CN105137719A - Gas supply device and photoetching projection objective provided with same - Google Patents
Gas supply device and photoetching projection objective provided with same Download PDFInfo
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- CN105137719A CN105137719A CN201510600397.2A CN201510600397A CN105137719A CN 105137719 A CN105137719 A CN 105137719A CN 201510600397 A CN201510600397 A CN 201510600397A CN 105137719 A CN105137719 A CN 105137719A
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Abstract
The invention discloses a gas supply device and a photoetching projection objective provided with the same. The gas supply device comprises a gas source and a gas supply control pipeline, wherein one end of the gas supply control pipeline is communicated with the gas source, and the other end of the gas supply control pipeline is communicated with an internal chamber of an objective body; the gas supply control pipeline comprises a heat exchanger, a reducing valve and a mass flow controller which are arranged on the pipeline; the heat exchanger is used for performing heat exchange on working gas to adjust the temperature; the reducing valve is used for adjusting the gas supply pressure of the working gas; the mass flow controller is used for adjusting the flow of the working gas. Through treatment of the working gas provided by the gas source, parameters of pressure, flow, temperature and the like of the working gas supplied to the internal chamber of the objective body are stable. The device is simple in structure, easy to operate and convenient to maintain and effectively guarantees stability of environmental parameters under the normal working condition of the photoetching projection objective, and the situation that pollutants in the external environment enter the objective body and pollute an optical system is avoided.
Description
Technical field
The present invention relates to photoetching projection objective lens control field, especially, relate to a kind of gas supply device.In addition, the invention still further relates to a kind of photoetching projection objective lens comprising above-mentioned gas feedway.
Background technology
Photoetching projection objective lens is a kind of ultra-precise optical system, is the core component of litho machine, and it is the key affecting photolithography resolution and live width.Along with the raising of lithographic accuracy, to the requirement of environment as the requirement to environment temperature, air pressure, cleanliness factor etc., also more and more harsher.There is a large amount of thermals source and comprise various motor and excimer laser etc. in object lens inside, the change of temperature can cause object lens position of focal plane to change and affect the image quality of object lens, object lens inside needs sealed environment and high-purity, clean nitrogen to prevent air from entering projection objective internal contamination optical mirror slip simultaneously, need to ensure that nitrogen has constant pressure and flow simultaneously, reduce the impact on Optical Surface.
The temperature environment of projection objective internal chamber is about 22 DEG C.At present, for 193nm LASER Light Source, by not having emulation experiment to the objective system hot dipping of 10 groups of varying environment temperature of environment temperature within the scope of 21.5 DEG C ~ 22.5 DEG C, draw when object lens internal chamber variation of ambient temperature about 0.01 DEG C, wave aberration maximum change 0.12nm, multiplying power maximum change 0.4ppm, distort maximum change 0.09nm.The air pressure of projection objective internal chamber is about: 750mbar ~ 1050mbar.At present, for 193nm LASER Light Source, according to the result of optical design and simulation analysis, the relation of multiplying power and air pressure is about: multiplying power and air pressure are approximately linear relationship within the scope of this, during air pressure change 100pa, multiplying power has changed 0.64ppm, during air pressure change 76pa, multiplying power has changed 0.5ppm, when during air pressure change 15.2pa, multiplying power has changed 0.1ppm.This shows the isoparametric change of photoetching projection objective lens internal gas pressure, temperature, will the precision of photoetching be had a strong impact on, therefore, need to ensure the stable of photoetching projection objective lens internal environment, reduce the impact on optical system.
The air feed source of the gas of photoetching projection objective lens internal gas generally adopts the form of external gas cylinders, the indexs such as its pressure, flow, degree of purity, temperature all can not meet the demands, projection objective internal gas environmental requirement high-purity (nitrogen content 99.999999%), granularity (maximum 3nm), constant rate (12NL/H), pressure (100 ± 10pa).
Therefore, need the source of the gas of the design high-purity accurate gas supply device of a kind of photoetching projection objective lens to outside badly and process, and be supplied to the inert gas of the stable pressure of projection objective internal chamber, flow, temperature, cleanliness factor.
Summary of the invention
The invention provides a kind of gas supply device and there is its photoetching projection objective lens, be difficult to the technical matters effectively controlled with the pressure, flow, temperature etc. that solve existing photoetching projection objective lens internal chamber.
