CN105006270B - Conductive composite material and preparation method thereof, and preparation method for conductive line - Google Patents
Conductive composite material and preparation method thereof, and preparation method for conductive line Download PDFInfo
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- CN105006270B CN105006270B CN201510423482.6A CN201510423482A CN105006270B CN 105006270 B CN105006270 B CN 105006270B CN 201510423482 A CN201510423482 A CN 201510423482A CN 105006270 B CN105006270 B CN 105006270B
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Abstract
The invention discloses a conductive composite material and a preparation method thereof, and a preparation method for a conductive line. The conductive material comprises a substrate, and metal particles uniformly dispersed in the substrate, the diameter of the metal particles is from 100 nm to 10 <mu>m, the substrate is polymer resin, and the metal particles are metal particles with three-dimensional fractal layered structures. The conductive material is used for laser etching, the micro-nano metal particles with the three-dimensional fractal layered structures are employed as the conductive filling material, the unique geometric shapes of the metal particles are employed so that ablation occurs more easily under the effect of laser compared with conventional filling material particles, and finer wiring effect can be realized under low laser power; the same conductivity is reached by adopting less metal particles than the conventional filling material particles so that the required laser etching energy is less; and the content of the metal particles is less so that the bonding force in conductive slurry and the bonding force between the conductive slurry and a matched insulation substrate can be both greatly increased.
Description
【Technical field】
The present invention relates to the conducing composite material being related in laser ablation Wiring technique, more particularly to a kind of to be used for laser
Conducing composite material of etching wiring and preparation method thereof.
【Background technology】
With developing rapidly for mobile electronic device and touch screen industry, the laser-induced thermal etching conductive paste in touch screen processing
Material market also quickly grows.Traditional Screen-printed conductive slurry wiring technique most narrow linewidth is generally only capable of reaching 50 microns, and
And yield is low, higher to process control needs.Laser ablation wiring technique is a kind of new efficient rapid tooling techniques.Laser
Lithographic technique utilizes pulse laser point source, is etched along desired trajectory, makes conductive silver paste instant vaporization to be processed, from
And removing Excess conductive silver paste is reached, circuitous pattern, and the temperature of surrounding is formed without there is big lifting.For example, in order to protect
The high permeability of card narrow-frame touch panel, the usual baseplate material for adopting polyester resin film such as PET as thin-film module, then
Silk screen printing is printed on electrocondution slurry in thin-film module, then coordinates laser etching technology processing to obtain fine conductive paste stockline
Road obtains the wiring effect finer compared with traditional silk-screened technology as frame lead.
With the development of intelligent wearing, large-scale intelligent liquid crystal display screen and vehicle-mounted touch-control, this is high-end for laser-induced thermal etching electrocondution slurry
Electronic material industry also will further speed up expansion, and its technological break-through has become that electronic printing industry is in the urgent need to address to ask
Topic.
【The content of the invention】
The technical problem to be solved is：Above-mentioned the deficiencies in the prior art are made up, is proposed a kind of for laser incising
Conducing composite material of erosion wiring and preparation method thereof, is capable of achieving the wiring for more becoming more meticulous, and the conducing composite material has wider
The general suitability.
The technical problem of the present invention is solved by following technical scheme：
It is a kind of for laser ablation wiring conducing composite material, including substrate, be dispersed in it is straight in the substrate
Metallic particles of the footpath between 100 nanometers to 10 microns；The substrate is fluoropolymer resin, and the metallic particles is with three-dimensional
Divide the metallic particles of shape hierarchical structure.
Wherein, the mass fraction of the metallic particles is 30%～80%, the mass fraction of the substrate is 20%～
70%.
The metallic particles is silver, copper, stannum, gold, platinum, palladium, one or more the mixing in aluminum.
The fluoropolymer resin is thermoset polymer resin or thermoplastic polymer resin.
The thermoset polymer resin is epoxy resin, phenolic resin, polyester, polyimides, polyurethane, polyacrylic acid
One or more mixture in ester, cyanate, polysiloxanes.
The thermoplastic polymer resin is Merlon, polyacrylate, polyester, polyurethane, polysiloxanes, polyamides Asia
One or more mixture in amine prepolymer.
Also include adjuvant, the adjuvant is one or more in firming agent, cross-linking agent, rheology control agent or stabilizer
Mixing.
A kind of preparation method of the conducing composite material for laser ablation wiring, comprises the following steps：Prepare polymer
Resin is used as substrate；Prepare with the metallic particles of three-dimensional fractal hierarchical structure, diameter between 100 nanometers to 10 microns, will
The metallic particles is dispersed in the substrate.
Wherein, the mass fraction of the metallic particles is 30%～80%, the mass fraction of the substrate is 20%～
70%.
A kind of preparation method of conducting wire, comprises the following steps：Prepare fluoropolymer resin as substrate；Prepare with three
The metallic particles is dispersed in institute by the dimension point metallic particles of shape hierarchical structure, diameter between 100 nanometers to 10 microns
State in substrate, conductive material is obtained；Conductive material is made into electrocondution slurry, is printed on insulated substrate；Received 355 using wavelength
Rice～10640 nanometer ranges are interior and power existsIn the range of laser carry out laser ablation processing, by the insulation base
Electrocondution slurry on plate is etched into the conducting wire of setting；Wherein, W is in 0.1 watt～50 watts of scope.
The beneficial effect that the present invention is compared with the prior art is：
The conducing composite material for laser ablation wiring of the present invention, using unique with three-dimensional fractal hierarchical structure
Metallic particles as conductive filler, be dispersed in polymer resin matrix.Due to the three-dimensional fractal structure of metallic particles, can be from
Gross energy is peeled off in melting and two aspects of energy reduce the laser power needed for etching and processing needed for single-point fusing, specifically,
Same etch effect is realized such as, the laser power of existing electrocondution slurry etching is W (between 0.1 watt to 50 watts), and of the invention
The laser power of conductive material etching be then 1/8～1/2 times of W.Laser-induced thermal etching processing, laser beam is carried out under low-power
Size accordingly can be reduced, and so as to make graphical machining accuracy improve, realize the wiring that high-resolution more becomes more meticulous.Meanwhile, relatively low
Etch under power, the thermal shock that resin dispersion is mutually subject to is less, can retain preferable mechanical bonding force and longer life-span.And
Relatively low Laser Processing power can reduce energy transmission of the electrocondution slurry to the insulated substrate of application to printed, reduce insulated substrate
Thermal deformation, so as to conductive material can be used cooperatively with wider insulated substrate, the suitability is wider, and insulated substrate heat become
Shape can further reduce the thickness of insulated substrate less, advantageously in realizing the lightening of electronic material.
【Description of the drawings】
Fig. 1 is scanning electron microscope (SEM) image of the metallic particles of the embodiment of the present invention 1；
Fig. 2 is scanning electron microscope (SEM) image of the cross section of the conductive material obtained in the embodiment of the present invention 1；
Fig. 3 is scanning electron microscope of the conductive material of the embodiment of the present invention 1 and reference examples after laser-induced thermal etching processing
(SEM) image；
Fig. 4 is scanning electron microscope of the conductive material of the embodiment of the present invention 1 and reference examples after laser ablation processing
Chromatography (SEM-EDS) image；
Fig. 5 is optical photograph of the conductive material of the embodiment of the present invention 1 after laser ablation processing；
Fig. 6 is partial enlargement optical photograph of the conductive material of the embodiment of the present invention 1 after laser ablation processing；
Fig. 7 is optical microscope image of the conductive material of the embodiment of the present invention 1 after laser ablation processing；
Fig. 8 is scanning electron microscope (SEM) figure of the conductive material of the embodiment of the present invention 2 after laser-induced thermal etching processing
Picture；
Fig. 9 is scanning electron microscope (SEM) figure of the conductive material of the embodiment of the present invention 3 after laser-induced thermal etching processing
Picture；
Figure 10 is the resistivity of conductive material conducting wire after laser ablation processing of the embodiment of the present invention 1 and reference examples
With the changing trend diagram of laser power.
