CN105153979B - Peeling-resistant LED bonding material and preparation method thereof - Google Patents
Peeling-resistant LED bonding material and preparation method thereof Download PDFInfo
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- CN105153979B CN105153979B CN201510653216.2A CN201510653216A CN105153979B CN 105153979 B CN105153979 B CN 105153979B CN 201510653216 A CN201510653216 A CN 201510653216A CN 105153979 B CN105153979 B CN 105153979B
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Abstract
The invention discloses a preparation method of a peeling-resistant LED bonding material . The preparation method of the bonding material comprises the following steps: step 1, respeactively taking the following components in parts by weight: 10-16 parts of polymethyl methacrylate, 3-6 parts of polyvinyl acetate, 5-9 parts of poly(butyl acrylate), 2-5 parts of 2-(dimethylamino)ethyl methacrylate, and 2-6 parts of ethyl 4-dimethylaminobenzoate, and stirring the components; step 2, adding the following components into the mixture obtained in the step 1 in parts by weight: 3-7 parts of pentaerythrityl tetrastearate, 3-8 parts of poly epsilon-caprolaclone glycol and 4-10 parts of polyethylene adipate glycol, and stirring; step 3, performing high-speed shearing; step 4, cooling the mixed materials to room temperature, packaging and sealing, so as to obtain the peeling-resistant LED bonding material. The prepared bonding material is improved in peeling re-sistance and tensile strength, and can be used in bonding of LED lamps or other relevant lamps.
Description
Technical field
The invention belongs to LED adhesivess field, is related to a kind of LED adhesivess of resistance to stripping and preparation method thereof.
Background technology
The vehicle that of the same race or solid material surface not of the same race is glued together can be referred to as adhesive material, adhesive material is also referred to as binding agent.The method of surface of solids connection is made to be called bonding or glue by the bonding force of adhesive.World's adhesives industries still belong to the preferable chemical industry of development, and more than 12,000,000 t/a, global consumption structure accounts for 35% for packaging to global adhesive sales volume in 1998, and building accounts for 25%, and timber processing accounts for 20%, and Automobile Transportation accounts for 10%, and other account for 10%.Adhesivess are divided into volatilization curing type such as starch, natural glue, thermoplastic resin etc., heat molten type such as ethylene-vinyl acetate copolymer, polyacrylate, wax class etc. by curing mode；Reaction-curable such as epoxy resin, polyurethane etc..
Preferable peel resistant strength and tensile strength is needed to have for the adhesivess in the correlation photoelectric material bonding such as LED, only possess above-mentioned good property, just can guarantee that the steadiness of the light fixtures such as LED or photoelectric material.
The content of the invention
Technical problem to be solved：LED in encapsulation and other adhesion process needs to use adhesivess, and the adhesivess for LED need to have preferable adhesive strength and tensile strength, and the purpose of the present invention is to improve peel resistant strength and the tensile strength of LED adhesivess.
Technical scheme：For the problems referred to above, the invention discloses a kind of LED adhesivess of resistance to stripping, the LED adhesivess of described resistance to stripping are composed of the following components in parts by weight：
Polymethyl methacrylate 10-16 parts,
Polyvinyl acetate 3-6 parts,
Butyl polyacrylate 5-9 parts,
Dimethylaminoethyl methacrylate
2-5 parts,
(dimethylamino)-ethyl benzoate
2-6 parts,
Pentaerythritol stearate 3-7 parts,
Poly-epsilon-caprolactone glycol 3-8 parts,
Polyadipate ethylene glycol 4-10 parts.
Further, the LED adhesivess of described a kind of resistance to stripping, are composed of the following components in parts by weight：
Polymethyl methacrylate 11-15 parts,
Polyvinyl acetate 4-5 parts,
Butyl polyacrylate 6-8 parts,
Dimethylaminoethyl methacrylate
3-4 parts,
(dimethylamino)-ethyl benzoate
3-5 parts,
Pentaerythritol stearate 4-6 parts,
Poly-epsilon-caprolactone glycol 4-7 parts,
Polyadipate ethylene glycol 5-9 parts.
