CN105023750A - Multi-layered ceramic capacitor - Google Patents
Multi-layered ceramic capacitor Download PDFInfo
- Publication number
- CN105023750A CN105023750A CN201410707802.6A CN201410707802A CN105023750A CN 105023750 A CN105023750 A CN 105023750A CN 201410707802 A CN201410707802 A CN 201410707802A CN 105023750 A CN105023750 A CN 105023750A
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- China
- Prior art keywords
- internal electrode
- lead portion
- multilayer ceramic
- body part
- ceramic capacitor
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The invention discloses a MULTI-LAYERED CERAMIC CAPACITOR, which comprises: a ceramic body, wherein a plurality of dielectric layers are stacked in the ceramic body; a first external electrodes and second external electrodes of different polarity; and a plurality of internal electrodes comprising a plurality of body portions and a plurality of lead portions, said multi-overlap each other in a body portion of the ceramic body, at least one of said dielectric layer is interposed between said body portion, said plurality of lead portions are extending from the body portion of said plurality and alternately connected to the first external electrode and the second external electrode. Internal electrodes having lead parts adjacent to a common polarity internal electrodes are not overlapped.
Description
The cross reference of related application
This application claims and be committed to the priority of the korean patent application No.10-2014-0047381 of Korean Intellectual Property Office on April 21st, 2014, the content of this application combines so far by reference.
Technical field
The present invention relates to a kind of ceramic capacitor.
Background technology
The example employing the electronic component of ceramic material comprises capacitor, inductor, piezoelectric element, rheostat, thermistor etc.
Multilayer ceramic capacitor (MICC) is the one of ceramic electronic component, due to its inherent advantages, such as size is relatively little, high capacitance and be easy to install, multilayer ceramic capacitor may be used in various electronic equipment.
For charge or discharge on the circuit board that multilayer ceramic capacitor can be arranged on electronic product, described electronic product is as computer, personal digital assistant (PDA), mobile phone etc.
In the process manufacturing this multilayer ceramic capacitor, can the internal electrode with predetermined thickness be set on the dielectric layer, each internal electrode occupies the area less than the area of dielectric layer on the dielectric layer, and then, the dielectric layer being formed with internal electrode can be stacked up.Thus, can be formed and be provided with the step part between the active region of internal electrode and the white space not being provided with internal electrode.
In addition, in the process manufacturing this multilayer ceramic capacitor, multiple dielectric layer and internal electrode can be stacking, then compress with the pressure of predetermined extent.In this case, owing to there is step part, white space may be further compressed, and thus, compared with the density of active region, white space has the density of increase at the thickness direction of ceramic body.
Now, with the blank parts of ceramic body along the Width of this ceramic body situation differently, when the marginal portion of ceramic body is along the length direction of this ceramic body, the every alternating floor of lead portion of internal electrode occurs.
Therefore, when multiple dielectric layer and multiple internal electrode is stacking then compress time, lead portion can resist compression, the blank parts compression degree alongst of ceramic body can be less than the compression degree of blank parts along Width of ceramic body, thus the blank parts of ceramic body length direction density can relatively lower than the blank parts of ceramic body along the density of Width.
[correlation technique file]
(patent document 1) Korean Patent No.587006
Summary of the invention
The multilayer ceramic capacitor that a kind of illustrative embodiments of the present invention can provide a kind of reliability to improve.
According to a kind of illustrative embodiments of the present invention, multilayer ceramic capacitor can comprise: ceramic body, and stacking in this ceramic body have multiple dielectric layer; There is the first outer electrode and second outer electrode of opposed polarity; And, multiple internal electrode, described multiple internal electrode comprises multiple body part and multiple lead portion, described multiple body part is set to overlap each other in described ceramic body, and between described multiple body part, be inserted with dielectric layer described at least one, described multiple lead portion is respectively since the described body part of multiple correspondence extends and is alternately connected to described first outer electrode and described second outer electrode, wherein, the lead portion with the adjacent internal electrode of common polarization in described internal electrode is arranged in non-overlapped mode.
Accompanying drawing explanation
According to following detailed description by reference to the accompanying drawings, above-mentioned and other side, feature and advantage of the present invention more clearly will be understood, wherein:
Fig. 1 is the schematic perspective view of the multilayer ceramic capacitor according to a kind of illustrative embodiments of the present invention;
Fig. 2 is the cutaway view along Fig. 1 center line A-A ';
Fig. 3 is the exploded perspective schematic diagram of the multilayer ceramic capacitor according to a kind of illustrative embodiments of the present invention, comprising dielectric layer, internal electrode and dielectric covering layer;
Fig. 4 is the cutaway view along Fig. 1 center line B-B ';
Fig. 5 is the plane graph of the internal electrode of multilayer ceramic capacitor according to another kind of illustrative embodiments of the present invention; And
Fig. 6 is the plane graph of the internal electrode of multilayer ceramic capacitor according to another kind of illustrative embodiments of the present invention.
Embodiment
Below with reference to the accompanying drawings embodiments of the present invention are described in detail.
But the present invention can realize in many different forms, and should not be construed the particular implementation being confined to describe in this specification.On the contrary, the object of these execution modes is to make the present invention comprehensively and thoroughly, and scope of the present invention is showed those skilled in the art fully.
In the accompanying drawings, for the sake of clarity, the shape and size of element may be exaggerated, and the identical Reference numeral of use is represented same or analogous element.
Fig. 1 is the schematic perspective view of the multilayer ceramic capacitor according to a kind of illustrative embodiments of the present invention; Fig. 2 is the cutaway view along Fig. 1 center line A-A '; Fig. 3 is the exploded perspective schematic diagram of multilayer ceramic capacitor, and comprising dielectric layer, internal electrode and dielectric covering layer, outer electrode is separated from described multilayer ceramic capacitor.
Referring to figs. 1 to Fig. 3, ceramic body 110, first and second outer electrode 131,132 and first to fourth internal electrode 121-124 can be comprised according to the multilayer ceramic capacitor 100 of a kind of illustrative embodiments of the present invention.
By the stacking multiple dielectric layer 111 of thickness direction T along ceramic body, then can sinter the plurality of dielectric layer 111 and form ceramic body 110.
In this case, the adjacent dielectric 111 of ceramic body 110 can be combined with each other, thus the border between them is not clearly.
Ceramic body 110 can have hexahedral present situation, but is not limited to this.
In this illustrative embodiments, conveniently explain, directional terminology is defined as follows: the upper surface 1 of ceramic body 110 and lower surface 2 refer to the thickness direction T surfaces opposite to each other along this ceramic body 110 of ceramic body 110, and the dielectric layer 111 of ceramic body 110 is stacking along described thickness direction T; First end face 3 of ceramic body 110 and the second end face 4 refer to surface upper surface 1 and lower surface 2 are connected to each other of ceramic body 110, simultaneously this surface along ceramic body 110 length direction L toward each other; 3rd side surface 5 of ceramic body 110 and the 4th side surface 6 refer to the surface crossing with the first end face 3 and the second end face 4 of ceramic body 110, simultaneously this surface along ceramic body 110 Width W toward each other.
Meanwhile, ceramic body 110 can have the upper dielectric covering layer 112 be formed in above the superiors' internal electrode and the lower dielectric covering layer 113 be formed in below orlop internal electrode, and wherein, this upper and lower dielectric covering layer can have predetermined thickness.
In this case, dielectric covering layer 112 can be formed by the composition identical with the composition of dielectric layer 111 with 113, and can be formed by least one or more dielectric layer without internal electrode stacking on the upper surface and lower surface of ceramic body 110.
Dielectric layer 111 can comprise high potassium (high-k) ceramic material, such as barium titanate (BaTiO3) based ceramic powder end etc.But the material of dielectric layer is not limited to this.
The example at barium titanate (BaTiO3) based ceramic powder end comprises (Ba
1-xca
x) TiO
3, Ba (Ti
1-yca
y) O
3, (Ba
1-xca
x) (Ti
1-yzr
y) O
3, Ba (Ti
1-yzr
y) O
3deng, wherein Ca, Zr etc. are partly dissolved in BaTiO
3in.But the present invention is not limited to this.
In addition, dielectric layer 111 can also comprise at least one in ceramic additive, organic solvent, plasticizer, adhesive and dispersant.
With regard to ceramic additive, for example, transition metal oxide or carbide, rare earth element, magnesium (Mg), aluminium (Al) etc. can be used.
