CN105023997A - Long-time baking hardening method in LED packaging - Google Patents
Long-time baking hardening method in LED packaging Download PDFInfo
- Publication number
- CN105023997A CN105023997A CN201510460060.6A CN201510460060A CN105023997A CN 105023997 A CN105023997 A CN 105023997A CN 201510460060 A CN201510460060 A CN 201510460060A CN 105023997 A CN105023997 A CN 105023997A
- Authority
- CN
- China
- Prior art keywords
- temperature
- led
- baking
- temperature sensor
- baking box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000001276 controlling effect Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 102100026816 DNA-dependent metalloprotease SPRTN Human genes 0.000 description 1
- 101710175461 DNA-dependent metalloprotease SPRTN Proteins 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
The invention discloses a long-time baking hardening method in LED (Light-Emitting Diode) packaging. The method comprises the following steps of: firstly, mounting temperature sensors at all the eight corners in a roaster; setting temperature of the roaster to be 120-150 DEG C, and setting baking time to be 20-30 minutes; then, according to numerical values acquired by the eight temperature sensors, controlling corresponding heating devices to rise or lower the temperature; and finally, judging whether the long-time baking time is up, and finishing long-time baking. Each area in the roaster always keeps constant temperature, and the temperature can be regulated automatically, thus, colour of an LED subjected to long-time baking is consistent and not liable to change.
Description
Technical field
The invention belongs to LED application, the length be specifically related in a kind of LED bakes method for curing.
Background technology
LED photovoltaic industry is an emerging rising industry, there is the feature of energy-saving and environmental protection, especially the low-carbon emission reduction effect of in December, 2009 Copenhagen global climate meeting, by make LED photovoltaic industry more meet our country the energy, subtract carbon strategy, and obtain more industry support and the market demand, become one beautiful industry development landscape.LED industry chain is totally divided into upper, middle and lower to swim, and is LED epitaxial chip, LED and LED application respectively.As the LED industry formed a connecting link in LED industry chain, in whole industrial chain, play unrivaled important function.Types of applications product based on LED component uses LED component in a large number, as the LED backlight of large LED display screen, liquid crystal display, LED illumination lamp, LED traffic lights and LED automobile lamp etc., LED component account for 40% to 70% in application product total cost, and the properties of LED application product often more than 70% is determined by the performance of LED component.
China is LED big country, and the LED component encapsulation of the whole world 80% quantity concentrates on China according to estimates, is distributed in all kinds of U.S. money, Taiwan investment, HongKong-funded, domestic-investment encapsulation enterprise.
In in the past 5 years, foreign capitals LED enterprise constantly moves to the interior continent, the continuous Growth Development of domestic-investment encapsulation enterprise, and technology is ripe and innovation constantly.In low and middle-end LED component encapsulation field, the occupation rate of market of Chinese LED enterprise is higher, and in high-end LED component encapsulation field, part Chinese Enterprise has comparatively quantum jump.Along with the continuous maturation of technology and the accumulation of brand prestige, Chinese LED enterprise will apply in big country at this LED of China plays the part of important and leading role.
LED encapsulation is explained: LED is exactly process LED encapsulation material being packaged into LED in simple terms; LED encapsulation flow process: general led encapsulation has to pass through the flow processs such as expansion crystalline substance-die bond-bonding wire-encapsulating-cutting-color-division; The predominant package material of LED encapsulating material: LED has: chip, gold thread, support, glue etc.; LED sealed in unit: expand brilliant equipment, bonder, bonding equipment, point gum machine, baking box etc., is generally divided into the manual sealed in unit two kinds of full-automatic sealed in unit.
In prior art, model is that the tunnel production line oven of DS-4000 is mainly used to LED encapsulating baking-curing roasting plant, and baking oven streamline is continuous type drying equipment, sustainablely toasts incessantly, improves production efficiency.
This tunnel oven has following features:
1) bilateral be furnished with chain drive, solves the phenomenon of sideslip in transport process.
2) baking oven Segmented heating, independent electronic box controls, easy to operate.
3) structure forms primarily of conveyer system and drying oven two large divisions, and multistage is independent.
4) ID temperature controls, and in-furnace temperature is even.
5) transporting velocity frequency control, regulate freely, operate steadily, production efficiency is high.
6) every section of independent case body arranges toxic emission interface, can be external to outside workshop, exempts from house exhaust dirt.
Above-mentioned baking box adopts the warm area of multistage, but the Time Inconsistency toasted between each warm area, and cause part warm area and occur idle phenomenon, effective rate of utilization is not high.
Just bake after mould at LED, have metachromatism during long roasting sclerosis, this phenomenon major part causes due to non-uniform temperature in baking box, or too concentrates that thermal convection is uneven to be caused because LED places.
Summary of the invention
Technical problem to be solved by this invention is: provide the length in a kind of LED to bake method for curing, solves the problem of LED variable color in long roasting hardening process in prior art.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
Length in LED bakes a method for curing, comprises the steps:
Step 1, by 8 equal set temperature transducers in angle in baking box;
Step 2, the LED after just roasting is positioned in baking box, controls baking box work;
Step 3, the temperature arranging baking box are 120 ~ 150 DEG C, and arranging baking time is 20 ~ 30 minutes;
Step 4, temperature sensor detect the temperature in baking box in real time, and are sent to peripheral control unit, and controller judges that whether the numerical value that 8 temperature sensors send is consistent, if unanimously, performs step 5, otherwise, perform step 6;
Step 5, controller judge whether baking time arrives, if baking time arrives, stop baking, otherwise, repeated execution of steps 5;
Step 6, the numerical value of 8 temperature sensor collections to be compared with the temperature threshold preset, if the numerical value of temperature sensor collection is greater than temperature threshold, control the corresponding heater cooling of this temperature sensor, if the numerical value of temperature sensor collection is less than temperature threshold, controls the corresponding heater of this temperature sensor and heat;
Step 7, repeated execution of steps 4 to step 6, baked until long.
Step 8, control heater stop.
In described step 3, the temperature of baking box is 135 DEG C, and baking time is 25 minutes.
Described heater and conveyer are all wirelessly connected with controller.
Described controller comprises central processing unit, display unit, memory cell, data transmission unit, control panel, shown display unit is for showing work at present data and setting data, described memory cell is for storing the intermediate data produced in the technique, working procedure parameter and the course of work that preset, data transmission unit is used for the data of transmitting control data and work feedback, and control panel is for arranging the technique, the working procedure parameter that preset.
The central processing unit of described controller is the fpga chip of Spartan-6 series.
Compared with prior art, the present invention has following beneficial effect:
1, the LED of the long roasting sclerosis of the method, because roasting the temperature inside the box remains regional constant temperature, and can regulate automatically, the LED color after long baking is consistent, is not easy variable color.
2, adopt wireless way for transmitting, do not need external wire rod, saved space, improve the efficiency of transfer of data.
3, Spartan-6 family chip has the optimum balance of low-risk, low cost and low-power consumption, and compared with earlier generations device, not only lower power consumption 42%, performance improves 12% simultaneously.Spartan-6 family chip can meet the requirement of LED display to data transmission bauds and precision, meanwhile, reduces the cost of whole LED display.
Embodiment
Structure of the present invention and the course of work are described further below.
Length in LED bakes a method for curing, comprises the steps:
Step 1, by 8 equal set temperature transducers in angle in baking box;
Step 2, the LED after just roasting is positioned in baking box, controls baking box work;
Step 3, the temperature arranging baking box are 120 ~ 150 DEG C, and arranging baking time is 20 ~ 30 minutes;
Step 4, temperature sensor detect the temperature in baking box in real time, and are sent to peripheral control unit, and controller judges that whether the numerical value that 8 temperature sensors send is consistent, if unanimously, performs step 5, otherwise, perform step 6;
Step 5, controller judge whether baking time arrives, if baking time arrives, stop baking, otherwise, repeated execution of steps 5;
Step 6, the numerical value of 8 temperature sensor collections to be compared with the temperature threshold preset, if the numerical value of temperature sensor collection is greater than temperature threshold, control the corresponding heater cooling of this temperature sensor, if the numerical value of temperature sensor collection is less than temperature threshold, controls the corresponding heater of this temperature sensor and heat;
Step 7, repeated execution of steps 4 to step 6, baked until long.
