CN105006270A - Conductive composite material and preparation method thereof, and preparation method for conductive line - Google Patents
Conductive composite material and preparation method thereof, and preparation method for conductive line Download PDFInfo
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- CN105006270A CN105006270A CN201510423482.6A CN201510423482A CN105006270A CN 105006270 A CN105006270 A CN 105006270A CN 201510423482 A CN201510423482 A CN 201510423482A CN 105006270 A CN105006270 A CN 105006270A
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Abstract
The invention discloses a conductive composite material and a preparation method thereof, and a preparation method for a conductive line. The conductive material comprises a substrate, and metal particles uniformly dispersed in the substrate, the diameter of the metal particles is from 100 nm to 10 <mu>m, the substrate is polymer resin, and the metal particles are metal particles with three-dimensional fractal layered structures. The conductive material is used for laser etching, the micro-nano metal particles with the three-dimensional fractal layered structures are employed as the conductive filling material, the unique geometric shapes of the metal particles are employed so that ablation occurs more easily under the effect of laser compared with conventional filling material particles, and finer wiring effect can be realized under low laser power; the same conductivity is reached by adopting less metal particles than the conventional filling material particles so that the required laser etching energy is less; and the content of the metal particles is less so that the bonding force in conductive slurry and the bonding force between the conductive slurry and a matched insulation substrate can be both greatly increased.
Description
[technical field]
The present invention relates to the conducing composite material related in laser ablation Wiring technique, particularly relate to a kind of conducing composite material for laser ablation wiring and preparation method thereof.
[background technology]
Along with developing rapidly of mobile electronic device and touch screen industry, the laser-induced thermal etching electrocondution slurry market in touch screen processing is also developed rapidly.The most narrow linewidth of traditional Screen-printed conductive slurry wiring technique only can reach 50 microns usually, and yield is low, higher to process control needs.Laser ablation wiring technique is a kind of novel efficient rapid tooling techniques.Laser etching techniques utilizes pulse laser point-source of light, etches along desired trajectory, makes conductive silver paste instant vaporization to be processed, thus reaches removing Excess conductive silver slurry, form circuitous pattern, and temperature around does not have large lifting.Such as, in order to ensure the high permeability of narrow-frame touch panel, usual employing polyester resin film such as PET is as the baseplate material of thin-film module, then electrocondution slurry is printed in thin-film module by silk screen printing, coordinate laser etching technology processing to obtain meticulous electrocondution slurry circuit again to go between as frame, obtain the wiring effect meticulousr compared with traditional silk-screened technology.
Along with the development of intelligence wearing, large-scale intelligent liquid crystal display screen and vehicle-mounted touch-control, this high-end electronic material industry of laser-induced thermal etching electrocondution slurry also will accelerate expansion further, and its technological break-through has become electronic printing industry problem in the urgent need to address.
[summary of the invention]
Technical problem to be solved by this invention is: make up above-mentioned the deficiencies in the prior art, and propose a kind of conducing composite material for laser ablation wiring and preparation method thereof, can realize the wiring more become more meticulous, this conducing composite material has applicability widely.
Technical problem of the present invention is solved by following technical scheme:
For a conducing composite material for laser ablation wiring, comprise matrix, the metallic particles of diameter between 100 nanometers are to 10 microns be dispersed in described matrix; Described matrix is fluoropolymer resin, and described metallic particles is the metallic particles with three-dimensional fractal hierarchical structure.
Wherein, the mass fraction of described metallic particles is 30% ~ 80%, and the mass fraction of described matrix is 20% ~ 70%.
Described metallic particles is one or more the mixing in silver, copper, tin, gold, platinum, palladium, aluminium.
Described fluoropolymer resin is thermoset polymer resin or thermoplastic polymer resin.
Described thermoset polymer resin is one or more the mixture in epoxy resin, phenolic resins, polyester, polyimides, polyurethane, polyacrylate, cyanate, polysiloxanes.
Described thermoplastic polymer resin is one or more the mixture in Merlon, polyacrylate, polyester, polyurethane, polysiloxanes, polyimide preformed polymer.
Also comprise auxiliary material, described auxiliary material is one or more the mixing in curing agent, crosslinking agent, rheology control agent or stabilizer.
