CN105073660A - Method for producing flexible film - Google Patents

Method for producing flexible film Download PDF

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Publication number
CN105073660A
CN105073660A CN201480009734.4A CN201480009734A CN105073660A CN 105073660 A CN105073660 A CN 105073660A CN 201480009734 A CN201480009734 A CN 201480009734A CN 105073660 A CN105073660 A CN 105073660A
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CN
China
Prior art keywords
resin layer
groove
thin glass
mentioned
duplexer
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Pending
Application number
CN201480009734.4A
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Chinese (zh)
Inventor
村重毅
服部大辅
龟山忠幸
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Nitto Denko Corp
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Nitto Denko Corp
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Publication date
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Publication of CN105073660A publication Critical patent/CN105073660A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B32B2038/168—Removing solvent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/72—Density
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Nonlinear Science (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Mining & Mineral Resources (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)

Abstract

Provided is a method for producing a flexible film (a diced laminate) that has a smooth torn surface and does not undergo the breakage of a thin glass contained therein by cutting a laminate comprising the thin glass and a resin layer. The method for producing a flexible film according to the present invention comprises cutting a laminate which comprises a thin glass having a thickness of 100 miu or less and a resin layer arranged on one surface or both surfaces of the thin glass. The method comprises the steps of: forming a groove on the outer surface side of the resin layer; and cutting the laminate along the groove.

Description

The manufacture method of flexible thin film
Technical field
The present invention relates to the manufacture method of a kind of flexible thin film.More particularly, the present invention relates to a kind of manufacture method comprising the flexible thin film of thin glass.
Background technology
In recent years, in view of the development of image communication technology, the light weight slimming of flat-panel monitor (FPD: such as liquid crystal display device, organic EL display element) is developed.In the past, the substrate of display element adopted glass substrate.The transparency of glass substrate, solvent resistance, gas barrier property, excellent heat resistance.But when seeking the slimming of the glass material forming glass substrate, rise although flexible light-weighted while, shock-resistance becomes insufficient, produces the problem that process becomes difficulty.In order to promote the treatability of slim glass substrate, disclose a kind of glass substrate (such as with reference to patent documentation 1,2) being formed with resin layer at glass surface.
Glass substrate normally blocks as predetermined size uses according to purposes.As the method for blocking glass substrate, the method adopting cutter, the method etc. adopting laser can be listed.But, when using cutter to block glass substrate, there is the poor such problem of smoothness of truncation surface.In addition, when using laser for the glass substrate with resin layer, different with the processing temperature of glass owing to being suitable for resin, therefore, the illuminate condition that setting is suitable for both resin and glass becomes difficulty.Specifically, when being set to the illuminate condition that can block glass, resin layer burns and the smoothness of truncation surface reduces, and when being set to the illuminate condition of the degree that resin layer does not burn, existence cannot suitably be blocked glass, crack such problem.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 11-329715 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2001-113631 publication
Summary of the invention
the problem that invention will solve
Namely the present invention completes to solve above-mentioned problem in the past, its object is to provide a kind of cut off there is thin glass and resin layer duplexer, manufacture to have and level and smooth cut off face and inhibit the method for flexible thin film's duplexer of panelization () of thin glass breakage.
for the scheme of dealing with problems
It is the operation that the thin glass of less than 100 μm and the duplexer of resin layer that is configured in the one-sided of this thin glass or both sides cut off that the manufacture method of flexible thin film of the present invention comprises possessing thickness, wherein, the manufacture method of this flexible thin film comprises following operation: the operation arranging groove from the outside surface side of this resin layer; And the operation of this duplexer is cut off along this groove.
In preferred technical scheme, above-mentioned thin glass does not arrange groove.
In preferred technical scheme, the width of the resin layer outer surface of above-mentioned groove is 0.01mm ~ 5mm.
In preferred technical scheme, cutter or laser is utilized to form above-mentioned groove.