【Specific embodiment】
With reference to specific embodiment and compare accompanying drawing the present invention is described in further details.
Idea of the invention is that, technological improvement direction of the electrocondution slurry during laser-induced thermal etching is more, some schemes from
Laser angle is improved, and control improves etching process, so as to improve etch effect.And some schemes are in terms of resin material
It is improved, this is because after laser-induced thermal etching, the electrocondution slurry part for forming circuitous pattern is subject to thermal shock, and uses cooperatively
The mechanical adhesion power of insulated substrate is deteriorated, and easily comes off.Therefore improve the component proportion of resin, so as to improve the viscous of resin material
Knot property.The solution of the present invention is improved from the structure design of metallic conductive fillers, using with three-dimensional fractal level
The metallic particles of structure, diameter between 100 nanometers to 10 microns as conductive filler, so as to the uniqueness using the structure,
It is improved from the lower angle of laser power of etching, it is the wiring that solves the problems, such as more to become more meticulous, more generally applicable.This granule
With unique point shape hierarchical structure, the abundant nanostructured (characteristic size only has several nanometers to tens nanometers) in its periphery is easy to
Generation low-temperature sintering, and the rapid ablation fusing under laser action.What metallic particles with such microstructure was conventional should
With the catalyst in electrochemical catalysis that focuses mostly on, and in terms of strengthening the optical detection material of Raman scattering, it is of the invention then by its
Innovatively apply in the electrocondution slurry of laser-induced thermal etching, so as to realize that low power laser is etched, and then it is excellent to obtain series technique
Gesture.
A kind of conducing composite material for laser ablation wiring is provided in this specific embodiment, including substrate, uniformly
It is dispersed in metallic particles of the diameter in the substrate between 100 nanometers to 10 microns；The substrate be fluoropolymer resin, institute
It is the metallic particles with three-dimensional fractal hierarchical structure to state metallic particles.Three-dimensional fractal structure refers to dendrite in one-level fractal structure
On the basis of grow two grades of fractal structures, on two grades of fractal structures so growth three-level fractal structure, be three-dimensional pine-tree structure.
Above-mentioned conductive material, due to the three-dimensional fractal structure of metallic particles, on the one hand, the metal packing of three-dimensional hierarchical structure
With higher three-dimensional specific surface area, contact with each other between conductive filler conducting when, the volume ratio of the actual occupancy of filler it is spherical or
The metal packing of person's lamellar is much smaller, and the amount for obtaining the metallic particles needed during the suitable conductive material of electric conductivity is less, from
And required stripping little energy, contraction on melting can be etched using the laser of less energy, form open circuit effect；The opposing party
Face, the principle of the metal packing sintered molten of three-dimensional fractal hierarchical structure are to shrink under laser heat action, realize contact
Separate so as to separate insulation, it is not necessary to the melting of whole metallic particles is vaporized off as spherical or sheet metal granule, because
This energy needed for cut-off is also less.Therefore, reduce in terms of gross energy and energy two needed for single-point fusing are peeled off in melting
Laser power needed for etching and processing.Empirical tests, when such as reaching same etch effect, when conventional electrocondution slurry carries out laser-induced thermal etching
Performance number be W, in 0.1 watt～50 watts of scope, and electrocondution slurry is carried out made by the above-mentioned conducing composite material of the present invention
1/8～1/2 times for W of the performance number of laser-induced thermal etching.When the power of laser-induced thermal etching is relatively low, graphical machining accuracy can be improved,
Realize the wiring that high-resolution more becomes more meticulous.Meanwhile, etch at lower power, the infringement to other materials can be reduced, for example, tree
The thermal shock that fat dispersion phase is subject to is less, can retain preferable mechanical bonding force and longer life-span, then for example, electrocondution slurry pair
The energy transmission of the insulated substrate being used in combination is less, reduce insulated substrate thermal deformation, so as to conductive material can with more
Extensive insulated substrate is used cooperatively, and the suitability is wider, and insulated substrate thermal deformation can further reduce the thickness of insulated substrate less
Degree, advantageously in realizing the lightening of electronic material.