For a preparation method for the conducing composite material of laser ablation wiring, comprise the following steps: prepare fluoropolymer resin as matrix; Prepare that there is three-dimensional fractal hierarchical structure, the metallic particles of diameter between 100 nanometers are to 10 microns, described metallic particles is dispersed in described matrix.
Wherein, the mass fraction of described metallic particles is 30% ~ 80%, and the mass fraction of described matrix is 20% ~ 70%.
A preparation method for conducting wire, comprises the following steps: prepare fluoropolymer resin as matrix; Prepare that there is three-dimensional fractal hierarchical structure, the metallic particles of diameter between 100 nanometers are to 10 microns, described metallic particles is dispersed in described matrix, obtained electric conducting material; Electric conducting material is made electrocondution slurry, is printed on insulated substrate; Adopt wavelength in 355 nanometer ~ 10640 nanometer range and power exist
laser in scope carries out laser ablation processing, the electrocondution slurry on described insulated substrate is etched into the conducting wire of setting; Wherein, W is the scope of 0.1 watt ~ 50 watts.
The beneficial effect that the present invention is compared with the prior art is:
Conducing composite material for laser ablation wiring of the present invention, adopts unique metallic particles with three-dimensional fractal hierarchical structure as conductive filler, is dispersed in polymer resin matrix.Due to the three-dimensional fractal structure of metallic particles, gross energy and single-point fusing institute energy requirement two aspects can be peeled off from melting and reduce laser power needed for etching and processing, particularly, as realized same etch effect, the laser power of existing electrocondution slurry etching is W (between 0.1 watt to 50 watts), and the laser power of electric conducting material etching of the present invention is then 1/8 ~ 1/2 times of W.Under low-power, carry out laser-induced thermal etching processing, laser beam size can correspondingly reduce, thus makes graphical machining accuracy improve, and realizes the wiring that high-resolution more becomes more meticulous., etch at lower power, the thermal shock that resin dispersion is subject to mutually is less meanwhile, can retain good mechanical bonding force and longer life-span.And lower laser processing power can reduce the energy transferring of electrocondution slurry to the insulated substrate of application to printed, reduce the thermal deformation of insulated substrate, thus electric conducting material can with insulated substrate widely with the use of, applicability is wider, and insulated substrate thermal deformation can reduce the thickness of insulated substrate less further, advantageously in realizing the lightening of electronic material.
[accompanying drawing explanation]
Fig. 1 is scanning electron microscopy (SEM) image of the metallic particles of the embodiment of the present invention 1;
Fig. 2 is scanning electron microscopy (SEM) image of the cross section of the electric conducting material obtained in the embodiment of the present invention 1;
Fig. 3 is scanning electron microscopy (SEM) image of electric conducting material after laser-induced thermal etching processing of the embodiment of the present invention 1 and reference examples;
Fig. 4 is scanning electron microscopy chromatography (SEM-EDS) image of electric conducting material after laser ablation processing of the embodiment of the present invention 1 and reference examples;
Fig. 5 is the optical photograph of electric conducting material after laser ablation processing of the embodiment of the present invention 1;
Fig. 6 is the partial enlargement optical photograph of electric conducting material after laser ablation processing of the embodiment of the present invention 1;
Fig. 7 is the optical microscope image of electric conducting material after laser ablation processing of the embodiment of the present invention 1;
Fig. 8 is scanning electron microscopy (SEM) image of electric conducting material after laser-induced thermal etching processing of the embodiment of the present invention 2;
Fig. 9 is scanning electron microscopy (SEM) image of electric conducting material after laser-induced thermal etching processing of the embodiment of the present invention 3;
Figure 10 is the changing trend diagram of resistivity with laser power of electric conducting material conducting wire after laser ablation processing of the embodiment of the present invention 1 and reference examples.
[embodiment]
Contrast accompanying drawing below in conjunction with embodiment the present invention is described in further details.
