CN105141369A - Optical module - Google Patents
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- CN105141369A CN105141369A CN201510608788.9A CN201510608788A CN105141369A CN 105141369 A CN105141369 A CN 105141369A CN 201510608788 A CN201510608788 A CN 201510608788A CN 105141369 A CN105141369 A CN 105141369A
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Abstract
The invention provides an optical module. The optical module comprises a flexible circuit board, a light receiving/sending device, and a heat conduction block, wherein the light receiving/sending device is arranged on the first surface of the flexible circuit board and electrically connected with the flexible circuit board; and the first surface of the heat conduction block is in contact with the second surface of the flexible circuit board. The optical module produces favorable heat dissipation effects and temperature of devices in the optical module can be quickly reduced.
Description
Technical field
The present invention relates to fiber optic telecommunications equipment technology, particularly relate to a kind of optical module.
Background technology
Internet communication system is made up of central server and multiple terminal equipment, can carry out transfer of data between terminal equipment and central server by optical fiber.Along with the development of Internet technology, the operating frequency of central server and cloud device internal circuitry is more and more higher, make respective data processing rate and message transmission rate therebetween increase gradually, also just require that the speed that optical fiber communication equipment transmits light signal is more and more faster.
Optical module is very important optical signal interface device in optical fiber communication equipment, comprise printed circuit board (PCB) (PrintedCircuitboard, be called for short: PCB), arrange laser on a printed circuit, detector and the device such as driving chip for drive laser and detector, each device is welded on the corresponding pad of printed circuit board (PCB).Each device can generate heat in the process run, if heat can not be distributed rapidly, then its ambient temperature can be caused constantly to raise.And due to printed circuit board (PCB) thicker, and mostly adopt the materials such as phenolic resins, glass fibre, epoxy resin to make, its heat-conducting effect is poor.Therefore, existing optical module adopts printed circuit board (PCB) to be unfavorable for heat radiation, increases device power consumption on the one hand, have impact on again service behaviour and the stability of each device on the other hand, and then shortens the overall performance of optical module.
Summary of the invention
The invention provides a kind of optical module, its radiating effect is better, can reduce the temperature of inner each device fast.
The embodiment of the present invention provides a kind of optical module, comprising: flexible electric circuit board, be arranged on flexible electric circuit board first surface and the light receiving element/optical transmitting component be electrically connected with flexible electric circuit board and heat-conducting block; The first surface of described heat-conducting block contacts with the second surface of flexible electric circuit board.
The technical scheme that the embodiment of the present invention provides, by adopting the flexible electric circuit board of thinner thickness, light receiving element/optical transmitting component is arranged on the first surface of flexible electric circuit board, the second surface of flexible electric circuit board contacts with heat-conducting block, adopt the flexible electric circuit board of thinner thickness compared with printed circuit board (PCB) used in the prior art, be equivalent to shorten heat dissipation path, therefore the effect fast heat being conducted to heat-conducting block from light receiving element/optical transmitting component can be reached, improve radiating rate, not only device power consumption can be reduced, service behaviour and the stability of each device can also be ensured, increase the service life.
Accompanying drawing explanation
The structural representation of the optical module that Fig. 1 provides for the embodiment of the present invention;
The structural representation of the another optical module that Fig. 2 provides for the embodiment of the present invention.
Reference numeral:
1-flexible electric circuit board; 2-heat-conducting block; 3-optical transmitting component;
4-light receiving element; 5-optical fiber; 6-metal shell;
7-lens subassembly; 8-electric connector.
Embodiment
Embodiment one
The structural representation of the optical module that Fig. 1 provides for the embodiment of the present invention.As shown in Figure 1, the optical module that the present embodiment provides comprises: flexible electric circuit board 1, be arranged on flexible electric circuit board 1 first surface and the light receiving element 4 be electrically connected with flexible electric circuit board 1 and heat-conducting block 2, and the first surface of heat-conducting block 2 contacts with the second surface of flexible electric circuit board 1.
Concrete, in Fig. 1, the upper surface of flexible electric circuit board 1 is first surface, and lower surface is second surface, and light receiving element 4 is arranged on the first surface of flexible electric circuit board 1, and the pad solder corresponding with on flexible electric circuit board 1.
The upper surface of heat-conducting block 2 is first surface, and the lower surface of heat-conducting block 2 is second surface, that is: first surface and second surface are relative surface.The second surface of flexible electric circuit board 1 contacts with heat-conducting block 2, then the heat of light receiving element 4 can conduct to heat-conducting block 2 by flexible electric circuit board 1, then is distributed by heat-conducting block 2.Base material due to flexible electric circuit board 1 adopts polyesters compound, organic fiber compound, polytetroxide ethene dielectric film etc. to make usually, its toughness is fabulous flexible, thinner thickness, therefore, for printed circuit board (PCB) used in the prior art, the flexible electric circuit board 1 of thinner thickness can conduct heat quickly, improves radiating rate.
In a certain medium, heat is transmitted to B point from A point, then the temperature difference Δ T between A point and B point can refer to following formula and obtains:
Wherein, be the power consumption of source (i.e. A point), L is heat dissipation path (distance namely between A point and B point), and ρ is the thermal conductivity of this medium, and S is the cross-sectional area of thermal conductive surface.When the cross-sectional area S of the thermal conductivity ρ of source power consumption P, medium, thermal conductive surface is certain, shortens heat dissipation path L, just can reduce the temperature difference Δ T between A point and B point.
For technique scheme, the heat of light receiving element 4 is distributed to heat-conducting block 2, then light receiving element 4 is equivalent to above-mentioned A point, and heat-conducting block 2 is equivalent to above-mentioned B point, distance then between light receiving element 4 and heat-conducting block 2 is: heat dissipation path L, namely the thickness of flexible electric circuit board 1.
The such scheme that the present embodiment provides, adopt the flexible electric circuit board 1 of thinner thickness compared with printed circuit board (PCB) used in the prior art, be equivalent to shorten heat dissipation path L, therefore the effect fast heat being conducted to heat-conducting block 2 from light receiving element 4 can be reached, improve radiating rate, not only can reduce device power consumption, service behaviour and the stability of each device can also be ensured, increase the service life.The thickness of flexible electric circuit board 1 can reach between 0.05mm to 0.3mm, and compared to the printed circuit board (PCB) of thickness at 1.6mm, its heat dissipation path is much little, and radiating rate have also been obtained and significantly promotes.
Above-mentioned light receiving element 4 is specifically as follows detector, for receiving optical signals, belongs to the thermal source device that power consumption is large, caloric value is large.
Except detector, flexible electric circuit board 1 can also being provided with the driving chip for driving detector work, also belonging to the large and thermal source device that caloric value is larger of power consumption.This driving chip is also arranged on flexible electric circuit board 1, quick heat radiating can be carried out by flexible electric circuit board 1 equally.
The optical module that technique scheme provides can receive extraneous light signal, and optical module can combine with the device for changing light transmition direction, to adapt to multiple paths direction.
Or can also arrange lens subassembly 7 in optical module, lens subassembly 7 is located at the top of above-mentioned light receiving element 4, extraneous light is radiated on optical receiver 4 after lens subassembly 7 reflects.
Further, the first surface of flexible electric circuit board 1 can also be arranged other device, such as main control chip etc., the caloric value of main control chip is also larger, and by the such scheme adopting the present embodiment to provide, its heat also can be conducted as early as possible.
Above-mentioned heat-conducting block 2 can adopt the good material of heat conductivility to make, such as metal, metal alloy, pottery etc.The present embodiment adopts metal to make block structure, is referred to as metal heat sink, and its thermal conductivity is comparatively large, can be (100-1000) W/ (m* DEG C).In addition, increase the contact area of metal heat sink and flexible electric circuit board 1 second surface as far as possible, radiating rate can be improved further.
Embodiment two
Different from embodiment one, the present embodiment provides another kind of optical module, as shown in Figure 1, this optical module comprises: flexible electric circuit board 1, be arranged on flexible electric circuit board 1 first surface and the optical transmitting component 3 be electrically connected with flexible electric circuit board 1 and heat-conducting block 2, and the first surface of heat-conducting block 2 contacts with the second surface of flexible electric circuit board 1.
Similar with embodiment one, in Fig. 1, the upper surface of flexible electric circuit board 1 is first surface, and lower surface is second surface, and optical transmitting component 3 is arranged on the first surface of flexible electric circuit board 1, and the pad solder corresponding with on flexible electric circuit board 1.
The upper surface of heat-conducting block 2 is first surface, and the lower surface of heat-conducting block 2 is second surface, that is: first surface and second surface are relative surface.The second surface of flexible electric circuit board 1 contacts with heat-conducting block 2, then the heat of optical transmitting component 3 can conduct to heat-conducting block 2 by flexible electric circuit board 1, then is distributed by heat-conducting block 2.Base material due to flexible electric circuit board 1 adopts polyesters compound, organic fiber compound, polytetroxide ethene dielectric film etc. to make usually, its toughness is fabulous flexible, thinner thickness, therefore, for printed circuit board (PCB) used in the prior art, the flexible electric circuit board 1 of thinner thickness can conduct heat quickly, improves radiating rate.
With reference to the heat conduction formula that embodiment one provides, the heat of optical transmitting component 3 is distributed to heat-conducting block 2, then optical transmitting component 3 is equivalent to above-mentioned A point, heat-conducting block 2 is equivalent to above-mentioned B point, distance then between optical transmitting component 3 and heat-conducting block 2 is: heat dissipation path L, namely the thickness of flexible electric circuit board 1.
The such scheme that the present embodiment provides, adopt the flexible electric circuit board 1 of thinner thickness compared with printed circuit board (PCB) used in the prior art, be equivalent to shorten heat dissipation path L, therefore the effect fast heat being conducted to heat-conducting block 2 from optical transmitting component 3 can be reached, improve radiating rate, not only can reduce device power consumption, service behaviour and the stability of each device can also be ensured, increase the service life.The thickness of flexible electric circuit board 1 can reach between 0.05mm to 0.3mm, and compared to the printed circuit board (PCB) of thickness at 1.6mm, its heat dissipation path is much little, and radiating rate have also been obtained and significantly promotes.
Above-mentioned optical transmitting component 3 is specifically as follows laser, for utilizing emitted light signal, belongs to the thermal source device that power consumption is large, caloric value is large.
Besides a laser, flexible electric circuit board 1 can also be provided with the driving chip for drive laser work, also belong to the large and thermal source device that caloric value is larger of power consumption.This driving chip is also arranged on flexible electric circuit board 1, quick heat radiating can be carried out by flexible electric circuit board 1 equally.
Similar with embodiment one, the optical module that the present embodiment provides outwardly can send light signal, and optical module can combine with the device for changing light transmition direction, to adapt to multiple paths direction.
Such as, or can also arrange lens subassembly 7 in optical module, lens subassembly 7 is located at the top of above-mentioned optical transmitting component 3, and the light that optical transmitting component 3 sends reflects backward outer injection through lens subassembly 7, injects the transmission carrying out light signal in optical fiber.
Further, the first surface of flexible electric circuit board 1 also can arrange main control chip etc., the caloric value of main control chip is also larger, and by the such scheme adopting the present embodiment to provide, its heat also can be conducted as early as possible.
Embodiment three
With above-described embodiment one and embodiment two unlike, in the optical module that the present embodiment provides, namely can comprise light receiving element 4, also can comprise optical transmitting component 3, that is: optical transmitting component 3 and light receiving element 4 are all arranged on the first surface of flexible electric circuit board 1.
Concrete, as shown in Figure 1, the optical module that the present embodiment provides comprises: flexible electric circuit board 1, be arranged on flexible electric circuit board 1 first surface and the optical transmitting component 3, light receiving element 4 and the heat-conducting block 2 that are electrically connected with flexible electric circuit board 1, and the first surface of heat-conducting block 2 contacts with the second surface of flexible electric circuit board 1.
With embodiment one and embodiment two similar, in Fig. 1, the upper surface of flexible electric circuit board 1 is first surface, lower surface is second surface, and optical transmitting component 3 and light receiving element 4 are arranged on the first surface of flexible electric circuit board 1, and the pad solder corresponding with on flexible electric circuit board 1.
The upper surface of heat-conducting block 2 is first surface, and the lower surface of heat-conducting block 2 is second surface, that is: first surface and second surface are relative surface.The second surface of flexible electric circuit board 1 contacts with heat-conducting block 2, then the heat of optical transmitting component 3 and light receiving element 4 can conduct to heat-conducting block 2 by flexible electric circuit board 1, then is distributed by heat-conducting block 2.Base material due to flexible electric circuit board 1 adopts polyesters compound, organic fiber compound, polytetroxide ethene dielectric film etc. to make usually, its toughness is fabulous flexible, thinner thickness, therefore, for printed circuit board (PCB) used in the prior art, the flexible electric circuit board 1 of thinner thickness can conduct heat quickly, improves radiating rate.
With reference to the heat conduction formula that embodiment one provides, the heat of optical transmitting component 3 and light receiving element 4 is distributed to heat-conducting block 2, then optical transmitting component 3 and light receiving element 4 are equivalent to above-mentioned A point separately respectively, heat-conducting block 2 is equivalent to above-mentioned B point, then optical transmitting component 3, the distance of light receiving element 4 separately and between heat-conducting block 2 are: heat dissipation path L, the namely thickness of flexible electric circuit board 1.
The such scheme that the present embodiment provides, adopt the flexible electric circuit board 1 of thinner thickness compared with printed circuit board (PCB) used in the prior art, be equivalent to shorten heat dissipation path L, therefore the effect fast heat being conducted to heat-conducting block 2 from optical transmitting component 3 and light receiving element 4 can be reached, improve radiating rate, not only can reduce device power consumption, service behaviour and the stability of each device can also be ensured, increase the service life.The thickness of flexible electric circuit board 1 can reach between 0.05mm to 0.3mm, and compared to the printed circuit board (PCB) of thickness at 1.6mm, its heat dissipation path is much little, and radiating rate have also been obtained and significantly promotes.
Above-mentioned optical transmitting component 3 is specifically as follows laser, for utilizing emitted light signal; Above-mentioned light receiving element 4 is specifically as follows detector, and laser and detector all belong to the thermal source device that power consumption is large, caloric value is large.
Except laser and detector, flexible electric circuit board 1 can also being provided with the driving chip for drive laser work, and for driving the driving chip of detector work, all belonging to the large and thermal source device that caloric value is larger of power consumption.Wherein, for the driving chip of drive laser work with for driving the driving chip of detector work to be independently two chips, a chip can be also integrated into.Driving chip is also arranged on flexible electric circuit board 1, quick heat radiating can be carried out by flexible electric circuit board 1 equally.
Similar with embodiment one, the optical module that the present embodiment provides outwardly can send light signal and can from extraneous receiving optical signals, then optical module can combine with the device for changing light transmition direction, to adapt to multiple paths direction.
Or, can also lens subassembly 7 be set in optical module, lens subassembly 7 is located at the top of above-mentioned optical transmitting component 3 and light receiving element 4, and the light that optical transmitting component 3 sends reflects backward outer injection through lens subassembly 7, such as, inject the transmission carrying out light signal in optical fiber; The light signal in the external world carries out reflecting rear directive light receiving element 4 by lens subassembly 7.
Further, the first surface of flexible electric circuit board 1 also can arrange main control chip etc., the caloric value of main control chip is also larger, and by the such scheme adopting the present embodiment to provide, its heat also can be conducted as early as possible.
Embodiment four
For the optical module that above-described embodiment provides, although the thinner thickness of flexible electric circuit board 1, radiating rate can be increased substantially compared to adopting printed circuit board (PCB) in prior art, but be subject to the restriction that flexible electric circuit board 1 makes material, its heat-conducting effect also has a certain distance compared with metal material.
Therefore, the present embodiment provides again a kind of implementation of optical module: on the basis of the technical scheme provided in the various embodiments described above, flexible electric circuit board 1 bottom light receiving element 4 and/or optical transmitting component 3 offers through hole, metal column (depending on not going out in figure) is provided with in this through hole, one end of metal column contacts with the bottom of light receiving element 4 or optical transmitting component 3, and the other end contacts with the first surface of heat-conducting block 2.The cross-sectional area of metal column is identical with the cross-sectional area of through hole, the height of metal column is identical with the thickness of flexible electric circuit board 1, then when heat dissipation path L is constant, the heat-transfer rate of metal column will be far longer than flexible electric circuit board 1, therefore, the heat of light receiving element 4 and/or optical transmitting component 3 not only conducts to heat-conducting block 2 by flexible electric circuit board 1, also conduct to heat-conducting block 2 by metal column, and want fast a lot of by the speed that metal column carries out heat conduction, be equivalent to the thermal conductivity ρ reducing medium, can radiating effect be further increased.
Metal column can adopt the good metal or metal alloy of heat-conducting effect in prior art to make, and such as copper, aluminium, aluminium alloy etc., the present embodiment is made of copper copper post.
Embodiment five
Further, present embodiments provide the implementation of another kind of optical module: on the basis of above-described embodiment, metal level (not shown) is equipped with at the second surface of flexible electric circuit board 1, the first surface of heat-conducting block 1 contacts with metal level, is equivalent to metal level and is arranged between flexible electric circuit board 1 and heat-conducting block 2.
For flexible electric circuit board 1, due to its thinner thickness, then the heat conduction velocity along thickness (namely longitudinally) direction is very fast, but still more weak along the capacity of heat transmission of (namely laterally) in plate.Therefore, according to above-mentioned formula, the heat conduction of light receiving element 4 or optical transmitting component 3 can be considered the contact area of light receiving element 4 or optical transmitting component 3 and flexible electric circuit board 1 to the cross-sectional area S of the thermal conductive surface of heat-conducting block 2.The present embodiment arranges metal level between flexible electric circuit board 1 and heat-conducting block 2, due to better in the horizontal capacity of heat transmission of metal layer itself, then the heat of light receiving element 4 and/or optical transmitting component 3 conducts on metal level by flexible electric circuit board 1, not only can fast along metal level longitudinally conduction, can also along metal layer itself cross conduction, be equivalent to the cross-sectional area S increasing thermal conductive surface, accelerate heat-transfer rate further, improve radiating effect.
Metal level can adopt the good metal or metal alloy of heat-conducting effect in prior art to make, such as copper, aluminium, aluminium alloy etc., and the present embodiment adopts copper to form layers of copper at the second surface of flexible electric circuit board 1.
Embodiment six
In conjunction with the two kinds of implementations being provided with metal level and metal column in above-described embodiment four and embodiment five, the present embodiment also provides the implementation of another kind of optical module: be both equipped with metal level at the second surface of flexible electric circuit board 1, flexible electric circuit board 1 again bottom light receiving element 4 and/or optical transmitting component 3 offers through hole, and metal column is set in this through hole, one end of metal column contacts with the bottom of light receiving element 4 or optical transmitting component 3, and the other end contacts with metal level.Then this implementation, can either by heat cross conduction and reach the object of cross-sectional area S increasing thermal conductive surface in metal level, heat conduction can be carried out by the metal column that thermal conductivity ρ is lower again, heat conduction velocity can be accelerated further, improve radiating effect.
Embodiment seven
On the basis of the various embodiments described above, for the set-up mode of flexible electric circuit board 1, multiple way of realization can be had:
One, flexible electric circuit board 1 is set to slab construction, each circuit devcie is all arranged on the first surface of flexible electric circuit board 1, the second surface of flexible electric circuit board 1 directly contacts with heat-conducting block 2, or metal level is set on the second surface of flexible electric circuit board 1, contacted with heat-conducting block 2 again by metal level.
Two, be set to comprise interconnective slab construction and warp architecture by flexible electric circuit board 1, as shown in Figure 1, slab construction is be positioned at the part above heat-conducting block 2, and warp architecture is be positioned at the part on the left of heat-conducting block 2.
Each circuit devcie is all arranged on the first surface of flexible electric circuit board 1, specifically can be arranged in slab construction, also can be arranged on warp architecture.When the quantity of circuit devcie is more, when volume is larger, need the area of flexible electric circuit board 1 also larger.If for the printed circuit board (PCB) of rigidity of the prior art or the flexible electric circuit board 1 of above-mentioned slab construction, the size of circuit board can be very large, and then cause the volume of optical module entirety larger.
And due to the toughness of the base material of flexible electric circuit board 1 better, can bend, such as, in Fig. 1, warp architecture is positioned at the left side of heat-conducting block 2, then can reduce the volume of optical module.
In central server optical module being applied to Internet communication system and cloud device, for the Circuits System plate of same area, more optical module can be held, improve light process density, increase substantially communication bandwidth.
Three, flexible electric circuit board 1 is set to comprise the first slab construction and the second slab construction, connected by warp architecture between first slab construction and the second slab construction, as shown in Figure 1, first slab construction is positioned at the part above heat-conducting block 2, warp architecture is be positioned at the part on the left of heat-conducting block 2, and the second slab construction is positioned at the part below heat-conducting block 2.Be equivalent to flexible electric circuit board 1 bending after, its first slab construction all contacts with heat-conducting block 2 with the second surface in the second slab construction, wherein, second surface in first slab construction contacts with the first surface of heat-conducting block 2, and the second surface in the second slab construction contacts with the second surface of heat-conducting block 2.
Each circuit devcie is all arranged on the first surface of flexible electric circuit board 1, specifically can be arranged in the first slab construction, also can be arranged on warp architecture, can also be arranged in the second slab construction.When the area of flexible electric circuit board 1 is constant, can the more circuit devcie of magnitude setting.
Embodiment eight
For the technical scheme of the various embodiments described above, flexible electric circuit board 1 can be provided with golden finger, is connected with external circuits device by golden finger.Then above-mentioned light receiving element 4 and/or optical transmitting component 3, driving chip etc. to be all arranged on flexible electric circuit board 1 and correspondingly with flexible electric circuit board 1 to be electrically connected, and are electrically connected to the corresponding link in external circuits device by golden finger.
Concrete, a circuit connecting terminals can be set in addition, such as electric connector 8, it not arranged any circuit devcie, only use as splicing ear.Electric connector 8 is connected with external circuits device again.The golden finger of flexible electric circuit board 1 keeps being electrically connected with electric connector 8, to make light receiving element 4 and/or optical transmitting component 3 are electrically connected with electric connector 8 by the golden finger on flexible electric circuit board 1, then is electrically connected with external circuits device by electric connector 8.
In Fig. 1, the electric connector 8 in optical module is arranged on the below of heat-conducting block 2, and electric connector 8 be arranged on flexible electric circuit board 1 first surface on and be electrically connected with flexible electric circuit board 1.
Or, electric connector 8 arranges golden finger, is connected with external circuits device by golden finger.And flexible electric circuit board 1 can be arranged golden finger, also can not arrange golden finger, flexible electric circuit board 1 is electrically connected with electric connector 8.
Embodiment nine
Outside three kinds of implementations providing of removing embodiment seven, flexible electric circuit board 1 can also be set to other form by those skilled in the art.The structural representation of the another optical module that Fig. 2 provides for the embodiment of the present invention.As shown in Figure 2:
On the basis of embodiment eight, flexible electric circuit board 1 is set to comprise the first slab construction and the second slab construction, connected by the first warp architecture between first slab construction and the second slab construction, the end of the first slab construction forms the second warp architecture on the right side of heat-conducting block 2 after bending.Wherein, the implementation of the first slab construction, the second slab construction and the first warp architecture all can refer to Fig. 1.With Fig. 1 difference be: the electric connector 8 in Fig. 2 is arranged on the right side of heat-conducting block, and electric connector 8 to be arranged on the second warp architecture and to be electrically connected with the second warp architecture.
In addition, electric connector 8 can also be arranged on other position, and flexible electric circuit board 1 can carry out corresponding change of shape, to adapt to and to be electrically connected with electric connector 8.
Embodiment ten
The various embodiments described above provide optical module be that all circuit devcies are placed on flexible electric circuit board 1, instead of be placed on printing board PCB, adopt flexible electric circuit board 1 to substitute printing board PCB comprehensively.
And the present embodiment also provides a kind of implementation of optical module: adopt the flexible electric circuit board 1 that printed circuit board (PCB) of the prior art and technique scheme provide simultaneously, be electrically connected therebetween.Wherein, the flexible one-tenth of flexible electric circuit board 1 is set angle relative to printed circuit board (PCB), and such as 90 °, that is: flexible electric circuit board 1 is vertical with printed circuit board (PCB).Circuit devcie less for caloric value can be arranged on a printed circuit, and optical transceiving device larger for caloric value is arranged on flexible electric circuit board 1, also can reach the technique effect that technique scheme possesses, that is: shorten heat dissipation path, improve radiating rate.
Embodiment 11
On the basis of the various embodiments described above; the present embodiment also provides a kind of optical module; also comprise the metal shell 6 for holding flexible electric circuit board 1; metal shell 6, by all coated to flexible electric circuit board 1, heat-conducting block 2, light receiving element 4 and/or the device such as optical transmitting component 3, lens subassembly 7, is protected it.The second surface of heat-conducting block 2 is contacted with metal shell 6, or other surface of heat-conducting block 2 also contacts with metal shell 6, the speed of heat conduction can be accelerated further, distributed by metal shell 6, improve radiating effect.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (10)
1. an optical module, is characterized in that, comprising: flexible electric circuit board, be arranged on flexible electric circuit board first surface and the light receiving element/optical transmitting component be electrically connected with flexible electric circuit board and heat-conducting block; The first surface of described heat-conducting block contacts with the second surface of flexible electric circuit board.
2. optical module according to claim 1, is characterized in that, the second surface of described flexible electric circuit board is equipped with metal level, and the first surface of described heat-conducting block contacts with described metal level.
3. optical module according to claim 1, is characterized in that, described flexible electric circuit board is provided with the golden finger for being connected with external circuits device.
4. optical module according to claim 1, is characterized in that, also comprises electric connector, and described flexible electric circuit board is connected with electric connector, and described electric connector is provided with the golden finger for being connected with external circuits device.
5. optical module according to claim 1, is characterized in that, the flexible electric circuit board bottom described light receiving element/optical transmitting component offers through hole, is provided with metal column in described through hole, described metal column contacts with the first surface of heat-conducting block.
6. optical module according to claim 2, is characterized in that, the flexible electric circuit board bottom described light receiving element/optical transmitting component offers through hole, is provided with metal column in described through hole, described metal column contacts with metal level.
7. the optical module according to any one of claim 1-6, it is characterized in that, also comprise the lens subassembly for adjusting light receiving element/optical transmitting component light transmition path, described lens subassembly to be located on light receiving element/optical transmitting component and to be fixedly connected with flexible electric circuit board.
8. the optical module according to any one of claim 2-6, is characterized in that, described metal level is layers of copper.
9. the optical module according to claim 5 or 6, is characterized in that, described metal column is copper post.
10. the optical module according to any one of claim 1-6, is characterized in that, also comprise the metal shell for holding described flexible electric circuit board, described heat-conducting block contacts with described metal shell.
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| CN105141369B (en) | 2018-04-24 |
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