At present widely used electrocondution slurry is spherical or lamellar micro-nano granules filler, and contained conductive filler contains
Amount is higher, typically in 70% or so (containing solvent), is fully cured rear argentum powder content and reaches more than 80%.Therefore in laser ablation mistake
Need higher laser power evaporate argentum powder filler and resinous substrates melting in journey.And this specific embodiment is adopted
Metallic particles with three-dimensional fractal hierarchical structure, can not only under relatively low laser power by silver paste used as conductive filler
Composite fuses, and obtains the Laser Processing conducting wire of high-resolution, high stability, and due to can relative reduction metallic particles
Content, and then the adhesion between the adhesion inside electrocondution slurry and electrocondution slurry and the insulated substrate being used in combination
All significantly lifted, without having to worry about the problem that electrocondution slurry during laser-induced thermal etching comes off from insulated substrate.
Preferably, the mass fraction of metallic particles is 30%～80%, and the mass fraction of the substrate is 20%～70%.
When the content of metallic particles is less than 30%, then the electric conductivity of conductive material will reduce, and be unfavorable for guaranteeing certain electric conductivity；Work as gold
The content of metal particles be more than 80% when, tenor is higher, then relative to metallic particles content less than 80% conductive material and
Speech, needs of a relatively high power to be etched, then become more meticulous and widely applicable property in terms of will be with respect to being affected by some.Enter
Preferably, the mass fraction of metallic particles is 30%～60% to one step, and the mass fraction of the substrate is 40%～70%, so as to
Further ensure that electric conductivity and become more meticulous and widely applicable property.
It is as follows, the performance of the conducing composite material by arranging the specific embodiment checking present invention.
Embodiment 1：
Choose micro-nano (diameter 100 nanometers to the 10 microns between) metallic particles with three-dimensional fractal hierarchical structure to make
For conductive filler, the pattern of metallic particles is as shown in figure 1, have three-dimensional pine-tree structure.To want obtained conducing composite material to be
Weight basis, Argent grain conductive filler of the percentage by weight for 50wt% is dispersed in polyester resin substrate, is prepared low
Power laser etches conducing composite material.Conductive silver paste made by conducing composite material is printed on by the method for silk screen printing
On glass substrate, the average thickness of silver paste circuit is 15 microns, and the original width and spacing of silver paste are set as 50 microns.To be printed
The sample of system carries out laser-induced thermal etching processing in 150 DEG C of heat treatments 15 minutes after being fully cured.Sample before laser-induced thermal etching processing
The SEM of cross section is schemed as shown in Fig. 2 conductive silver paste is evenly distributed on glass baseplate surface.
During laser-induced thermal etching, optical maser wavelength selects 1064 nanometers, and it is 10%, 15% and 20% (most to choose laser power respectively
Big laser power is 20 watts).The SEM shape appearance figures of the sample after laser-induced thermal etching processing respectively as shown in Fig. 3 (a)～(c), with
Corresponding silver element EDS maps result shape appearance figure (SEM-EDS) of the SEM shape appearance figures of these samples is as shown in Fig. 4 (a)～(c).
Controlled observation Fig. 3 SEM figure and relative to Fig. 4 SEM-EDS figure, can be clearly observable whether etching area has metal
The residual of grain.
So that laser power is 20% as an example, the conducting wire obtained after laser-induced thermal etching processing is as it can be seen in figures 5 and 6, therefrom may be used
It is more fine to obtain conducting wire.Fig. 7 is the optical microscope image of the conducting wire obtained after laser-induced thermal etching is processed, therefrom
Obtain, the recess width between the conducting wire and conducting wire of the signal of labelling 1 is 17.066 microns, and it is single that labelling 2 is illustrated
The width of conducting wire is 25.267 microns.