In preferred technical scheme, in above-mentioned duplexer, the total thickness of described resin layer is 0.3 ~ 4 with the ratio of the thickness of described thin glass.
the effect of invention
Adopt the present invention, utilize and the operation of groove is set from the outside surface side of the resin layer of duplexer and cuts off the operation of this duplexer along this groove, can manufacture to have and level and smooth cut off face and inhibit flexible thin film's duplexer of panelization () of thin glass breakage (such as crackle).
Accompanying drawing explanation
(a) of Fig. 1 is the general profile chart of the duplexer that the preferred embodiment of the present invention adopts.(b) of Fig. 1 is the general profile chart of the duplexer that another embodiment of the present invention adopts.
(a) of Fig. 2 is the general profile chart of the setting groove on the resin layer representing 1 embodiment of the present invention.(b) of Fig. 2 is the general profile chart of the setting groove on the resin layer representing another embodiment of the present invention.(c) of Fig. 2 is the general profile chart of the setting groove on the resin layer representing another embodiment of the invention.
Embodiment
A. duplexer
The manufacture method of flexible thin film of the present invention comprises the operation of cutting off duplexer.(a) of Fig. 1 is the general profile chart of this duplexer that the preferred embodiment of the present invention adopts.This duplexer 100 possesses thin glass 10 and is configured in the resin layer 11,11 ' of one-sided or both sides (being both sides in illustrated example) of thin glass 10.(b) of Fig. 1 is the general profile chart of this duplexer that another preferred implementation of the present invention adopts.This duplexer 101 is that thin glass 10 and resin layer 11,11 ' are laminated across adhesive linkage 12,12 '.
The total thickness of above-mentioned duplexer is preferably less than 160 μm, is more preferably less than 120 μm, is particularly preferably 50 μm ~ 120 μm.
The total thickness (d2) of above-mentioned resin layer is preferably 0.3 ~ 4 with the ratio (d2/d1) of the thickness (d1) of above-mentioned thin glass, is more preferably 0.5 ~ 2.1.As long as this scope, just can suitably adjust the stress produced in thin glass, thin glass can be strengthened fully, and can prevent resin layer from peeling off from thin glass and stably cutting off duplexer along the groove (seeing below) arranged on the resin layer.In addition, when above-mentioned duplexer possesses resin layer in the both sides of above-mentioned thin glass, " total thickness of resin layer " in this specification sheets refers to the meaning of the thickness sum of each resin layer.
A-1. thin glass
As long as above-mentioned thin glass tabular, just can adopt material suitable arbitrarily.Above-mentioned thin glass according to composition classification, such as, can list soda-lime glass, borate glass, aluminum oxide silicate glasses, silica glass etc.In addition, according to alkali compositional classification, non-alkali glass, glass with lower alkali content can be listed.The alkali metal component of above-mentioned thin glass (is such as Na 2o, K 2o, Li 2o) content is preferably less than 15 % by weight, is more preferably less than 10 % by weight.
The thickness of above-mentioned thin glass is preferably less than 100 μm, is more preferably 10 μm ~ 100 μm.
The density of above-mentioned thin glass is preferably 2.3g/cm 3~ 3.0g/cm 3, be more preferably 2.3g/cm 3~ 2.7g/cm 3.
The manufacturing process of above-mentioned thin glass can adopt any appropriate means.Say typically, by at the temperature of 1400 DEG C ~ 1600 DEG C by the mixture melting containing reductive agents such as defoamer and carbon such as the main raw material such as silicon-dioxide, aluminum oxide, saltcake, weisspiessglanzs, be configured as lamellar after carry out cooling to make above-mentioned thin glass.As the sheet moulding method of above-mentioned thin glass, such as, can list slot draw method, scorification, float glass process etc.Utilize these methods to be configured as the thin glass of tabular in order to thin plate or the smoothness improving surface and end, fluoric acid equal solvent also can be utilized as required to carry out chemical grinding.
