CN105101681A - HDI board manufacturing technology capable of improving blind hole cushion release - Google Patents
HDI board manufacturing technology capable of improving blind hole cushion release Download PDFInfo
- Publication number
- CN105101681A CN105101681A CN201510434101.4A CN201510434101A CN105101681A CN 105101681 A CN105101681 A CN 105101681A CN 201510434101 A CN201510434101 A CN 201510434101A CN 105101681 A CN105101681 A CN 105101681A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- copper
- pad
- belt sanding
- manufacture craft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to the field of circuit board processing, and particularly relates to an HDI board manufacturing technology capable of improving blind hole cushion release. Controllability of belt sanding amount is realized by optimizing belt sanding parameters, the blind hole bottom is avoided from being combined with an electroplated layer critical interface, and the belt sanding efficiency after an electroplating process is improved; the copper thickness of a blind hole orifice is thinned through chemical copper reduction, the tensile stress for the blind hole bottom during sanding is reduced, and the risk of cushion release caused by microcracks formed at the blind hole bottom is reduced; the controllability of belt sanding amount is realized, the copper is reduced in a chemical copper reduction manner firstly before film withdrawl, the tensile stress for the blind hole bottom during sanding can be reduced, the formation of the microcracks at the blind hole bottom is avoided, and the risks of blind hole microcracks and cushion release can be reduced; the problems of microcracks and cushion release for an HDI board blind hole are solved; the cost is reduced, the success rate is improved, the consumption of materials is reduced, the ideas of energy conservation and environmental protection are met, and the HDI board manufacturing technology has great economic value and market prospect.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to a kind ofly improve the HDI plate manufacture craft that blind hole takes off pad.
Background technology
At present, in prior art, for the filling perforation plating HDI plate having filling holes with resin flow process, all need to carry out belt sanding after tree consent flow process, need polish and just resin can be removed clean 3 times.In rear operation, if walk a plating flow process to this type of plate, due to many factors such as filling perforation parameters, copper thick normal meeting in aperture, higher than table copper, even exceedes dry film, so adopt the way of mechanical grinding to be removed by unnecessary copper.
But there is following risk in this flow process: for common HDI plate, the thickness requirement of plate electric layer is 6-8 μm, this type of plate carries out belt sanding after filling holes with resin, polishing amount is also generally at 6-8 μm, and polishing number of times is wayward at 3 times, and remaining plate electric layer after causing belt sanding is 1-2um, after rear operation pre-treatment microetch, remaining copper layer thickness will be less than 1um, and this has impact to the adhesion of filling perforation copper electroplating layer, easily cause the generation of micro-crack.After some plating filling perforation, remove dry film, if blind hole aperture place copper is thick exceed table copper certain altitude (close to dry film 40 μm or higher), during nog plate, the part exceeded can form shearing force with abrasive band, this shearing force acts on electro-coppering in hole and forms tension stress to blind via bottom junction, causes mechanical damage, leave quality hidden danger to binding site.The raised area is more, and larger to the stress of bottom during nog plate, if tension stress is greater than the adhesion of electro-coppering and end copper, blind hole is pulled up, and forms the even de-pad of micro-crack.Therefore, in existing procedure, nog plate operation causes blind via bottom micro-crack and takes off the very risky of pad.
Summary of the invention
For this reason, technical problem to be solved by this invention is to overcome the very risky technical bottleneck that nog plate operation in prior art causes blind via bottom micro-crack and de-pad, thus provides a kind of adhesion of blind via bottom and electrodeposited coating when improving a some plating; Realize belt sanding amount controlled, avoid the formation of blind via bottom micro-crack, the risk of blind hole micro-crack and de-pad can be reduced simultaneously; Improve HDI board blind hole micro-crack, de-pad problem; Cost is low, improves success rate, decreases the consume of material, meet the HDI plate manufacture craft of the theory of energy-conserving and environment-protective.
For solving the problems of the technologies described above, of the present invention disclosing a kind ofly improves the HDI plate manufacture craft that blind hole takes off pad, and wherein, described process sequence comprises first time belt sanding, chemistry subtracts copper, move back film step, second time belt sanding.
Preferably, described improvement blind hole takes off the HDI plate manufacture craft of pad, wherein, described first time belt sanding and second time belt sanding all positive and negative has been carried out to HDI plate and to have polished twice grinding process.
Preferably, described improvement blind hole takes off the HDI plate manufacture craft of pad, and wherein, described chemistry subtracts in copper step, subtracts the plated hole mouth copper post height < 20 μm after copper and retreats film.