The preparation method of the LED adhesivess of described a kind of resistance to stripping, comprises the steps：
Step 1：Take polymethyl methacrylate 10-16 parts, polyvinyl acetate 3-6 parts, butyl polyacrylate 5-9 parts, dimethylaminoethyl methacrylate 2-5 parts, (dimethylamino)-ethyl benzoate 2-6 parts by weight respectively, by above-mentioned various composition, in the case where temperature is for 55-65 DEG C, stirring is mixture, speed of agitator is 50-90r/min, stirs 15-35min；
Step 2：Pentaerythritol stearate 3-7 parts, poly-epsilon-caprolactone glycol 3-8 parts, polyadipate ethylene glycol 4-10 parts is added by weight in the mixture of step 1 again, and it is to be stirred at 70-80 DEG C to rise high-temperature, stirs 10-30min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 4000-6000rpm, and shear time is 10-20min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Further, the preparation method of the LED adhesivess of described a kind of resistance to stripping, in described step 1, temperature is that stirring is mixture at 60 DEG C, and speed of agitator is 70r/min, stirs 25min.
Further, the preparation method of the LED adhesivess of described a kind of resistance to stripping, it is to be stirred at 75 DEG C to rise high-temperature in described step 2, stirs 20min.
Further, the preparation method of the LED adhesivess of described a kind of resistance to stripping, in described step 3, shearing rotating speed is 5000rpm, and shear time is 15min.
Beneficial effect：The LED adhesivess of the resistance to stripping of the present invention have very excellent peel resistant strength and tensile strength, the compositing formula of the LED adhesivess of the present invention is also larger with the constituent difference of conventional adhesivess, after improveing to the constituent of LED adhesivess, again by rationally simple preparation technology, the LED adhesivess for obtaining effectively meet the adhesive property needs of LED and other light fixtures.
Specific embodiment
Embodiment 1
Step 1：Take 16 parts of polymethyl methacrylate, 3 parts of polyvinyl acetate, 9 parts of butyl polyacrylate, 5 parts of dimethylaminoethyl methacrylate, 6 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 65 DEG C, stirring is mixture, speed of agitator is 90r/min, stirs 35min；
Step 2：7 parts of pentaerythritol stearate, 3 parts of poly-epsilon-caprolactone glycol, 4 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 80 DEG C to rise high-temperature, stirs 30min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Embodiment 2
Step 1：Take 10 parts of polymethyl methacrylate, 6 parts of polyvinyl acetate, 5 parts of butyl polyacrylate, 2 parts of dimethylaminoethyl methacrylate, 2 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 55 DEG C, stirring is mixture, speed of agitator is 50r/min, stirs 15min；
Step 2：3 parts of pentaerythritol stearate, 8 parts of poly-epsilon-caprolactone glycol, 10 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 70 DEG C to rise high-temperature, stirs 10min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 4000rpm, and shear time is 20min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Embodiment 3
Step 1：Take 11 parts of polymethyl methacrylate, 5 parts of polyvinyl acetate, 6 parts of butyl polyacrylate, 4 parts of dimethylaminoethyl methacrylate, 3 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 65 DEG C, stirring is mixture, speed of agitator is 90r/min, stirs 35min；
Step 2：6 parts of pentaerythritol stearate, 4 parts of poly-epsilon-caprolactone glycol, 5 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 80 DEG C to rise high-temperature, stirs 30min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Embodiment 4
Step 1：Take 15 parts of polymethyl methacrylate, 4 parts of polyvinyl acetate, 8 parts of butyl polyacrylate, 3 parts of dimethylaminoethyl methacrylate, 5 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 55 DEG C, stirring is mixture, speed of agitator is 50r/min, stirs 15min；
Step 2：4 parts of pentaerythritol stearate, 7 parts of poly-epsilon-caprolactone glycol, 9 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 70 DEG C to rise high-temperature, stirs 10min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 4000rpm, and shear time is 20min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Embodiment 5