Also easy bonding process can be implemented on the surface of above-mentioned thin glass.As long as implement easy bonding process, the bonding force between thin glass and resin layer just can be improved.As easy bonding process, such as, can list the contactless surface treatment such as corona treatment, Cement Composite Treated by Plasma, coupling processing and these combinations processed.
As the coupling agent that above-mentioned coupling processing adopts, such as, can list Ammonia coupling agent, epoxies coupling agent, isocyanates coupling agent, vinyl-based coupling agent, sulfydryl class coupling agent, (methyl) acryloyl-oxy base class coupling agent etc.When the resin forming resin layer contains ester bond, preferably use Ammonia coupling agent, epoxies coupling agent or isocyanates coupling agent.When the resin forming resin layer contains hydroxyl, preferably use epoxies coupling agent.Above-mentioned Ammonia coupling agent is preferably containing amino organoalkoxysilane or containing amino halogenated silanes.Be particularly preferably containing amino organoalkoxysilane.
A-2. resin layer
As the resin forming above-mentioned resin layer, preferably adopt thermoplastic resin.As this resin, such as, can list: polyether sulfone resin; Polycarbonate resin; Acrylic resin; The polyester resins such as polyethylene terephthalate resinoid, PEN resinoid; Polyolefin resin; The cycloolefin resinoids such as norbornene resin; Polyimide based resin; Polyamide-based resin; Polyamideimides resin; Polyarylester resinoid; Polysulfones resin; Polyetherimide resinoid etc.In addition, also can use redix, the resin of the bridging property such as urethane based resin, silicone based resin.
In 1 embodiment, above-mentioned resin layer contains the resin with the repeating unit represented with general expression (1).By containing such resin, can be formed with the excellent adhesion of above-mentioned thin glass and the also very excellent resin layer of toughness.This resin layer is difficult to when cutting off duplexer peel off from thin glass, can prevent the crackle produced on thin glass.
change 1
In formula (1), R 1the aryl of the displacement of carbon number 6 ~ 24 or non-displacement, the ring alkylidene group of the straight-chain of carbon number 1 ~ 8 or the alkylidene group of branch-like or carbon number 4 ~ 14 or Sauerstoffatom, be preferably the displacement of carbon number 6 ~ 20 or the aryl of non-displacement, the straight-chain of carbon number 1 ~ 6 or the alkylidene group of branch-like, the ring alkylidene group of carbon number 4 ~ 12 or Sauerstoffatom, be more preferably the aryl of the displacement of carbon number 6 ~ 18 or non-displacement, the ring alkylidene group of the straight-chain of carbon number 1 ~ 4 or the alkylidene group of branch-like or carbon number 5 ~ 10 or Sauerstoffatom.R 2be the displacement of carbon number 6 ~ 24 or the aryl of non-displacement, the straight-chain of carbon number 1 ~ 8 or the alkyl of branch-like, the alkylidene group of the straight-chain of carbon number 1 ~ 8 or branch-like, the cycloalkyl of carbon number 5 ~ 12, the ring alkylidene group of carbon number 5 ~ 12 or hydrogen atom, be preferably the displacement of carbon number 6 ~ 20 or the aryl of non-displacement, the straight-chain of carbon number 1 ~ 6 or the alkyl of branch-like, the alkylidene group of the straight-chain of carbon number 1 ~ 4 or branch-like, the cycloalkyl of carbon number 5 ~ 10, the ring alkylidene group of carbon number 5 ~ 10 or hydrogen atom.
The polymerization degree with the resin of the repeating unit represented with above-mentioned general expression (1) is preferably 10 ~ 6000, is more preferably 20 ~ 5000, is particularly preferably 50 ~ 4000.
The vitrification point with the resin of the repeating unit represented with above-mentioned general expression (1) is preferably more than 120 DEG C, is more preferably more than 150 DEG C, is particularly preferably 180 DEG C ~ 350 DEG C.
