CN104992213A - Intelligent electronic tag - Google Patents
Intelligent electronic tag Download PDFInfo
- Publication number
- CN104992213A CN104992213A CN201510318943.3A CN201510318943A CN104992213A CN 104992213 A CN104992213 A CN 104992213A CN 201510318943 A CN201510318943 A CN 201510318943A CN 104992213 A CN104992213 A CN 104992213A
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- China
- Prior art keywords
- audio connector
- intelligent electronic
- circuit board
- electronic label
- storage chip
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Abstract
An intelligent electronic tag comprises a circuit board and a memory chip arranged on one side of the circuit board. The intelligent electronic tag further comprises an audio connector connected with the circuit board. The circuit board is equipped with four bonding pads or three welding holes, and the bonding pads or welding holes are disposed on the other side of the memory chip. The audio connector is a 2.5mm audio connector. The intelligent ODN product adopting the scheme is low in cost and high in contact reliability. The memory chip is encapsulated with potting glue, which achieves higher stability and reliability than a scheme in which the memory chip is directly exposed after surface-mounting currently adopted by manufacturers in the intelligent ODN industry. Therefore, the intelligent electronic tag can adapt to a harsher environment.
Description
[technical field]
The present invention relates to electronic tag field, particularly relate to a kind of intelligent electronic label.
[background technology]
Intelligent ODN industry development under the common promotion of national standardization association and three large operators in recent years, the relevant criterion of this industry is also ripe and perfect constantly.But the technical scheme that current intelligent ODN product adopts mainly contains the unibus storage chip and RFID storage chip two schemes that adopt Maxim.The scheme of unibus because be exclusive patent storage chip cost more than 3.5 yuan, relatively high, and be also difficult on long terms reduce costs.The cost of RFID storage chip technical scheme read write line is also higher, and reliability is poor.Be difficult to promote so cause whole intelligent ODN industry, the standard of industry standard and three large operators also slowly cannot formally be issued.
The EEPROM storage chip cost of I2C agreement is adopted to only have 10% of Maxim unibus storage chip.And producer is numerous, being widely used, is a kind of storage chip of maturation.But problem is this storage chip needs at least 4 contact pins, reliability is more less better than only needing the unibus Maxim storage chip of 2 contact pins.
[summary of the invention]
The present invention is intended to solve the problem and provides a kind of structure simple, cheap intelligent electronic label.
For achieving the above object, the invention provides a kind of intelligent electronic label, this intelligent electronic label comprise circuit board, the storage chip be located on described circuit board side, also comprise the audio Connector be connected with described circuit board.
Described circuit board is provided with four pads or three welding holes, and described pad or welding hole are positioned at the opposite side of described storage chip.
Described storage chip is the EEPROM storage chip adopting I2C agreement, and packing forms can be the one in DFN8, TSSOP8, SOT23-5 encapsulation.
Described audio Connector is the audio Connector of 2.5mm.
Described audio Connector comprises the audio Connector with leg, the vertical axis with described audio Connector of described leg.
Described circuit board and storage chip injection molding packaging form packaging body.
Described packaging body one end connects tail rope, and described tail rope side is provided with fixed orifice and clip.
Described audio Connector snaps fit onto on tail wires of fiber optics.
Compared with prior art, its beneficial effect is a kind of intelligent electronic label of the present invention:
1, adopt the intelligent ODN product price of this programme cheap.Adopt the EEPROM storage chip of I2C agreement cheap, on average at about 0.25 yuan, audio connector is cheap, and price is at about 0.35 yuan.Add the packaging cost of intelligent label, be expected to when production in enormous quantities control within 1 yuan.
2, adopt the intelligent ODN product contact reliability of this programme high.Because what adopt is the 2.5mm audio connector of standard, reliability is through national standard certification, and the contact scheme formulated than current intelligent ODN industry each producer designed, designed is more reliable.
3, storage chip is encapsulated by encapsulating, more reliable and more stable than the scheme directly exposed after the paster that the current intelligent each producer of ODN industry adopts, and can adapt to rugged environment more.
[accompanying drawing explanation]
Fig. 1 is the stereographic map of the embodiment of the present invention 1.
Fig. 2 is the stereographic map of the embodiment of the present invention 1.
Fig. 3 is the stereographic map of encapsulation 1 of the present invention.
Fig. 4 is the stereographic map of encapsulation 2 of the present invention.
[embodiment]
The following example is further explanation of the present invention, does not constitute any limitation the present invention.
Embodiment 1
As shown in Figure 1, a kind of intelligent electronic label of the present invention comprises circuit board 11, storage chip 12 and audio Connector 13.Circuit board 11 is miniature multi-layer PCB boards, and this pcb board size is more bigger than storage chip 12.Storage chip 12 paster on pcb board, the pcb board of storage chip 12 opposite side is provided with 3 welding holes, these 3 welding holes are a line spread, are provided with a pad at pcb board lateral edges place.The alternative model of storage chip 12 is many, for the ease of being encapsulated on intelligent label, what storage chip 12 of the present invention adopted is customize the EEPROM storage chip with 4 pad I2C agreements by producer, and storage chip packing forms can be any one chip in DFN8, TSSOP8, SOT23-5.