Step 8, control heater stop.
In described step 3, the temperature of baking box is 135 DEG C, and baking time is 25 minutes.
Described heater and conveyer are all wirelessly connected with controller.
Described controller comprises central processing unit, display unit, memory cell, data transmission unit, control panel, shown display unit is for showing work at present data and setting data, described memory cell is for storing the intermediate data produced in the technique, working procedure parameter and the course of work that preset, data transmission unit is used for the data of transmitting control data and work feedback, and control panel is for arranging the technique, the working procedure parameter that preset.
The central processing unit of described controller is the fpga chip of Spartan-6 series.
Spartan-6 family chip has the optimum balance of low-risk, low cost and low-power consumption, and compared with earlier generations device, not only lower power consumption 42%, performance improves 12% simultaneously.Spartan-6 family chip can meet the requirement of LED display to data transmission bauds and precision, meanwhile, reduces the cost of whole LED display.
Spartan-6 series not only has leading system integration ability, can also realize the minimum total cost being applicable to high volume applications simultaneously.This series is by 13 member compositions, and available density is not from 3840 logical blocks to 147443 logical blocks etc.Compared with previous generation Spartan series, this serial power consumption be only its 50%, and speed is faster, linkage function is more comprehensively abundant.Spartan-6 series adopts the manufacture of ripe 45nm low-power consumption copper wiring technology, the perfection achieving cost performance and power consumption balances, brand-new and more efficient pair register 6 can be provided to input look-up table (LUT) logic and a series of abundant built-in system level module, comprising 18Kb (2 x 9Kb) Block RAM, second generation DSP48A1 Slice, SDRAM Memory Controller, enhancement mode mixed mode Clock management module, SelectIO technology, the high speed serialization transceiver module of power optimization, the compatible endpoint module of PCI Express, AS level power supply management mode, automatic detection config option, and by AES and Device DNA defencive function realize enhanced ip fail safe.These excellent specific properties provide the replacement scheme able to programme of low cost for customizing ASIC product with unprecedented ease for use.Spartan-6 FPGA can be logical design in enormous quantities, is that the DSP design of guiding and cost-sensitive Embedded Application provide best solution with consumer.Spartan-6 FPGA has established solid programmable chip basis, is highly suitable for the target design platform that can provide integrated software and hardware assembly, energy can be focused on innovation work to make designer at the beginning of development starts.
Claims (6)
1. the length in LED bakes a method for curing, it is characterized in that: comprise the steps:
Step 1, by 8 equal set temperature transducers in angle in baking box;
Step 2, the LED after just roasting is positioned in baking box, controls baking box work;
Step 3, the temperature arranging baking box are 120 ~ 150 DEG C, and arranging baking time is 20 ~ 30 minutes;
Step 4, temperature sensor detect the temperature in baking box in real time, and are sent to peripheral control unit, and controller judges that whether the numerical value that 8 temperature sensors send is consistent, if unanimously, performs step 5, otherwise, perform step 6;
Step 5, controller judge whether baking time arrives, if baking time arrives, stop baking, otherwise, repeated execution of steps 5;
Step 6, the numerical value of 8 temperature sensor collections to be compared with the temperature threshold preset, if the numerical value of temperature sensor collection is greater than temperature threshold, control the corresponding heater cooling of this temperature sensor, if the numerical value of temperature sensor collection is less than temperature threshold, controls the corresponding heater of this temperature sensor and heat;
Step 7, repeated execution of steps 4 to step 6, baked until long.
2. step 8, control heater stop.
3. the length in LED according to claim 1 bakes method for curing, it is characterized in that: in described step 3, the temperature of baking box is 135 DEG C, and baking time is 25 minutes.
4. the length in LED according to claim 1 bakes method for curing, it is characterized in that: described heater and conveyer are all wirelessly connected with controller.
5. the length in LED according to claim 3 bakes method for curing, it is characterized in that: described controller comprises central processing unit, display unit, memory cell, data transmission unit, control panel, shown display unit is for showing work at present data and setting data, described memory cell is for storing the intermediate data produced in the technique, working procedure parameter and the course of work that preset, data transmission unit is used for the data of transmitting control data and work feedback, and control panel is for arranging the technique, the working procedure parameter that preset.
6. the length in LED according to claim 4 bakes method for curing, it is characterized in that: the central processing unit of described controller is the fpga chip of Spartan-6 series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510460060.6A CN105023997A (en) | 2015-07-31 | 2015-07-31 | Long-time baking hardening method in LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510460060.6A CN105023997A (en) | 2015-07-31 | 2015-07-31 | Long-time baking hardening method in LED packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105023997A true CN105023997A (en) | 2015-11-04 |
Family
ID=54413815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510460060.6A Pending CN105023997A (en) | 2015-07-31 | 2015-07-31 | Long-time baking hardening method in LED packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105023997A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107037841A (en) * | 2016-02-04 | 2017-08-11 | 北新集团建材股份有限公司 | Plastic packaging temperature control equipment and method and packaging machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203465028U (en) * | 2013-08-16 | 2014-03-05 | 肇庆爱晟电子科技有限公司 | Multi-channel temperature monitor based on NTC temperature sensor |
| CN204116993U (en) * | 2014-03-31 | 2015-01-21 | 皖西学院 | A kind of temperature control system |
| CN104659168A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | Crystal fixing method for LED and manufacturing method for high-power LED lamps |
-
2015
- 2015-07-31 CN CN201510460060.6A patent/CN105023997A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203465028U (en) * | 2013-08-16 | 2014-03-05 | 肇庆爱晟电子科技有限公司 | Multi-channel temperature monitor based on NTC temperature sensor |
| CN204116993U (en) * | 2014-03-31 | 2015-01-21 | 皖西学院 | A kind of temperature control system |
| CN104659168A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | Crystal fixing method for LED and manufacturing method for high-power LED lamps |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107037841A (en) * | 2016-02-04 | 2017-08-11 | 北新集团建材股份有限公司 | Plastic packaging temperature control equipment and method and packaging machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103029048B (en) | A kind of manufacture method of large size ceramic high speed grinding wheel | |
| CN104393149A (en) | Baking system in LED (Light Emitting Diode) packaging | |
| CN203589082U (en) | Fully-automatic LED packaging device | |
| CN104308315B (en) | A kind of device and method of ceramic component reflow soldering process | |
| CN105140353A (en) | Baking method for direct-insert type light-emitting diode (LED) encapsulation | |
| CN105023997A (en) | Long-time baking hardening method in LED packaging | |
| CN104393150A (en) | Baking temperature control method in LED (Light Emitting Diode) encapsulation | |
| CN102583971A (en) | Hot-melting glass with bowlder effect and manufacturing method of hot-melting glass | |
| CN201569288U (en) | Device for saving alloy smelting furnace cooling water | |
| CN101826591B (en) | LED packaging process | |
| CN104802493A (en) | Bag capsule type pressurized packaging laminating machine | |
| CN201867031U (en) | Automatic constant temperature regulating system for tunnel dryer | |
| CN201930693U (en) | Dehumidifier | |
| CN102430496A (en) | Light emitting diode (LED) powder spotting system and LED powder spotting method | |
| CN104588267A (en) | Fluorescence gum shape preserving scraping coating device for LED filament and scraping coating method | |
| CN205133710U (en) | Efficient aluminium alloy ageing furnace | |
| CN204941837U (en) | A kind of automobile air conditioner compressor radiating piece | |
| CN204459840U (en) | Energy-Saving Intelligent LED Illumination System | |
| CN203565845U (en) | Multi-furnace casting device and chute assembly of aluminum ingot | |
| CN105135066B (en) | A kind of automation fire trapping ring core material production equipment and method | |
| CN204216851U (en) | Microwave power amplifier cooling system | |
| CN208412345U (en) | Packaging system is used in a kind of production of intelligent measurement instrument | |
| CN204120087U (en) | A kind of biscuit heat sink | |
| CN107871807A (en) | A kind of sintering baking oven with small sintering mouth | |
| CN203377253U (en) | Small module high strength LED package structure with green chip and red fluorescence powder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151104 |
|
| RJ01 | Rejection of invention patent application after publication |