The thickness of above-mentioned resin layer is preferably 1 μm ~ 60 μm, is more preferably 10 μm ~ 50 μm, more preferably 20 μm ~ 40 μm.When resin layer is configured in the both sides of above-mentioned thin glass, the thickness of each resin layer both can be identical, also can be different.Preferably, the thickness of each resin layer is identical.Further, each resin layer both can be made up of identical resin, also can be made up of different resins.Preferably, each resin layer is made up of identical resin.Thus, most preferably, each resin layer is configured to identical thickness by identical resin.As long as this structure, even if carry out heat treated, also equably thermal stresses is applied to two faces of thin glass, therefore, raw bending, the fluctuating of pole difficult labour.
Above-mentioned resin layer also can contain any suitable additive according to object.As above-mentioned additive, such as, can list thinner, protective agent, denaturing agent, tensio-active agent, dyestuff, pigment, anti-blushing agent, UV light absorber, softening agent, stablizer, softening agent, defoamer, stiffeners etc.The kind of the additive contained by resin layer, number and amount can be suitably set according to object.
B. the manufacture method of duplexer
As long as can manufacture the duplexer of said structure, the manufacture method of above-mentioned duplexer just can adopt manufacture method suitable arbitrarily.As the method forming resin layer on above-mentioned thin glass, such as, can to list on thin glass the method, stacked containing the resin layer of above-mentioned resin and the method etc. of thin glass across adhesive linkage that the solution of coating containing above-mentioned resin forms resin layer.
Formed in the method for resin layer at the solution of coating containing above-mentioned resin, say typically, in the one-sided or both sides of above-mentioned thin glass, the solution (below also referred to as resin solution) of coating containing above-mentioned resin forms overlay, makes this overlay dry, forms resin layer thus.
As the solvent used when forming above-mentioned overlay, such as, can list ketones solvent, halogen based solvents, aromatic series kind solvent, methyl-sulphoxide, N, N '-dimethyl methane amide, N-Methyl pyrrolidone etc.
As the coating method of above-mentioned resin solution, such as, can list air knife coating method, scraper plate coating method, scraper for coating method, reverse coating method, delivery roll coating method (transferrollcoating), gravure roll coating method, roller lick the coating method such as coating method, cast coating method, spraying coating method, slot apertures coating method (Slotorificecoating), calendering coating method, galvanic deposit coating method, Dipcoat method, mould Tu Fa; The print processes such as porous printing method such as the toppan printings such as flexible printing, directly woodburytype, the flexographic printing process etc. such as woodburytype, offset gravure method lithography, silk screen print method.
As drying means, drying means (such as seasoning, air-supply drying, heat drying) suitable arbitrarily can be adopted.Such as when heat drying, drying temperature says it is 90 DEG C ~ 200 DEG C typically, says it is 1 minute ~ 10 minutes time of drying typically.
Also can heat-treat after making overlay drying.As heat treating method, heat treating method suitable arbitrarily can be adopted.Say typically, thermal treatment temp is 90 DEG C ~ 300 DEG C, and heat treatment time is 5 minutes ~ 45 minutes.
As the method across the stacked resin layer of adhesive linkage and thin glass, any appropriate means can be adopted.Specifically, can list in the one-sided of thin glass or both sides adhesive-applying, the method that makes caking agent solidify after by thin glass and resin film laminating.In addition, also can by caking agent by the overlay be made up of resin solution that is formed on supporting substrate (namely, the overlay of partial desiccation state) and thin glass gluing after heat-treat (dry solidification of overlay, the solidification of caking agent), peel off supporting substrate, obtain duplexer.
As above-mentioned caking agent, such as can list containing have epoxy group(ing), glyceryl, the caking agent of the resin, acrylic resin, silicon system resin etc. of the cyclic ether group such as oxetanyl.
As the curing of above-mentioned caking agent, such as, thermofixation, active energy line curing etc. can be listed.Preferably, utilize active energy line curing that caking agent is solidified.As long as utilize active energy line curing to make caking agent solidify, resin layer just can be suppressed to expand, the duplexer of surface smoothing can be obtained.
Above-mentioned caking agent also can containing other suitable arbitrarily compositions.As other composition, the solidifying agent such as ultraviolet curing agent, photosensitizers, coupling agent etc. can be listed.
By making caking agent solidify as described above, form adhesive linkage.The thickness of adhesive linkage is preferably 0.1 μm ~ 20 μm, is more preferably 0.1 μm ~ 10 μm.
C. the manufacture method of flexible thin film
The manufacture method of flexible thin film of the present invention comprises the operation of the groove arranging linearity from outside surface side at the resin layer of above-mentioned duplexer.By cutting off along this groove the duplexer that is provided with groove and obtain above-mentioned flexible thin film in rear operation.The length of groove and number can be set as length suitable arbitrarily and number according to the shape of the flexible thin film expected.Preferably, groove extends to another end from the end of in the surface of resin layer.In addition, when above-mentioned duplexer possesses resin layer in two faces of thin glass, groove can be set in two of this duplexer face.
As the formation method of above-mentioned groove, such as, can list the method adopting cutter, the method etc. adopting laser.As cutter, the cutter with shape suitable arbitrarily can be adopted, such as, can adopt discoid dise knife tool, flat cutter etc. that point of a knife is linearity.
Above-mentioned laser preferably comprises the light that wavelength is more than below 400nm or 1.5 μm, more preferably the light of more than below 360nm or 5 μm is comprised, preferably comprise the light of more than below 360nm or 8 μm further, particularly preferably comprise the light of below 360nm or 8 μm ~ 12 μm.
As above-mentioned laser, laser suitable arbitrarily can be adopted.As laser, such as, can list excimer laser, CO 2laser, YAG laser, UV laser etc.
The illuminate condition (power condition, translational speed, number of times) of laser can adopt condition suitable arbitrarily according to the kind of resin, the degree of depth of groove etc. forming resin layer.When adopting UV laser, power condition says it is 1W ~ 10W typically, is preferably 3W ~ 7W, is more preferably 3W ~ 5W.When adopting UV laser, translational speed say typically be 1mm/ second ~ 500mm/ second, be preferably 100mm/ second ~ 400mm/ second.Number of times says it is 2 times ~ 10 times typically.
The operation that above-mentioned resin layer arranges groove both can be carried out after stacked above-mentioned thin glass and resin layer, also can carry out before laminated thin glass and resin layer.As the concrete grammar carried out before laminated thin glass and resin layer, can list and groove is set on the resin film forming resin layer, the resin film being provided with groove is layered in the method on thin glass.In addition, form resin layer in two faces of thin glass, when utilizing laser that groove is set afterwards, at the table back of the body, groove can be set simultaneously.
(a) of Fig. 2 is the general profile chart of the setting groove on the resin layer representing 1 embodiment of the present invention.As shown in (a) of Fig. 2, preferably, thin glass does not arrange groove.That is, when above-mentioned duplexer does not possess adhesive linkage, the degree of depth of this groove is preferably below the thickness of above-mentioned resin layer.In addition, when above-mentioned duplexer possesses adhesive linkage, the degree of depth of this groove is preferably below the aggregate thickness of above-mentioned resin layer and adhesive linkage, is thicker than the thickness of resin layer below the aggregate thickness being more preferably above-mentioned resin layer and adhesive linkage.As long as do not arrange groove on thin glass, just smoothly the face of cutting off can be cut off, and can prevent from cracking on thin glass.In addition, when utilizing laser to form groove, only using the irradiation object of resin layer as laser, therefore, it is possible to be set as the illuminate condition of applicable resin layer.Its result, can suppress resin layer to burn, and can obtain level and smooth cutting off face.Further, as long as above-mentioned groove arrives adhesive linkage, cutting off with regard to transfiguration of duplexer is easy, can workability better and stably obtain flexible thin film.
When above-mentioned duplexer does not possess adhesive linkage, the degree of depth of above-mentioned groove, for the thickness of above-mentioned resin layer, is preferably 70% ~ 100%, is more preferably 80% ~ 100%, more preferably 90% ~ 100%.When above-mentioned duplexer possesses adhesive linkage, the degree of depth of above-mentioned groove, for the aggregate thickness of above-mentioned resin layer and adhesive linkage, is preferably 80% ~ 100%, is more preferably 85% ~ 95%, and more preferably 90% ~ 92%.
The width a of the resin layer outer surface of above-mentioned groove is preferably 0.01mm ~ 5mm, is more preferably 0.5mm ~ 2mm.As long as within the scope of this, cutting off direction would not rise and fall in face, stably can cut off duplexer.
When forming groove from two faces of above-mentioned duplexer, medullary ray B, B of extending along depth direction of paired groove ' deviation b be preferably below 2.5mm, be more preferably below 1mm, more preferably below 0.25mm, be particularly preferably 0mm.
The cross-sectional shape of above-mentioned groove can be both trilateral as shown in (a) of Fig. 2, can be also rectangle as shown in (b) of Fig. 2, can be also trapezoidal as shown in (c) of Fig. 2.Be preferably trilateral or rectangle, be more preferably trilateral.
After the outside surface side as described above from resin layer is provided with groove, cut off above-mentioned duplexer along above-mentioned groove, obtain the duplexer (flexible thin film) of panelization.More particularly, such as, by making above-mentioned duplexer bend as salient point the part being provided with above-mentioned groove, thus this duplexer is cut off.Only after the end of thin glass defines small (such as about length 3mm's) otch, also duplexer can be cut off.If do like this, then otch becomes the beginning, easily can cut off duplexer.
Embodiment
Below, utilize embodiment to specifically describe the present invention, but the present invention is not limited to some extent by these embodiments.In addition, digital micrometer " KC-351C " detect thickness of An Li Inc. is used.Microscope (OLYMPUS Inc., trade name " MX61L ") is utilized to observe and the width of measuring reservoir and deviation.After the part being provided with groove having been cut off, SEM (Inc. of Hitachi, trade name " S-3000N ") the observation face of cutting off has been utilized to carry out the degree of depth of measuring reservoir.
[embodiment 1]
In PET film (Dong Li Inc., trade name " Lu meter Le T60 ", thickness: 25 μm) the upper adhesive-applying (epoxide resin adhesive of Tai Jin chemical industrial company, the mixed solution of the trade name " CELLOXIDE2021P " of 100 weight parts, the trade name " OXT221 " of East Asia Synesis Company of 10 weight parts, the trade name " SP-170 " of Chinese mugwort Dicon A/S of 3 weight parts, the methyl ethyl ketone of 100 weight parts) and make it dry, define adhesive linkage (thickness: 5 μm).PET (resin layer)/adhesive linkage film applying is being utilized coupling agent (chemical industrial company of SHIN-ETSU HANTOTAI system, trade name " KBM-403 ") carry out, on two faces of thin glass (thickness: 30 μm) of coupling processing, utilizing UV light (1000mJ/cm to two faces 2above) adhesive linkage is solidified.
NT cutting unit (registered trademark) is utilized to be provided with groove on the resin layer in two faces of the duplexer obtained like this.The width of groove is below 1mm, and the deviation of the medullary ray along depth direction extension of the groove in two faces is below 0.5mm.The degree of depth of groove is set to 25 μm, and this groove reaches adhesive linkage.