Preferably, described improvement blind hole takes off the HDI plate manufacture craft of pad, wherein, in described belt sanding, after polishing residue plate electric layer thick >=2 μm or≤0 μm.
More preferred, described improvement blind hole takes off the HDI plate manufacture craft of pad, wherein, first time belt sanding and the parameter of second time belt sanding be: with 600 or 800# sand paper, the transfer rate of 3-3.5m/min, 1-1.2kw power to polish tow sides, often polishing, once to subtract copper amount be 1.5-3.8 μm.
Further, described a kind ofly improve the HDI plate manufacture craft that blind hole takes off pad, wherein, polishing parameter is: the transfer rate of 600# sand paper, 3.5m/min, the power of 1.2kw.
Further, described improvement blind hole takes off the HDI plate manufacture craft of pad, wherein, before described first time belt sanding, also comprise sawing sheet successively, inner layer exposure, pressing, internal layer boring, internal layer sink copper, inner plating electricity, internal layer plated hole figure, plated hole, filling holes with resin.
Further, described improvement blind hole takes off the HDI plate manufacture craft of pad, wherein, after described first time belt sanding, before chemistry subtracts copper step, also comprise inner layer exposure, pressing, outer boring, outer heavy copper, electric plating of whole board, outer plated hole figure, filling perforation plating successively.
More further, described improvement blind hole takes off the HDI plate manufacture craft of pad, wherein, after described second time abrasive belt grinding, also comprises outer graphics, graphic plating, outer etching, silk-screen, welding resistance, printed character, heavy nickel gold.
Technique scheme of the present invention has the following advantages compared to existing technology: by optimizing belt sanding parameter, achieving belt sanding amount controlled, avoiding blind via bottom to combine with electrodeposited coating critical surface, improves and to plate belt sanding efficiency after flow process; Subtract copper thinning blind hole aperture copper by chemistry thick, the tension stress that during reduction nog plate, blind via bottom is subject to, reduce the risk that blind via bottom formation micro-crack causes de-pad; Realize belt sanding amount controlled, first subtract copper mode with chemistry and subtract copper before moving back film, the tension stress that when can reduce nog plate, blind via bottom is subject to, avoids the formation of blind via bottom micro-crack, can reduce the risk of blind hole micro-crack and de-pad simultaneously; Improve HDI board blind hole micro-crack, de-pad problem; Change polishing parameter, reduced polishing number of times, by original three polishings, be improved as twice positive and negative polishing.Both ensure that resin polishing was clean, also control and subtract copper amount, cost is low, improves success rate, decreases the consume of material, meet the theory of energy-conserving and environment-protective, have great economic worth and market prospects.
Embodiment
Embodiment
Present embodiment discloses and a kind ofly improve the HDI plate manufacture craft that blind hole takes off pad, concrete technology step is as follows:
S1: output central layer by jigsaw size;
S2: complete internal layer circuit exposure with 6 lattice exposure guide rules, development after etching goes out line pattern;
S3: check opening the defects such as short circuit and making correction of internal layer;
S4: pressing: carry out brown, brown speed, according to the thick brown of end copper copper, then selects suitable lamination to carry out pressing according to plate Tg, and outer copper foil follow-up customer requirement assembled watch copper thickness selects Copper Foil;
S5: according to thickness of slab, utilizes borehole data to carry out the processing of internal layer laser drill;
S6: carry out internal layer and sink copper, wherein backlight tests 9.5 grades;
S7: carry out inner plating plating, controls in 6-8um scope;
S8: complete outer-layer circuit exposure with 6 lattice exposure guide rules, and develop, complete internal layer plated hole figure;
S9: with suitable current parameters and electroplating time, fill and lead up process to blind hole, completes filling perforation plating;
S10: plated hole: to the development further copper facing in hole out, hole copper single-point meets the demands with table copper smallest point;
S11: filling holes with resin: carry out resin filling through hole after moving back film, can filling holes with resin after instrument connection copper is qualified;
S12: first time abrasive belt grinding: with the parameter positive and negative polishing twice after optimizing, save the polishing time, remain that total copper is thick meets customer requirement, ensure that resin polishing is clean, remain after needing to guarantee to polish simultaneously plate electric layer thick >=2 μm or≤0 μm;
