CN105081617A - Aluminium soldering paste and preparation method and purpose - Google Patents
Aluminium soldering paste and preparation method and purpose Download PDFInfo
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- CN105081617A CN105081617A CN201410188470.5A CN201410188470A CN105081617A CN 105081617 A CN105081617 A CN 105081617A CN 201410188470 A CN201410188470 A CN 201410188470A CN 105081617 A CN105081617 A CN 105081617A
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- aluminium
- fluoride
- aluminium soldering
- soldering
- soldering paste
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Abstract
An aluminium soldering paste is characterized by comprising the following components by weight percent: 50-80% of SnCl2, 3-10% of fluoride, and 15-40% of organic solvent; the fluoride refers to aluminium fluoride, fluorination zinc or potassium fluoride, or a mixture of the side three; the organic solvent is alcohols organic solvent, and refers to methanol, ethanol, or propanol, or a mixture of the said three. The aluminium soldering paste is a reaction type soldering paste containing stannous chloride; the stannous chloride can make contact with aluminium metal so as to generate tin metal, and aluminium metal surface can be activated to form an alloy, thus completing welding; the aluminium soldering paste is suitable for aluminium soldering; in usage, solder is not needed; the aluminium soldering paste can be coated on an aluminium piece in a soldering process, thus bringing convenience for aluminium soldering operation.
Description
Technical field
The present invention relates to a kind of soldering paste, particularly a kind of aluminium soldering cream for aluminium soldering and preparation method thereof, purposes.
Background technology
Soldering be utilize fusing point lower than mother metal metal as solder, after heating, brazing filler metal melts, weldment is non-fusible, utilizes liquid solder to soak mother metal, fill play movement and with the counterdiffusion of mother metal phase, weldment is firmly linked together.According to the difference of solder fusing point, soldering is divided into solder and solder brazing.The solder fusing point of solder lower than 450 DEG C, strength of joint lower (being less than 70MPa), therefore solder be used for conducting electricity in electronics and food industry, the welding of airtight and watertight device, the most conventional as the soldering of solder using leypewter.The solder fusing point of solder brazing higher than 450 DEG C, strength of joint higher (being greater than 200MPa).
The flux used when brazing flux is soldering, its effect is the oxide removing solder and mother metal surface, and protects weldment and liquid solder in brazing process, avoid oxidation, improves the wetability of liquid solder butt-welding fitting.For in most of brazing process, need solder and brazing flux to use, this is that the operation of soldering brings some inconvenience simultaneously.
For the problem bringing operation constant when needing solder and brazing flux to use when solving soldering simultaneously, there is soldering paste.Soldering paste is a kind of uniform homogeneous blend, and by alloy welding powder, what pasty state solder flux and some additives mixed has certain viscosity and good thixotropic body of paste, and the appearance of soldering paste facilitates the welding of operating personnel to connector.In prior art, soldering paste is usually used in the welding to electronic devices and components, at normal temperatures, soldering paste can be bonded at commitment positions by the beginning of electronic devices and components, when being heated to uniform temperature, along with the volatilization of solvent and portions additive, the fusing of alloyed powder, make together with welded components and parts are interconnected at pad, cooling forms the permanent solder joint connected.Owing to being generally solder to electronic devices and components welding, its welding temperature is lower, and the fusing point of usual solder is lower than 450 DEG C, and therefore in prior art, the alloy welding powder of soldering paste is also soft solder, and this soldering paste is only applicable to solder, is not suitable for aluminium soldering.
Summary of the invention
The invention provides a kind of aluminium soldering cream, object solves prior art problem, and provide a kind of aluminium soldering cream being applicable to aluminium soldering, brazing flux and solder combine by this soldering paste, facilitate the operation of aluminium soldering.
The present invention deal with problems adopt technical scheme be:
A kind of aluminium soldering cream, comprises the component of following percentage by weight; SnCl
250% ~ 80%, fluoride 3 ~ 10%, organic solvent 15 ~ 40%.
Each constituent content is preferred: SnCl
260% ~ 75%, fluoride 5 ~ 8%, organic solvent 20 ~ 30%.
Described fluoride is selected from one or more the mixing in aluminum fluoride, zinc fluoride, potassium fluoride, sodium fluoride.
Described organic solvent is alcohol organic solvent.
Described organic solvent is selected from one or more the mixing in methyl alcohol, ethanol, propyl alcohol.
The preparation method of above-mentioned aluminium soldering cream, comprises the following steps; Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours.
