CN105159425A - Heat-conducting cooling apparatus of computer - Google Patents

Heat-conducting cooling apparatus of computer Download PDF

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Publication number
CN105159425A
CN105159425A CN201510591621.6A CN201510591621A CN105159425A CN 105159425 A CN105159425 A CN 105159425A CN 201510591621 A CN201510591621 A CN 201510591621A CN 105159425 A CN105159425 A CN 105159425A
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CN
China
Prior art keywords
water
heat
computer
computing machine
cooling tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510591621.6A
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Chinese (zh)
Inventor
杨艺文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hunan Bailimu Technology Co Ltd
Original Assignee
Hunan Bailimu Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hunan Bailimu Technology Co Ltd filed Critical Hunan Bailimu Technology Co Ltd
Priority to CN201510591621.6A priority Critical patent/CN105159425A/en
Publication of CN105159425A publication Critical patent/CN105159425A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a heat-conducting cooling apparatus of a computer. The heat-conducting cooling apparatus is mounted above an expansion slot card in the computer. The heat-conducting cooling apparatus comprises a heat dissipater and a water-cooling pipe, wherein the heat dissipater is connected with the water-cooling pipe; and the water-cooling pipe is snake-shaped and is connected to an inlet and an outlet of the heat dissipater end to end. The apparatus needs to be mounted in parallel above the expansion slot card, and the diameter of the water-cooling pipe is 2-3 mm. The heat-conducting cooling apparatus of the computer, provided by the invention, has the advantages that the heat dissipater and the water-cooling pipe are mounted, the water-cooling pipe is filled with water, the water in the water-cooling pipe collects heat emitted by the expansion slot card of the computer through operation of the heat dissipater, and cooling is performed through the heat dissipater and a case fan to achieve economic and environmentally-friendly good water-cooling circulation.

Description

A kind of computing machine heat conduction heat sink
Technical field
The present invention relates to computer realm, particularly relate to the server of network computer, workstation.
Background technology
Computing machine is commonly called as computer, is that one can be run according to program, automatically, the modernization intelligent electronic device of high speed processing mass data.Being made up of hardware system and software systems, the computing machine not installing any software is called bare machine.Can be divided into supercomputer, industrial control computer, network computer (containing server, workstation), personal computer (desktop computer), embedded computer five class, more advanced computing machine has biocomputer, photonic computer, quantum computer etc.
At server, the workstation of network computer, expansion card all can be had for installing the plug-in card (as RAID card, sonet card, network interface card etc.) of different demand type in the desktop computer of personal computer, intensive expansion card and intensive chip layout use the heat radiation of expansion card to become problem, and bad meeting of dispelling the heat causes expansion card to occur the phenomenon such as overheating fault and reduced lifetime.
Summary of the invention
In view of this, be necessary to provide a kind of heat conduction heat sink solving expansion card heat dissipation problem in computing machine.
The present invention relates to a kind of computing machine heat conduction heat sink, above the expansion slot card being installed on computer-internal, described heat conduction heat sink comprises heating radiator and water cooling tube, heating radiator is connected with water cooling tube, water cooling tube adopts the end to end entrance and exit to heating radiator of " snake " type, described device need parallelly be installed on above expansion slot card, described water cooling tube diameter is 2 ~ 3mm, computing machine heat conduction heat sink advantage provided by the invention is: by installation of heat radiator and water cooling tube, water is loaded in water cooling tube, by the operation of heating radiator, water in water cooling tube collects the heat that computing machine expansion slot card distributes, cooling processing is carried out through heating radiator and case fan, to reach the optimum Water-cooling circulating of economic environmental protection.
Accompanying drawing explanation
Fig. 1 is a kind of computing machine heat conduction heat sink structural representation of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is a kind of computer to dissipate heat dust guard structural representation of the present invention.
Described a kind of computing machine heat conduction heat sink, be arranged on the inside of computing machine (20), the parallel installation in top of expansion slot card (23), described body comprises heating radiator (10) and water cooling tube (11), during operation, water-cooled adopts and circulates heat absorption, water cooling tube (11) adopts " snake " type head and the tail to connect, water cooling tube (11) interior current are after heating radiator (10), carry out cooling processing by heating radiator (10) and case fan (21), cabinet afterbody is provided with louvre (22).
Described computing machine heat conduction heat sink, is characterized in that, the top of described computing machine (20) expansion slot card (23) has clearance spaces to install body, and water cooling tube (11) diameter of body is 2 ~ 3mm.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (2)

1. a kind of computing machine heat conduction heat sink described in, be arranged on the inside of computing machine (20), the parallel installation in top of expansion slot card (23), described body comprises heating radiator (10) and water cooling tube (11), during operation, water-cooled adopts and circulates heat absorption, water cooling tube (11) adopts " snake " type head and the tail to connect, water cooling tube (11) interior current are after heating radiator (10), carry out cooling processing by heating radiator (10) and case fan (21), cabinet afterbody is provided with louvre (22).
2. computing machine heat conduction heat sink according to claim 1, it is characterized in that, the top of described computing machine (20) expansion slot card (23) has clearance spaces to install body, and water cooling tube (11) diameter of body is 2 ~ 3mm.
CN201510591621.6A 2015-09-17 2015-09-17 Heat-conducting cooling apparatus of computer Pending CN105159425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510591621.6A CN105159425A (en) 2015-09-17 2015-09-17 Heat-conducting cooling apparatus of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510591621.6A CN105159425A (en) 2015-09-17 2015-09-17 Heat-conducting cooling apparatus of computer

Publications (1)

Publication Number Publication Date
CN105159425A true CN105159425A (en) 2015-12-16

Family

ID=54800308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510591621.6A Pending CN105159425A (en) 2015-09-17 2015-09-17 Heat-conducting cooling apparatus of computer

Country Status (1)

Country Link
CN (1) CN105159425A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2819296Y (en) * 2005-07-21 2006-09-20 朱晓君 Radiator of computer processor
CN203259960U (en) * 2013-04-24 2013-10-30 王爱英 Computer heat-radiating device
CN204256639U (en) * 2014-11-05 2015-04-08 天津市招财猫信息技术有限公司 A kind of injection cold head
CN204406312U (en) * 2015-01-17 2015-06-17 南阳医学高等专科学校 A kind of computer radiator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2819296Y (en) * 2005-07-21 2006-09-20 朱晓君 Radiator of computer processor
CN203259960U (en) * 2013-04-24 2013-10-30 王爱英 Computer heat-radiating device
CN204256639U (en) * 2014-11-05 2015-04-08 天津市招财猫信息技术有限公司 A kind of injection cold head
CN204406312U (en) * 2015-01-17 2015-06-17 南阳医学高等专科学校 A kind of computer radiator

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Application publication date: 20151216

WD01 Invention patent application deemed withdrawn after publication