and the 4th welding electrode 334, the 7th welding electrode 352 of magnetic bead and the 8th welding electrode 353.Further, when comprising the second laminated body, capacitor in described lamination resistance, described multi-functional components and parts also comprise the 5th welding electrode and the 6th welding electrode (not shown) of described second laminated body, capacitor.
It should be noted that, when to comprise in the first laminated body, capacitor, Chip-R, magnetic bead and the second laminated body, capacitor multiple for described multi-functional components and parts, be mutually electrically insulated between each device.The multi-functional components and parts that the present embodiment provides can comprise any one or more of the first laminated body, capacitor, Chip-R and magnetic bead, when to comprise in described first laminated body, capacitor, Chip-R and magnetic bead multiple, it can combination in any, and for situation the present embodiment of combination, therefore not to repeat here.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not protection scope of the present invention be departed from.Therefore, although be described in further detail invention has been by above embodiment, the present invention is not limited only to above embodiment, when not departing from the present invention's design, can also comprise other Equivalent embodiments more, and scope of the present invention is determined by appended right.
Claims (10)
1. multi-functional components and parts, is characterized in that, comprising:
Conductive coil;
And at least one in first laminated body, capacitor, Chip-R and magnetic bead;
Wherein, described conductive coil, the first laminated body, capacitor, Chip-R and magnetic bead are electrically insulated mutually;
Described first laminated body, capacitor is positioned at inside described conductive coil and/or outside;
Described Chip-R is positioned at described conductive coil end face and/or bottom surface;
Described magnetic bead is positioned at described conductive coil end face and/or bottom surface.
2. components and parts according to claim 1, is characterized in that, are provided with magnetic core or iron core inside described conductive coil.
3. components and parts according to claim 1, is characterized in that, also comprise the housing be positioned at outside described conductive coil, and described first laminated body, capacitor is positioned at described housing.
4. components and parts according to claim 1, is characterized in that, described first cascade electric capacity comprises:
Multiple first inner electrode layer and multiple the second inner electrode layer, described first inner electrode layer and the second inner electrode layer replace insulation setting and part is overlapping;
First welding electrode and the second welding electrode, described first welding electrode is electrically connected with described multiple first inner electrode layer, and described second welding electrode is electrically connected with described multiple the second inner electrode layer.
5. components and parts according to claim 1, is characterized in that, described Chip-R comprises:
Medium substrate;
Be positioned at the resistive layer above described medium substrate;
3rd welding electrode and the 4th welding electrode, described 3rd welding electrode and the 4th welding electrode are electrically connected with the two ends of described resistive layer respectively.
6. components and parts according to claim 5, is characterized in that, are provided with the second laminated body, capacitor in described medium substrate;
Described second laminated body, capacitor comprises: multiple 3rd inner electrode layer and multiple 4th inner electrode layer, and described 3rd inner electrode layer and multiple 4th inner electrode layer replace insulation setting and part is overlapping;
5th welding electrode and the 6th welding electrode, described 5th welding electrode is electrically connected with described multiple 3rd inner electrode layer, and described 6th termination electrode is electrically connected with described multiple 4th inner electrode layer.
7. components and parts according to claim 1, is characterized in that, described magnetic bead comprises:
Ferrite;
Be positioned at the 7th welding electrode and the 8th welding electrode at described ferrite two ends.
8. components and parts according to claim 1, is characterized in that, the material of described housing is plastics or epoxy resin.
9. components and parts according to claim 1, is characterized in that, also comprise and to be positioned at outside described conductive coil and the radome be mutually electrically insulated.
10. components and parts according to claim 1, is characterized in that, described conductive coil is single or multiple lift.
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| CN201510505005.4A CN105163490B (en) | 2015-08-17 | 2015-08-17 | A kind of multi-functional component |
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| CN201510505005.4A CN105163490B (en) | 2015-08-17 | 2015-08-17 | A kind of multi-functional component |
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| CN105163490A true CN105163490A (en) | 2015-12-16 |
| CN105163490B CN105163490B (en) | 2017-11-07 |
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| JP2010123879A (en) * | 2008-11-21 | 2010-06-03 | Shinko Electric Ind Co Ltd | Coil structure and method for manufacturing the same |
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|---|---|---|---|---|
| US5450263A (en) * | 1993-08-16 | 1995-09-12 | California Micro Devices, Inc. | Thin film inductors, inductor network and integration with other passive and active devices |
| US5990776A (en) * | 1994-12-08 | 1999-11-23 | Jitaru; Ionel | Low noise full integrated multilayers magnetic for power converters |
| CN1926646A (en) * | 2004-03-10 | 2007-03-07 | Det国际控股有限公司 | Magnetic part |
| EP1863038A1 (en) * | 2005-03-23 | 2007-12-05 | Murata Manufacturing Co., Ltd. | Composite dielectric sheet, method for manufacturing same and multilayer electronic component |
| JP2010123879A (en) * | 2008-11-21 | 2010-06-03 | Shinko Electric Ind Co Ltd | Coil structure and method for manufacturing the same |
| US20120019267A1 (en) * | 2010-07-21 | 2012-01-26 | Daihen Corporation | High frequency detection device and coaxial cable including the same |
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|---|---|
| CN105163490B (en) | 2017-11-07 |
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