The above-mentioned application of aluminium soldering cream in aluminium soldering.
Above-mentioned fluoride is as brazing flux, and SnCl
2in welding process, form metallic tin (Sn) with the metallic aluminium generation displacement reaction on aluminum products surface to be welded, metallic tin participates in aluminium soldering process as solder, realizes soldering.The surface tension that the generation of Sn also reduces melting brazing flux liquid helps melt liquid to sprawl.
Tinol of the present invention is not the soldering paste of traditional containing metal tin, and its operation principle neither link simply by the thawing of metallic tin and welded part.The composition that it contains is stannous chloride, is a kind of chlorination salt of tin.This soldering paste is a kind of soldering paste of response type, passes through SnCl
2the aluminum metal reaction of aluminum component generates tin metal, and activated metal surface forms alloy and completes welding.
Beneficial effect of the present invention: aluminium soldering cream of the present invention is a kind of response type soldering paste, is reacted by the stannous chloride contained and the aluminum metal touched and generates tin metal, and activate aluminum metal surface formation alloy and complete welding, be applicable to aluminium soldering.In use do not need solder, only soldering paste need be smeared on aluminum component and can carry out soldering, facilitate aluminium soldering operation.
Detailed description of the invention
The present invention is by SnCl
2, carry out fusion to other fluorides and corresponding organic solvent and make lotion.This lotion in use, SnCl wherein
2become branch, with the aluminium simple substance touched, following displacement reaction occurs: 3SnCl
2+ 2Al=3Sn+2AlCl
3↑ (gas)
The tin metal that displacement reaction generates becomes required solder.In course of reaction, soldering paste of the present invention is smeared at welded piece surface, directly contacts above-mentioned reaction occurs with aluminium simple substance.But because aluminium material surface often has the oxide layer of one deck densification under normal circumstances, hinder Sn
2+the contact of ion and aluminium simple substance, therefore at normal temperatures, SnCl
2can not directly and aluminum component react.But in brazing process, through heating, burning, organic matter volatilization or burning are totally, temperature rises to 200 degrees centigrade, especially after reaching brazing flux fusing point, now the oxide of aluminium material surface is exposed aluminium simple substance by dissolving, aluminium simple substance and the high activity Sn that dissociates
2+ion fully contacts and rapidly displacement reaction occurs, and generates metal Sn.Sn now participates in aluminium soldering as solder, and except the function of solder, the surface tension that the generation of Sn also reduces melting brazing flux liquid helps melt liquid to sprawl.
The preparation process of aluminium soldering paste of the present invention agent is, stannous chloride and above-mentioned fluoride is proportionally mixed and adds ball mill, and add alcohols solvent, carries out ball milling mixing 2 to 4 hours.
Below in conjunction with specific embodiment, the present invention is described in further details.
Embodiment 1
Component: SnCl
275kg, aluminum fluoride 5kg, methyl alcohol 20kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Embodiment 2
Component: SnCl
280kg, zinc fluoride 3kg, ethanol 17kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Embodiment 3
Component: SnCl
270kg, potassium fluoride 5kg, propyl alcohol 25kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Embodiment 4
Component: SnCl
265kg, sodium fluoride 5kg, methyl alcohol 15kg, ethanol 15kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Embodiment 5
Component: SnCl
260kg, aluminum fluoride 5kg, zinc fluoride 5kg, ethanol 30kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Embodiment 6
Component: SnCl
250kg, aluminum fluoride 2kg, zinc fluoride 3kg, sodium fluoride 5kg, methyl alcohol 10kg, ethanol 10kg, propyl alcohol 20kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Embodiment 7
Component: SnCl
277kg, aluminum fluoride 2kg, zinc fluoride 2kg, sodium fluoride 2kg, potassium fluoride 2kg, methyl alcohol 10kg, propyl alcohol 5kg.
Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours, obtain the agent of aluminium soldering paste.This aluminium soldering paste agent can exempt the interpolation of solder, can be used for aluminium soldering, facilitates the operation of aluminium soldering.
Claims (7)
1. an aluminium soldering cream, is characterized in that: the component comprising following percentage by weight; SnCl
250% ~ 80%, fluoride 3 ~ 10%, organic solvent 15 ~ 40%.
2. aluminium soldering cream as described in claim 1, is characterized in that: each constituent content is preferred: SnCl
260% ~ 75%, fluoride 5 ~ 8%, organic solvent 20 ~ 30%.
3. aluminium soldering cream as described in claim 1, is characterized in that: described fluoride is selected from one or more the mixing in aluminum fluoride, zinc fluoride, potassium fluoride, sodium fluoride.
4. aluminium soldering cream as described in claim 1, is characterized in that: described organic solvent is alcohol organic solvent.
5. aluminium soldering cream as described in claim 4, is characterized in that: described organic solvent is selected from one or more the mixing in methyl alcohol, ethanol, propyl alcohol.
6., as the preparation method of the aluminium soldering cream as described in arbitrary in claim 1 to 5, it is characterized in that: comprise the following steps; Stannous chloride and above-mentioned fluoride are proportionally mixed and adds ball mill, and add alcohols solvent, carry out ball milling mixing 2 to 4 hours.
7. as the application of aluminium soldering cream in aluminium soldering as described in arbitrary in claim 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410188470.5A CN105081617A (en) | 2014-05-06 | 2014-05-06 | Aluminium soldering paste and preparation method and purpose |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410188470.5A CN105081617A (en) | 2014-05-06 | 2014-05-06 | Aluminium soldering paste and preparation method and purpose |
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| CN105081617A true CN105081617A (en) | 2015-11-25 |
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| CN201410188470.5A Pending CN105081617A (en) | 2014-05-06 | 2014-05-06 | Aluminium soldering paste and preparation method and purpose |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113369618A (en) * | 2021-07-08 | 2021-09-10 | 烟台市固光焊接材料有限责任公司 | Brazing process of ultrathin liquid cooling plate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3988175A (en) * | 1974-08-23 | 1976-10-26 | Bethlehem Steel Corporation | Soldering flux and method |
| JPS61195797A (en) * | 1985-02-26 | 1986-08-30 | Mitsubishi Alum Co Ltd | Flux for brazing and brazing method |
| JPH05318177A (en) * | 1992-05-20 | 1993-12-03 | Showa Alum Corp | Flux for soldering aluminum casting material |
| CN1125167A (en) * | 1994-12-20 | 1996-06-26 | 罗启昌 | Method for cast aluminium braze-welding |
| CN101204762A (en) * | 2007-12-25 | 2008-06-25 | 昆山成利焊锡制造有限公司 | Al and Al alloy soft braze welding metal displaced type unleaded welding soldering flux |
| CN102922178A (en) * | 2012-11-01 | 2013-02-13 | 青岛英太克锡业科技有限公司 | No-cleaning liquid aluminum flux and preparation method thereof |
| CN103659054A (en) * | 2013-10-25 | 2014-03-26 | 天津大学 | Selffluxing brazing alloy suitable for brazing of thin aluminum plates and aluminum alloys and preparation method |
-
2014
- 2014-05-06 CN CN201410188470.5A patent/CN105081617A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3988175A (en) * | 1974-08-23 | 1976-10-26 | Bethlehem Steel Corporation | Soldering flux and method |
| JPS61195797A (en) * | 1985-02-26 | 1986-08-30 | Mitsubishi Alum Co Ltd | Flux for brazing and brazing method |
| JPH05318177A (en) * | 1992-05-20 | 1993-12-03 | Showa Alum Corp | Flux for soldering aluminum casting material |
| CN1125167A (en) * | 1994-12-20 | 1996-06-26 | 罗启昌 | Method for cast aluminium braze-welding |
| CN101204762A (en) * | 2007-12-25 | 2008-06-25 | 昆山成利焊锡制造有限公司 | Al and Al alloy soft braze welding metal displaced type unleaded welding soldering flux |
| CN102922178A (en) * | 2012-11-01 | 2013-02-13 | 青岛英太克锡业科技有限公司 | No-cleaning liquid aluminum flux and preparation method thereof |
| CN103659054A (en) * | 2013-10-25 | 2014-03-26 | 天津大学 | Selffluxing brazing alloy suitable for brazing of thin aluminum plates and aluminum alloys and preparation method |
Non-Patent Citations (1)
| Title |
|---|
| 《装备制造业节能减排技术手册》编辑委员会: "《装备制造业节能减排技术手册 上册》", 31 August 2013, 机械工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113369618A (en) * | 2021-07-08 | 2021-09-10 | 烟台市固光焊接材料有限责任公司 | Brazing process of ultrathin liquid cooling plate |
| CN113369618B (en) * | 2021-07-08 | 2022-09-09 | 烟台市固光焊接材料有限责任公司 | Brazing process of ultrathin liquid cooling plate |
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Application publication date: 20151125 |