The technical solution used in the present invention is as follows:
According to an aspect of the present invention, a kind of gas supply device is provided, working gas is provided for giving the object lens body interior chamber of photoetching projection objective lens, gas supply device comprises: source of the gas and air feed pilot piping, one end of air feed pilot piping is communicated with source of the gas, and the other end is used for being communicated with the internal chamber of object lens body;
Air feed pilot piping comprises: be located at the heat exchanger on pipeline, reduction valve, mass flow controller, wherein,
Heat exchanger is used for carrying out heat interchange to regulate temperature to working gas;
Reduction valve is used for regulating the supply gas pressure of working gas;
Mass flow controller is used for regulating the flow of working gas.
Further, air feed pilot piping also comprises: be located at the filtrator on pipeline, controls for carrying out filtration to the granularity of working gas.
Further, air feed pilot piping also comprises: be located at the purifier on pipeline, controls for carrying out purification to the purity of working gas.
Further, air feed pilot piping also comprises: be located at the blowdown valve on pipeline, for providing overvoltage safety protection to control to working gas.
Further, air feed pilot piping also comprises: pressure transducer, is located on the pipeline of the outlet side of reduction valve, for measuring the force value after reduction valve regulates, to control reduction valve according to force value.
Further, reduction valve comprises one-level pressure relief valve and second depressurized valve, and the outlet side of one-level pressure relief valve is provided with the first pressure transducer, and the outlet side of second depressurized valve is provided with the second pressure transducer.
Further, heat exchanger comprises primary heat exchanger and secondary heat exchanger, wherein, primary heat exchanger is used for carrying out heat interchange with coarse adjustment temperature to working gas, and secondary heat exchanger is used for carrying out heat interchange with meticulous adjustment temperature to the working gas after primary heat exchanger adjustment.
Further, air feed pilot piping comprises the primary heat exchanger, diaphragm valve, one-level pressure relief valve, the first pressure transducer, filtrator, second depressurized valve, the second pressure transducer, mass flow controller, purifier, blowdown valve, the secondary heat exchanger that connect successively, wherein
Primary heat exchanger is communicated with source of the gas and diaphragm valve, for carrying out heat interchange with coarse adjustment temperature to working gas;
Diaphragm valve is used for controlling the working gas supply through primary heat exchange;
One-level pressure relief valve is used for carrying out coarse adjustment to the supply gas pressure of working gas;
First pressure transducer is used for the pressure after to one-level pressure relief valve adjustment and measures;
Filtrator is used for carrying out filtration to the granularity of working gas and controls;
Second depressurized valve is used for carrying out meticulous adjustment to the supply gas pressure of working gas;
Second pressure transducer is used for measuring the pressure after second depressurized valve regulation;
Mass flow controller is used for regulating the flow of working gas;
Purifier is used for carrying out purification to the purity of working gas and controls;
Blowdown valve is used for providing overvoltage safety protection to control to working gas;
The internal chamber of the outlet object lens body of secondary heat exchanger, for carrying out heat interchange with meticulous adjustment temperature to working gas.
According to a further aspect in the invention, provide a kind of photoetching projection objective lens, comprise object lens body, the inner space gas supply device described above of object lens body.
Further, the inner chamber of object lens body is provided with gas outlet, and gas outlet connects restrictor, under the prerequisite of working gas environment ensureing object lens chamber body, carries out constraint control air consumption.
The present invention has following beneficial effect:
Gas supply device of the present invention and there is its photoetching projection objective lens, processed by the working gas provided source of the gas, make the parameter stabilities such as the pressure of the working gas of the internal chamber being supplied to object lens body, flow, temperature, its structure simple, easy to operate and be convenient to safeguard, under effectively having ensured photoetching projection objective lens normal operation, environmental parameter is stablized, and avoids the pollutant of external environment condition to enter object lens body interior to pollute optical system.
Except object described above, feature and advantage, the present invention also has other object, feature and advantage.Below with reference to figure, the present invention is further detailed explanation.
