CN101826591B - LED packaging process - Google Patents
LED packaging process Download PDFInfo
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- CN101826591B CN101826591B CN2010101553244A CN201010155324A CN101826591B CN 101826591 B CN101826591 B CN 101826591B CN 2010101553244 A CN2010101553244 A CN 2010101553244A CN 201010155324 A CN201010155324 A CN 201010155324A CN 101826591 B CN101826591 B CN 101826591B
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Abstract
The invention discloses an LED packaging process, which comprises the following steps of: (1) mixing UV adhesive and magnetized carbon nanotube powder in the weight ratio of 100:5-100:10, uniformly stirring the mixture at the normal temperature and storing the mixture under vacuum for 5 to 10 minutes; (2) injecting the prepared raw materials into a mould for sealing; placing the mould in which the raw material is injected in a magnetic field with a strength of 10 to 15T for 10 to 20 minutes; and curing the material by the irradiation of an ultraviolet lamp; and (3) placing the half-finished product cured by the irradiation of the ultraviolet lamp into a baking box of 60 to 80 DEG C for 10 to 20 minutes and taking the dried product out to finish the curing process. The process can improve the production efficiency of the LED, improve the potential defects of the LED and improve the quality of the LED product.
Description
Technical field:
The present invention relates to the manufacturing technology of electric light source products, relate in particular to a kind of LED packaging technology.
Background technology:
LED means light-emitting diode from the abbreviation of English LIGHT EMITTING DIODE.The simplest light-emitting diode structure comprises, P-N-type semiconductor N, N-N-type semiconductor N and formed between the two PN junction are when electric current passes through diode; At above-mentioned PN junction place; Just produce electric charge carrier, i.e. electronics and hole, electronics combines with the hole and gives off energy with the form of photon.Add specific chemicals at the PN junction place, then can make diode send the light of particular color, can produce blue light, add gallium nitride (GaN) and can produce green glow etc. as adding InGaN (lnGaN).LED have life-span length, power saving, durable, firm, reaction is fast, low used heat and be suitable for advantage such as batch process, so since the invention of self-luminous diode, the development of expanding rapidly of this industry progressively replaces traditional tungsten lamp and fluorescent lamp in the lamp decoration industry.
Existing LED internal structure has generally comprised lens, lead, insulation moulding material, outer lead (pin promptly is installed), crystal-bonding adhesive, LED wafer, lens filling glue, heating column, heat-radiating substrate, these ten parts of phosphor powder layer.In the LED of prior art encapsulation, how in the LED encapsulation process, to dispel the heat and mechanization is produced in batch and become a technical barrier.Heat radiation in the encapsulation process of LED directly has influence on the luminosity and the life-span of LED finished product; The efficient that how to improve batch process then is related to production cost and production cycle.So how quick heat radiating is most important with batch process in the production process of great power LED.Thereby on to the material selection of fixing luminescent wafer and technology controlling and process, strict requirement is arranged, to improve luminous efficiency as much as possible, reduce decay and reduce the production cycle; The general mixture of a kind of metal and resin that uses of traditional great power LED is bound the LED wafer, and still, resin is easy ageing under hot conditions, and heat conductivility is bad, and general conductive coefficient is less than 7W/ (m.K); And, use this type of solid crystal type need dry by the fire in 1.5 hours at least and examine; Production efficiency is low.In the encapsulation of LED lens; Traditional high-power LED encapsulation pattern is in lens, to fill silicones, and this generation pattern complicated operation and production efficiency are low, can't carry out mechanized operation; In the face of the increasing LED market demand, it is very backward that this production model has seemed.The method for packing of LED exists the low technological deficiency of radiating effect production efficiency poor, encapsulation in encapsulation process in the prior art, become those skilled in the art anxious technical problem to be solved.
Summary of the invention:
The objective of the invention is to overcome the deficiency of prior art, a kind of LED packaging technology is provided, can improve LED production efficiency, and can improve the potential defect problem of LED, improve the LED product quality.
The technical scheme that the present invention solves the prior art problem is:
A kind of LED packaging technology the steps include: that (1) mixes with magnetization CNT powder UV glue according to 100: 5 ~ 100: 10 weight ratio, and rearmounted vacuum state preservation 5-10min stirs under the normal temperature; (2) carry out sealing with the good material injecting mould of above-mentioned allotment, the mould that injects above-mentioned raw materials is placed the magnetic field 10min-20min of magnetic field intensity 10-15 tesla; Solidify with ultra violet lamp then; (3) the above-mentioned semi-finished product LED that solidifies through ultra violet lamp is put into 60 ℃ of-80 ℃ of baking oven 10min-20min, taking-up can be accomplished curing process.
The present invention further improves: in the described curing process, the magnetic line of force in its magnetic field is parallel with LAMP formula LED lamp base.Control CNT direction is consistent reach parallel with the LED lamp base, thereby become effective transmission pipeline at bake process chips heat energy, effectively be chip cooling; And in using, be similarly led chip in the future good heat dissipation environment is provided, guaranteed that led chip can be because of overheated and aging decay.
The present invention's improvement further is: described curing process is when carrying out ultra violet lamp curing, and the ultraviolet light light intensity is 80mW/cm
2-150mW/cm
2The time, irradiation time is 1-5 second.
The parameter area of above-mentioned UV glue is following: the curing optical wavelength is 250-350nm, solidify that light exerts oneself is that 1200-2500 microwatt, para-electric press representative value 3.0-4.5 volt, para-electric to press maximum 3.5-5.0 volt.
