CN105127054B - 芯片组装机的点胶装置 - Google Patents
芯片组装机的点胶装置 Download PDFInfo
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- CN105127054B CN105127054B CN201510653199.2A CN201510653199A CN105127054B CN 105127054 B CN105127054 B CN 105127054B CN 201510653199 A CN201510653199 A CN 201510653199A CN 105127054 B CN105127054 B CN 105127054B
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CN201510653199.2A CN105127054B (zh) | 2015-10-12 | 2015-10-12 | 芯片组装机的点胶装置 |
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CN201510653199.2A CN105127054B (zh) | 2015-10-12 | 2015-10-12 | 芯片组装机的点胶装置 |
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CN105127054A CN105127054A (zh) | 2015-12-09 |
CN105127054B true CN105127054B (zh) | 2017-09-01 |
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Families Citing this family (2)
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CN108480141B (zh) * | 2018-06-01 | 2024-04-02 | 岑科科技(深圳)集团有限公司 | 一种高效的电感侧面涂装式点胶机构 |
CN109896276A (zh) * | 2019-03-29 | 2019-06-18 | 昆山沃得福自动化设备有限公司 | Ic烧制设备中的运载系统 |
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CN201375950Y (zh) * | 2008-11-25 | 2010-01-06 | 上海航天精密机械研究所 | 一种化铣保护胶涂覆装置 |
CN101811110B (zh) * | 2010-03-01 | 2011-12-14 | 王燕 | 一种螺丝打胶机 |
US8997685B2 (en) * | 2012-08-07 | 2015-04-07 | Erdman Automation Corporation | Single axis applicator |
CN202877040U (zh) * | 2012-10-11 | 2013-04-17 | 信华精机有限公司 | 一种桌上型s导线自动涂胶、硬化机 |
CN205056386U (zh) * | 2015-10-12 | 2016-03-02 | 苏州达恩克精密机械有限公司 | 芯片组装机的点胶装置 |
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Effective date of registration: 20181228 Address after: Room 107, Di Shang Science and Technology House, West District, Chang Xincun, Jizhou District, Tianjin 301900 Patentee after: Tianjin ocean Hangzhou Science and Technology Co., Ltd. Address before: 215400 101, room 3, 10 Datong Road, high tech Zone, Suzhou, Jiangsu 1001 Patentee before: SUZHOU DAENKE PRECISION MACHINERY CO., LTD. |
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Effective date of registration: 20190520 Address after: 215000 No. 22 Yaonan Road, Hengjing Street, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: SUZHOU NEW STAR PRECISION MECHANISM CO., LTD. Address before: Room 107, Di Shang Science and Technology House, West District, Chang Xincun, Jizhou District, Tianjin 301900 Patentee before: Tianjin ocean Hangzhou Science and Technology Co., Ltd. |