First outer electrode 131 and the second outer electrode 132 can be separately positioned on two end sections of ceramic body 110, and in case of need, the upper surface 1 of ceramic body 110 and the part of lower surface 2 can be extended to respectively from the first end face 3 of ceramic body 110 and the second end face 4, or extend to the 3rd side surface 5 of ceramic body 110 and the part of the 4th side surface 6 respectively.
In this case, by the conductive paste of two end section coatings containing conducting metal to ceramic body 110, and this conductive paste can be sintered and forms the first external electrode 131 and the second outer electrode 132.
Conducting metal can be nickel (Ni), copper (Cu), palladium (Pd) or their alloy.
Meanwhile, if desired, the first external electrode 131 and the second outer electrode 132 can have the coating formed by carrying out plating over their surface.
Coating can comprise by respectively on the first outer electrode and the second outer electrode nickel plating (Ni) and formed nickel coating and by zinc-plated on nickel coating (Sn) and formed tin coating.
First to fourth internal electrode 121-124 can be arranged alternately along the thickness direction of ceramic body 110, is inserted with at least one dielectric layer 111 between them simultaneously.
In this case, first to fourth internal electrode 121-124 can be insulated from each other by the dielectric layer 111 inserted between which.
In this case, first to fourth internal electrode 121-124 can be formed in the following manner: use the conductive paste containing conducting metal on each ceramic green sheet forming dielectric layer 111, to print each internal electrode pattern by silk screen print method, woodburytype etc., then be printed with the ceramic green sheet of internal electrode pattern by the first internal electrode to the sequence stack of the 4th internal electrode, and sinter this stacking ceramic green sheet.
Conducting metal can be nickel (Ni), copper (Cu), palladium (Pd) or their alloy.But the present invention is not limited to this.
First to fourth internal electrode 121-124 can be comprised and is set to overlap each other and is inserted with first to fourth body part 121a-124a of each dielectric layer therebetween and extends and the first to fourth lead portion 121b-124b exposed by one of ceramic body 110 surface from first to fourth body part 121a-124a respectively.
In this case, first to fourth internal electrode 121-124 can be arranged so that the internal electrode being applied with the different voltage of polarity is connected to the first outer electrode 131 and the second outer electrode 132, and passes through the first end face 3 and the alternately exposure of the second end face 4 of ceramic body 110.
In this illustrative embodiments, first internal electrode 121 can comprise the first noumenon part 121a and the first lead portion 121b, first lead portion 121b extends to the first end face 3 of ceramic body 110 from the first noumenon part 121a, thus is connected to the first outer electrode 131.
Second internal electrode 122 can be applied with the voltage that polarity is different from the polarity of the voltage putting on the first internal electrode, and the second body part 122a and the second lead portion 122b can be comprised, described second body part 122a is set in ceramic body 110 overlapping with the first noumenon part 121a, second lead portion 122b extends to the second end face 4 of ceramic body 110 from the second body part 122a, thus is connected to the second outer electrode 132.
3rd internal electrode 123 can be applied with the polarity voltage identical with the polarity of the voltage putting on the first internal electrode 121, and the 3rd body part 123a and the 3rd lead portion 123b can be comprised, 3rd body part 123a is set in ceramic body 110 overlapping with the second body part 122a, 3rd lead portion 123b extends to the first end face 3 of ceramic body 110 from the 3rd body part 123a, thus is connected to the first outer electrode 131.Herein, the 3rd internal electrode 123 can be set to not overlapping with the first lead portion 121b.
4th internal electrode 124 can be applied with the polarity voltage identical with the polarity of the voltage putting on the second internal electrode 122, and the 4th body part 124a and the 4th lead portion 124b can be comprised, 4th body part 124a is set in ceramic body 110 overlapping with the 3rd body part 123a, 4th lead portion 124b extends to the second end face 4 of ceramic body 110 from the 4th body part 124a, thus is connected to the second outer electrode 132.Herein, the 4th internal electrode 124 can be set to not overlapping with the second lead portion 122b.
Due to above setting, when applying voltage to the first outer electrode 131 and the second outer electrode 132, can between the first to fourth internal electrode 121-124 faced one another stored charge.