S13: complete internal layer circuit exposure with 6 lattice exposure guide rules, development after etching goes out line pattern
S14: check opening the defects such as short circuit and making correction of internal layer
S15: brown speed, according to the thick brown of end copper copper, selects suitable lamination to carry out pressing according to plate Tg, outer copper foil follow-up customer requirement assembled watch copper thickness selects Copper Foil;
S16: outer boring: laser drill, according to thickness of slab, utilizes borehole data to carry out Drilling operation;
S17: outer heavy copper: wherein, backlight tests 9.5 grades;
S18: electric plating of whole board: hole copper controls in 7-12um scope;
S19: outer plated hole figure: complete outer-layer circuit exposure with 6 lattice exposure guide rules, and develop;
S20: filling perforation is electroplated: with suitable current parameters and electroplating time, fill and lead up process to blind hole;
S21: chemistry subtracts copper operation, and plated hole mouth copper post height < 20 μm retreats film;
S22: with the parameter positive and negative polishing twice after optimizing, complete belt sanding operation, save the polishing time, to ensure after polishing residue plate electric layer thick >=2 μm or≤0 μm;
S23: complete outer-layer circuit exposure with 6 lattice exposure guide rules, and develop, completes outer graphics operation;
S24: require to electroplate to hole, table copper, complete graphic plating operation;
S25: alkali etching, etching speed etches by end copper, controls etching live width, completes outer etching;
S26: the test of low resistance four line is carried out, to judge whether blind hole exists the defect such as micro-crack, cavity to HDI board blind hole network;
S27: check and outer fieldly open the defects such as short circuit and make correction;
S28: solder mask is coated in uniformly on the qualified pcb board of pre-treatment, use little wild exposure machine exposure, welding resistance film harmomegathus controls at +/-0.01mm, completes silk-screen welding resistance;
S29: adopt white reticulated printing character and image;
S30: control gold, nickel layer thickness, carries out the operation of heavy nickel gold.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (9)
1. improve the HDI plate manufacture craft that blind hole takes off pad, it is characterized in that, described process sequence comprise first time belt sanding, chemistry subtract copper, move back film step, second time belt sanding.
2. improve the HDI plate manufacture craft that blind hole takes off pad as claimed in claim 1, it is characterized in that, described first time belt sanding and second time belt sanding all positive and negative has been carried out to HDI plate and to have polished twice grinding process.
3. improve the HDI plate manufacture craft that blind hole takes off pad as claimed in claim 1, it is characterized in that, described chemistry subtracts in copper step, subtracts the plated hole mouth copper post height < 20 μm after copper and retreats film.
4. improve the HDI plate manufacture craft that blind hole takes off pad as claimed in claim 1, it is characterized in that, in described belt sanding, after polishing residue plate electric layer thick >=2 μm or≤0 μm.
5. improve the HDI plate manufacture craft that blind hole takes off pad as claimed in claim 1, it is characterized in that, first time belt sanding and the parameter of second time belt sanding be: with 600 or 800# sand paper, the transfer rate of 3-3.5m/min, 1-1.2kw power to polish tow sides, often polishing, once to subtract copper amount be 1.5-3.8 μm.
6. a kind ofly improve the HDI plate manufacture craft that blind hole takes off pad as claimed in claim 5, it is characterized in that, polishing parameter is: the transfer rate of 600# sand paper, 3.5m/min, the power of 1.2kw.
7. the improvement blind hole as described in any one of claim 1-6 takes off the HDI plate manufacture craft of pad, it is characterized in that, before described first time belt sanding, also comprise sawing sheet successively, inner layer exposure, pressing, internal layer boring, internal layer sink copper, inner plating electricity, internal layer plated hole figure, plated hole, filling holes with resin.
8. the improvement blind hole as described in any one of claim 1-6 takes off the HDI plate manufacture craft of pad, it is characterized in that, after described first time belt sanding, before chemistry subtracts copper step, also comprise inner layer exposure, pressing, outer boring, outer heavy copper, electric plating of whole board, outer plated hole figure, filling perforation plating successively.