Embodiment 2：
Choose micro-nano (diameter 100 nanometers to the 10 microns between) metallic particles with three-dimensional fractal hierarchical structure to make
For conductive filler.It is to want obtained conducing composite material as weight basis, percentage by weight is conductive for the Argent grain of 50wt%
Filler is dispersed in polyester resin substrate, prepares low power laser etching conducing composite material.By the side of silk screen printing
Method is printed on conductive silver paste made by conducing composite material on pet substrate, and the average thickness of silver paste circuit is 15 microns, silver paste
Original width and spacing be set as 50 microns.By the sample printed in 150 DEG C of heat treatments 15 minutes, carry out after being fully cured
Laser Processing.During laser-induced thermal etching, optical maser wavelength selects 532 nanometers, and it is that 20% (maximum laser power is 20 to choose laser power
Watt).Sample SEM shape appearance figures after laser-induced thermal etching processing as shown in figure 8, formed the open circuit effect of cut-off through laser-induced thermal etching
Really, the pattern that metallic particles and can be observed from figure is three-dimensional fractal hierarchical structure.According to the result figure after etching, it is known that
The conducing composite material of the present embodiment is capable of achieving the etching and processing that becomes more meticulous when power is 20% on pet substrate.The present embodiment
The SEM-EDS figures of middle sample, and the conducting wire figure that obtains it is approximate with embodiment 1, here is not repeated offer.
Embodiment 3：
Choose micro-nano (diameter 100 nanometers to the 10 microns between) metallic particles with three-dimensional fractal hierarchical structure to make
For conductive filler.It is to want obtained conducing composite material as weight basis, percentage by weight is conductive for the Argent grain of 40wt%
The conductive filler of filler is dispersed in polyester resin substrate, prepares low power laser etching conducing composite material.By silk
The method of wire mark brush is printed on conductive silver paste made by conducing composite material on pet substrate, and the average thickness of silver paste circuit is
15 microns, the original width and spacing of silver paste are set as 50 microns.It is by the sample printed in 150 DEG C of heat treatments 15 minutes, complete
Laser machined after all solidstate.During laser-induced thermal etching, optical maser wavelength selects 532 nanometers, and it is 20% (maximum to swash to choose laser power
Luminous power is 20 watts).Through laser-induced thermal etching processing after sample SEM shape appearance figures as shown in figure 9, through laser-induced thermal etching formed every
Disconnected open circuit effect, and can be observed from figure metallic particles pattern be three-dimensional fractal hierarchical structure.After etching
Result figure, it is known that the conductive material of the present embodiment is capable of achieving the etching and processing that becomes more meticulous when power is 20% on pet substrate.
SEM-EDS figures of sample in the present embodiment, and the conducting wire figure that obtains it is approximate with embodiment 1, here does not repeat offer.
Reference examples：
Choose the special conductive silver paste of Korea import laser (FP, FTL-630LE, polyester resin as matrix, containing 75wt%
Ball shape silver powder), conductive silver paste is printed on PET or glass substrate by the method for silk screen printing, silver paste circuit it is average
Thickness is 15 microns, and the original width and spacing of silver paste are set as 50 microns.By the sample printed in 15 points of 150 DEG C of heat treatments
Clock, carries out laser-induced thermal etching processing after being fully cured.
During laser-induced thermal etching, optical maser wavelength selects 1064 nanometers, and it is 10%, 15% and 20% (most to choose laser power respectively
Big laser power is 20 watts).The SEM shape appearance figures of the sample after laser-induced thermal etching processing respectively as shown in Fig. 3 (d)～(f), with
Corresponding silver element EDS maps result shape appearance figure (SEM-EDS) of the SEM shape appearance figures of these samples is as shown in Fig. 4 (d)～(f).