Herein, the electric capacity of multilayer ceramic capacitor 100 can be directly proportional to the area along the region that the stacking direction of first to fourth internal electrode 121-124 overlaps each other of first to fourth body part 121a-124a.
In this illustrative embodiments, the corner part 121c that first lead portion 121b of the first internal electrode 121 can be formed as making it be close in the 3rd side surface 5 of ceramic body 110 forms step, and the corner part 123c that the 3rd lead portion 123b of the 3rd internal electrode 123 can be formed as making it be close in the 4th side surface 6 of ceramic body 110 forms step.In this case, the Breadth Maximum of the first lead portion 121b and the 3rd lead portion 123b can be less than 1/2 of the width of the first noumenon part 121a and the 3rd body part 123a.
With reference to figure 4, the first lead portion 121b can be set to be biased to the left side in Fig. 4, and the 3rd lead portion 121b can be set to biased to the right side in Fig. 4.
Therefore, although the first internal electrode 121 is applied with the identical voltage of polarity with the 3rd internal electrode 123, but because the first adjacent lead portion 121b and the 3rd lead portion 123b is set to not overlap each other, thus, compared with the structure of multilayer ceramic capacitor of the prior art, the white space alongst of ceramic body 110 can increase about twice.
Simultaneously, due to except the second lead portion 122b and the 4th lead portion 124b by ceramic body 110 second end face 4 expose except, the structure of the second internal electrode 122 and the 4th internal electrode 124 and the structural similarity of the first internal electrode 121 and the 3rd internal electrode 123, no longer carry out repeated description at this.Reference numeral 122c and 124c represents the corner part of the second internal electrode 122 and the 4th internal electrode 124 respectively.
Usually, in the process manufacturing multilayer ceramic capacitor, wherein stacking multiple dielectric layer and multiple internal electrode, then compress with predetermined pressure, white space can be further compressed by the direction compressed along multiple dielectric layer and multiple internal electrode due to step part while being compressed by pressure, thus, compared with active region, white space has the density of improvement along the thickness direction of ceramic body.
According to this illustrative embodiments, the region area that the lead portion of the internal electrode appeared in the white space alongst of ceramic body due to every alternating floor overlaps each other is reduced to 1/2 of respective area in prior art, when then stacking multiple dielectric layer and multiple internal electrode compress, compared with prior art, the amount of the white space alongst of ceramic body can be increased, thus, the density of the white space alongst of ceramic body can be improved further.
Therefore, due to the mechanical strength of above-mentioned improvement, the reliability of multilayer ceramic capacitor improves.
Fig. 5 is the plane graph of the internal electrode of multilayer ceramic capacitor according to another kind of illustrative embodiments of the present invention.
In this embodiment, in order to avoid repeated description, omit the detailed description to the structure with the structural similarity in foregoing exemplary embodiment, the first to fourth lead portion 1210b-1240b with the structure different from the structure of first to fourth lead portion of the multilayer ceramic capacitor in foregoing exemplary embodiment will be described in detail.The direction of ceramic body and surface reference Fig. 1 limit.
With reference to figure 5, first to fourth body part 1210a-1240a can be comprised respectively according to first to fourth internal electrode 1210-1240 of the another kind of illustrative embodiments of the present invention and respectively from first to fourth lead portion 1210b-1240b of this first to fourth body part 1210a-1240a extension.
The corner part 1210c that first lead portion 1210b of the first internal electrode 1210 can be formed as making it be close in the 3rd side surface 5 of ceramic body 110 forms step, and the corner part 1230c that the 3rd lead portion 1230b of the 3rd internal electrode 1230 can be formed as making it be close in the 4th side surface 6 of ceramic body 110 forms step.In this case, the Breadth Maximum of the first lead portion 1210b and the 3rd lead portion 1230b can be less than 1/2 of the width of the first noumenon part 1210a and the 3rd body part 1230a.
In this case, the first lead portion 1210b and the 3rd lead portion 1230b can be formed as making their side 1210d and 1230d to tilt.
Due to except the second lead portion 1220b and the 4th lead portion 1240b by ceramic body 110 second end face 4 expose except, the structure of the second internal electrode 1220 and the 4th internal electrode 1240 and the structural similarity of the first internal electrode 1210 and the 3rd internal electrode 1230, no longer carry out repeated description at this.Reference numeral 1220c and 1240c represents the corner part of the second internal electrode 1220 and the 4th internal electrode 1240 respectively.
Meanwhile, if necessary, various change can be had according to the shape of the first lead portion of illustrative embodiments and the 3rd lead portion in the present invention.
Such as, as shown in Figure 6, if necessary, the first lead portion 1210b ' and the 3rd lead portion 1230b ' can have both sides 1210d ', 1210e ' and 1230d ', the 1230e ' of inclination respectively, and they can be formed as the shape with taper thus.
Reference numeral 1210c '-1240c ' represents first to fourth internal electrode 1210 '-1240 respectively ' corner part.
In this case, can narrow gradually towards the first end face 3, first lead portion 1210b ' of ceramic body and the width of the 3rd lead portion 1230b '.
Due to except the second lead portion 1220b ' and the 4th lead portion 1240b ' by ceramic body 110 second end face 4 expose except, the structural similarity of the structure of the second internal electrode 1220 ' and the 4th internal electrode 1240 ' and the first internal electrode 1210 ' and the 3rd internal electrode 1230 ', no longer carries out repeated description at this.Reference numeral 1220d ', 1220e ', 1240d ' and 1240e ' represent the second lead portion 1220b ' of the second internal electrode 1220 ' and the 4th internal electrode 1240 ' and the both sides of the 4th lead portion 1240b ' respectively.
As mentioned above, according to an illustrative embodiment of the invention, because mechanical strength improves, the reliability of multilayer ceramic capacitor can be improved.
Although show and describe illustrative embodiments, for those skilled in the art apparently, when not departing from the scope of the present invention limited by the claims of enclosing, modifications and variations can be made above.
Claims (12)
1. a multilayer ceramic capacitor, this multilayer ceramic capacitor comprises:
Ceramic body, stacking in this ceramic body have multiple dielectric layer;
There is the first outer electrode and second outer electrode of opposed polarity; And
Multiple internal electrode, described multiple internal electrode comprises multiple body part and multiple lead portion, described multiple body part is set to overlap each other in described ceramic body, and be inserted with dielectric layer described at least one between described multiple body part, described multiple lead portion is respectively since the described body part of multiple correspondence extends and is alternately connected to described first outer electrode and described second outer electrode;
Wherein, the lead portion with the adjacent internal electrode of common polarization in described internal electrode is arranged in non-overlapped mode.
2. multilayer ceramic capacitor as claimed in claim 1, wherein, a corner part of described lead portion forms step, and
Described in each, the width of lead portion is less than 1/2 of the width of body part described in each.
3. multilayer ceramic capacitor as claimed in claim 2, wherein, the lopsidedness of the described lead portion of described internal electrode.
4. multilayer ceramic capacitor as claimed in claim 2, wherein, described lead portion is taper.
5. multilayer ceramic capacitor as claimed in claim 2, wherein, the width of described lead portion narrows gradually towards a surface of described ceramic body.
6. multilayer ceramic capacitor as claimed in claim 1, wherein, described ceramic body has dielectric covering layer, and at least one in described dielectric covering layer is arranged on the top of the internal electrode of the superiors and the below of undermost internal electrode.
7. a multilayer ceramic capacitor, this multilayer ceramic capacitor comprises:
Ceramic body, has multiple dielectric layer along the thickness direction of this ceramic body is stacking in this ceramic body;
First outer electrode and the second outer electrode, this first outer electrode and the second outer electrode are separately positioned on the two end portions of described ceramic body; And
First internal electrode is to the 4th internal electrode, and described first internal electrode is arranged alternately to the 4th internal electrode along the thickness direction of described ceramic body, and is inserted with at least dielectric layer described in one deck between this first internal electrode to the 4th internal electrode,
Wherein, described first internal electrode comprises the first noumenon part and extends with the first lead portion being connected to described first outer electrode from this first noumenon part,
Described second internal electrode to comprise with described the first noumenon partly overlapping second body part and extends the second lead portion to be connected to described second outer electrode from this second body part,
Described 3rd internal electrode comprises three body part overlapping with described second body part and extends the 3rd lead portion to be connected to described first outer electrode from the 3rd body part, described 3rd lead portion is set to not overlapping with described first lead portion, and
Described 4th internal electrode comprises four body part overlapping with described 3rd body part and extends the 4th lead portion to be connected to described second outer electrode from the 4th body part, and described 4th lead portion is set to not overlapping with described second lead portion.
8. multilayer ceramic capacitor as claimed in claim 7, wherein, a corner part of described first to fourth lead portion forms step, and
The width of each of described first to fourth lead portion is less than 1/2 of the width of each in described first to fourth body part.
9. multilayer ceramic capacitor as claimed in claim 8, wherein, the lopsidedness of described first to fourth lead portion of described first to fourth internal electrode.
10. multilayer ceramic capacitor as claimed in claim 8, wherein, described first to fourth lead portion is taper.
11. multilayer ceramic capacitors as claimed in claim 8, wherein, the width of each in described first to fourth lead portion narrows gradually towards a surface of described ceramic body.
12. multilayer ceramic capacitors as claimed in claim 7, wherein, described ceramic body has dielectric covering layer, and at least one in described dielectric covering layer is arranged on the top of the internal electrode of the superiors and the below of undermost internal electrode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0047381 | 2014-04-21 | ||
| KR1020140047381A KR20150121479A (en) | 2014-04-21 | 2014-04-21 | Multi-layered ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105023750A true CN105023750A (en) | 2015-11-04 |
Family
ID=54413642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410707802.6A Pending CN105023750A (en) | 2014-04-21 | 2014-11-28 | Multi-layered ceramic capacitor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2015207749A (en) |
| KR (1) | KR20150121479A (en) |
| CN (1) | CN105023750A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735507A (en) * | 2017-04-13 | 2018-11-02 | 三星电机株式会社 | Multilayer ceramic capacitor and plate with multilayer ceramic capacitor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210075670A (en) | 2019-12-13 | 2021-06-23 | 삼성전기주식회사 | Multilayered capacitor |
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|---|---|---|---|---|
| JP2000150292A (en) * | 1998-11-17 | 2000-05-30 | Tokin Ceramics Corp | Layered ceramic capacitor |
| CN1427429A (en) * | 2001-12-03 | 2003-07-02 | Tdk株式会社 | Stacked capacitor |
| JP2004140211A (en) * | 2002-10-18 | 2004-05-13 | Murata Mfg Co Ltd | Multilayer capacitor |
| CN1705047A (en) * | 2004-05-31 | 2005-12-07 | Tdk股份有限公司 | Multilayer capacitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11154621A (en) * | 1997-11-20 | 1999-06-08 | Tdk Corp | Laminated ceramic chip capacitor arrays |
-
2014
- 2014-04-21 KR KR1020140047381A patent/KR20150121479A/en active Search and Examination
- 2014-07-02 JP JP2014136554A patent/JP2015207749A/en active Pending
- 2014-11-28 CN CN201410707802.6A patent/CN105023750A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150292A (en) * | 1998-11-17 | 2000-05-30 | Tokin Ceramics Corp | Layered ceramic capacitor |
| CN1427429A (en) * | 2001-12-03 | 2003-07-02 | Tdk株式会社 | Stacked capacitor |
| JP2004140211A (en) * | 2002-10-18 | 2004-05-13 | Murata Mfg Co Ltd | Multilayer capacitor |
| CN1705047A (en) * | 2004-05-31 | 2005-12-07 | Tdk股份有限公司 | Multilayer capacitor |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735507A (en) * | 2017-04-13 | 2018-11-02 | 三星电机株式会社 | Multilayer ceramic capacitor and plate with multilayer ceramic capacitor |
| CN108735507B (en) * | 2017-04-13 | 2019-11-12 | 三星电机株式会社 | Multilayer ceramic capacitor and plate with multilayer ceramic capacitor |
| US10475574B2 (en) | 2017-04-13 | 2019-11-12 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
| US10522285B2 (en) | 2017-04-13 | 2019-12-31 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
| US11062845B2 (en) | 2017-04-13 | 2021-07-13 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
| US11569033B2 (en) | 2017-04-13 | 2023-01-31 | Samsung Electro-Mechanics Co., Ltd | Multilayer ceramic capacitor and board having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015207749A (en) | 2015-11-19 |
| KR20150121479A (en) | 2015-10-29 |
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