CN105021099B - A kind of large scale is ground silicon wafer warpage measured material - Google Patents
A kind of large scale is ground silicon wafer warpage measured material Download PDFInfo
- Publication number
- CN105021099B CN105021099B CN201510420124.XA CN201510420124A CN105021099B CN 105021099 B CN105021099 B CN 105021099B CN 201510420124 A CN201510420124 A CN 201510420124A CN 105021099 B CN105021099 B CN 105021099B
- Authority
- CN
- China
- Prior art keywords
- turntable
- leg
- plate
- silicon wafer
- adjustment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of large scale to be ground silicon wafer warpage measured material.It includes supporting construction and adjustment structure；Supporting construction is made up of leg, leg balance plate, the first picking-up plate, bottom supporting table, the second picking-up plate, top braces platform；Adjustment structure is made up of regulation handle, ball bearing, regulation mat, adjustment axis, adjustment gear, driven gear, turntable axle, turntable, connecting stud, traction pin, supporting studs, support column, support ball.By rotating regulation handle, adjustment gear drives driven gear rotation, so that turntable rotates；Turntable driving traction pin rotation offset, so as to drive groove of the support column along top braces platform inwardly or outwardly to move.The present invention can meet the support and positioning during to the grinding silicon wafer warpage measurement of different sizes, coordinate silicon wafer warpage equipment to be ground silicon wafer warpage to different sizes and quickly measured.The present invention is simple in construction, easy to operate, securely and reliably.
Description
Technical field
The present invention relates to semi-conducting material to process technical field of measurement and test, specially a kind of large scale grinding silicon wafer warpage measurement
Fixture.
Background technology
Electronic Encapsulating Technology, which continues to develop, promotes Electronic Packaging product gradually to be sent out to thin, small, light and highly integrated direction
Exhibition.Base material of the Silicon Wafer as Electronic Packaging, to meet package thickness requirement, before encapsulation need that wafer is thinned.By
In low damage, efficient advantage, wafer spin turns grinding technique has turned into main flow skilled worker's technology of wafer grinding.However, machine
Tool grinding inevitably plays into crystal column surface damage and produces residual stress.Damaging layer and residual stress will cause wafer to stick up
Song, the transmission of wafer is had a strong impact on, reduced the efficiency of successive process.Therefore, measurement grinding silicon wafer warpage, is made with amount of warpage
Have great importance for the characterization parameter of wafer grinding quality to optimize grinding process.At present, silicon wafer warpage measurement is set
Standby mainly have 3D patterns instrument and an optical profilometer, need to carry out supported at three point and fixation to wafer during measurement.But actually measured
Cheng Zhong, supporting point position is adjusted according to diameter wafer.Existing easy support fixture regulation is got up time-consuming, laborious.Therefore, it is anxious
A kind of novel clamp is needed in order to the regulation of the strong point in test process, improves the measurement efficiency of silicon wafer warpage.
To solve the above problems, the invention discloses a kind of large scale to be ground silicon wafer warpage measured material, wafer can be entered
Row positioning and the quick measurement of warpage.
The content of the invention
The present invention proposes a kind of large scale grinding silicon wafer warpage measured material, can be achieved to wafer positioning and amount of warpage
Quick detection.
The present invention adopts the following technical scheme that：
A kind of large scale is ground silicon wafer warpage measured material, it is characterised in that：Including supporting construction and adjustment structure.
The supporting construction includes：Leg 110, leg balance plate 119, first hold up plate 501, second and hold up plate 502, bottom
Portion's supporting table 116, top braces platform 104.Wherein, leg 110 is cylinder, and leg balance plate 119 is circular slab, and leg balances
The diameter of plate 119 is more than the diameter of leg 110, and leg balance plate 119 and leg 110 consolidate；First holds up plate 501 fixes by first
Spiral shell button 301 is connected with bottom supporting table 116, and bottom supporting table 116 is provided with through hole, and second holds up plate 502 fixes by second
Spiral shell button 302 is connected with top braces platform 104, and top braces platform 104 is provided with groove 105, position line 109, graduation mark 201.
The adjustment structure includes：Regulation handle 118, ball bearing 601, mat 117, adjustment axis 113, adjustment gear
112nd, driven gear 114, turntable axle 115, turntable 111, supporting studs 106, turntable connecting stud 107, traction pin 108.Wherein,
Adjustment axis 113 matches somebody with somebody to merge with ball bearing 601 is fixed by mat 117, and ball bearing 601 leads to embedded in the bearing of bottom supporting table 116
In hole 503, the top of adjustment axis 113 is provided with adjustment gear 112, and adjustment gear 112 is engaged with driven gear 114, driven gear 114
It is loaded on turntable axle 115；Traction pin 108 is connected by connecting stud 107 with turntable 111, and passes through connecting stud 106 and top
Portion's supporting table 104 connects, and supporting studs 106 are provided with support column 102, and the top of support column 102 is provided with support ball 101, supports ball
101 consolidate with support column 102.
The present invention can obtain following beneficial effect：
1st, the fixation and positioning to wafer can be achieved in the present invention in test process.
2nd, the present invention drives turntable to rotate by rotating regulation handle, and the rotation of turntable makes traction pin rotation offset, so as to
The support ball on support column is driven to be moved to target location, it is convenient and reliable.
3rd, the present invention is simple in construction, easy to use, securely and reliably.
Brief description of the drawings：
Fig. 1 is overall structure diagram of the present invention.
Fig. 2 is top structure schematic diagram of the present invention.
Fig. 3 is side structure schematic view of the present invention.
Fig. 4 is polycrystalline substance schematic diagram of the present invention.
Fig. 5 is support section structural representation of the present invention.
Fig. 6 is present invention regulation part-structure schematic diagram.
Fig. 7 is driven gear structural representation of the present invention.
Fig. 8 is regulation handle part-structure schematic diagram of the present invention.
Fig. 9 is rolling bearing structure schematic diagram of the present invention.
In figure：
101-support ball, 102-support column, 103-boss, 104-top braces platform, 105-groove, 106-support
Stud, 107-connecting stud, 108-traction pin, 109-position line, 110-leg, 111-turntable.112-adjustment gear,
113-adjustment axis, 114-driven gear, 115-turntable axle, 116-bottom supporting table, 117-adjustment axis mat, 118-adjust
Section handle, 119-leg balance plate, 201-graduation mark, the 301-the first fixation spiral shell button, the 302-the second fixation spiral shell button, 501-
First holds up plate, and 502-the second holds up plate, 601-ball bearing.
Embodiment：
The present invention is described in detail below in conjunction with the accompanying drawings：
Fig. 1 is overall structure diagram of the present invention：Test process, fixture are placed on below instrument probe, leg balance plate
119 are supported on equipment platform；For different size wafers, regulation handle 118, the adjustment gear on the top of adjustment axis 113 are adjusted
112 drive driven gears 114 rotate, and driven gear 114 drives turntable axle 115 to rotate, and turntable axle 115 drives turntable 111 to rotate,
The driving traction rotation offset of pin 108 of turntable 111, traction pin 108 rotation offset drive support column 102 along groove 105 inwardly or
It is displaced outwardly, so that support ball 101 is moved to target location.
Fig. 2 is top structure schematic diagram of the present invention, place wafer when, make wafer orientation indentation, there circular arc with wherein one
Position line 109 keeps vertical, and the outward flange of wafer and three positioning thread ends is homogeneously cut；Graduation mark 201 is easy to support ball
Positioning when mobile.
Fig. 3 is side structure schematic view of the present invention.
Fig. 4 is polycrystalline substance schematic diagram of the present invention.
Fig. 5 is support section structural representation of the present invention, and first, which holds up plate 501, second, holds up plate 502, leg balance plate
119 are fixedly arranged on leg 110, and leg 110 is embedded in the through hole in bottom supporting table 116, and first holds up plate 501 consolidates by first
Determine spiral shell button 301 to be connected with bottom supporting table, the second picking-up plate 502 is connected by the second fixation spiral shell button 302 with top braces platform 104
Connect.
Fig. 6 is present invention regulation part-structure schematic diagram, and ball bearing 601 is embedded in the bearing cross hole 503 of bottom supporting table 116
Interior, adjustment axis 113 is fixed on ball bearing 601 in ball bearing 601 by adjustment axis mat 117；Adjustment axis
113 tops are provided with adjustment gear 112, and bottom is provided with regulation handle regulation handle 118；Driven gear 114 is loaded on turntable axle 115
It is upper to be engaged with adjustment gear 112；The traction bottom connecting stud 107 of pin 108 is connected, and top is connected with supporting studs 106, supports spiral shell
Post 106 is provided with support column 102, and the top of support column 102 is provided with support ball 101, and support ball 101 consolidates with support column 102.
Fig. 7 is driven gear structural representation of the present invention, and the inside of driven gear 114 is provided with groove, is easy to being loaded for gear.
Fig. 8 is regulation handle part-structure schematic diagram of the present invention, and regulation handle 118 can be adjusted to the position for supporting ball
Section, adjustment axis mat 117 are used to support secured adjusted axle 113, and adjustment gear 112 is engaged with driven gear 114.
Fig. 9 is ball bearing structure schematic diagram of the present invention, and the hollow space diameter of ball bearing 601 is less than adjustment axis mat
117 diameter, adjustment axis 113 are nested in ball bearing 601.
Claims (1)
1. a kind of large scale is ground silicon wafer warpage measured material, it is characterised in that including supporting construction and adjustment structure；
The supporting construction includes：Leg (110), leg balance plate (119), first hold up plate (501), the second picking-up plate
(502), bottom supporting table (116), top braces platform (104)；Wherein, leg (110) is cylindrical, leg balance plate (119)
For circular slab, leg balance plate (119) diameter is more than leg (110) diameter, leg balance plate (119) and leg (110) consolidation；
First picking-up plate (501) is connected by the first fixation spiral shell button (301) with bottom supporting table (116), and bottom supporting table is set on (116)
There is through hole, the second picking-up plate (502) is connected by the second fixation spiral shell button (302) with top braces platform (104), top braces platform
(104) groove (105), position line (109), graduation mark (201) are provided with；
The adjustment structure includes：Regulation handle (118), ball bearing (601), mat (117), adjustment axis (113), regulation tooth
Take turns (112), driven gear (114), turntable axle (115), turntable (111), supporting studs (106), turntable connecting stud (107),
Draw pin (108)；Wherein, adjustment axis (113) is matched somebody with somebody with ball bearing (601) merges, ball bearing fixed by mat (117)
(601) in bottom supporting table (116) bearing cross hole (503), adjustment gear (112) is provided with the top of adjustment axis (113), is adjusted
Gear (112) is engaged with driven gear (114), and driven gear (114) is loaded on turntable axle (115)；Traction pin (108) passes through
Turntable connecting stud (107) is connected with turntable (111), and is connected by supporting studs (106) with top braces platform (104), branch
Stud (106) is supportted in groove (105), supporting studs (106) are provided with support column (102), and support column (102) top is provided with
Ball (101) is supported, support ball (101) consolidates with support column (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420124.XA CN105021099B (en) | 2015-07-16 | 2015-07-16 | A kind of large scale is ground silicon wafer warpage measured material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420124.XA CN105021099B (en) | 2015-07-16 | 2015-07-16 | A kind of large scale is ground silicon wafer warpage measured material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105021099A CN105021099A (en) | 2015-11-04 |
| CN105021099B true CN105021099B (en) | 2018-04-03 |
Family
ID=54411255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510420124.XA Expired - Fee Related CN105021099B (en) | 2015-07-16 | 2015-07-16 | A kind of large scale is ground silicon wafer warpage measured material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105021099B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI651157B (en) * | 2018-01-31 | 2019-02-21 | 揚明光學股份有限公司 | Coordinate measuring system and its fixture |