The comparison of embodiment 1 and reference examples：
By Fig. 3 (a)～(c) as can be seen that using the argentum powder of three-dimensional fractal hierarchical structure as conductive filler in embodiment 1
Silver paste etching pattern have more clean open circuit feature.Although silver paste conducting wire exhibition in the SEM figures in Fig. 3 (a)～(c)
Reveal the distribution of the silver element in zigzag pattern, but corresponding EDS analysis results (such as Fig. 4 (a)～(c)) display resin matrix
Good rectilinear configuration is kept still.It is excellent linear that this shows that three-dimensional fractal hierarchical structure silver paste has in laser-induced thermal etching figure
Processing characteristics.Even and if Fig. 3 (d)～(f) can be seen that FTL-630LE silver pastes Jing after 20% laser power lithography, etching
Substantial amounts of Argent grain is remained in groove afterwards still, the electric performance test carried out with reference to Fig. 8 confirms that the groove remains to conducting.This is main
It is, due to silver content very high (75wt%) in FTL-630LE, these Argent grain ablations will to be shelled in the Laser Processing of short time
Fall, 20% laser power is not enough, in addition it is also necessary to increase the power of laser.Empirical tests, when Laser Processing power ascension is to 30%,
FTL-630LE silver pastes could obtain mutually not short-circuit fine-line.And same fine conducting wire is obtained, embodiment 1
Laser Processing power needed for the silver paste that three-dimensional fractal hierarchical structure is obtained is only 15%.Show the conductive material of embodiment 1
Laser-induced thermal etching power is only the 1/2 of the laser-induced thermal etching power of reference examples FTL-630LE silver paste.
As shown in Figure 10, be under different laser powers in embodiment 1 and reference examples electrocondution slurry after laser-induced thermal etching
The specific insulation of conducting wire.For laser power is in the range of 10%～70%, the volume of the conducting wire of embodiment 1
Resistivity can be maintained at 2 × 10-4～3 × 10-4In the range of Ω cm.And the FTL-630LE conductive silver pastes in reference examples,
When laser power is in the range of 30%～70%, specific insulation is maintained at 2 × 10-4Ω cm or so.And for laser work(
When rate is 10% and 20%, substantial amounts of resin and Argent grain in the groove after laser ablation, is still remained, tied in conducting performance test
Fruit confirms that the grooved area between conducting wire and conducting wire remains to conducting, and product is unqualified, so not listing in fig. 8
The specific insulation of the conducting wire obtained under 20% and 10% power condition.
Find through above-mentioned contrast：Based on the electrocondution slurry of high performance three-dimensional point shape hierarchical structure metallic particles, with compared with
Excellent electric conductivity, and the higher fine conductive circuit of resolution can be prepared.When laser power is 15%, you can
Obtain live width, the fine conductive circuit that line-spacing is 20 microns.And for the FTL-630LE conductive silver pastes in reference examples, need
When to want laser power be 30%, could etch the groove for forming cut-off, its laser-induced thermal etching working power is higher, and then realization is finely
That what is changed is relatively costly, and the requirement of the insulated substrate used to matching is higher, and its suitability is narrower.
To sum up, using this specific embodiment three-dimensional fractal hierarchical structure metallic particles as conductive filler, can be with
While conducting wire quality is ensured, the power needed for laser processing procedure is greatly lowered, and embodies serial skill therewith
Art advantage.Therefore, it is possible to provide valuable technical scheme for the development of touch screen industry.
Above content is with reference to specific preferred implementation further description made for the present invention, it is impossible to assert
The present invention be embodied as be confined to these explanations.For general technical staff of the technical field of the invention,
Some replacements or obvious modification is made on the premise of without departing from present inventive concept, and performance or purposes are identical, should all be considered as
Belong to protection scope of the present invention.
