CN105023875A - 一种晶圆升降机构 - Google Patents

一种晶圆升降机构 Download PDF

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Publication number
CN105023875A
CN105023875A CN201510458178.5A CN201510458178A CN105023875A CN 105023875 A CN105023875 A CN 105023875A CN 201510458178 A CN201510458178 A CN 201510458178A CN 105023875 A CN105023875 A CN 105023875A
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CN
China
Prior art keywords
support plate
wafer
lifting mechanism
cylinder
thimble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510458178.5A
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English (en)
Inventor
刘忆军
续震
柴智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Piotech Inc
Original Assignee
Piotech Shenyang Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Piotech Shenyang Co Ltd filed Critical Piotech Shenyang Co Ltd
Priority to CN201510458178.5A priority Critical patent/CN105023875A/zh
Publication of CN105023875A publication Critical patent/CN105023875A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种晶圆升降机构，包括连接件(1)、顶针(2)、支板(3)、加热盘(4)和气缸(5)。支板(3)固定在气缸(5)活塞上。连接件(1)处于支板(3)的上端。顶针(2)固定在支板(3)上。顶针(2)的上端穿过加热盘(4)。本发明结构紧凑合理，可以保证三根顶针同时进行升降，避免了晶圆的滑动现象。

Description

一种晶圆升降机构
技术领域
本发明涉及一种升降机构，尤其是一种晶圆升降机构，主要应用于半导体设备。
背景技术
半导体设备在装调时，三跟顶针托起晶圆进行升降运动。因为三根顶针是分别独立的，所以会发生不是同步升降的情况。这样会导致晶圆在顶针上产生滑动的现象，会影响到后续工艺的结果。
发明内容
针对上述现有技术的不足，本发明提供了一种晶圆升降机构。
为实现上述目的，本发明采用的技术方案是：一种晶圆升降机构，包括连接件(1)、顶针(2)、支板(3)、加热盘(4)和气缸(5)。支板(3)固定在气缸(5)活塞上。连接件(1)处于支板(3)的上端。顶针(2)固定在支板(3)上。顶针(2)的上端穿过加热盘(4)。
本发明结构紧凑合理，可以保证三根顶针同时进行升降，避免了晶圆的滑动现象。
附图说明
图1是本发明的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清晰、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1所示：一种晶圆升降机构，包括连接件1、顶针2、支板3、加热盘4和气缸5。支板3固定在气缸5活塞上。连接件1处于支板3的上端。顶针2固定在支板3上。顶针2的上端穿过加热盘4。
晶圆放置在加热盘4的表面，连接件1装在加热盘4下方，通过螺纹与三根顶针2连接。使三根顶针形成一体化，当气缸动作升起支板3，支板3再托起连接件1，利用连接件1自身的重力保证了三根顶针2可以同时升降。而且三根顶针2与加热盘4衬套不产生摩擦。

Claims (1)

1.一种晶圆升降机构，其特征在于：包括连接件(1)、顶针(2)、支板(3)、加热盘(4)和气缸(5)；支板(3)固定在气缸(5)活塞上，连接件(1)处于支板(3)的上端，顶针(2)固定在支板(3)上，顶针(2)的上端穿过加热盘(4)。
CN201510458178.5A 2015-07-29 2015-07-29 一种晶圆升降机构 Pending CN105023875A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510458178.5A CN105023875A (zh) 2015-07-29 2015-07-29 一种晶圆升降机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510458178.5A CN105023875A (zh) 2015-07-29 2015-07-29 一种晶圆升降机构

Publications (1)

Publication Number Publication Date
CN105023875A true CN105023875A (zh) 2015-11-04

Family

ID=54413739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510458178.5A Pending CN105023875A (zh) 2015-07-29 2015-07-29 一种晶圆升降机构

Country Status (1)

Country Link
CN (1) CN105023875A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107424952A (zh) * 2016-05-24 2017-12-01 沈阳芯源微电子设备有限公司 一种晶圆升降机构
CN111336792A (zh) * 2018-12-19 2020-06-26 江苏鲁汶仪器有限公司 一种干燥微水珠的腔体
CN113814114A (zh) * 2020-07-17 2021-12-21 常州铭赛机器人科技股份有限公司 多工位点胶机及其点胶方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060156987A1 (en) * 2005-01-18 2006-07-20 Chien-Hsing Lai Lift pin mechanism and substrate carrying device of a process chamber
KR20060118742A (ko) * 2005-05-17 2006-11-24 삼성전자주식회사 웨이퍼 리프팅 장치
CN202487551U (zh) * 2012-03-19 2012-10-10 理想能源设备(上海)有限公司 基板传输机构
CN103094149A (zh) * 2011-10-27 2013-05-08 沈阳芯源微电子设备有限公司 一种防止晶片翘曲的烘烤装置及其烘烤方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060156987A1 (en) * 2005-01-18 2006-07-20 Chien-Hsing Lai Lift pin mechanism and substrate carrying device of a process chamber
KR20060118742A (ko) * 2005-05-17 2006-11-24 삼성전자주식회사 웨이퍼 리프팅 장치
CN103094149A (zh) * 2011-10-27 2013-05-08 沈阳芯源微电子设备有限公司 一种防止晶片翘曲的烘烤装置及其烘烤方法
CN202487551U (zh) * 2012-03-19 2012-10-10 理想能源设备(上海)有限公司 基板传输机构

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107424952A (zh) * 2016-05-24 2017-12-01 沈阳芯源微电子设备有限公司 一种晶圆升降机构
CN111336792A (zh) * 2018-12-19 2020-06-26 江苏鲁汶仪器有限公司 一种干燥微水珠的腔体
CN111336792B (zh) * 2018-12-19 2022-03-11 江苏鲁汶仪器有限公司 一种干燥微水珠的腔体
CN113814114A (zh) * 2020-07-17 2021-12-21 常州铭赛机器人科技股份有限公司 多工位点胶机及其点胶方法

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Application publication date: 20151104