CN104977809A - Method for calibrating vertical control parameters of lithography - Google Patents
Method for calibrating vertical control parameters of lithography Download PDFInfo
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- CN104977809A CN104977809A CN201410137059.5A CN201410137059A CN104977809A CN 104977809 A CN104977809 A CN 104977809A CN 201410137059 A CN201410137059 A CN 201410137059A CN 104977809 A CN104977809 A CN 104977809A
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Abstract
The invention discloses a method for calibrating vertical control parameters of lithography. The method is characterized by comprising the following steps: (1) initializing a wafer stage, a reticle stage, a reticle focusing and leveling sensor and a coaxial alignment subsystem; (2) uploading a mask; (3) moving a reticle alignment mark to a coaxial alignment position; (4) setting up the reticle stage to move vertically with specified step length in a specified range, wherein the wafer stage moves along with the reticle stage; (5) recording readings of the reticle focusing and leveling sensor and a grating scale of the wafer stage obtained by measurement at each step, and repeating the step (4) till the reticle stage completes vertical movement in the specified range; (6) calculating proportional coefficients of the two groups of data; and (7) upgrading the proportional coefficient of the reticle focusing and leveling sensor based on the measurement data of the grating scale of the wafer stage.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, further, relate to the vertical controling parameters calibration steps of a kind of litho machine.
Background technology
In litho machine, have two and overlap independently object space and the vertical control device of image space substrate: work stage and mask platform.Two are just had to overlap independently vertical measuring set accordingly: mask focusing and leveling sensor and grating scale.Two cover measurement mechanisms without calibration before, follow respective measurement scale respectively.So in actual use, the catenary motion amount of object space and image space can not be moved according to desirable proportionate relationship accurately, can use after needing calibration.
In prior art, US Patent No. 5625436A discloses a kind of scanning-exposure apparatus and exposure method, has in this exposure device comprises: the distributed architecture of the splicing of scan exposure, many object lens and object lens.Exposure method has in comprising: real estate shape record, adjustable object lens multiplying power and scan exposure speed, for measuring the alignment device that real estate shape uses and the method obtaining real estate shape according to the change of marker graphic.This invention belongs to substrate surface shape measurement in online production process, compensation method and device, before not mentioning measuring surface shape, to the calibration process of this measurement and compensation method.
Summary of the invention
In order to overcome defect of the prior art, the present invention proposes the scale-up factor that off-line calibration object space and image space two overlap vertical control system, the measurement of alignment surface shape compensation method and compensation precision.
The present invention proposes the vertical controling parameters calibration steps of a kind of litho machine, it is characterized in that: comprise the steps:
Step 1: initialization work stage, mask platform, mask focusing and leveling sensor, coaxial alignment subsystem;
Step 2: upload mask;
Step 3: mask alignment mark is moved to coaxial alignment position;
Step 4: mask platform is set to specify step-length catenary motion in specified scope, work stage follows mask platform motion;
Step 5: record mask focusing and leveling sensor and work stage grating scale reading that each pacing measures; Repeat step 4 until mask platform completes the catenary motion in described specified scope;
Step 6: the scale-up factor calculating work stage grating scale and mask focusing and leveling sensor two groups of data;
Step 7: the scale-up factor calculated with the measurement data of work stage grating scale is the scale-up factor of datum renewal mask focusing and leveling sensor.
Wherein, described step 4 also comprises the steps:
Step 4.1: mask platform is to specify step-length catenary motion;
Step 4.2: work stage follows mask platform motion according to the desirable position of focal plane that coaxial alignment search, measurement obtain, and records the contrast-data of each step;
Step 4.3:: the numerical value according to work stage grating scale vertical position and contrast finds extreme point.
Wherein, by the numerical value of described work stage grating scale vertical position and contrast is made least square method high order fitting, extreme point is found.
Wherein, the catenary motion scope in described step 4 is determined according to mask focusing and leveling sensor accurate measurement scope.
Wherein, the scale-up factor of least square fitting two groups of data is used in described step 6.
The vertical controling parameters calibration steps of a kind of litho machine that the present invention proposes, by measuring calibration object space and image space two overlaps the scale-up factor of vertical control system, thus the measurement of alignment surface shape compensation method and compensation precision.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is litho machine structural representation of the present invention;
Fig. 2 is alignment mark schematic diagram of the present invention;
Fig. 3 is litho machine of the present invention vertical controling parameters calibration steps process flow diagram;
Fig. 4 is that the vertical controling parameters calibration steps of litho machine of the present invention aims at focal plane search schematic diagram.
Embodiment
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
As shown in Figure 1, Fig. 1 is litho machine structural representation of the present invention, comprising: work stage 1, mask platform 2, the measuring beam exit end 3 of mask focusing and leveling sensor, the receiving end 4, CCD 5 of mask focusing and leveling sensor, object lens 7, and coaxial alignment system 8.Work stage 1 for load image sensor CCD 5 to different aligning vertical positions.Mask platform 2, for carrying alignment mark 6 on mask to different vertical positions.Mask focusing and leveling sensor, for measuring mask in motion process, the vertical height value of reality of object plane.Object lens 7, for by the alignment mark imaging on object plane mask to CCD 5.Coaxial alignment system 8, processes for the alignment mark image obtained of being sampled by CCD5, according to result, controls work stage 1 and moves to differing heights to find out image space clearly.
Fig. 2 is the mask alignment mark schematic diagram that mask of the present invention uses.