As shown in Figure 1, audio Connector 13 adopts the audio Connector with the metal sleeve that 3 diameters do not wait of customization, and the welding position of audio Connector 13 is right cylinder, and it is respectively first, second, third and Section four from fine to coarse.The rectangular parallelepiped column that metal sleeve comprises an annulus and is fixedly connected with this annulus, circle diameter is corresponding with the welding position of audio Connector, and rectangular parallelepiped column is metal sleeve leg 131.On the same axis, leg 131 and metal sleeve axes normal, first, second, third of three welding positions of three metal sleeve diameters and audio Connector save corresponding metal sleeve, and three metal sleeve height are identical.3 leg 131 extension elongations are identical.Metal sleeve is enclosed within first, second, third joint of the welding position of audio Connector 13 respectively, and be packed together to an entirety by machine, in 3 welding holes on the pcb board that 3 legs 131 are inserted into respectively, through having welded the connection with pcb board, the pad of PCB lateral edges has contacted with Section four, the welding position of audio connector and has welded.The PCBA of this belt transect storage chip 12 just can be welded direct on 2.5mm audio Connector, can carry out automated production, reduces production cost.Audio Connector 13 adopts 2.5mm audio connector.2.5mm audio connector is a kind of widely used AN connector of maturation, the requirement that its technical specification should meet " the wired earphone interface technical requirement of YD/T 1885-2009 GSM CDMA and method of testing ".2.5mm audio connector has 4 to contact pin, can solve the problem of contact reliability and the problem of cost with adopting the EEPROM storage chip of I2C agreement to be applied to together in intelligent ODN product.
As shown in Figure 3, the circuit board 11 in above-mentioned intelligent electronic label and storage chip 12 are become an entirety and packaging body 20 by injection molding packaging, ensure circuit board 11 and storage chip 12 inertia in packaging body 20, audio Connector 13 exposes outside packaging body 20.Storage chip 12 is encapsulated by encapsulating, more reliable and more stable than the scheme directly exposed after the paster that the current intelligent each producer of ODN industry adopts, and can adapt to rugged environment more.The side of packaging body 20 connects tail rope 21, and tail rope 21 adopts soft material, ensures that tail rope 21 has enough pliabilitys and toughness.Tail rope 21 side is provided with a fixed orifice 22 and multiple clip 23, ensure that clip 23 not easily pulls out through fixed orifice 22, for fixing whole electronic tag, this structure is suitable for intelligent ODN transformation project, designs the optic cable tail fiber that multiple clip can adapt to plurality of specifications.
As shown in Figure 4, this encapsulating structure scheme is suitable for intelligent ODN new project, and intelligent electronic label can directly be stuck on fiber connector 30.The cutting ferrule part 32 of intelligent electronic label snaps on fiber connector 30 after movable part 31 can being opened, and then is anchored on the button bit of other side by 31 parts of cutting ferrule, thus whole intelligent electronic label is fixed on fiber connector 30.Can intelligent electronic label be inserted simultaneously and extract during plug fiber connector.
Embodiment 2
The present embodiment 2 is different from embodiment 1 is circuit board 11 and audio Connector 13 structure.The welding position of audio Connector 13 is right cylinder, and it is respectively first, second, third and Section four from fine to coarse.In the present embodiment, circuit board 11 is not the structure adopting welding hole, but on circuit board 11, be provided with 4 pads, audio Connector 13 is common 2.5mm audio Connectors 13 not with leg, between circuit board 11 and audio Connector 13 welding position be welded to connect by 3 wires 111, namely A, L, D pad welds respectively by second, third and Section four of wire and audio Connector 13 welding position.On circuit board 11,1 pad of outermost edge welds with the welding position first segment of audio Connector 13.
Identical with embodiment 1 of the intelligent electronic label encapsulating structure of the present embodiment, is not repeating at this.
Although by above embodiment to invention has been announcement, protection scope of the present invention is not limited thereto, under the condition not departing from the present invention's design, all will fall in right of the present invention the distortion, replacement etc. that above each component does.
Claims (8)
1. an intelligent electronic label, it is characterized in that, comprise circuit board (11), the storage chip (12) be located on described circuit board (11) side, also comprise the audio Connector (13) be connected with described circuit board (11).
2. intelligent electronic label as claimed in claim 1, it is characterized in that, described circuit board (11) is provided with four pads or three welding holes, and described pad or welding hole are positioned at the opposite side of described storage chip (12).
3. intelligent electronic label as claimed in claim 1, is characterized in that, described storage chip (12) is the EEPROM storage chip adopting I2C agreement, and packing forms can be any one in DFN8, TSSOP8, SOT23-5 encapsulation.
4. intelligent electronic label as claimed in claim 1, is characterized in that, the audio Connector that described audio Connector (13) is 2.5mm.
5. intelligent electronic label as claimed in claim 1, it is characterized in that, described audio Connector (13) comprises the audio Connector with leg, the vertical axis with described audio Connector (13) of described leg.
6. intelligent electronic label as claimed in claim 1, is characterized in that, described circuit board (11) and storage chip (12) injection molding packaging form packaging body (20).
7. intelligent electronic label as claimed in claim 6, it is characterized in that, described packaging body (20) one end connects tail rope (21), and described tail rope (21) side is provided with fixed orifice (22) and clip (23).
8. intelligent electronic label as claimed in claim 1, it is characterized in that, described audio Connector (13) snaps fit onto on tail wires of fiber optics (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510318943.3A CN104992213A (en) | 2015-06-11 | 2015-06-11 | Intelligent electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510318943.3A CN104992213A (en) | 2015-06-11 | 2015-06-11 | Intelligent electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104992213A true CN104992213A (en) | 2015-10-21 |
Family
ID=54304025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510318943.3A Pending CN104992213A (en) | 2015-06-11 | 2015-06-11 | Intelligent electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104992213A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105303963A (en) * | 2015-11-26 | 2016-02-03 | 国网冀北电力有限公司信息通信分公司 | Double-sided contact-type intelligent electronic tag |
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| CN102722688A (en) * | 2012-06-07 | 2012-10-10 | 华为技术有限公司 | Tail optical fiber management device |
| CN102891716A (en) * | 2012-10-24 | 2013-01-23 | 南京普天通信股份有限公司 | Intelligent management device for contact type optical fiber physical port |
| CN103067072A (en) * | 2012-12-18 | 2013-04-24 | 华为技术有限公司 | Optical branching device, method and device of distinguishing optical branching device and coil outlet ports of optical branching device |
| CN103246023A (en) * | 2013-05-15 | 2013-08-14 | 深圳市特发信息光网科技股份有限公司 | Joint of optical fiber flexible connector |
| CN203340094U (en) * | 2013-07-15 | 2013-12-11 | 南京普天通信股份有限公司 | Passive intelligent management system based on wireless transmission for optical distribution equipment |
| CN203365736U (en) * | 2013-08-07 | 2013-12-25 | 苏州新海宜通信科技股份有限公司 | Optical fiber connector electronic label suite for intelligent ODN (Optical Distribution Node) network |
| CN103516551A (en) * | 2013-10-15 | 2014-01-15 | 南京普天通信股份有限公司 | Optical fiber physical port intelligent management system using passive double RFID tags |
| CN203720407U (en) * | 2013-12-18 | 2014-07-16 | 烽火通信科技股份有限公司 | Movable optical fiber connector with replaceable electronic tag |
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2015
- 2015-06-11 CN CN201510318943.3A patent/CN104992213A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045125A (en) * | 2009-10-26 | 2011-05-04 | 华为技术有限公司 | Optical splitter as well as optical splitter port identification method and device |
| CN102722688A (en) * | 2012-06-07 | 2012-10-10 | 华为技术有限公司 | Tail optical fiber management device |
| CN102891716A (en) * | 2012-10-24 | 2013-01-23 | 南京普天通信股份有限公司 | Intelligent management device for contact type optical fiber physical port |
| CN103067072A (en) * | 2012-12-18 | 2013-04-24 | 华为技术有限公司 | Optical branching device, method and device of distinguishing optical branching device and coil outlet ports of optical branching device |
| CN103246023A (en) * | 2013-05-15 | 2013-08-14 | 深圳市特发信息光网科技股份有限公司 | Joint of optical fiber flexible connector |
| CN203340094U (en) * | 2013-07-15 | 2013-12-11 | 南京普天通信股份有限公司 | Passive intelligent management system based on wireless transmission for optical distribution equipment |
| CN203365736U (en) * | 2013-08-07 | 2013-12-25 | 苏州新海宜通信科技股份有限公司 | Optical fiber connector electronic label suite for intelligent ODN (Optical Distribution Node) network |
| CN103516551A (en) * | 2013-10-15 | 2014-01-15 | 南京普天通信股份有限公司 | Optical fiber physical port intelligent management system using passive double RFID tags |
| CN203720407U (en) * | 2013-12-18 | 2014-07-16 | 烽火通信科技股份有限公司 | Movable optical fiber connector with replaceable electronic tag |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105303963A (en) * | 2015-11-26 | 2016-02-03 | 国网冀北电力有限公司信息通信分公司 | Double-sided contact-type intelligent electronic tag |
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Application publication date: 20151021 |