Accompanying drawing explanation
The accompanying drawing forming a application's part is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the structural representation of preferred embodiment of the present invention photoetching projection objective lens;
Fig. 2 is that laser irradiates lower N
2the film transmitance correlation curve figure that impurity is different.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
With reference to Fig. 1, the preferred embodiments of the present invention provide provides a kind of gas supply device, working gas is provided for giving object lens body 1 internal chamber of photoetching projection objective lens, the present embodiment gas supply device comprises: source of the gas 2 and air feed pilot piping, one end of air feed pilot piping is communicated with source of the gas 2, and the other end is used for being communicated with the internal chamber of object lens body 1; Air feed pilot piping comprises: be located at the heat exchanger on pipeline, reduction valve, mass flow controller 10, and wherein, heat exchanger is used for carrying out heat interchange to regulate temperature to working gas; Reduction valve is used for regulating the supply gas pressure of working gas; Mass flow controller 10 is for regulating the flow of working gas.In the present embodiment, working gas is inert gas, pollutes optical mirror slip to prevent air from entering object lens body 1 internal chamber, and source of the gas 2 is for providing the device such as gas cylinder or gas tank of inert gas.The present embodiment is by processing the working gas that source of the gas 2 provides, make the parameter stabilities such as the pressure of the working gas of the internal chamber being supplied to object lens body 1, flow, temperature, its structure simple, easy to operate and be convenient to safeguard, under effectively having ensured photoetching projection objective lens normal operation, environmental parameter is stablized, and avoids the pollutant of external environment condition to enter object lens body interior to pollute optical system.
Further, air feed pilot piping also comprises: be located at the filtrator 7 on pipeline, controls for carrying out filtration to the granularity of working gas.
Further, air feed pilot piping also comprises: be located at the purifier 11 on pipeline, controls for carrying out purification to the purity of working gas.
Alternatively, the present embodiment air feed pilot piping also comprises: be located at the blowdown valve 12 on pipeline, for providing overvoltage safety protection to control to working gas.When the force value of the working gas on pipeline exceedes safe threshold, then pass through blowdown valve 12 pressure release to protect the internal environment of object lens body 1.
Alternatively, the present embodiment air feed pilot piping also comprises: pressure transducer, is located on the pipeline of the outlet side of reduction valve, for measuring the force value after reduction valve regulates, to control reduction valve according to force value.
Alternatively, with reference to Fig. 1, in the present embodiment, reduction valve comprises one-level pressure relief valve 5 and second depressurized valve 8, and the outlet side of one-level pressure relief valve 5 is provided with the first pressure transducer 6, and the outlet side of second depressurized valve 8 is provided with the second pressure transducer 9.
Alternatively, with reference to Fig. 1, heat exchanger comprises primary heat exchanger 3 and secondary heat exchanger 13, wherein, primary heat exchanger 3 is for carrying out heat interchange with coarse adjustment temperature to working gas, and secondary heat exchanger 13 is for carrying out heat interchange with meticulous adjustment temperature to the working gas after primary heat exchanger 3 adjustment.The present embodiment is controlled by secondary heat interchange, can accurately to the temperature of photoetching projection objective lens interior working gas, to ensure that its working environment parameter is stablized.
With reference to Fig. 1, as a kind of preferred embodiment, this air feed pilot piping comprises the primary heat exchanger 3, diaphragm valve 4, one-level pressure relief valve 5, first pressure transducer 6, filtrator 7, second depressurized valve 8, second pressure transducer 9, mass flow controller 10, purifier 11, blowdown valve 12, the secondary heat exchanger 13 that connect successively, wherein
Primary heat exchanger 3 is communicated with source of the gas 2 and diaphragm valve 4, for carrying out heat interchange with coarse adjustment temperature to working gas;
Diaphragm valve 4 is for controlling the working gas supply through primary heat exchange; This isolation valve 4 can be solenoid valve or switch valve etc., to control the supply break-make of working gas;
One-level pressure relief valve 5 is for carrying out coarse adjustment to the supply gas pressure of working gas;
First pressure transducer 6 is for measuring the pressure after one-level pressure relief valve 5 adjustment;
Filtrator 7 controls for carrying out filtration to the granularity of working gas.Preferably, the quantity of filtrator 7 can be two or multiple, and multiple filtrator is connected in parallel in gas piping.
Second depressurized valve 8 is for carrying out meticulous adjustment to the supply gas pressure of working gas;
Second pressure transducer 9 is for measuring the pressure after second depressurized valve 8 adjustment;
Mass flow controller 10 is for regulating the flow of working gas;
Purifier 11 controls for carrying out purification to the purity of working gas.Preferably, the quantity of development of evil in febrile disease device 11 can be two or multiple, and connected mode is for being connected in parallel in gas piping.