Afterwards, cut off duplexer along above-mentioned groove, obtain flexible thin film.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
[embodiment 2]
Except adopting the thin glass of the thin glass alternate thicknesses 30 μm of thickness 50 μm, obtain flexible thin film similarly to Example 1.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
[embodiment 3]
Except adopting the thin glass of the thin glass alternate thicknesses 30 μm of thickness 100 μm, obtain flexible thin film similarly to Example 1.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
[embodiment 4]
(adjustment of resin solution)
In the reaction vessel possessing whipping appts, make 4,4 '-(1,3-dimethylbutylene) bis-phenol 7.65 weight part, 4,4 '-(1-phenyl-ethylene) bis-phenol 12.35 weight part, benzyltriethylammoinium chloride 0.444 weight part, p-tert-butylphenol 0.022 weight part be dissolved in 1M sodium hydroxide solution 185 weight part.Stir while join in this solution by disposable for the solution dissolving p-phthaloyl chloride 14.4 weight part in chloroform 246 weight part, at room temperature stir 120 minutes.Afterwards, the chloroformic solution containing polymkeric substance is separated by polymeric solution standing separation, then with the cleaning of acetic acid water, after ion exchanged water cleaning, is put in methyl alcohol and polymkeric substance is separated out.By the polymer filtration separated out, carry out drying at reduced pressure conditions, obtain the polymkeric substance of white thus.Modulate by the polymer dissolution obtained of 10 weight parts in 90 weight parts cyclopentanone 10 % by weight resin solution a.
(modulation of caking agent)
Polyethersulfone (sumitomo chemical company system, trade name " SUMIKAEXCEL5003P ") 10 weight part heating for dissolving by terminal hydroxyl modification, in cyclopentanone 90 weight part, obtain the solution of 10 % by weight.3-ethyl-3{ [(3-Ethyloxetane-3-base) methoxyl group] methyl is added in the solution obtained } trimethylene oxide (East Asia Synesis Company system, trade name " ARONOXETANEOXT-221 ") 0.6 weight part, 1,2-methylimidazole 0.4 weight part and epoxy group(ing) end coupling agent (chemical industrial company of SHIN-ETSU HANTOTAI system, trade name " KBM403 ") 2.5 weight parts, obtain caking agent b.
(thin glass)
After the monoplanar surface of cleaning thin glass (thickness: 50 μm) with methyl ethyl ketone, carry out corona treatment, coating epoxy coupling agents (chemical industrial company of SHIN-ETSU HANTOTAI system, trade name " KBM403 ") 2% aqueous solution, makes its dry 10 minutes at 100 DEG C.Same process is also carried out in another face for thin glass.
(manufacture of duplexer)
Afterwards, above-mentioned resin solution a is coated in there is solvent perviousness PET (Dong Li company limited system, trade name " Lu meter Le ", thickness: 75 μm) base material on, at 90 DEG C, make solvent evaporates 8 minutes, define overlay.
While supply above-mentioned caking agent b between thin glass after process as described above and the overlay being formed in above-mentioned PET base material, thin glass and overlay are fitted.This operation is carried out to two faces of thin glass, obtains duplexer (PET base material/overlay/caking agent/thin glass/caking agent/overlay/PET base material).
The duplexer obtained has been carried out to the thermal treatment of 4 minutes, carried out the thermal treatment of 4 minutes, at 150 DEG C, carried out the thermal treatment of 4 minutes at 130 DEG C at 90 DEG C.
Afterwards, peel off the PET base material in two faces, and then at 150 DEG C, carry out the thermal treatment of 12 minutes, obtain the duplexer (resin layer (30 μm)/adhesive linkage (2.5 μm)/thin glass (50 μm)/adhesive linkage (2.5 μm)/resin layer (30 μm)) of total thickness 115 μm.
(cutting off of duplexer)
NT cutting unit (registered trademark) is utilized to be provided with groove on the resin layer in two faces of the duplexer obtained like this.The width of groove is below 1mm, and the deviation of the medullary ray along depth direction extension of the groove in two faces is below 0.5mm.The degree of depth of groove is set to 30 μm, and this groove reaches adhesive linkage.
Afterwards, cut off duplexer along above-mentioned groove, obtain flexible thin film.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
[embodiment 5]
Manufacture duplexer similarly to Example 4.