The present invention is owing to adopt the UV glue added magnetization CNT powder as adhesive material, thereby can be cured through UV-irradiation, not only simplified solidification process, and only needed 1-5 second its curing time, improved production efficiency greatly; In addition; The most important thing is; Owing to added the CNT dusty material, make adhesive material have dredging of good heat energy, effectively prevent to gather and cause chip operation that local overheating influences because of chip heat; Reduce led chip because of the overheated decay that produces, so can improve quality and the life-span of LED.And can be able to adapt to the more high-power LED of production and guarantee its quality.
Embodiment:
Provide most preferred embodiment of the present invention below.
The embodiment of LED packaging technology of the present invention is following: earlier with UV glue and the weight ratio mix of magnetization CNT powder according to 100: 6; Wherein UV glue adopts and to sell the UV-8618UV glue that the prosperous safe adhesive article of the prosperous gold in Shenzhen Co., Ltd produces on the market; Magnetization CNT powder is provided by chemical institute of Hubei University, and the said mixture rearmounted vacuum state that stirs is at normal temperatures preserved 8min;
Carry out the sealing operation with the good material injecting mould of above-mentioned allotment then, the mould that injects above-mentioned raw materials is placed the magnetic field intensity 12 magnetic field 15min of tesla; Use wavelength to be 100mW/cm then as 260nm, light intensity
2Ultra violet lamp make its primary solidification 2 seconds;
Again the above-mentioned semi-finished product LED that solidifies through ultra violet lamp is put into 70 ℃ of baking oven 14min, taking-up can be accomplished curing process.
With the LED product of the packaging technology gained of the embodiment of the invention, with the contrast test data (seeing attached list) of adopting the LED product that the ordinary resin encapsulation produced.First set product is to use the LED product that the packaging technology of the embodiment of the invention is produced in the subordinate list; Second set product is to adopt the LED product that ordinary resin encapsulation is produced in the subordinate list, and wherein the technology controlling and process of resin-encapsulated is baking 1 hour in 120 ℃ of baking ovens, and then in 130 ℃ the oven environment 7 hours and accomplish solidification process.Both power is identical.
Subordinate list is following:
| Numbering | Package curing institute time-consuming | Brightness improves percentage | The temperature ℃ of 24 hours encapsulating materials of energising |
| Product of the present invention | About 30min | 30％ | 50 |
| Contrast product | 8 hours | 0 | 80 |
The above only is preferred embodiment of the present invention, is not structure of the present invention is done any pro forma restriction.Every foundation technical spirit of the present invention all still belongs in the scope of technical scheme of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (2)
1. a LED packaging technology the steps include:
(1) UV glue is mixed according to 100: 5～100: 10 weight ratio with magnetization CNT powder, the rearmounted vacuum state that stirs under the normal temperature is preserved 5-10min;
(2) carry out sealing with the good material injecting mould of above-mentioned allotment, the mould that injects above-mentioned raw materials is placed the magnetic field 10min-20min of magnetic field intensity 10-15 tesla; Solidify with ultra violet lamp then;
(3) the above-mentioned semi-finished product LED that solidifies through ultra violet lamp is put into 60 ℃ of-80 ℃ of baking oven 10min-20min, taking-up can be accomplished curing process;
It is characterized in that: the magnetic line of force in said magnetic field is parallel with LAMP formula LED lamp base.
2. according to the said curing process of claim 1, it is characterized in that: when carrying out ultra violet lamp curing, the ultraviolet light light intensity is 80mW/cm
2-150mW/cm
2The time, irradiation time is 1-5 second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101553244A CN101826591B (en) | 2010-04-23 | 2010-04-23 | LED packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101553244A CN101826591B (en) | 2010-04-23 | 2010-04-23 | LED packaging process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101826591A CN101826591A (en) | 2010-09-08 |
| CN101826591B true CN101826591B (en) | 2012-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101553244A Active CN101826591B (en) | 2010-04-23 | 2010-04-23 | LED packaging process |
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| CN (1) | CN101826591B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468402A (en) * | 2010-11-17 | 2012-05-23 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure, and manufacturing method thereof |
| CN106159060A (en) * | 2015-04-09 | 2016-11-23 | 湖南博元照明科技有限公司 | A kind of LED packaging technology |
| CN109093251B (en) * | 2017-06-20 | 2020-08-04 | 上海微电子装备（集团）股份有限公司 | Laser packaging device and packaging method |
| CN109166957B (en) * | 2018-08-03 | 2020-05-22 | 湖南华特光电科技有限公司 | LED lamp packaging process |
| CN111640851A (en) * | 2020-05-29 | 2020-09-08 | 旭宇光电（深圳）股份有限公司 | Deep ultraviolet LED light source and packaging method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101386194A (en) * | 2007-09-13 | 2009-03-18 | 艺术达科技材料股份有限公司 | Forming method of resin lens in LED module |
| CN101507003A (en) * | 2006-08-17 | 2009-08-12 | 3M创新有限公司 | Method of making a light emitting device having a molded encapsulant |
-
2010
- 2010-04-23 CN CN2010101553244A patent/CN101826591B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101507003A (en) * | 2006-08-17 | 2009-08-12 | 3M创新有限公司 | Method of making a light emitting device having a molded encapsulant |
| CN101386194A (en) * | 2007-09-13 | 2009-03-18 | 艺术达科技材料股份有限公司 | Forming method of resin lens in LED module |
Non-Patent Citations (2)
| Title |
|---|
| E.S.ChOi et al.《Enhancement of thermal and electrical properties of carbon nanotube polymer composites by magnetic field processing》.《JOURNAL OF APPLIED PHYSICS》.2003,第94卷(第9期),第6034页第I部分，第6038页第IV部分. * |
| K.ZHANG et al.《Thermal Interface Material with Aligned CNT and Its Application in HB-LED Packaging》.《2006 Electronic Components and Technology Conference》.2006,第177页. * |
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| CN101826591A (en) | 2010-09-08 |
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