Design of the present invention is, the technological improvement direction of electrocondution slurry in laser-induced thermal etching process is more, and some schemes are improved from laser angle, controls to improve etching process, thus improves etch effect.And some schemes are improved from resin material aspect, this is because after laser-induced thermal etching, form the electrocondution slurry part of circuitous pattern and be subject to thermal shock, with the use of the mechanical adhesion power of insulated substrate be deteriorated, easily come off.Therefore improve the component proportion of resin, thus improve the caking property of resin material.The solution of the present invention is then improve from the structural design of metallic conductive fillers, adopt and there is three-dimensional fractal hierarchical structure, the metallic particles of diameter between 100 nanometers are to 10 microns as conductive filler, thus utilize the uniqueness of this structure, the angle lower from the laser power of etching is improved, the problem solve the wiring that more becomes more meticulous, being more extensively suitable for.This particle has unique fractal hierarchical structure, and its peripheral abundant nanostructure (characteristic size only has a few nanometer to tens nanometer) is easy to low-temperature sintering occurs, and rapid ablation fusing under laser action.The metallic particles application in the past with this type of microstructure focuses mostly on catalyst in electrochemical catalysis, and strengthen the optical detection material aspect of Raman scattering, it is then applied in the electrocondution slurry of laser-induced thermal etching by the present invention innovatively, thus realize low power laser etching, and then obtain series technique advantage.
A kind of conducing composite material for laser ablation wiring is provided in this embodiment, comprises matrix, the metallic particles of diameter between 100 nanometers are to 10 microns be dispersed in described matrix; Described matrix is fluoropolymer resin, and described metallic particles is the metallic particles with three-dimensional fractal hierarchical structure.Three-dimensional fractal structure refers to that dendrite grows secondary fractal structure on one-level fractal structure basis, on secondary fractal structure so that growth three grades of fractal structures, be namely three-dimensional pine-tree structure.
Above-mentioned electric conducting material, due to the three-dimensional fractal structure of metallic particles, on the one hand, the metallic stuffing of three-dimension layer aggregated(particle) structure has higher three-dimensional specific area, contact with each other between conductive filler conducting time, the metallic stuffing that is spherical or sheet of the actual volume ratio taken of filler is much little, the amount of the metallic particles needed when obtaining the suitable electric conducting material of electric conductivity is less, thus required stripping little energy, the laser of less energy can be used to carry out etching melting and to shrink, form open circuit effect; On the other hand, the principle of the metallic stuffing sintered molten of three-dimensional fractal hierarchical structure is, shrink under laser heat action, realize contact separation thus cut off insulation, do not need as spherical or sheet metal particle, whole metallic particles melting to be vaporized off, therefore cut off required energy less yet.Therefore, the laser power needed for gross energy and single-point fusing institute energy requirement two aspects reduction etching and processing is peeled off from melting.Empirical tests, during as reached same etch effect, performance number when conventional electrocondution slurry carries out laser-induced thermal etching is W, and the scope of 0.1 watt ~ 50 watts, and the performance number that the electrocondution slurry that above-mentioned conducing composite material of the present invention is made carries out laser-induced thermal etching is 1/8 ~ 1/2 times of W.When the power of laser-induced thermal etching is lower, graphical machining accuracy can be improved, realize the wiring that high-resolution more becomes more meticulous.Simultaneously, etch at lower power, the infringement to other material can be reduced, such as, the thermal shock that resin dispersion is subject to mutually is less, good mechanical bonding force and longer life-span can be retained, again such as, the energy transferring of electrocondution slurry to the insulated substrate be used in combination is less, reduce the thermal deformation of insulated substrate, thus electric conducting material can with insulated substrate widely with the use of, applicability is wider, and insulated substrate thermal deformation can reduce the thickness of insulated substrate less further, advantageously in realizing the lightening of electronic material.
The electrocondution slurry extensively adopted at present is spherical or sheet micro-nano granules filler, and contained conductive filler content is higher, and generally at about 70% (containing solvent), after solidification, silver powder content reaches more than 80% completely.Therefore in laser ablation process, need higher laser power silver powder filler and resinous substrates melting could be evaporated.And this embodiment have employed there is three-dimensional fractal hierarchical structure metallic particles as conductive filler, silver can not only be starched composite material fusing under lower laser power, obtain the laser processing conducting wire of high-resolution, high stability, and due to the content of metallic particles relatively can be reduced, and then the adhesion of electrocondution slurry inside and the adhesion between electrocondution slurry and the insulated substrate be used in combination all significantly promote, without the need to the problem worrying that in laser-induced thermal etching process, electrocondution slurry comes off from insulated substrate.
Preferably, the mass fraction of metallic particles is 30% ~ 80%, and the mass fraction of described matrix is 20% ~ 70%.When the content of metallic particles is less than 30%, then the conductivity of electric conducting material will reduce, and be unfavorable for guaranteeing certain conductivity; When the content of metallic particles is greater than 80%, tenor is higher, then relative to metallic particles content lower than 80% electric conducting material for, need relatively high power etch, then become more meticulous and widely applicable property aspect will relatively be subject to some impact.Further preferably, the mass fraction of metallic particles is 30% ~ 60%, and the mass fraction of described matrix is 40% ~ 70%, thus further guarantees conductivity and become more meticulous and widely applicable property.
As follows, the performance of conducing composite material of the present invention is verified by arranging specific embodiment.
Embodiment 1:
Choose there is three-dimensional fractal hierarchical structure micro-nano (diameter is between 100 nanometers are to 10 microns) metallic particles as conductive filler, the pattern of metallic particles as shown in Figure 1, has three-dimensional pine-tree structure.With the conducing composite material that will obtain for weight basis, be that the Argent grain conductive filler of 50wt% is dispersed in mylar matrix by percentage by weight, prepare low power laser etching conducing composite material.The conductive silver paste made by conducing composite material by the method for silk screen printing is printed on the glass substrate, and the average thickness of silver slurry circuit is 15 microns, and original width and the spacing setting of silver slurry are 50 microns.By printed sample 150 DEG C of heat treatments 15 minutes, carry out laser-induced thermal etching processing after solidification completely.Before laser-induced thermal etching processing, as shown in Figure 2, conductive silver paste is evenly distributed on glass baseplate surface to the SEM figure of the cross section of sample.
During laser-induced thermal etching, optical maser wavelength selects 1064 nanometers, and choosing laser power is respectively 10%, 15% and 20% (maximum laser power is 20 watts).The SEM shape appearance figure of the sample after laser-induced thermal etching processing is respectively as shown in Fig. 3 (a) ~ (c), and silver element EDS maps result shape appearance figure (SEM-EDS) corresponding with the SEM shape appearance figure of these samples is as shown in Fig. 4 (a) ~ (c).The SEM figure of controlled observation Fig. 3 and relative to the SEM-EDS figure of Fig. 4, whether clearly can observe etching area has the residual of metallic particles.
For laser power for 20%, the conducting wire obtained after laser-induced thermal etching processing as illustrated in Figures 5 and 6, therefrom can obtain conducting wire comparatively meticulous.Fig. 7 is the optical microscope image of the conducting wire obtained after laser-induced thermal etching processing, therefrom obtains, and the recess width between the conducting wire of mark 1 signal and conducting wire is 17.066 microns, and the width of the single conducting wire of mark 2 signal is 25.267 microns.
Embodiment 2:
Choose there is three-dimensional fractal hierarchical structure micro-nano (diameter is between 100 nanometers are to 10 microns) metallic particles as conductive filler.With the conducing composite material that will obtain for weight basis, be that the Argent grain conductive filler of 50wt% is dispersed in mylar matrix by percentage by weight, prepare low power laser etching conducing composite material.The conductive silver paste made by conducing composite material by the method for silk screen printing is printed on pet substrate, and the average thickness of silver slurry circuit is 15 microns, and original width and the spacing setting of silver slurry are 50 microns.By printed sample 150 DEG C of heat treatments 15 minutes, carry out laser processing after solidification completely.During laser-induced thermal etching, optical maser wavelength selects 532 nanometers, and choosing laser power is 20% (maximum laser power is 20 watts).Sample SEM shape appearance figure after laser-induced thermal etching processing as shown in Figure 8, formed the open circuit effect of partition, and the pattern that can be observed metallic particles from figure is three-dimensional fractal hierarchical structure through laser-induced thermal etching.According to the result figure after etching, the conducing composite material of known the present embodiment, on pet substrate, can realize the etching and processing that becomes more meticulous when power is 20%.In the present embodiment sample SEM-EDS figure and the conducting wire figure that obtains and embodiment 1 in be similar to, no longer repeat to provide at this.