Utilize UV laser (COHERENT Inc., trade name " Talisker ") to the resin layer irradiating laser (wavelength: 355nm) in two faces of the duplexer obtained, be provided with groove.The illuminate condition of laser is set to power 4W, frequency 200kHz, translational speed 200mm/ second, irradiates number of times 5 back and forth.The width of groove is below 1mm, and the deviation of the medullary ray along depth direction extension of the groove in two faces is 0mm.The degree of depth of groove is set to 32.5 μm, and this groove reaches glass layer.
Afterwards, cut off duplexer along above-mentioned groove, obtain flexible thin film.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
[embodiment 6]
Except by PET (resin layer)/adhesive linkage pellicular cascade except the one side of thin glass, obtain flexible thin film similarly to Example 1.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
In addition, the width of groove is below 1mm.The degree of depth of groove is set to 25 μm, and this groove reaches adhesive linkage.
Afterwards, cut off duplexer along above-mentioned groove, obtain flexible thin film.The face of cutting off of flexible thin film is level and smooth, and, thin glass does not crack.
[comparative example 1]
Except adopting the thin glass of the thin glass alternate thicknesses 30 μm of thickness 50 μm, obtain duplexer similarly to Example 1.
The duplexer obtained does not arrange groove, utilizes scissors to be blocked completely by this duplexer, obtain flexible thin film.
Near the truncation surface of the flexible thin film obtained, thin glass creates the crackle of about length 1mm.
[comparative example 2]
Obtain duplexer similarly to Example 4.
The duplexer obtained does not arrange groove, utilizes CO 2it blocks to this duplexer irradiating laser (wavelength: 10600nm) by laser (COMNET Inc.) completely, obtains flexible thin film.The illuminate condition of laser is set to power 30W, translational speed 200mm/ second, irradiates number of times 10 back and forth.
In the truncation surface of the flexible thin film obtained, resin layer burns, and does not form level and smooth truncation surface.
[comparative example 3]
Except adopting the thin glass of the thin glass alternate thicknesses 30 μm of thickness 200 μm, obtain duplexer similarly to Example 1.
NT cutting unit (registered trademark) is utilized to be provided with groove on the resin layer in two faces of the duplexer obtained.The width of groove is below 1mm, and the deviation of the medullary ray along depth direction extension of the groove in two faces is 1mm.The degree of depth of groove is set to 25 μm, and this groove reaches adhesive linkage.
Cut off duplexer afterwards, but cannot cut off along groove, thin glass has created crackle.
Can be clear and definite according to embodiment 1 ~ 6, adopt the present invention, face of cutting off is level and smooth, and can suppress to crack on thin glass and wait breakage and cut off duplexer.
utilizability in industry
The duplexer utilizing manufacture method of the present invention to obtain can be applied to display element, solar cell or illumination component.As display element, such as, can list liquid-crystal display, plasma display, OLED display, Electronic Paper etc.As illumination component, such as, organic EL etc. can be listed.
description of reference numerals
10, thin glass; 11,11 ', resin layer; 12,12 ', adhesive linkage; 100,101, duplexer.

Claims (5)

1. a flexible thin film's manufacture method, it comprises possessing thickness is the operation that the thin glass of less than 100 μm and the duplexer of resin layer that is configured in the one-sided of this thin glass or both sides cut off, wherein,
The manufacture method of this flexible thin film comprises following operation:
The operation of groove is set from the outside surface side of this resin layer; And
The operation of this duplexer is cut off along this groove.
2. the manufacture method of flexible thin film according to claim 1, wherein,
Above-mentioned thin glass does not arrange groove.
3. the manufacture method of flexible thin film according to claim 1 and 2, wherein,
The width of the resin layer outer surface of above-mentioned groove is 0.01mm ~ 5mm.
4. the manufacture method of the flexible thin film according to any one of claims 1 to 3, wherein,
Cutter or laser is utilized to form above-mentioned groove.
5. the manufacture method of the flexible thin film according to any one of Claims 1 to 4, wherein,
In above-mentioned duplexer, the total thickness of described resin layer is 0.3 ~ 4 with the ratio of the thickness of described thin glass.
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Application publication date: 20151118