CN101808461B - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN101808461B CN101808461B CN201010130848.8A CN201010130848A CN101808461B CN 101808461 B CN101808461 B CN 101808461B CN 201010130848 A CN201010130848 A CN 201010130848A CN 101808461 B CN101808461 B CN 101808461B
- Authority
- CN
- China
- Prior art keywords
- cable
- hole
- pcb board
- circuit board
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims description 18
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 241001062009 Indigofera Species 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010130848.8A CN101808461B (en) | 2010-03-22 | 2010-03-22 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010130848.8A CN101808461B (en) | 2010-03-22 | 2010-03-22 | Circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101808461A CN101808461A (en) | 2010-08-18 |
CN101808461B true CN101808461B (en) | 2015-05-27 |
Family
ID=42610012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010130848.8A Expired - Fee Related CN101808461B (en) | 2010-03-22 | 2010-03-22 | Circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101808461B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3286801B1 (en) | 2015-04-20 | 2022-12-28 | InterDigital Madison Patent Holdings, SAS | Strain relief antenna wiring connector in an electronic device |
CN106477093A (en) * | 2016-11-22 | 2017-03-08 | 天津航空机电有限公司 | A kind of binding post welds the binding method of wire harness |
CN107949165B (en) * | 2017-10-24 | 2020-05-12 | 珠海格力节能环保制冷技术研究中心有限公司 | Fixing structure of power line and motor |
CN112911795B (en) * | 2021-02-26 | 2022-08-19 | 深圳市皓文电子有限公司 | Method for connecting cables in high-power-density power module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002217565A (en) * | 2001-01-19 | 2002-08-02 | Aiphone Co Ltd | Lead wire processing structure for interphone |
CN2525650Y (en) * | 2001-12-26 | 2002-12-11 | 富士康(昆山)电脑接插件有限公司 | Cable clip |
CN1589093A (en) * | 2004-08-13 | 2005-03-02 | 广州金升阳科技有限公司 | Method for improving fine enamelled wire spot welding strengh in spot welding |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2386546Y (en) * | 1999-09-03 | 2000-07-05 | 杨文钦 | Telephone change-over socket box |
JP3493659B2 (en) * | 2000-06-06 | 2004-02-03 | 船井電機株式会社 | Wire processing structure of lead wire |
-
2010
- 2010-03-22 CN CN201010130848.8A patent/CN101808461B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002217565A (en) * | 2001-01-19 | 2002-08-02 | Aiphone Co Ltd | Lead wire processing structure for interphone |
CN2525650Y (en) * | 2001-12-26 | 2002-12-11 | 富士康(昆山)电脑接插件有限公司 | Cable clip |
CN1589093A (en) * | 2004-08-13 | 2005-03-02 | 广州金升阳科技有限公司 | Method for improving fine enamelled wire spot welding strengh in spot welding |
Also Published As
Publication number | Publication date |
---|---|
CN101808461A (en) | 2010-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: HU'NAN QIU ZEYOU PATENT STRATEGIC PLANNING CO., LT Free format text: FORMER OWNER: QIU ZEYOU Effective date: 20101101 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 410011 28/F, SHUNTIANCHENG, NO.59, SECTION 2 OF FURONG MIDDLE ROAD, CHANGSHA CITY, HU'NAN PROVINCE TO: 410205 JUXING INDUSTRY BASE, NO.8, LUJING ROAD, CHANGSHA HIGH-TECH. DEVELOPMENT ZONE, YUELU DISTRICT, CHANGSHA CITY, HU'NAN PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20101104 Address after: 518040 Shenzhen City, Futian District Che Kung Temple Industrial Zone Tairan 211 industrial buildings seventh floor 706 Applicant after: Shenzhen Zhongqingwei Technology Development Co., Ltd. Address before: 100085, room 5, building 1, 402 East Road, Haidian District, Beijing Applicant before: Beijing Jushu Digital Technology Development Co., Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Sun Liming Inventor before: Xing Wei Inventor before: Shao Yinliang Inventor before: Jie Chunxia |
|
COR | Change of bibliographic data | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160629 Address after: 200436 No. 52, Lane 1090, Lane 9, Shanghai Baoshan District Road, Shanghai Patentee after: Shanghai austor Technology Co., Ltd. Address before: 518040 Shenzhen City, Futian District Che Kung Temple Industrial Zone Tairan 211 industrial buildings seventh floor 706 Patentee before: Shenzhen Zhongqingwei Technology Development Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 Termination date: 20200322 |