Blowdown valve 12 is for providing overvoltage safety protection to control to working gas; When the force value of the working gas on pipeline exceedes safe threshold, then pass through blowdown valve 12 pressure release to protect the internal environment of object lens body 1.
The internal chamber of the outlet object lens body 1 of secondary heat exchanger 13, for carrying out heat interchange with meticulous adjustment temperature to working gas.
Due to pollute monitoring and control be one of requisite link in lithographic objective environmental Kuznets Curves process.The quality of Environmental capacity will affect many optical characteristics such as visual field homogeneity (fielduniformity), object lens transmitance (lenstransmission), groove consistance (CDuniformity) and parasitic light (scatteredlight), and the gas supply device of lithographic objective often ignored the monitoring for pollutant in supply gas in the past, caused the generation of great number of issues.
The type of object lens internal contamination mainly contains H
2o, O
2, CO, CO
2, H
2deng inorganics, and the multiple organic compound such as benzene, acid, alkane, alcohol, all in all, pollution source is broadly divided into following a few class:
1) in object lens assembling process, the dust introduced because external environment condition cleanliness factor is lower;
2) nitrogen be filled with is impure, even if the high pure nitrogen of 99.9999%, also needs to detect its composition;
3) glue used in single mirror integrating process produces volatilization or chemical reaction under the irradiation of ultraviolet light;
4) photoresist issues biochemical reaction in UV-irradiation, window under pollution object lens.
And in order to solve and control because the gas be filled with in lithographic objective causes the problem of object lens internal contamination, filtrator and purifier is provided with in the present embodiment in gas supply device, to realize purifying before gas is filled with object lens, to avoid the generation of polluting, shown in Figure 2 is influence curve to film transmitance under F2 laser and ArF laser irradiate, wherein, whether optimize front/rear essential difference is filter the impurity in nitrogen, purifying, as shown in Figure 2 by gas filtration, be filled with again in lithographic objective after purifying, its film transmitance can be significantly improved, visible, necessity and the importance of filtrator and purifier is provided with in gas supply device.
Whether the impurity content of the quality of Environmental capacity and the cleanliness factor of projection objective environment, high pure nitrogen, object lens inside and outside differential pressure/sealing, insufflation gas flow can cause the factors such as internal turbulence relevant, therefore the sealed environment of object lens inside and high-purity, clean nitrogen enter projection objective internal contamination optical mirror slip to prevent air to need the device in a kind of the present embodiment to ensure, need to ensure that nitrogen has constant pressure and flow simultaneously, reduce the impact on Optical Surface.
According to a further aspect in the invention, provide a kind of photoetching projection objective lens, comprise object lens body 1, the inner space of object lens body 1 is as the gas supply device of above-described embodiment.
The inner chamber of the present embodiment object lens body 1 is provided with gas outlet, and gas outlet connects restrictor 14, under the prerequisite of working gas environment ensureing object lens body 1 inner chamber, carries out constraint control air consumption.
The supply gas of the high-purity accurate gas supply device of the present embodiment photoetching projection objective lens to external air source processes, and is supplied to high-purity accurate inert gases such as the stable pressure of photoetching projection objective lens internal chamber (100 ± 10pa), flow (12NL/H), temperature, granularity, cleanliness factor.Under having ensured photoetching projection objective lens normal operation, environmental parameter is stablized, and carries out Environmental capacity to projection objective inside, avoids the polluter of external environment condition to enter projection objective inside and pollutes optical system.The invention has the advantages that: gas purity high (nitrogen content 99.999999%), pressure, discharge stability are good, and structure is simple, easy to operate, easy to maintenance.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a gas supply device, working gas is provided for giving object lens body (1) internal chamber of photoetching projection objective lens, it is characterized in that, described gas supply device comprises: source of the gas (2) and air feed pilot piping, one end of described air feed pilot piping is communicated with described source of the gas (2), and the other end is used for being communicated with the internal chamber of described object lens body (1);
Described air feed pilot piping comprises: be located at the heat exchanger on pipeline, reduction valve, mass flow controller (10), wherein,
Described heat exchanger is used for carrying out heat interchange to regulate temperature to described working gas;
Described reduction valve is used for regulating the supply gas pressure of described working gas;
Described mass flow controller (10) is for regulating the flow of described working gas.
