CN105070680A - Wafer dewaxing device and dewaxing method - Google Patents
Wafer dewaxing device and dewaxing method Download PDFInfo
- Publication number
- CN105070680A CN105070680A CN201510502858.2A CN201510502858A CN105070680A CN 105070680 A CN105070680 A CN 105070680A CN 201510502858 A CN201510502858 A CN 201510502858A CN 105070680 A CN105070680 A CN 105070680A
- Authority
- CN
- China
- Prior art keywords
- wafer
- area
- end plate
- dewax
- fixed charge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 238000005406 washing Methods 0.000 claims abstract description 8
- 238000010926 purge Methods 0.000 claims abstract description 6
- 238000007669 thermal treatment Methods 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 6
- 230000001737 promoting effect Effects 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 abstract 4
- 238000011010 flushing procedure Methods 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 239000001993 wax Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer dewaxing device. The wafer dewaxing device comprises a frame and a mobile track arranged on the upper end of the frame. A horizontal moving platform capable of moving horizontally along the mobile track is arranged on the mobile track, and a heating area, a wax melting area, a cleaning area and a flushing area are sequentially arranged on the frame along the mobile track direction. A hydraulic cylinder is arranged under the horizontal moving platform, a fixing end plate is arranged on the lower end of the hydraulic cylinder, and mounting bars for installing wafers are arranged under the fixing end plate. The area of the lower end face of the fixing end plate is greater than that of the upper end faces of the heating area, the wax melting area, the cleaning area and the flushing area. Preheating, high temperature heating, washing and air purging steps are conducted to dewax, and the dewaxing efficiency is improved. A mobile platform structure is employed, and wafer can be shifted among different process. The manual transhipment time and cost can be reduced.
Description
Technical field
The present invention relates to a kind of wafer dewax equipment and dewax method.
Background technology
In wafer process process, wax can be adhered in its surface, needs to be removed.Because existing single dewax mode exists the not high problem of dewax efficiency, simultaneously, existing overall composite dewax machinery dewax efficiency is not high, between different operation in mobile wafer process, need manual operation, affect operating efficiency, wafer can not reasonably be installed, cause in dewax process, wafer easily damages by mechanical force.
Summary of the invention
The object of the present invention is to provide a kind of wafer dewax equipment and dewax method, prior art Problems existing can be improved, dewax operation is realized by adopting the steps such as preheating, high-temperature heating, washing, air purge, improve dewax efficiency, simultaneously, adopt the platform structure of movement, facilitate the transhipment of wafer between different operation, reduce time and the cost of man-handling of materials.
The present invention is achieved through the following technical solutions:
A kind of wafer dewax equipment, comprise frame and be arranged on the moving track of frame upper end, described moving track is provided with the horizontal shifting platform that can move horizontally along moving track, described frame is disposed with the thermal treatment zone, Hua La district, cleaning area, rinsing area along moving track direction;
Be provided with hydraulic cylinder below described horizontal shifting platform, described hydraulic cylinder lower end is provided with fixed charge method end plate, is provided with the mounting bar for installing wafer below described fixed charge method end plate;
The area of described fixed charge method end plate lower surface is greater than the area of the described thermal treatment zone, Hua La district, cleaning area, upper surface, rinsing area.
Further, for realizing the present invention better, described horizontal shifting platform two ends are respectively arranged with belt pulley, and described frame side is provided with the pulley rotation described in drive motors drive.
Further, for realizing the present invention better, described fixed charge method end plate is provided with draw-in groove, described mounting bar upper end is connected in described draw-in groove.
Further, for realizing the present invention better, the described thermal treatment zone is provided with resistance wire.
Further, for realizing the present invention better, described rinsing area is provided with high temperature hot gas shower nozzle.
A kind of wafer dewax method, comprises the following steps:
S1: install wafer: say that wafer is as on mounting bar, its wafer is fixed on mounting bar, and mounting bar is snapped fit onto fixed charge method end plate lower surface;
S2: preheating: start drive motors, drives horizontal shifting platform to move along moving track, time above fixed charge method end plate is positioned at the thermal treatment zone, primer fluid cylinder pressure, promoting fixed charge method end plate lower surface is fitted on the upper surface of the thermal treatment zone, heats, make its preheating to the wafer being positioned at the thermal treatment zone;
S3: change wax: the wafer through preheating is input to Hua La district and its carrying out wax is operated;
S4: washing: the wafer through step S3 process is placed in cleaning area, and adopts cleaning fluid to carry out water washing operations;
S5: air purge: the wafer through step S4 process is placed in rinsing area, makes it dry by spraying into high temperature hot gas, and exports chassis equipment.
The present invention compared with prior art, has following beneficial effect:
(1) the present invention is by adopting integral structure, realizes how completing to the disposable of operation, effectively improves paraffin removal efficiency;
(2) the present invention moves wafer by adopting moving track to realize mechanization, effectively avoids the operation Problem that the mode of moved by hand is brought, meanwhile, can reduce labour intensity, increase work efficiency;
(3) the present invention is by adopting hydraulic cylinder, can realize the mounting bar lifting promoting to be provided with wafer, thus improve dewax efficiency;
(4) area of the present invention by making the area of fixed charge method end plate be greater than the thermal treatment zone, Hua La district, cleaning area, upper surface, rinsing area, fixed charge method end plate can be made to cover above-mentioned zone top completely, wafer can be made to be in said structure inside completely when corresponding operation, its inner material is avoided to leak the pollution causing operating environment, time closure operation.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment below, be to be understood that, the following drawings illustrate only some embodiment of the present invention, therefore the restriction to scope should be counted as, for those of ordinary skill in the art, under the prerequisite not paying creative work, other relevant accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is overall structure schematic diagram of the present invention.
Wherein: 101. frames, 102. moving tracks, 103. horizontal shifting platforms, 104. thermals treatment zone, 105. Hua La districts, 106. cleaning areas, 107. rinsing areas, 108. hydraulic cylinders, 109. fixed charge method end plates, 110. mounting bars, 111. draw-in grooves.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
As shown in Figure 1, a kind of wafer dewax equipment, comprise frame 101 and be arranged on the moving track 102 of frame 101 upper end, described moving track 102 is provided with the horizontal shifting platform 103 that can move horizontally along moving track 102, described frame 101 is disposed with the thermal treatment zone 104, Hua La district 105, cleaning area 106, rinsing area 107 along moving track 102 direction;
Be provided with hydraulic cylinder 108 below described horizontal shifting platform 103, described hydraulic cylinder 108 lower end is provided with fixed charge method end plate 109, is provided with the mounting bar 110 for installing wafer below described fixed charge method end plate 109;
The area of described fixed charge method end plate 109 lower surface is greater than the area of the described thermal treatment zone 104, Hua La district 105, cleaning area 106, upper surface, rinsing area 107.
Embodiment 1:
In the present embodiment, disclose a kind of preferred structure driving horizontal shifting platform to move, described horizontal shifting platform 103 two ends are respectively arranged with belt pulley, and described frame 101 side is provided with the pulley rotation described in drive motors drive.
Further preferably, in the present embodiment, described fixed charge method end plate 109 is provided with draw-in groove 111, described mounting bar 110 upper end is connected in described draw-in groove 111.By adopting notch, the installation of mounting bar can be facilitated, and then facilitate the installation and removal of wafer.
Preferably, in the present embodiment, the described thermal treatment zone 104 is provided with resistance wire.
In order to realize air purge, in the present embodiment, described rinsing area 107 is provided with high temperature hot gas shower nozzle.
Embodiment 2:
A kind of wafer dewax method, comprises the following steps:
S1: install wafer: say that wafer is as on mounting bar 110, makes its wafer be fixed on mounting bar 110, and mounting bar 110 is snapped fit onto fixed charge method end plate 109 lower surface;
S2: preheating: start drive motors, horizontal shifting platform 103 is driven to move along moving track 102, time above fixed charge method end plate 109 is positioned at the thermal treatment zone 104, primer fluid cylinder pressure 108, promoting fixed charge method end plate 109 lower surface is fitted on the upper surface of the thermal treatment zone 104, the wafer being positioned at the thermal treatment zone 104 is heated, makes its preheating;
S3: change wax: the wafer through preheating is input to Hua La district 105 and its carrying out wax is operated;
S4: washing: the wafer through step S3 process is placed in cleaning area 106, and adopts cleaning fluid to carry out water washing operations;
S5: air purge: the wafer through step S4 process is placed in rinsing area 107, makes it dry by spraying into high temperature hot gas, and exports frame 101 equipment.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a wafer dewax equipment, it is characterized in that: comprise frame (101) and be arranged on the moving track (102) of frame (101) upper end, described moving track (102) is provided with the horizontal shifting platform (103) that can move horizontally along moving track (102), described frame (101) is disposed with the thermal treatment zone (104), Hua La district (105), cleaning area (106), rinsing area (107) along moving track (102) direction;
Described horizontal shifting platform (103) below is provided with hydraulic cylinder (108), and described hydraulic cylinder (108) lower end is provided with fixed charge method end plate (109), and described fixed charge method end plate (109) below is provided with the mounting bar (110) for installing wafer;
The area of described fixed charge method end plate (109) lower surface is greater than the area of the described thermal treatment zone (104), Hua La district (105), cleaning area (106), rinsing area (107) upper surface.
2. a kind of wafer dewax equipment according to claim 1, is characterized in that: described horizontal shifting platform (103) two ends are respectively arranged with belt pulley, and described frame (101) side is provided with the pulley rotation described in drive motors drive.
3. a kind of wafer dewax equipment according to claim 1 and 2, it is characterized in that: on described fixed charge method end plate (109), be provided with draw-in groove (111), described mounting bar (110) upper end is connected in described draw-in groove (111).
4. a kind of wafer dewax equipment according to claim 1 and 2, is characterized in that: the described thermal treatment zone (104) is provided with resistance wire.
5. a kind of wafer dewax equipment according to claim 1 and 2, is characterized in that: described rinsing area (107) is provided with high temperature hot gas shower nozzle.
6. a wafer dewax method, is characterized in that: comprise the following steps:
S1: install wafer: say that wafer is as on mounting bar (110), makes its wafer be fixed on mounting bar (110), and mounting bar (110) is snapped fit onto fixed charge method end plate (109) lower surface;
S2: preheating: start drive motors, drive horizontal shifting platform (103) mobile along moving track (102), when fixed charge method end plate (109) is positioned at top, the thermal treatment zone (104), primer fluid cylinder pressure (108), promoting fixed charge method end plate (109) lower surface is fitted on the upper surface of the thermal treatment zone (104), the wafer being positioned at the thermal treatment zone (104) is heated, makes its preheating;
S3: change wax: the wafer through preheating is input to Hua La district (105) and its carrying out wax is operated;
S4: washing: the wafer through step S3 process is placed in cleaning area (106), and adopts cleaning fluid to carry out water washing operations;
S5: air purge: the wafer through step S4 process is placed in rinsing area (107), makes it dry by spraying into high temperature hot gas, and exports frame (101) equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510502858.2A CN105070680A (en) | 2015-08-15 | 2015-08-15 | Wafer dewaxing device and dewaxing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510502858.2A CN105070680A (en) | 2015-08-15 | 2015-08-15 | Wafer dewaxing device and dewaxing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105070680A true CN105070680A (en) | 2015-11-18 |
Family
ID=54500016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510502858.2A Pending CN105070680A (en) | 2015-08-15 | 2015-08-15 | Wafer dewaxing device and dewaxing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105070680A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105415027A (en) * | 2015-12-07 | 2016-03-23 | 上海现代先进超精密制造中心有限公司 | Method for conducting dewaxing without deformation through heat gun |
| CN109449103A (en) * | 2018-11-12 | 2019-03-08 | 江苏利泷半导体科技有限公司 | Wax system under a kind of full-automatic amorphous processing procedure |
| CN110744532A (en) * | 2019-11-21 | 2020-02-04 | 江苏索尔思通信科技有限公司 | Dewaxing solution sheet taking device and method |
| CN113731932A (en) * | 2021-09-03 | 2021-12-03 | 广东先导微电子科技有限公司 | Wax melting method of indium phosphide wafer |
-
2015
- 2015-08-15 CN CN201510502858.2A patent/CN105070680A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105415027A (en) * | 2015-12-07 | 2016-03-23 | 上海现代先进超精密制造中心有限公司 | Method for conducting dewaxing without deformation through heat gun |
| CN109449103A (en) * | 2018-11-12 | 2019-03-08 | 江苏利泷半导体科技有限公司 | Wax system under a kind of full-automatic amorphous processing procedure |
| CN110744532A (en) * | 2019-11-21 | 2020-02-04 | 江苏索尔思通信科技有限公司 | Dewaxing solution sheet taking device and method |
| CN113731932A (en) * | 2021-09-03 | 2021-12-03 | 广东先导微电子科技有限公司 | Wax melting method of indium phosphide wafer |
| CN113731932B (en) * | 2021-09-03 | 2023-02-17 | 广东先导微电子科技有限公司 | Wax melting method of indium phosphide wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151118 |