Claims (8)
1. a kind of preparation method of conducting wire, it is characterised in that：Comprise the following steps：Prepare fluoropolymer resin as substrate；
Prepare with the metallic particles of three-dimensional fractal hierarchical structure, diameter between 100 nanometers to 10 microns, will be the metallic particles equal
It is even to be dispersed in the substrate, conductive material is obtained；Conductive material is made into electrocondution slurry, is printed on insulated substrate；Using
Wavelength is in 355 nanometers～10640 nanometer ranges and power existsIn the range of laser carry out laser ablation processing,
So that the metallic particles of three-dimensional fractal hierarchical structure is shunk under laser heat action realizes contact separation, by the insulation base
Electrocondution slurry on plate is etched into the conducting wire of setting；Wherein, W is in 0.1 watt～50 watts of scope.
2. the preparation method of conducting wire according to claim 1, it is characterised in that：The mass fraction of the metallic particles
For 30%～80%, the mass fraction of the substrate is 20%～70%.
3. the preparation method of conducting wire according to claim 1, it is characterised in that：The metallic particles be silver, copper,
One or more mixing in stannum, gold, platinum, palladium, aluminum.
4. the preparation method of conducting wire according to claim 1, it is characterised in that：The fluoropolymer resin is thermosetting
Fluoropolymer resin or thermoplastic polymer resin.
5. the preparation method of conducting wire according to claim 4, it is characterised in that：The thermoset polymer resin is
One kind in epoxy resin, phenolic resin, polyester, polyimides, polyurethane, polyacrylate, cyanate, polysiloxanes or
Various mixture.
6. the preparation method of conducting wire according to claim 4, it is characterised in that：The thermoplastic polymer resin is
One or more mixing in Merlon, polyacrylate, polyester, polyurethane, polysiloxanes, polyimide preformed polymer
Thing.
7. the preparation method of conducting wire according to claim 1, it is characterised in that：It is additionally included in the conductive material
The step of addition adjuvant, the adjuvant is the mixed of one or more in firming agent, cross-linking agent, rheology control agent or stabilizer
Close.
8. conducting wire obtained in a kind of preparation method according to any one of claim 1～7.
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| CN106847372B (en) * | 2017-03-15 | 2018-08-07 | 清华大学深圳研究生院 | A kind of overflow protecting element and preparation method thereof, current foldback circuit |
| CN113527948A (en) * | 2020-04-21 | 2021-10-22 | 上海宝银电子材料有限公司 | Conductive ink for pad printing process and preparation method thereof |
| CN112961540A (en) * | 2021-03-31 | 2021-06-15 | 上海宝银电子材料有限公司 | Conductive ink for pad printing process and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002664A (en) * | 2011-09-18 | 2013-03-27 | 宝宸（厦门）光学科技有限公司 | Touch screen and manufacturing method of conducting circuits |
| CN103400637A (en) * | 2013-08-05 | 2013-11-20 | 清华大学深圳研究生院 | Electroconductive slurry and preparation method thereof, and printed circuit material |
| JP2014107533A (en) * | 2012-11-29 | 2014-06-09 | Pelnox Ltd | Conductive paste composition for laser etching |
| CN104028776A (en) * | 2014-06-20 | 2014-09-10 | 清华大学深圳研究生院 | Metal particles with three-dimensional dendritic crystal structures and preparation method for metal particles |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI486975B (en) * | 2012-05-22 | 2015-06-01 | Teco Nanotech Co Ltd | High resolution laser etching method for processing transparent conductive oxide layers of touch panel |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002664A (en) * | 2011-09-18 | 2013-03-27 | 宝宸（厦门）光学科技有限公司 | Touch screen and manufacturing method of conducting circuits |
| JP2014107533A (en) * | 2012-11-29 | 2014-06-09 | Pelnox Ltd | Conductive paste composition for laser etching |
| CN103400637A (en) * | 2013-08-05 | 2013-11-20 | 清华大学深圳研究生院 | Electroconductive slurry and preparation method thereof, and printed circuit material |
| CN104028776A (en) * | 2014-06-20 | 2014-09-10 | 清华大学深圳研究生院 | Metal particles with three-dimensional dendritic crystal structures and preparation method for metal particles |
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