Fig. 3 is litho machine of the present invention vertical controling parameters calibration steps process flow diagram, comprises the steps:
Step one: initialization work stage 1, mask platform 2, mask focusing and leveling sensor, coaxial alignment subsystem;
Step 2: upload the mask with mask alignment mark;
Step 3: mask alignment mark 6 is moved to coaxial alignment position;
Step 4: first arrange mask platform 2 to specify step-length catenary motion, this range of movement is determined according to mask focusing and leveling sensor accurate measurement scope.Then, each mask platform vertical position, work stage 1 follows mask platform motion according to the desirable position of focal plane that coaxial alignment search, measurement obtain, and records the contrast-data of each step.Finally, the numerical value of work stage grating scale vertical position and contrast is made least square method high order fitting, and finds extreme point.As shown in Figure 4, in aligning focal plane search schematic diagram, this extreme point is exactly the most clearly, the work stage aligned position that contrast is the highest.
Step 5: record now work stage grating scale and mask focusing and leveling sensor reading, repeats step 4 until mask platform 2 completes the catenary motion of specifying within the scope of mask focusing and leveling sensor accurate measurement.
Step 6: model calculates: the scale-up factor using least square fitting work stage grating scale and mask focusing and leveling sensor two groups of data, this scale-up factor is the vertical controling parameters calibrator quantity (scale-up factor that mask focusing and leveling sensor is to be calibrated) required by this method invention.
Step 7: the scale-up factor calculated with the measurement data of work stage grating scale is the scale-up factor of datum renewal work stage focusing and leveling sensor.
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (5)
1. the vertical controling parameters calibration steps of litho machine, is characterized in that: comprise the steps:
Step 1: initialization work stage, mask platform, mask focusing and leveling sensor, coaxial alignment subsystem;
Step 2: upload mask;
Step 3: mask alignment mark is moved to coaxial alignment position;
Step 4: mask platform is set to specify step-length catenary motion in specified scope, work stage follows mask platform motion;
Step 5: record mask focusing and leveling sensor and work stage grating scale reading that each pacing measures; Repeat step 4 until mask platform completes the catenary motion in described specified scope;
Step 6: the scale-up factor calculating work stage grating scale and mask focusing and leveling sensor two groups of data;
Step 7: the scale-up factor calculated with the measurement data of work stage grating scale is the scale-up factor of datum renewal mask focusing and leveling sensor.
2. the vertical controling parameters calibration steps of litho machine as claimed in claim 1, it is characterized in that, described step 4 also comprises the steps:
Step 4.1: mask platform is to specify step-length catenary motion;
Step 4.2: work stage follows mask platform motion according to the desirable position of focal plane that coaxial alignment search, measurement obtain, and records the contrast-data of each step;
Step 4.3:: the numerical value according to work stage grating scale vertical position and contrast finds extreme point.
3. the vertical controling parameters calibration steps of litho machine as claimed in claim 2, is characterized in that, by the numerical value of described work stage grating scale vertical position and contrast is made least square method high order fitting, find extreme point.
4. the vertical controling parameters calibration steps of litho machine as claimed in claim 1, is characterized in that, the catenary motion scope in described step 4 is determined according to mask focusing and leveling sensor accurate measurement scope.
5. the vertical controling parameters calibration steps of litho machine as claimed in claim 1, is characterized in that, use the scale-up factor of least square fitting two groups of data in described step 6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410137059.5A CN104977809B (en) | 2014-04-08 | 2014-04-08 | A kind of vertical control parameter calibration method of litho machine |
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| CN201410137059.5A CN104977809B (en) | 2014-04-08 | 2014-04-08 | A kind of vertical control parameter calibration method of litho machine |
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| CN104977809A true CN104977809A (en) | 2015-10-14 |
| CN104977809B CN104977809B (en) | 2017-06-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444200A (en) * | 2019-08-28 | 2021-03-05 | 上海微电子装备（集团）股份有限公司 | Workbench equipment and method for measuring vertical zero clearing error of workbench |
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| JPH07201713A (en) * | 1993-12-28 | 1995-08-04 | Sony Corp | Aligner and aligning method |
| TW440749B (en) * | 1995-12-26 | 2001-06-16 | Toshiba Corp | Optical exposure apparatus of scanning exposure system and its exposing method |
| CN1476629A (en) * | 2000-11-22 | 2004-02-18 | 株式会社尼康 | Aligner, aligning method and method for fabricating device |
| JP2006279029A (en) * | 2005-03-01 | 2006-10-12 | Canon Inc | Method and device for exposure |
| CN101221368A (en) * | 2008-01-21 | 2008-07-16 | 上海微电子装备有限公司 | Real-time detecting and correcting device and method for position of object plane and image plane |
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2014
- 2014-04-08 CN CN201410137059.5A patent/CN104977809B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201713A (en) * | 1993-12-28 | 1995-08-04 | Sony Corp | Aligner and aligning method |
| TW440749B (en) * | 1995-12-26 | 2001-06-16 | Toshiba Corp | Optical exposure apparatus of scanning exposure system and its exposing method |
| CN1476629A (en) * | 2000-11-22 | 2004-02-18 | 株式会社尼康 | Aligner, aligning method and method for fabricating device |
| JP2006279029A (en) * | 2005-03-01 | 2006-10-12 | Canon Inc | Method and device for exposure |
| CN101221368A (en) * | 2008-01-21 | 2008-07-16 | 上海微电子装备有限公司 | Real-time detecting and correcting device and method for position of object plane and image plane |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444200A (en) * | 2019-08-28 | 2021-03-05 | 上海微电子装备（集团）股份有限公司 | Workbench equipment and method for measuring vertical zero clearing error of workbench |
| CN112444200B (en) * | 2019-08-28 | 2021-12-31 | 上海微电子装备（集团）股份有限公司 | Workbench equipment and method for measuring vertical zero clearing error of workbench |
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| CN104977809B (en) | 2017-06-27 |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |