CN105153979A - Peeling-resistant LED bonding material and preparation method thereof - Google Patents
Peeling-resistant LED bonding material and preparation method thereof Download PDFInfo
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- CN105153979A CN105153979A CN201510653216.2A CN201510653216A CN105153979A CN 105153979 A CN105153979 A CN 105153979A CN 201510653216 A CN201510653216 A CN 201510653216A CN 105153979 A CN105153979 A CN 105153979A
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Abstract
The invention discloses a preparation method of a peeling-resistant LED bonding material . The preparation method of the bonding material comprises the following steps: step 1, respeactively taking the following components in parts by weight: 10-16 parts of polymethyl methacrylate, 3-6 parts of polyvinyl acetate, 5-9 parts of poly(butyl acrylate), 2-5 parts of 2-(dimethylamino)ethyl methacrylate, and 2-6 parts of ethyl 4-dimethylaminobenzoate, and stirring the components; step 2, adding the following components into the mixture obtained in the step 1 in parts by weight: 3-7 parts of pentaerythrityl tetrastearate, 3-8 parts of poly epsilon-caprolaclone glycol and 4-10 parts of polyethylene adipate glycol, and stirring; step 3, performing high-speed shearing; step 4, cooling the mixed materials to room temperature, packaging and sealing, so as to obtain the peeling-resistant LED bonding material. The prepared bonding material is improved in peeling re-sistance and tensile strength, and can be used in bonding of LED lamps or other relevant lamps.
Description
Technical field
The invention belongs to LED adhesives field, relate to LED adhesives of a kind of resistance to stripping and preparation method thereof.
Background technology
Of the same race or that solid material surface not of the same race is glued together vehicle can be referred to as adhesive material, adhesive material is also referred to as tackiness agent.Method solid surface being connected by the bonding force of tackiness agent is called bonding or glue.World's adhesives industries still belongs to the good chemical industry of development, and within 1998, global tackiness agent sales volume is more than 1,200 ten thousand t/a, and global consumption structure is that packaging accounts for 35%, and building accounts for 25%, and wood working accounts for 20%, and Automobile Transportation accounts for 10%, and other accounts for 10%.Adhesives is divided into volatilization curing as starch, natural glue, thermoplastic resin etc. by curing mode, and hot-melting type is as ethylene-vinyl acetate copolymer, polyacrylic ester, wax class etc.; Reaction-curable is as epoxy resin, urethane etc.
Adhesives in bonding for relative photo electric materials such as LED needs to possess desirable peel resistant strength and tensile strength, only possesses above-mentioned good character, the steadiness of the light fixtures such as guarantee LED or photoelectric material.
Summary of the invention
The technical problem solved: LED is in encapsulation and other adhesion process, need to use adhesives, adhesives for LED needs to possess good bonding strength and tensile strength, the object of the invention is the peel resistant strength and the tensile strength that improve LED adhesives.
Technical scheme: for the problems referred to above, the invention discloses a kind of LED adhesives of resistance to stripping, and the LED adhesives of described resistance to stripping is grouped into by the one-tenth of following weight part:
Polymethylmethacrylate 10-16 part,
Polyvinyl acetate 3-6 part,
Butyl polyacrylate 5-9 part,
Dimethylaminoethyl methacrylate 2-5 part,
(dimethylamino)-ethyl benzoate 2-6 part,
Pentaerythritol stearate 3-7 part,
Poly-epsilon-caprolactone glycol 3-8 part,
Poly-adipate glycol 4-10 part.
Further, the LED adhesives of described a kind of resistance to stripping, is grouped into by the one-tenth of following weight part:
Polymethylmethacrylate 11-15 part,
Polyvinyl acetate 4-5 part,
Butyl polyacrylate 6-8 part,
Dimethylaminoethyl methacrylate 3-4 part,
(dimethylamino)-ethyl benzoate 3-5 part,
Pentaerythritol stearate 4-6 part,
Poly-epsilon-caprolactone glycol 4-7 part,
Poly-adipate glycol 5-9 part.
The preparation method of the LED adhesives of described a kind of resistance to stripping, comprises the steps:
Step 1: get polymethylmethacrylate 10-16 part, polyvinyl acetate 3-6 part, butyl polyacrylate 5-9 part, dimethylaminoethyl methacrylate 2-5 part, (dimethylamino)-ethyl benzoate 2-6 part by weight respectively, above-mentioned various compositions are stirred at temperature is 55-65 DEG C for mixture, mixing speed is 50-90r/min, stirs 15-35min;
Step 2: add pentaerythritol stearate 3-7 part, poly-epsilon-caprolactone glycol 3-8 part, poly-adipate glycol 4-10 part again in the mixture of step 1 by weight, raised temperature is stir at 70-80 DEG C again, stirs 10-30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 4000-6000rpm, and shear time is 10-20min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Further, the preparation method of the LED adhesives of described a kind of resistance to stripping, in described step 1, temperature is stir at 60 DEG C as mixture, and mixing speed is 70r/min, stirs 25min.
Further, the preparation method of the LED adhesives of described a kind of resistance to stripping, in described step 2, raised temperature is stir at 75 DEG C again, stirs 20min.
Further, the preparation method of the LED adhesives of described a kind of resistance to stripping, shearing rotating speed in described step 3 is 5000rpm, and shear time is 15min.
Beneficial effect: the LED adhesives of resistance to stripping of the present invention has very excellent peel resistant strength and tensile strength, the compositing formula of LED adhesives of the present invention is also larger with the moiety difference of the adhesives of routine, after the moiety of LED adhesives is improved, again by reasonable simple preparation technology, the LED adhesives obtained effectively meets the adhesiveproperties needs of LED and other light fixtures.
Embodiment
Embodiment 1
Step 1: get polymethylmethacrylate 16 parts, polyvinyl acetate 3 parts, butyl polyacrylate 9 parts, dimethylaminoethyl methacrylate 5 parts, (dimethylamino)-ethyl benzoate 6 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 65 DEG C for mixture, mixing speed is 90r/min, stirs 35min;
Step 2: add pentaerythritol stearate 7 parts, poly-epsilon-caprolactone glycol 3 parts, poly-adipate glycol 4 parts again in the mixture of step 1 by weight, raised temperature is stir at 80 DEG C again, stirs 30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Embodiment 2
Step 1: get polymethylmethacrylate 10 parts, polyvinyl acetate 6 parts, butyl polyacrylate 5 parts, dimethylaminoethyl methacrylate 2 parts, (dimethylamino)-ethyl benzoate 2 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 55 DEG C for mixture, mixing speed is 50r/min, stirs 15min;
Step 2: add pentaerythritol stearate 3 parts, poly-epsilon-caprolactone glycol 8 parts, poly-adipate glycol 10 parts again in the mixture of step 1 by weight, raised temperature is stir at 70 DEG C again, stirs 10min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 4000rpm, and shear time is 20min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Embodiment 3
Step 1: get polymethylmethacrylate 11 parts, polyvinyl acetate 5 parts, butyl polyacrylate 6 parts, dimethylaminoethyl methacrylate 4 parts, (dimethylamino)-ethyl benzoate 3 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 65 DEG C for mixture, mixing speed is 90r/min, stirs 35min;
Step 2: add pentaerythritol stearate 6 parts, poly-epsilon-caprolactone glycol 4 parts, poly-adipate glycol 5 parts again in the mixture of step 1 by weight, raised temperature is stir at 80 DEG C again, stirs 30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Embodiment 4
Step 1: get polymethylmethacrylate 15 parts, polyvinyl acetate 4 parts, butyl polyacrylate 8 parts, dimethylaminoethyl methacrylate 3 parts, (dimethylamino)-ethyl benzoate 5 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 55 DEG C for mixture, mixing speed is 50r/min, stirs 15min;
Step 2: add pentaerythritol stearate 4 parts, poly-epsilon-caprolactone glycol 7 parts, poly-adipate glycol 9 parts again in the mixture of step 1 by weight, raised temperature is stir at 70 DEG C again, stirs 10min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 4000rpm, and shear time is 20min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Embodiment 5
Step 1: get polymethylmethacrylate 13 parts, polyvinyl acetate 4 parts, butyl polyacrylate 7 parts, dimethylaminoethyl methacrylate 3 parts, (dimethylamino)-ethyl benzoate 4 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 60 DEG C for mixture, mixing speed is 75r/min, stirs 20min;
Step 2: add pentaerythritol stearate 5 parts, poly-epsilon-caprolactone glycol 5 parts, poly-adipate glycol 7 parts again in the mixture of step 1 by weight, raised temperature is stir at 70 DEG C again, stirs 10min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 5000rpm, and shear time is 15min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Comparative example 1
Step 1: get polymethylmethacrylate 16 parts, polyvinyl acetate 3 parts, butyl polyacrylate 9 parts, dimethylaminoethyl methacrylate 5 parts, (dimethylamino)-ethyl benzoate 6 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 65 DEG C for mixture, mixing speed is 90r/min, stirs 35min;
Step 2: add pentaerythritol stearate 7 parts, poly-adipate glycol 4 parts again in the mixture of step 1 by weight, raised temperature is stir at 80 DEG C again, stirs 30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Comparative example 2
Step 1: get polymethylmethacrylate 16 parts, polyvinyl acetate 3 parts, butyl polyacrylate 9 parts, dimethylaminoethyl methacrylate 5 parts, (dimethylamino)-ethyl benzoate 6 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 65 DEG C for mixture, mixing speed is 90r/min, stirs 35min;
Step 2: add poly-epsilon-caprolactone glycol 3 parts by weight again in the mixture of step 1, raised temperature is stir at 80 DEG C again, stirs 30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Comparative example 3
Step 1: get polymethylmethacrylate 16 parts, polyvinyl acetate 3 parts, butyl polyacrylate 9 parts, dimethylaminoethyl methacrylate 5 parts by weight respectively, above-mentioned various compositions are stirred at temperature is 65 DEG C for mixture, mixing speed is 90r/min, stirs 35min;
Step 2: add poly-epsilon-caprolactone glycol 3 parts, poly-adipate glycol 4 parts again in the mixture of step 1 by weight, raised temperature is stir at 80 DEG C again, stirs 30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 6000rpm, and shear time is 10min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
Peel resistant strength and the tensile strength of the LED adhesives of the resistance to stripping of above-described embodiment are as shown in the table:
| Peel resistant strength (N/mm) | Tensile strength (MPa) | |
| Embodiment 1 | 30.7 | 24.7 |
| Embodiment 2 | 30.5 | 24.5 |
| Embodiment 3 | 33.1 | 25.8 |
| Embodiment 4 | 32.5 | 25.6 |
| Embodiment 5 | 35.4 | 26.9 |
Peel resistant strength and the tensile strength of the LED adhesives of the resistance to stripping of above-mentioned comparative example are as shown in the table:
| Peel resistant strength (N/mm) | Tensile strength (MPa) | |
| Embodiment 1 | 24.1 | 17.4 |
| Embodiment 2 | 22.7 | 16.9 |
| Embodiment 3 | 25.2 | 19.5 |
Claims (6)
1. a LED adhesives for resistance to stripping, is characterized in that, the LED adhesives of described resistance to stripping is grouped into by the one-tenth of following weight part:
Polymethylmethacrylate 10-16 part,
Polyvinyl acetate 3-6 part,
Butyl polyacrylate 5-9 part,
Dimethylaminoethyl methacrylate 2-5 part,
(dimethylamino)-ethyl benzoate 2-6 part,
Pentaerythritol stearate 3-7 part,
Poly-epsilon-caprolactone glycol 3-8 part,
Poly-adipate glycol 4-10 part.
2. the LED adhesives of a kind of resistance to stripping according to claim 1, is characterized in that, the LED adhesives of described resistance to stripping is grouped into by the one-tenth of following weight part:
Polymethylmethacrylate 11-15 part,
Polyvinyl acetate 4-5 part,
Butyl polyacrylate 6-8 part,
Dimethylaminoethyl methacrylate 3-4 part,
(dimethylamino)-ethyl benzoate 3-5 part,
Pentaerythritol stearate 4-6 part,
Poly-epsilon-caprolactone glycol 4-7 part,
Poly-adipate glycol 5-9 part.
3. the preparation method of the LED adhesives of a kind of resistance to stripping according to claim 1, is characterized in that described preparation method comprises the steps:
Step 1: get polymethylmethacrylate 10-16 part, polyvinyl acetate 3-6 part, butyl polyacrylate 5-9 part, dimethylaminoethyl methacrylate 2-5 part, (dimethylamino)-ethyl benzoate 2-6 part by weight respectively, above-mentioned various compositions are stirred at temperature is 55-65 DEG C for mixture, mixing speed is 50-90r/min, stirs 15-35min;
Step 2: add pentaerythritol stearate 3-7 part, poly-epsilon-caprolactone glycol 3-8 part, poly-adipate glycol 4-10 part again in the mixture of step 1 by weight, raised temperature is stir at 70-80 DEG C again, stirs 10-30min;
Step 3: adopt high-speed shearing machine to carry out high speed shear again to the mixing material of step 2, shearing rotating speed is 4000-6000rpm, and shear time is 10-20min;
Step 4: mixing material is cooled to room temperature, after packaging, sealing, is the LED adhesives of resistance to stripping.
4. the preparation method of the LED adhesives of a kind of resistance to stripping according to claim 3, is characterized in that, in described step 1, temperature is stir at 60 DEG C as mixture, and mixing speed is 70r/min, stirs 25min.
5. the preparation method of the LED adhesives of a kind of resistance to stripping according to claim 3, is characterized in that, in described step 2, raised temperature is stir at 75 DEG C again, stirs 20min.
6. the preparation method of the LED adhesives of a kind of resistance to stripping according to claim 3, is characterized in that, shearing rotating speed in described step 3 is 5000rpm, and shear time is 15min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510653216.2A CN105153979B (en) | 2015-10-12 | 2015-10-12 | Peeling-resistant LED bonding material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510653216.2A CN105153979B (en) | 2015-10-12 | 2015-10-12 | Peeling-resistant LED bonding material and preparation method thereof |
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| Publication Number | Publication Date |
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| CN105153979A true CN105153979A (en) | 2015-12-16 |
| CN105153979B CN105153979B (en) | 2017-03-22 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1537912A (en) * | 2003-02-20 | 2004-10-20 | �����Ʒ�ۺ��﹫˾ | Blends of high T.g polymer emulsions and pressure sensitive adhesive polymer emulsion usefuel as pressure sensitive adhesives |
| CN102569451A (en) * | 2010-10-20 | 2012-07-11 | 苏州尚善新材料科技有限公司 | Solar module back veneer comprising non-solvent bonding layers and manufacturing method thereof |
| CN102863930A (en) * | 2012-10-16 | 2013-01-09 | 四川省玻纤集团有限公司 | Adhesive and preparation method thereof |
| CN103214983A (en) * | 2013-03-21 | 2013-07-24 | 马鞍山市中澜橡塑制品有限公司 | Waterproof hot melt adhesive and preparation method thereof |
-
2015
- 2015-10-12 CN CN201510653216.2A patent/CN105153979B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1537912A (en) * | 2003-02-20 | 2004-10-20 | �����Ʒ�ۺ��﹫˾ | Blends of high T.g polymer emulsions and pressure sensitive adhesive polymer emulsion usefuel as pressure sensitive adhesives |
| CN102569451A (en) * | 2010-10-20 | 2012-07-11 | 苏州尚善新材料科技有限公司 | Solar module back veneer comprising non-solvent bonding layers and manufacturing method thereof |
| CN102863930A (en) * | 2012-10-16 | 2013-01-09 | 四川省玻纤集团有限公司 | Adhesive and preparation method thereof |
| CN103214983A (en) * | 2013-03-21 | 2013-07-24 | 马鞍山市中澜橡塑制品有限公司 | Waterproof hot melt adhesive and preparation method thereof |
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| CN105153979B (en) | 2017-03-22 |
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Inventor after: Li Bingliang Inventor before: Qing Xiaorong |
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Effective date of registration: 20170113 Address after: 528000 Foshan, Nanhai District, Lishui Town, Red Village Road, No. 11, No. two, No. Applicant after: Foshan powery Polymer Technology Co Ltd Address before: Suzhou Wuzhong District City, Jiangsu province 215124 Guo Xiang Jie Dao Yin Feng No. 37 Applicant before: SUZHOU YIXINYUAN PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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