Step 1：Take 13 parts of polymethyl methacrylate, 4 parts of polyvinyl acetate, 7 parts of butyl polyacrylate, 3 parts of dimethylaminoethyl methacrylate, 4 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 60 DEG C, stirring is mixture, speed of agitator is 75r/min, stirs 20min；
Step 2：5 parts of pentaerythritol stearate, 5 parts of poly-epsilon-caprolactone glycol, 7 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 70 DEG C to rise high-temperature, stirs 10min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 5000rpm, and shear time is 15min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Comparative example 1
Step 1：Take 16 parts of polymethyl methacrylate, 3 parts of polyvinyl acetate, 9 parts of butyl polyacrylate, 5 parts of dimethylaminoethyl methacrylate, 6 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 65 DEG C, stirring is mixture, speed of agitator is 90r/min, stirs 35min；
Step 2：7 parts of pentaerythritol stearate, 4 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 80 DEG C to rise high-temperature, stirs 30min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Comparative example 2
Step 1：Take 16 parts of polymethyl methacrylate, 3 parts of polyvinyl acetate, 9 parts of butyl polyacrylate, 5 parts of dimethylaminoethyl methacrylate, 6 parts of (dimethylamino)-ethyl benzoate by weight respectively, by above-mentioned various composition, in the case where temperature is for 65 DEG C, stirring is mixture, speed of agitator is 90r/min, stirs 35min；
Step 2：3 parts of poly-epsilon-caprolactone glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 80 DEG C to rise high-temperature, stirs 30min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
Comparative example 3
Step 1：Take 16 parts of polymethyl methacrylate, 3 parts of polyvinyl acetate, 9 parts of butyl polyacrylate, 5 parts of dimethylaminoethyl methacrylate by weight respectively, by above-mentioned various composition, in the case where temperature is for 65 DEG C, stirring is mixture, speed of agitator is 90r/min, stirs 35min；
Step 2：3 parts of poly-epsilon-caprolactone glycol, 4 parts of polyadipate ethylene glycol is added by weight in the mixture of step 1 again, and it is to be stirred at 80 DEG C to rise high-temperature, stirs 30min；
Step 3：High speed shear is carried out again using high-speed shearing machine to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
The peel resistant strength of the LED adhesivess of the resistance to stripping of above-described embodiment and tensile strength are as shown in the table：
| Peel resistant strength（N/mm） | Tensile strength（MPa） | |
| Embodiment 1 | 30.7 | 24.7 |
| Embodiment 2 | 30.5 | 24.5 |
| Embodiment 3 | 33.1 | 25.8 |
| Embodiment 4 | 32.5 | 25.6 |
| Embodiment 5 | 35.4 | 26.9 |
The peel resistant strength of the LED adhesivess of the resistance to stripping of above-mentioned comparative example and tensile strength are as shown in the table：
| Peel resistant strength（N/mm） | Tensile strength（MPa） | |
| Embodiment 1 | 24.1 | 17.4 |
| Embodiment 2 | 22.7 | 16.9 |
| Embodiment 3 | 25.2 | 19.5 |
Claims (6)
1. a kind of LED adhesivess of resistance to stripping, it is characterised in that the LED adhesivess of described resistance to stripping are composed of the following components in parts by weight：
Polymethyl methacrylate 10-16 parts,
Polyvinyl acetate 3-6 parts,
Butyl polyacrylate 5-9 parts,
Dimethylaminoethyl methacrylate 2-5 parts,
(dimethylamino)-ethyl benzoate 2-6 parts,
Pentaerythritol stearate 3-7 parts,
Poly- ε-caprolactone diol 3-8 parts,
10PE27 4-10 parts.
2. LED adhesivess of a kind of resistance to stripping according to claim 1, it is characterised in that the LED adhesivess of described resistance to stripping are composed of the following components in parts by weight：
Polymethyl methacrylate 11-15 parts,
Polyvinyl acetate 4-5 parts,
Butyl polyacrylate 6-8 parts,
Dimethylaminoethyl methacrylate 3-4 parts,
(dimethylamino)-ethyl benzoate 3-5 parts,
Pentaerythritol stearate 4-6 parts,
Poly- ε-caprolactone diol 4-7 parts,
10PE27 5-9 parts.