| CN110260764B (en) * | 2019-06-25 | 2024-02-06 | 麦斯克电子材料股份有限公司 | Measuring tool for horizontal crystal orientation positioning of crystal bar |
| CN116153848B (en) * | 2023-04-23 | 2023-07-04 | 无锡邑文电子科技有限公司 | Lifting mechanism and semiconductor device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4131267A (en) * | 1978-06-02 | 1978-12-26 | Disco Kabushiki Kaisha | Apparatus for holding workpiece by suction |
| US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
| US5986753A (en) * | 1998-03-09 | 1999-11-16 | Chapman Instruments Inc. | Wafer holding and orienting fixture for optical profilometry |
| CN2707432Y (en) * | 2004-07-09 | 2005-07-06 | 珠海天禾精密机械有限公司 | Precise cylindrical grinding device |
| CN101877325B (en) * | 2010-05-25 | 2012-12-05 | 北京中电科电子装备有限公司 | Chip center positioning device |
| CN201812806U (en) * | 2010-07-13 | 2011-04-27 | 上海技美电子科技有限公司 | Wafer bearing device |
| CN102501154B (en) * | 2011-10-26 | 2014-01-29 | 中国科学院光电技术研究所 | Work piece installing and clamping device in ion beam polishing process and method thereof |
| CN103594406B (en) * | 2013-11-05 | 2016-08-24 | 中国电子科技集团公司第四十五研究所 | Self-centering positioning chuck and centering positioning method of semiconductor wafer |
| CN204237882U (en) * | 2014-11-12 | 2015-04-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | Many size compatibilities single-wafer electroplating clamp |
| CN104538333A (en) * | 2014-12-16 | 2015-04-22 | 瑞德兴阳新能源技术有限公司 | Tray for eliminating warping of wafer |
| CN104851823B (en) * | 2015-04-03 | 2018-03-23 | 沈阳拓荆科技有限公司 | X, the contactless silicon wafer warpage degree measuring apparatus of Y Dual-spindle linkeds |
-
2015
- 2015-07-16 CN CN201510420124.XA patent/CN105021099B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105021099A (en) | 2015-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105021099B (en) | A kind of large scale is ground silicon wafer warpage measured material | |
| CN208025082U (en) | A kind of mapping auxiliary device | |
| CN104576493B (en) | A kind of wafer-supporting platform device for clamping wafer | |
| CN104697856B (en) | A kind of test equipment for welding spun gold pulling force and gold goal shearing force | |
| CN102087104A (en) | Three-coordinate conversion machine for measuring aircraft quality characteristics, test system and method | |
| CN208704692U (en) | A kind of wafer sampling observation device | |
| CN116124631A (en) | Glass hardness detection device based on multimode automation mechanized operation | |
| CN113670263A (en) | Land levelness measuring device for land planning and measuring method thereof | |
| CN218965192U (en) | Clamp for wafer test | |
| CN205002716U (en) | Beverage bottle perpendicularity detector | |
| CN103085111A (en) | Punching machine with accurately angle-adjustable platform for materials | |
| CN108020423A (en) | A kind of clamp truck | |
| CN209027403U (en) | A kind of novel test device for high technology ceramics | |
| CN102032857B (en) | Radial verticality detection platform | |
| CN208105335U (en) | A kind of self-leveling gravity platform | |
| CN205908948U (en) | Survey device is tested in leveling of numerical control ray apparatus work platform | |
| CN106053253A (en) | Soil grasper measuring device for measuring real displacement of soil sheared by large size soil engineering direct shear apparatus | |
| CN205067532U (en) | Probe station | |
| CN213685890U (en) | Tripod for civil engineering measurement | |
| CN204182596U (en) | Straight line degree measurement separator | |
| CN204831081U (en) | Elevator driving sheave grooving wearing and tearing volume measuring tool | |
| CN206787442U (en) | A kind of bearing ring annular groove simple detection device | |
| CN110142663B (en) | Automatic grinding machine for outer circular surface of ball body of ball valve and using method | |
| CN106774458A (en) | A kind of multiple-angle thinking determines platform | |
| CN209363038U (en) | A kind of blanking detection sorting equipment of grinding wheel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20210716 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |