CN105122438A - 基板检测系统及基板检测方法 - Google Patents

基板检测系统及基板检测方法 Download PDF

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Publication number
CN105122438A
CN105122438A CN201380075577.2A CN201380075577A CN105122438A CN 105122438 A CN105122438 A CN 105122438A CN 201380075577 A CN201380075577 A CN 201380075577A CN 105122438 A CN105122438 A CN 105122438A
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CN
China
Prior art keywords
substrate
mounting surface
surface faces
image
described substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380075577.2A
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English (en)
Chinese (zh)
Inventor
上田雅弘
三科健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of CN105122438A publication Critical patent/CN105122438A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201380075577.2A 2013-04-18 2013-04-18 基板检测系统及基板检测方法 Pending CN105122438A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/061489 WO2014170986A1 (ja) 2013-04-18 2013-04-18 基板検出システム及び基板検出方法

Publications (1)

Publication Number Publication Date
CN105122438A true CN105122438A (zh) 2015-12-02

Family

ID=51730956

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380075577.2A Pending CN105122438A (zh) 2013-04-18 2013-04-18 基板检测系统及基板检测方法

Country Status (3)

Country Link
JP (1) JP5987976B2 (ja)
CN (1) CN105122438A (ja)
WO (1) WO2014170986A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101836136B1 (ko) * 2016-09-01 2018-04-19 (주)시그마에프에이 관통홀 중심측정 유닛 및 이를 이용한 검사장치

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332388A (ja) * 2002-05-16 2003-11-21 Matsushita Electric Ind Co Ltd ワークの位置決め装置およびワークの下受け方法
US20050115830A1 (en) * 2003-10-15 2005-06-02 Anelva Corporation Film forming apparatus
CN1759478A (zh) * 2003-03-11 2006-04-12 应用材料有限公司 用于校准晶片运送机器人的视觉系统和方法
CN101312137A (zh) * 2007-05-22 2008-11-26 松下电器产业株式会社 电子元件安装系统和电子元件安装方法
JP2009054823A (ja) * 2007-08-28 2009-03-12 Panasonic Corp 部品実装装置及び部品実装装置の部品回収方法
CN101579967A (zh) * 2008-05-16 2009-11-18 精工爱普生株式会社 被记录件的有无检测系统、被记录件的有无检测方法及记录装置
JP2011061023A (ja) * 2009-09-10 2011-03-24 Kaneka Corp 基板保持部材及び薄膜の製造方法
CN102131351A (zh) * 2010-01-20 2011-07-20 株式会社日立高新技术 处理装置或acf粘贴状态检查方法或基板模块组装线
CN103000553A (zh) * 2007-08-15 2013-03-27 株式会社尼康 定位装置、贴合装置、层叠基板制造装置、曝光装置及定位方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6411683A (en) * 1987-07-03 1989-01-17 Iseki Agricult Mach Fruit selecting conveyor device
JPH0438405A (ja) * 1990-06-04 1992-02-07 Fujitsu Ltd トレイ上の透明部材認識方法
JPH04305950A (ja) * 1991-04-02 1992-10-28 Tokyo Electron Yamanashi Kk 半導体ウエハの測定方法
JP5538291B2 (ja) * 2011-04-13 2014-07-02 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332388A (ja) * 2002-05-16 2003-11-21 Matsushita Electric Ind Co Ltd ワークの位置決め装置およびワークの下受け方法
CN1759478A (zh) * 2003-03-11 2006-04-12 应用材料有限公司 用于校准晶片运送机器人的视觉系统和方法
US20050115830A1 (en) * 2003-10-15 2005-06-02 Anelva Corporation Film forming apparatus
CN101312137A (zh) * 2007-05-22 2008-11-26 松下电器产业株式会社 电子元件安装系统和电子元件安装方法
CN103000553A (zh) * 2007-08-15 2013-03-27 株式会社尼康 定位装置、贴合装置、层叠基板制造装置、曝光装置及定位方法
JP2009054823A (ja) * 2007-08-28 2009-03-12 Panasonic Corp 部品実装装置及び部品実装装置の部品回収方法
CN101579967A (zh) * 2008-05-16 2009-11-18 精工爱普生株式会社 被记录件的有无检测系统、被记录件的有无检测方法及记录装置
JP2011061023A (ja) * 2009-09-10 2011-03-24 Kaneka Corp 基板保持部材及び薄膜の製造方法
CN102131351A (zh) * 2010-01-20 2011-07-20 株式会社日立高新技术 处理装置或acf粘贴状态检查方法或基板模块组装线

Also Published As

Publication number Publication date
WO2014170986A1 (ja) 2014-10-23
JP5987976B2 (ja) 2016-09-07
JPWO2014170986A1 (ja) 2017-02-16

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