Embodiment 3:
Choose there is three-dimensional fractal hierarchical structure micro-nano (diameter is between 100 nanometers are to 10 microns) metallic particles as conductive filler.With the conducing composite material that will obtain for weight basis, be that the conductive filler of the Argent grain conductive filler of 40wt% is dispersed in mylar matrix by percentage by weight, prepare low power laser etching conducing composite material.The conductive silver paste made by conducing composite material by the method for silk screen printing is printed on pet substrate, and the average thickness of silver slurry circuit is 15 microns, and original width and the spacing setting of silver slurry are 50 microns.By printed sample 150 DEG C of heat treatments 15 minutes, carry out laser processing after solidification completely.During laser-induced thermal etching, optical maser wavelength selects 532 nanometers, and choosing laser power is 20% (maximum laser power is 20 watts).Sample SEM shape appearance figure after laser-induced thermal etching processing as shown in Figure 9, formed the open circuit effect of partition, and the pattern that can be observed metallic particles from figure is three-dimensional fractal hierarchical structure through laser-induced thermal etching.According to the result figure after etching, the electric conducting material of known the present embodiment, on pet substrate, can realize the etching and processing that becomes more meticulous when power is 20%.In the present embodiment sample SEM-EDS figure and the conducting wire figure that obtains and embodiment 1 in be similar to, do not repeat to provide at this.
Reference examples:
Choose the special conductive silver paste (FP of Korea S's import laser, FTL-630LE, mylar is as matrix, ball shape silver powder containing 75wt%), by the method for silk screen printing, conductive silver paste is printed on PET or glass substrate, the average thickness of silver slurry circuit is 15 microns, and original width and the spacing setting of silver slurry are 50 microns.By printed sample 150 DEG C of heat treatments 15 minutes, carry out laser-induced thermal etching processing after solidification completely.
During laser-induced thermal etching, optical maser wavelength selects 1064 nanometers, and choosing laser power is respectively 10%, 15% and 20% (maximum laser power is 20 watts).The SEM shape appearance figure of the sample after laser-induced thermal etching processing is respectively as shown in Fig. 3 (d) ~ (f), and silver element EDS maps result shape appearance figure (SEM-EDS) corresponding with the SEM shape appearance figure of these samples is as shown in Fig. 4 (d) ~ (f).
Embodiment 1 compares with reference examples:
As can be seen from Fig. 3 (a) ~ (c), the silver powder of three-dimensional fractal hierarchical structure in embodiment 1, is adopted to have more clean open circuit feature as the silver slurry etching pattern of conductive filler.Although silver slurry conducting wire shows zigzag pattern in the SEM figure in Fig. 3 (a) ~ (c), the distribution of the silver element in EDS analysis result (as Fig. 4 (a) ~ (c)) the display resin matrix of correspondence still keeps good rectilinear configuration.This shows that three-dimensional fractal hierarchical structure silver slurry has excellent linear processing characteristics in laser-induced thermal etching figure.And Fig. 3 (d) ~ (f) can find out, even if FTL-630LE silver slurry is after 20% laser power lithography, Argent grain still residual a large amount of in the groove after etching, the electric performance test that composition graphs 8 carries out confirms that this groove still can conducting.These Argent grain ablations, mainly due to silver content in FTL-630LE very high (75wt%), will be peeled off by this in the laser processing of short time, and the laser power of 20% not enough, also needs the power increasing laser.Empirical tests, during laser processing power ascension to 30%, FTL-630LE silver slurry could obtain the fine-line of not short circuit mutually.And obtaining conducting wire meticulous equally, the laser processing power needed for silver slurry that the three-dimensional fractal hierarchical structure of embodiment 1 obtains is only 15%.Show that the laser-induced thermal etching power of the electric conducting material of embodiment 1 is only 1/2 of the laser-induced thermal etching power of reference examples FTL-630LE silver slurry.
As shown in Figure 10, be the specific insulation of the conducting wire of electrocondution slurry after laser-induced thermal etching in embodiment 1 under different laser power and reference examples.For laser power in the scope of 10% ~ 70%, the specific insulation of the conducting wire of embodiment 1 all can remain on 2 × 10
-4~ 3 × 10
-4within the scope of Ω cm.And the FTL-630LE conductive silver paste in reference examples, when laser power is in the scope of 30% ~ 70%, specific insulation remains on 2 × 10
-4Ω about cm.And when being 10% and 20% for laser power, still a large amount of resins and Argent grain is remained in groove after laser ablation, confirm that recess region between conducting wire and conducting wire still can conducting in conducting performance test result, product is defective, so the specific insulation of the conducting wire obtained under not being listed in 20% and 10% power condition in fig. 8.
Find through above-mentioned contrast: based on the electrocondution slurry of the fractal hierarchical structure metallic particles of high performance three-dimensional, there is more excellent electric conductivity, and the higher fine conductive circuit of resolution can be prepared.When laser power is 15%, live width can be obtained, fine conductive circuit that line-spacing is 20 microns.And for the FTL-630LE conductive silver paste in reference examples, when needing laser power to be 30%, the groove being formed and cut off could be etched, its laser-induced thermal etching working power is higher, and then the cost realizing becoming more meticulous is higher, and higher to the requirement of the insulated substrate that coupling uses, its applicability is narrower.
To sum up, adopt the metallic particles of the three-dimensional fractal hierarchical structure of this embodiment as conductive filler, while the quality of guarantee conducting wire, significantly can reduce the power needed for laser processing procedure, and embody series technique advantage thereupon.Therefore, it is possible to provide valuable technical scheme for the development of touch screen industry.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, make some substituting or obvious modification without departing from the inventive concept of the premise, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. for a conducing composite material for laser ablation wiring, it is characterized in that: comprise matrix, the metallic particles of diameter between 100 nanometers are to 10 microns be dispersed in described matrix; Described matrix is fluoropolymer resin, and described metallic particles is the metallic particles with three-dimensional fractal hierarchical structure.
2. the conducing composite material for laser ablation wiring according to claim 1, it is characterized in that: the mass fraction of described metallic particles is 30% ~ 80%, the mass fraction of described matrix is 20% ~ 70%.
3. the conducing composite material for laser ablation wiring according to claim 1, is characterized in that: described metallic particles is one or more the mixing in silver, copper, tin, gold, platinum, palladium, aluminium.
4. the conducing composite material for laser ablation wiring according to claim 1, is characterized in that: described fluoropolymer resin is thermoset polymer resin or thermoplastic polymer resin.
5. the conducing composite material for laser ablation wiring according to claim 4, is characterized in that: described thermoset polymer resin is one or more the mixture in epoxy resin, phenolic resins, polyester, polyimides, polyurethane, polyacrylate, cyanate, polysiloxanes.
6. the conducing composite material for laser ablation wiring according to claim 4, is characterized in that: described thermoplastic polymer resin is one or more the mixture in Merlon, polyacrylate, polyester, polyurethane, polysiloxanes, polyimide preformed polymer.
7. the conducing composite material for laser ablation wiring according to claim 1, it is characterized in that: also comprise auxiliary material, described auxiliary material is one or more the mixing in curing agent, crosslinking agent, rheology control agent or stabilizer.
8. for a preparation method for the conducing composite material of laser ablation wiring, it is characterized in that: comprise the following steps: prepare fluoropolymer resin as matrix; Prepare that there is three-dimensional fractal hierarchical structure, the metallic particles of diameter between 100 nanometers are to 10 microns, described metallic particles is dispersed in described matrix.
9. the preparation method of conducing composite material according to claim 8, is characterized in that: the mass fraction of described metallic particles is 30% ~ 80%, and the mass fraction of described matrix is 20% ~ 70%.
10. a preparation method for conducting wire, is characterized in that: comprise the following steps: prepare fluoropolymer resin as matrix; Prepare that there is three-dimensional fractal hierarchical structure, the metallic particles of diameter between 100 nanometers are to 10 microns, described metallic particles is dispersed in described matrix, obtained electric conducting material; Electric conducting material is made electrocondution slurry, is printed on insulated substrate; Adopt wavelength in 355 nanometer ~ 10640 nanometer range and power exist
laser in scope carries out laser ablation processing, the electrocondution slurry on described insulated substrate is etched into the conducting wire of setting; Wherein, W is the scope of 0.1 watt ~ 50 watts.
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| CN112961540A (en) * | 2021-03-31 | 2021-06-15 | 上海宝银电子材料有限公司 | Conductive ink for pad printing process and preparation method thereof |
| CN113527948A (en) * | 2020-04-21 | 2021-10-22 | 上海宝银电子材料有限公司 | Conductive ink for pad printing process and preparation method thereof |
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