2. gas supply device according to claim 1, is characterized in that,
Described air feed pilot piping also comprises: be located at the filtrator (7) on pipeline, controls for carrying out filtration to the granularity of described working gas.
3. gas supply device according to claim 1, is characterized in that,
Described air feed pilot piping also comprises: be located at the purifier (11) on pipeline, controls for carrying out purification to the purity of described working gas.
4. gas supply device according to claim 1, is characterized in that,
Described air feed pilot piping also comprises: be located at the blowdown valve (12) on pipeline, for providing overvoltage safety protection to control to described working gas.
5. gas supply device according to claim 1, is characterized in that,
Described air feed pilot piping also comprises: pressure transducer, is located on the pipeline of the outlet side of described reduction valve, for measuring the force value after described reduction valve regulates, to control described reduction valve according to described force value.
6. gas supply device according to claim 5, is characterized in that,
Described reduction valve comprises one-level pressure relief valve (5) and second depressurized valve (8), and the outlet side of described one-level pressure relief valve (5) is provided with the first pressure transducer (6), and the outlet side of described second depressurized valve (8) is provided with the second pressure transducer (9).
7. gas supply device according to claim 1, is characterized in that,
Described heat exchanger comprises primary heat exchanger (3) and secondary heat exchanger (13), wherein, described primary heat exchanger (3) is for carrying out heat interchange with coarse adjustment temperature to described working gas, and described secondary heat exchanger (13) is for carrying out heat interchange with meticulous adjustment temperature to the working gas after described primary heat exchanger (3) adjustment.
8., according to the arbitrary described gas supply device of claim 1 to 7, it is characterized in that,
Described air feed pilot piping comprises the primary heat exchanger (3), diaphragm valve (4), one-level pressure relief valve (5), the first pressure transducer (6), filtrator (7), second depressurized valve (8), the second pressure transducer (9), mass flow controller (10), purifier (11), blowdown valve (12), the secondary heat exchanger (13) that connect successively, wherein
Described primary heat exchanger (3) is communicated with described source of the gas (2) and described diaphragm valve (4), for carrying out heat interchange with coarse adjustment temperature to described working gas;
Described diaphragm valve (4) is for controlling the working gas supply through primary heat exchange;
Described one-level pressure relief valve (5) is for carrying out coarse adjustment to the supply gas pressure of described working gas;
Described first pressure transducer (6) is for measuring the pressure after described one-level pressure relief valve (5) adjustment;
Described filtrator (7) controls for carrying out filtration to the granularity of described working gas;
Described second depressurized valve (8) is for carrying out meticulous adjustment to the supply gas pressure of described working gas;
Described second pressure transducer (9) is for measuring the pressure after described second depressurized valve (8) adjustment;
Described mass flow controller (10) is for regulating the flow of described working gas;
Described purifier (11) controls for carrying out purification to the purity of described working gas;
Described blowdown valve (12) is for providing overvoltage safety protection to control to described working gas;
The internal chamber of object lens body (1) described in the outlet of described secondary heat exchanger (13), for carrying out heat interchange with meticulous adjustment temperature to described working gas.
9. a photoetching projection objective lens, is characterized in that, comprises object lens body (1), the gas supply device as described in the inner space of described object lens body (1) is as arbitrary in claim 1 to 8.
10. photoetching projection objective lens according to claim 9, is characterized in that,
The inner chamber of described object lens body (1) is provided with gas outlet, and described gas outlet connects restrictor (14), under the prerequisite of working gas environment ensureing described object lens body (1) inner chamber, carries out constraint control air consumption.
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| CN201510600397.2A CN105137719B (en) | 2015-09-21 | 2015-09-21 | Gas supply device and the photoetching projection objective lens with it |
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| CN201510600397.2A CN105137719B (en) | 2015-09-21 | 2015-09-21 | Gas supply device and the photoetching projection objective lens with it |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997150A (en) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | It is a kind of to reduce the method and its application of lithographic objective pressure-sensitivity |
| CN107907960A (en) * | 2017-12-08 | 2018-04-13 | 长春国科精密光学技术有限公司 | A kind of optical system and its cooling device |
| CN108107681A (en) * | 2016-11-25 | 2018-06-01 | 中国科学院长春光学精密机械与物理研究所 | A kind of photoetching projection objective lens cavity precision monitoring device |
| CN111624731A (en) * | 2019-02-28 | 2020-09-04 | 上海微电子装备（集团）股份有限公司 | Objective lens device |
| CN111830791A (en) * | 2019-04-18 | 2020-10-27 | 佳能株式会社 | Stage apparatus, lithographic apparatus, and article manufacturing method |
| CN111965950A (en) * | 2020-08-25 | 2020-11-20 | 中国科学院微电子研究所 | Dynamic gas isolation device |
| CN113267963A (en) * | 2020-05-07 | 2021-08-17 | 台湾积体电路制造股份有限公司 | System and method for performing extreme ultraviolet lithography process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100140514A1 (en) * | 2007-08-31 | 2010-06-10 | Cymer, Inc. | Gas management system for a laser-produced-plasma EUV light source |
| CN102893217A (en) * | 2010-05-18 | 2013-01-23 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN203191239U (en) * | 2013-04-19 | 2013-09-11 | 眉山麦克在线设备有限公司 | Online analyzing and pretreating system for outlet samples of carbonyl reactor |
| CN203925950U (en) * | 2014-05-08 | 2014-11-05 | 安方高科电磁安全技术(北京)有限公司 | A kind of air-channel system |
| CN104317167A (en) * | 2014-10-27 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Gaseous environment acquisition control system for lithography projection lens internal chamber |
| CN104316104A (en) * | 2014-09-28 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Photolithography projection objective lens internal chamber high-precision gas measuring device |
-
2015
- 2015-09-21 CN CN201510600397.2A patent/CN105137719B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100140514A1 (en) * | 2007-08-31 | 2010-06-10 | Cymer, Inc. | Gas management system for a laser-produced-plasma EUV light source |
| CN102893217A (en) * | 2010-05-18 | 2013-01-23 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN203191239U (en) * | 2013-04-19 | 2013-09-11 | 眉山麦克在线设备有限公司 | Online analyzing and pretreating system for outlet samples of carbonyl reactor |
| CN203925950U (en) * | 2014-05-08 | 2014-11-05 | 安方高科电磁安全技术(北京)有限公司 | A kind of air-channel system |
| CN104316104A (en) * | 2014-09-28 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Photolithography projection objective lens internal chamber high-precision gas measuring device |
| CN104317167A (en) * | 2014-10-27 | 2015-01-28 | 中国科学院长春光学精密机械与物理研究所 | Gaseous environment acquisition control system for lithography projection lens internal chamber |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997150A (en) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | It is a kind of to reduce the method and its application of lithographic objective pressure-sensitivity |
| CN106997150B (en) * | 2016-01-22 | 2018-10-16 | 上海微电子装备（集团）股份有限公司 | A kind of method and its application reducing lithographic objective pressure-sensitivity |
| CN108107681A (en) * | 2016-11-25 | 2018-06-01 | 中国科学院长春光学精密机械与物理研究所 | A kind of photoetching projection objective lens cavity precision monitoring device |
| CN107907960A (en) * | 2017-12-08 | 2018-04-13 | 长春国科精密光学技术有限公司 | A kind of optical system and its cooling device |
| CN111624731A (en) * | 2019-02-28 | 2020-09-04 | 上海微电子装备（集团）股份有限公司 | Objective lens device |
| CN111624731B (en) * | 2019-02-28 | 2021-12-10 | 上海微电子装备（集团）股份有限公司 | Objective lens device |
| CN111830791A (en) * | 2019-04-18 | 2020-10-27 | 佳能株式会社 | Stage apparatus, lithographic apparatus, and article manufacturing method |
| CN111830791B (en) * | 2019-04-18 | 2024-03-19 | 佳能株式会社 | Stage device, lithographic apparatus, and article manufacturing method |
| CN113267963A (en) * | 2020-05-07 | 2021-08-17 | 台湾积体电路制造股份有限公司 | System and method for performing extreme ultraviolet lithography process |
| CN111965950A (en) * | 2020-08-25 | 2020-11-20 | 中国科学院微电子研究所 | Dynamic gas isolation device |
| CN111965950B (en) * | 2020-08-25 | 2024-01-19 | 中国科学院微电子研究所 | Dynamic gas isolation device |
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