3. the preparation method of the LED adhesivess of a kind of resistance to stripping according to claim 1, it is characterised in that described preparation method comprises the steps：
Step 1：Take polymethyl methacrylate 10-16 parts, polyvinyl acetate 3-6 parts, butyl polyacrylate 5-9 by weight respectively
Part, dimethylaminoethyl methacrylate 2-5 parts, (dimethylamino)-ethyl benzoate 2-6 parts, by above-mentioned various composition, in the case where temperature is for 55-65 DEG C, stirring is mixture, and speed of agitator is 50-90r/min, stirs 15-35min
；
Step 2：Pentaerythritol stearate 3-7 parts, poly- ε-caprolactone diol 3-8 parts, 10PE27 4-10 parts is added by weight in the mixture of step 1 again, and it is to be stirred at 70-80 DEG C to rise high-temperature, stirs 10-30min；
Step 3：Using high-speed shearing machine to step 2
Mixing material carry out high speed shear again, shearing rotating speed is 4000-6000rpm, and shear time is 10-20min
；
Step 4：Mixing material is cooled to into room temperature, is sealed after packaging, is the LED adhesivess of resistance to stripping.
4. the preparation method of the LED adhesivess of a kind of resistance to stripping according to claim 3, it is characterised in that temperature is that stirring is mixture at 60 DEG C in described step 1, and speed of agitator is 70r/min, stirs 25min.
5. the preparation method of the LED adhesivess of a kind of resistance to stripping according to claim 3, it is characterised in that it is to be stirred at 75 DEG C to rise high-temperature in described step 2, stirs 20min.
6. the preparation method of the LED adhesivess of a kind of resistance to stripping according to claim 3, it is characterised in that shearing rotating speed is 5000rpm in described step 3, and shear time is 15min.
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|---|---|---|---|
| CN201510653216.2A CN105153979B (en) | 2015-10-12 | 2015-10-12 | Peeling-resistant LED bonding material and preparation method thereof |
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| CN105153979A CN105153979A (en) | 2015-12-16 |
| CN105153979B true CN105153979B (en) | 2017-03-22 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569451A (en) * | 2010-10-20 | 2012-07-11 | 苏州尚善新材料科技有限公司 | Solar module back veneer comprising non-solvent bonding layers and manufacturing method thereof |
| CN103214983A (en) * | 2013-03-21 | 2013-07-24 | 马鞍山市中澜橡塑制品有限公司 | Waterproof hot melt adhesive and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030143409A1 (en) * | 2001-07-06 | 2003-07-31 | Di Stefano Frank Vito | Blends of high Tg polymer emulsions and pressure sensitive adhesive polymer emulsions useful as pressure sensitive adhesives |
| CN102863930A (en) * | 2012-10-16 | 2013-01-09 | 四川省玻纤集团有限公司 | Adhesive and preparation method thereof |
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- 2015-10-12 CN CN201510653216.2A patent/CN105153979B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569451A (en) * | 2010-10-20 | 2012-07-11 | 苏州尚善新材料科技有限公司 | Solar module back veneer comprising non-solvent bonding layers and manufacturing method thereof |
| CN103214983A (en) * | 2013-03-21 | 2013-07-24 | 马鞍山市中澜橡塑制品有限公司 | Waterproof hot melt adhesive and preparation method thereof |
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Inventor after: Li Bingliang Inventor before: Qing Xiaorong |
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Effective date of registration: 20170113 Address after: 528000 Foshan, Nanhai District, Lishui Town, Red Village Road, No. 11, No. two, No. Applicant after: Foshan powery Polymer Technology Co Ltd Address before: Suzhou Wuzhong District City, Jiangsu province 215124 Guo Xiang Jie Dao Yin Feng No. 37 Applicant before: SUZHOU YIXINYUAN PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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