9. the improvement blind hole as described in any one of claim 1-6 takes off the HDI plate manufacture craft of pad, it is characterized in that, after described second time abrasive belt grinding, also comprises outer graphics, graphic plating, outer etching, silk-screen, welding resistance, printed character, heavy nickel gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510434101.4A CN105101681B (en) | 2015-07-22 | 2015-07-22 | A kind of HDI plate manufacture crafts for improving the de- pad of blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510434101.4A CN105101681B (en) | 2015-07-22 | 2015-07-22 | A kind of HDI plate manufacture crafts for improving the de- pad of blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101681A true CN105101681A (en) | 2015-11-25 |
| CN105101681B CN105101681B (en) | 2018-03-06 |
Family
ID=54580882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510434101.4A Active CN105101681B (en) | 2015-07-22 | 2015-07-22 | A kind of HDI plate manufacture crafts for improving the de- pad of blind hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101681B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211560A (en) * | 2016-08-16 | 2016-12-07 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN111741614A (en) * | 2020-06-05 | 2020-10-02 | 广州美维电子有限公司 | Fine circuit PCB processing method |
| CN112165770A (en) * | 2020-09-17 | 2021-01-01 | 胜宏科技（惠州）股份有限公司 | Method for improving large blind hole recess |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951735A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Coppering and porefilling process for circuit board |
| US20130075140A1 (en) * | 2011-09-28 | 2013-03-28 | Ibiden Co., Ltd. | Printed wiring board |
| JP2013138124A (en) * | 2011-12-28 | 2013-07-11 | Taiyo Ink Mfg Ltd | Multilayer printed board manufacturing method, multilayer printed board manufactured by the manufacturing method, and curable resin composition used in the manufacturing method |
| CN103796449A (en) * | 2014-01-24 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing high-thickness-to-diameter-ratio circuit board plated filled via hole |
-
2015
- 2015-07-22 CN CN201510434101.4A patent/CN105101681B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951735A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Coppering and porefilling process for circuit board |
| US20130075140A1 (en) * | 2011-09-28 | 2013-03-28 | Ibiden Co., Ltd. | Printed wiring board |
| JP2013138124A (en) * | 2011-12-28 | 2013-07-11 | Taiyo Ink Mfg Ltd | Multilayer printed board manufacturing method, multilayer printed board manufactured by the manufacturing method, and curable resin composition used in the manufacturing method |
| CN103796449A (en) * | 2014-01-24 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing high-thickness-to-diameter-ratio circuit board plated filled via hole |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211560A (en) * | 2016-08-16 | 2016-12-07 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN106211560B (en) * | 2016-08-16 | 2019-01-25 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN111741614A (en) * | 2020-06-05 | 2020-10-02 | 广州美维电子有限公司 | Fine circuit PCB processing method |
| CN111741614B (en) * | 2020-06-05 | 2021-12-17 | 广州美维电子有限公司 | Fine circuit PCB processing method |
| CN112165770A (en) * | 2020-09-17 | 2021-01-01 | 胜宏科技（惠州）股份有限公司 | Method for improving large blind hole recess |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105101681B (en) | 2018-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102651946B (en) | Manufacturing process for step circuit of PCB (Printed Circuit Board) | |
| CN106973507B (en) | A kind of production method of filling holes with resin wiring board | |
| CN102883558B (en) | Manufacturing method of single plating hole copper | |
| CN101998768B (en) | Novel manufacturing method for back drilling of PCB (Printed Circuit Board) | |
| CN104994688B (en) | A kind of preparation method for the PCB for collecting a variety of surface treatments | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN104363704B (en) | A kind of thick hole copper PCB preparation method | |
| CN105101681A (en) | HDI board manufacturing technology capable of improving blind hole cushion release | |
| CN101951735A (en) | Coppering and porefilling process for circuit board | |
| CN110248473B (en) | Method for solving problem of small pressing hole of VIA-IN-PAD resin hole-plugged PCB (printed circuit board) | |
| CN101841972A (en) | Method for manufacturing high-AR and fine-line PCB | |
| CN103731992B (en) | Reduce the method that the gold-plated region of circuit board produces pit | |
| JP2005322868A (en) | Method for electrolytic gold plating of printed circuit board | |
| CN109275268A (en) | A kind of PCB back drill production method being less than 0.15mm for medium thickness | |
| CN103188875A (en) | Super-thick copper diagram manufacturing method and printed circuit board (PCB) provided with super-thick copper diagram | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| WO2020220681A1 (en) | Method for manufacturing printed circuit board for power source of civil high-speed transmission unmanned aerial vehicle | |
| CN107241867B (en) | Occurs the process of plating folder film when a kind of reduction alkali etching | |
| CN104812179B (en) | The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) | |
| CN103281870A (en) | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling | |
| CN106231801A (en) | For the technique making pottery plate HDI plate | |
| CN108449883A (en) | A kind of surface treatment is the production method for the wiring board that electric nickel gold adds part electricity gold | |
| CN107222975B (en) | A kind of gradation etches the pattern-producing method of thick metal plated micro-strip plate | |
| CN105120600A (en) | Nickel surface processing method | |
| CN205902191U (en) | Circuit board with sensitization printing ink layer of againsting corrosion |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |