CN105047688A - Process for packaging miniaturized organic light-emitting display device - Google Patents
Process for packaging miniaturized organic light-emitting display device Download PDFInfo
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- CN105047688A CN105047688A CN201510465671.XA CN201510465671A CN105047688A CN 105047688 A CN105047688 A CN 105047688A CN 201510465671 A CN201510465671 A CN 201510465671A CN 105047688 A CN105047688 A CN 105047688A
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Abstract
The invention belongs to the field of organic light-emitting displays, and in particular relates to a process for packaging a miniaturized organic light-emitting display device. By means of the process, the device has a good anti-impact vibration performance; a temporary protective sheet is pasted, so that a display area is prevented from being polluted in the technological process; furthermore, ultraviolet curing damage is eliminated; a display panel is thinned; therefore, the heat dissipation performance of the device is improved; the packaging integrated level is improved; gaps are filled by using silica gel; a bonding wire is subjected to flexible wrapping protection, so that influence of stress change to circuit connection is reduced; due to the interconnected combination manner of the display panel and a base, the integrated level and the whole heat dissipation performance of the device are improved; and in addition, flexible and diversified base forms can be adopted, so that system applications are more convenient.
Description
Technical field
The invention belongs to organic light emitting display field, be specifically related to a kind of packaging technology of little miniature organic light emitting display.
Background technology
Organic light emitting display, has the features such as self-luminous, visual angle is wide, the reaction time is short, and luminous efficiency is high, colour gamut is large, panel is frivolous, is the third generation Display Technique replacing LCD.Little miniscope stock size is less than 2.5 inches, and integration is high, is the display terminal of Mobile portable type equipment.Current little miniature organic light emitting display adopts that display floater and drive circuit backboard are directly bonding to be connect substantially, and by bonding wire, display floater PAD and drive circuit board PAD is carried out circuit interconnects, then carries out the packing forms that bonding wire fills protection.This process easily causes display floater to be shifted and bonding wire short circuit, and the STRESS VARIATION of filling in adhesive curing process easily causes the potential damage of organic luminous layer and barrier layer.
Summary of the invention
For this reason, technical problem to be solved by this invention is to overcome display floater in conventional art and is easily shifted and the phenomenon of the easy short circuit of bonding wire, and the STRESS VARIATION of filling in adhesive curing process easily causes the technical bottleneck of the potential damage of organic luminous layer and barrier layer, thus proposition one prepares high reliability, be easy to integrated and safeguard, anti-vibration and impact, obviously strengthen the reliability used on mobile portable equipment; The technique that the technical process low cost, the efficiency that realize packing forms is high, can carry out the little miniature organic light emitting display produced in batches.
For solving the problems of the technologies described above, the packaging technology that the invention discloses a kind of little miniature organic light emitting display of the present invention, wherein, described technique comprises the steps:
Aim at each display unit to the temporary protection sheet of miniature organic light emitting display to paste; Then the overall display floater bottom being pasted with temporary protection sheet is placed in that Mechanical polishing equipment to carry out grinding and polishing thinning; Then temporary protection sheet slice separation is become single display floater; In the middle part of described miniature organic light emitting display pedestal, be designed with lower floor's groove region of pasting display floater again, and in described lower floor's groove region, apply ultra-violet curing adhesive resin with point gum machine; Last injecting glue protection.
Preferably, the packaging technology of described little miniature organic light emitting display, wherein, described temporary protection sheet is for mixing uvioresistant coating PETG film.
Preferably, the packaging technology of described little miniature organic light emitting display, wherein, has one deck solid state heat and replys glue-line under described temporary protection sheet.
More preferred, the packaging technology of described little miniature organic light emitting display, wherein, described grinding and polishing is thinned to distance substrate circuit 0.35mm place and stops.
Preferably, the packaging technology of described little miniature organic light emitting display, wherein, the thinning number of times of described grinding and polishing is twice, thinning first time, adopts diameter 10 microns of magnesium oxide particle abrasive materials to carry out rough polishing; For the second time, adopt diameter 3 microns of oxidation particles to carry out essence to throw.
Preferably, the packaging technology of described little miniature organic light emitting display, wherein, described pedestal scribbles ultra-violet curing heat conduction adhesive resin.
Further, the packaging technology of described little miniature organic light emitting display, wherein, after described coating ultra-violet curing adhesive resin, with described temporary patch machine, single display floater is put into glue bearing areas, the UV radiation curing time is 15 seconds.
More further, the packaging technology of described little miniature organic light emitting display, wherein, before described section, also need paste the blue film needed for section on temporary protection sheet.
Preferably, the packaging technology of described little miniature organic light emitting display, wherein, cutting speed per second 10 is to 15mm, Cutting Road width 0.15mm; Carry out deionized water fan-shaped spray after cutting and rinse cleaning, and carry out high speed drying, scavenging period 5min, dry rotating speed 1100 revs/min.
More preferred, the packaging technology of described little miniature organic light emitting display, wherein, the position of described injecting glue protection is carry out injection silica gel in the void area of single display floater and pedestal, and is cured.
Technique scheme of the present invention has the following advantages compared to existing technology, and the preferred collocation of encapsulating material also combines the technical process be applicable to, and makes device have good anti shock and vibration ability; Paste temporary protection sheet, in technical process, protect viewing area not polluted; Carry out thinning to display floater, improve the heat dispersion of device, improve the integrated level of encapsulation; Use silica gel to carry out fill gaps, soft cladding protection can be carried out to bonding wire, decrease the impact that STRESS VARIATION connects circuit; Display floater and the interconnected compound mode of pedestal, improve the integrated level of device, and the integral heat sink performance of device; Flexile base form can be taked, be more convenient for system application.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the process chart in the embodiment of the present invention 1;
Fig. 2 is the schematic diagram single display floater being pasted with screening glass;
Fig. 3 is that single display floater and pedestal interconnect schematic diagram;
Reference numeral is expressed as: the single display floater of 1-; 2-temporary protection sheet; Weld bond PAD on 3-display unit; 4-is pedestal; The bonding wire of 5-display unit and pedestal circuit interconnection.
Embodiment
Embodiment
As shown in Figure 1, present embodiment discloses a kind of packaging technology of little miniature organic light emitting display, step is as follows:
(1) temporary protection sheet 2 is aimed at each display unit 1 to paste, paste precision X/Y direction ± 0.05mm, paste and be placed on hot plate that 60 DEG C of bakings are after 30 seconds, display floater and screening glass form temporary bond;
(2) the overall display floater bottom being pasted with temporary protection sheet 2 is placed in that Mechanical polishing equipment to carry out grinding and polishing thinning, grinding and polishing thinning process is at twice: for the first time, diameter 10 microns of magnesium oxide particle abrasive materials are adopted to carry out rough polishing, for the second time, adopt diameter 3 microns of oxidation particles to carry out essence to throw, tested by step instrument, finally be thinned to distance substrate circuit 0.35 ± 0.02mm place to stop, be immersed in deionized water for ultrasonic clean 60 seconds, to remove grinding and polishing impurity particle, carry out high speed to dry, cleaning process repeats two to three times, guarantee grinds with abrasive grain without attachment,
(3) on temporary protection sheet 2, paste section and use blue film, blue film is fixed on section frame, and on hot plate, 60 DEG C are toasted 30 seconds, be placed on slicing machine and carry out precision cutting, depth of cut controls at blue film sticking veneer, and cutting speed per second 10 is to 15mm, Cutting Road width 0.15mm; The display panel unit shown in Fig. 2 is formed after cutting, each unit is still fixed on blue film, carry out deionized water fan-shaped spray and rinse cleaning, and carry out high speed drying, scavenging period 5min, dry rotating speed 1100 revs/min, carry out purging 1 minute by ion wind gun after drying, with vacuum cups just unit display panel and blue UF membrane;
(4) lower floor's groove region of pasting display panel unit is designed with in the middle part of pedestal 4, in this region, ultra-violet curing adhesive resin is applied with point gum machine, glue-spread controls at 35mg/ square feet, with chip mounter, display panel unit is accurately put into glue bearing areas, put into pressure 250g/ square feet, positional precision 0.05mm, use ultraviolet source irradiation immediately 15 seconds, carry out ultra-violet curing, from stickup after to ultraviolet irradiation time started Separation control within 5 seconds, put into the weld bond PAD3 plasma cleaning that plasma cleaner carries out on display unit, under hot plate 60 DEG C of lasting curing environments, protective layer is taken off with vacuum head, unit display part and pedestal are carried out bonding wire interconnected, the bonding wire 5 of the corresponding display unit of every two PAD and pedestal circuit interconnection, purging is carried out 1 minute by ion wind gun.Carry out overall Photoelectric Detection;
(5) in void area, inject silica gel, form injecting glue protection zone, injecting glue temperature 110 DEG C, injecting glue amount can not exceed edge, viewing area, oven heat 70 DEG C, solidification in 24 hours.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (10)
1. a packaging technology for little miniature organic light emitting display, is characterized in that, described technique comprises the steps:
Aim at each display unit to the temporary protection sheet of miniature organic light emitting display to paste; Then the overall display floater bottom being pasted with temporary protection sheet is placed in that Mechanical polishing equipment to carry out grinding and polishing thinning; Then temporary protection sheet slice separation is become single display floater; In the middle part of described miniature organic light emitting display pedestal, be designed with lower floor's groove region of pasting display floater again, and in described lower floor's groove region, apply ultra-violet curing adhesive resin with point gum machine; Last injecting glue protection.
2. the packaging technology of little miniature organic light emitting display as claimed in claim 1, is characterized in that, described temporary protection sheet is for mixing uvioresistant coating PETG film.
3. the packaging technology of little miniature organic light emitting display as claimed in claim 2, is characterized in that, has one deck solid state heat and reply glue-line under described temporary protection sheet.
4. the packaging technology of little miniature organic light emitting display as claimed in claim 3, is characterized in that, described grinding and polishing is thinned to distance substrate circuit 0.35mm place and stops.
5. the packaging technology of little miniature organic light emitting display as claimed in claim 4, is characterized in that, the thinning number of times of described grinding and polishing is twice, thinning first time, adopts diameter 10 microns of magnesium oxide particle abrasive materials to carry out rough polishing; For the second time, adopt diameter 3 microns of oxidation particles to carry out essence to throw.
6. the packaging technology of little miniature organic light emitting display as claimed in claim 5, is characterized in that, described pedestal scribbles ultra-violet curing heat conduction adhesive resin.
7. the packaging technology of little miniature organic light emitting display as claimed in claim 6, it is characterized in that, after described coating ultra-violet curing adhesive resin, with described temporary patch machine, single display floater is put into glue bearing areas, the UV radiation curing time is 15 seconds.
8. the packaging technology of little miniature organic light emitting display as claimed in claim 7, is characterized in that, before described section, also need paste the blue film needed for section on temporary protection sheet.
9. the packaging technology of little miniature organic light emitting display as claimed in claim 8, is characterized in that, cutting speed per second 10 is to 15mm, Cutting Road width 0.15mm; Carry out deionized water fan-shaped spray after cutting and rinse cleaning, and carry out high speed drying, scavenging period 5min, dry rotating speed 1100 revs/min.
10. the packaging technology of little miniature organic light emitting display as claimed in claim 9, is characterized in that, the position of described injecting glue protection is carry out injection silica gel in the void area of single display floater and pedestal, and is cured.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510465671.XA CN105047688B (en) | 2015-07-31 | 2015-07-31 | A kind of packaging technology of small miniature organic light emitting display |
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| CN201510465671.XA CN105047688B (en) | 2015-07-31 | 2015-07-31 | A kind of packaging technology of small miniature organic light emitting display |
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| CN105047688B CN105047688B (en) | 2018-09-07 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020003403A1 (en) * | 2000-04-25 | 2002-01-10 | Ghosh Amalkumar P. | Thin film encapsulation of organic light emitting diode devices |
| CN101609872A (en) * | 2009-06-19 | 2009-12-23 | 云南北方奥雷德光电科技股份有限公司 | Quantity production packaging technique of minitype OLED display |
| CN103295893A (en) * | 2013-05-29 | 2013-09-11 | 华进半导体封装先导技术研发中心有限公司 | Wafer-level micro-assembly process |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020003403A1 (en) * | 2000-04-25 | 2002-01-10 | Ghosh Amalkumar P. | Thin film encapsulation of organic light emitting diode devices |
| CN101609872A (en) * | 2009-06-19 | 2009-12-23 | 云南北方奥雷德光电科技股份有限公司 | Quantity production packaging technique of minitype OLED display |
| CN103295893A (en) * | 2013-05-29 | 2013-09-11 | 华进半导体封装先导技术研发中心有限公司 | Wafer-level micro-assembly process |
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| CN105047688B (en) | 2018-09-07 |
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